JPH06337193A - Vacuum dryer - Google Patents

Abstract

PURPOSE:To provide a vacuum dryer, capable of drying even a fine pattern while keeping a semiconductor device clean, generating no electrostatic charging after drying and producing no water mark. CONSTITUTION:A vacuum dryer is provided with a water drop removing mechanism B, consisting of an inert gas injecting means 14 and a drain port 28, which are provided on a vessel body 23, and a vacuum drying mechanism A, consisting of the inert gas injecting means 14 and an evacuating means, evacuating a vacuum vessel 1, which are provided on the vacuum vessel 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum drying apparatus for semiconductor devices and the like, and more specifically, it can dry a fine pattern in a clean state, does not have static electricity after drying, and has a watermark after drying. The present invention relates to a vacuum drying device that eliminates the generation.

[0002]

2. Description of the Related Art Drying of semiconductor devices is usually
The following scheme is used. (1) Spin dryer A semiconductor device is set in a cassette and the rotor is rotated at a high speed to dry the semiconductor device. (2) IPA vapor drying The vapor of alcohol is brought into contact with the object to accelerate the drying. (3) Hot pure water pull-up and drying The semiconductor device is dipped in heated pure water, and the heated semiconductor device is slowly pulled up to dry. (4) Lamp heating and drying The semiconductor device is heated and dried by exposing the semiconductor device to light in the air.

[0003]

However, these devices have the following problems. In the case of the spin dryer of (1), since the rotor in which the cassette is set rotates at high speed, the semiconductor device may be charged with static electricity, or particles generated from the rotating shaft may adhere to the semiconductor device. In the case of (2) IPA vapor drying, alcohol is used, so it is necessary to take great care in terms of safety, such as using an explosion-proof mechanism. In the case of hot water pull-up and drying of (3), the control is fairly delicate, and it is difficult to dry it well. In the case of (4) heat drying by lamp, since it is heated and dried in the air, it is easily oxidized.
Further, in the drying by these apparatuses, the problem that the moisture remains in the deep groove portion of the fine pattern of the semiconductor device and the water mark is generated after the drying has not been solved. The present invention has been made in order to solve these problems, while keeping the semiconductor device clean, it is possible to dry to a fine pattern,
It is another object of the present invention to provide a vacuum drying device that does not have static electricity after drying and does not generate a watermark.

[0004]

In order to achieve the above object, the present invention provides a water drop removing mechanism in which a container body is provided with an inert gas injection means and a drain port, an inert gas injection means in a vacuum container, and And a vacuum drying mechanism provided with a vacuuming means for evacuating the vacuum container.
Further, a halogen lamp is disposed in a lower portion inside the vacuum container, a reflection hood is provided above the halogen lamp, and a light reflection plate is provided on an inner surface of the vacuum container and an inner surface of the lid. And

[0005]

In advance, large water droplets are ejected by the water droplet removal mechanism by the jetting force of the inert gas. As a result, drying in the vacuum container can be shortened, and oxidation during removal of water droplets can be prevented. A nozzle for introducing an inert gas and a vacuum ejector are connected to the vacuum container, and a halogen lamp is installed inside the vacuum container.Therefore, set a dried object such as a semiconductor device or a liquid crystal substrate in the vacuum container, It is possible to reduce the pressure while adjusting the pressure while introducing an inert gas, to return the inside of the vacuum container to the atmospheric pressure while supplying the inert gas, and to heat with a halogen lamp during the pressure reduction. In order to heat the halogen lamp while reducing the pressure in an inert gas atmosphere, the saturated vapor pressure is lowered, and drying is performed while maintaining or raising the temperature of the material to be dried, so it is possible to significantly improve the drying efficiency at a relatively low temperature. It is also possible to solve the oxidation during drying, which is the cause of generation of the watermark.

[0006]

Embodiments of the present invention will now be described in detail with reference to the drawings. FIG. 1 is a schematic explanatory view showing an embodiment of the present invention, in which a vacuum drying device comprises a vacuum drying mechanism A and a water droplet removing mechanism B. The vacuum drying mechanism A includes a vacuum container 1 and a vacuum ejector 2. In the vacuum container 1, a floor 4 for setting an object to be dried is formed of a bar so that moisture dripping from the object to be dried set in the vacuum container 1 can be removed and the high heat of the halogen lamp is evenly applied. . The bottom portion 1a below the floor portion 4 is tapered downward toward the center so that water droplets dropped from the floor portion 4 can smoothly fall.

