JPH064588Y2 - Semiconductor storage tray - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a tray used for storing and carrying semiconductor chips.

[Conventional technology]

Regarding the transportation of semiconductor chips, it is customary to transport the semiconductor wafer with the dicing grooves left in the diffused wafer, to mount the chips on a sticking sheet, or to transport them in an existing storage tray.

[Problems to be solved by the invention]

According to the method of transporting in the form of diffused wafers, the storage density during transportation is the highest, but the one with dicing grooves in the diffused wafers may be defective in appearance and characteristics when used. Therefore, it is necessary to select these. On the other hand, in the case where the chip is attached to the sticking sheet, a special device must be used when taking out the chip so that the sticking sheet can be easily peeled off. In addition, although the above-mentioned disadvantages can be eliminated when it is put in a storage tray, the material cost of the storage tray may be equal to or more than that of the chips to be stored, and it is possible to support small-quantity multi-product production. Needs to stock a large number of storage trays of a great variety.

That is, in the conventional storage tray, as shown in the cross section in FIG. 4, a large number of chip storage portions 11 are formed on a material 10 such as metal, but this storage tray is used in the semiconductor device manufacturing process of multi-product production. In order to use trays, a large number of storage trays of various types must always be prepared.

An object of the present invention is to provide a semiconductor storage tray that uses a heat-processable resin plate in common and provides a required number of trays of a required shape when needed, which is suitable for small-quantity and high-mix production of semiconductor chips. Especially.

[Means for solving problems]

In order to achieve the above object, a semiconductor storage tray according to the present invention is a semiconductor storage tray having a chip storage portion on a plate surface of a thermo-processable resin plate, the thermo-processable resin plate being a chip of a semiconductor to be stored. It has a common size regardless of the size, and the chip storage part is the one in which the convex shape of the heat-processed mold is transferred and shaped into a groove of a predetermined number, size and depth. The number, size and depth of the grooves of the chip accommodating portion formed on each heat-processable resin plate are different for each semiconductor chip size in accordance with the selected type of the heating type processing mold.

[Action]

Prepare a dozen or more types of heating-type processing molds that correspond to the shape types of thermo-processing resin plates and small-volume, multi-product products, select the heating-type processing mold, and process the thermo-processing resin plate as necessary. At times, we will supply the required number of trays of the required type.

〔Example〕

 Next, the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of a heating type working die 1 of the present invention. The working type 1 is made of a good heat conductive metal, and a heater 3, a power supply line 4 and a temperature control thermocouple 5 are inserted from a heater installation hole 2. You can do it. The bottom surface of the working die 1 has a convex portion 6 that determines the storage area of chips and a concave portion 7 that forms a partition.

FIG. 2 is a plan view of the semiconductor storage tray after the heat-processable resin plate 8 is processed and formed by the heating type processing die 1, and FIG. 3 is a sectional view of the semiconductor storage tray. The semiconductor storage tray has
A large number of chip accommodating portions 9 corresponding to the convex portions 6 of the working die 1 are provided.

There are more than a dozen types of heat processing types according to the shapes and types of small-quantity, high-mix production products of semiconductor chips. The number, size, and rising height of the convex portions 6 provided on the bottom surface of each heating type processing die 1 are different for each semiconductor chip size. On the other hand, the heat-processable resin plate is the same regardless of the size of the semiconductor chip. Therefore, when a semiconductor of a certain chip size is produced, one that is suitable for the chip size is selected from the prepared heating-type processing dies, and the heating-type processing die 1 is used, and the required number of thermal processing properties are used. The resin plate is taken out, and the shapes of the convex portions 6 and the concave portions 7 of the heating processing die 1 are transferred to the plate surface of each thermoworkable resin plate 8, and the predetermined number, size and A groove having a depth is formed, and each groove is processed into a semiconductor storage tray having a chip storage portion 9.

The same applies to the production of semiconductors of other chip sizes. Each time a semiconductor is produced, a type of heat-processable mold that is suitable for the chip size is selected, and when necessary, the necessary number of heat-processable resin plates are applied to mold the shape, number, Size and depth of chip storage 9
The semiconductor chips produced by processing are stored in a storage tray having.

[Effect of device]

As described above, according to the present invention, a necessary number of heat-processable resin plates are processed into storage trays according to the size of semiconductor chips produced, and therefore a large number of storage trays of various types are prepared in advance. There is no need to keep it, and because the thermo-processable resin plate is used in common regardless of the type of chip size, there is no need to store and manage each type of storage tray as in the past, and a simple press It suffices to provide only the required number of heating type processing molds, and by selecting the heating type processing type, it is possible to provide the required number of storage trays of the required size and to significantly reduce the chip packaging cost.

[Brief description of drawings]

FIG. 1 is a perspective view of a heating type processing die. 2 is a plan view of a semiconductor storage tray according to an embodiment of the present invention, and FIG. 3 is a sectional view thereof. FIG. 4 is a sectional view of a conventionally proposed semiconductor chip tray. 1 ... Heating type, 3 ... Heater 6 ... Convex part for forming chip storage part 7 ... Recess for forming partition, 8 ... Thermo-processable resin plate 9 ... Chip storage part

Claims (1)

[Scope of utility model registration request] 1. A semiconductor storage tray having a chip storage portion on the surface of a thermo-processable resin plate, wherein the thermo-processable resin plate has a common size regardless of the chip size of the semiconductor to be stored. Yes, the chip storage part is formed by transferring the convex shape of the heat-processed mold to a groove of a predetermined number, size and depth, and formed on each heat-processable resin plate. The semiconductor storage tray, wherein the number, size and depth of the grooves of the chip storage portion are different for each semiconductor chip size according to the selected type of the heating type processing die.