A heater, for example, a rubber heater 7 is provided on the outer peripheral surface of the bottom portion 1a of the vacuum container 1 so that it can be heated. A heater 7 is provided on the bottom portion 1a of the vacuum container 1 to heat the water in order to prevent water droplets attached when water is drained in the first stage from being deprived of heat of vaporization due to vacuum drying and frozen. Is.
The vacuum ejector 2 is connected to the bottom portion 1 a of the vacuum container 1 via a main vacuum line 8. A line 9 for pre-evacuating is provided in the middle of the line 8. The lines 8 and 9 are provided with valves 10 and 11, respectively. For example, a vacuum pump is used as the vacuum ejector 2.

A nozzle 14 for ejecting an inert gas is arranged above the vacuum container 1, and a regulator 15, a flow controller 16, and an air operate valve 1 are provided in the nozzle 14.
7, an inert gas supply line 1 provided with a filter 18
9 are connected to each other. Reference numeral 20 denotes an upper lid of the vacuum container 1.

As shown in FIG. 2, a halogen lamp 21 is arranged in the lower part of the vacuum vessel 1, and a light reflecting hood 22 is arranged above the halogen lamp 21 so that the light of the halogen lamp 21 is reflected at the bottom. The light is reflected toward 1a. A light reflection plate is attached to the inner surfaces of the vacuum container 1 and the lid 20 so that the light reflected from the bottom portion 1a is evenly applied to the article to be dried 3.

The water drop removing mechanism B has a container body 23, and nozzles 24 are arranged on the upper and left and right sides of the container body 23, and an inert gas supply line 26 having a regulator 25 is connected to the nozzle 24. Has been done. This container body 2
The floor 27 of No. 3 has a mesh shape, and the floor 27 is provided with a drain port 28.

Next, the operation of this embodiment will be described. The material to be dried 3 such as the leaked semiconductor device in the cassette is put in the container body 23 of the water drop removing mechanism B, and the inert gas adjusted to a high pressure of ³ to 7 kg / cm ² by the regulator 25 is jetted from the nozzle 24. Let As a result, large water droplets attached to the material to be dried 3 are blown downward without oxidizing the material to be dried 3 and are discharged from the drain port 28. After performing the above processing for several minutes, vacuum container 1 can be automatically or manually operated.
The material 3 to be dried is transferred into the inside, and the lid 20 is closed.

Subsequently, the bulb 11 is opened and the vacuum ejector 2 performs a preliminary vacuuming, and at the same time, the halogen lamp 2
Turn on 1. After performing this preliminary evacuation for a few minutes,
The halogen lamp 21 is turned on while the valve 10 is opened and the main vacuum is performed. At this time, the valve 17 is opened and the degree of vacuum is adjusted by the flow rate controller 16.

The preliminary vacuuming is first performed in order to avoid a sudden pressure change. The reason why the halogen lamp 21 is used to heat the material to be dried in vacuum is that heating by heat conduction cannot be expected at all in heating in vacuum, and radiation heating by light is more effective. When the saturated vapor pressure is reduced by reducing the pressure, water easily evaporates at low temperatures, but the evaporation heat is removed when the water evaporates, which lowers the temperature of the material to be dried and, in some cases, freezes it. At the same time. This makes it possible to significantly improve the drying efficiency. After performing the main evacuation for about 1 to 10 minutes in the above process, the halogen lamp is turned off, the main evacuation valve 10 is closed, and the gas flow rate controller 17 is fully opened from the inert gas introduction nozzle 14. The inert gas is flowed, and the vacuum container 1 is filled with the inert gas to return to the atmospheric pressure. The drying of the material to be dried is completed by the above steps.

[0014]

As described above, according to the present invention, a large water drop is removed in advance by the water drop removing mechanism, so that the drying time in the vacuum container is greatly shortened and the oxidation during the water drop removal is also reduced. It can be prevented. In addition, the saturated vapor pressure is lowered in the vacuum container, and the radiant heating by a halogen lamp is also used for drying, so that the drying efficiency is extremely good, and even the deep groove portion of a fine pattern such as a semiconductor device can be dried cleanly and mechanically. Since there is no part to be driven to the inside of the vacuum container, there is almost no generation of particles, and particles do not adhere to the material to be dried. Further, unlike the above-mentioned spin dryer, since the material to be dried is not rotated at high speed, there is no electrostatic charge. In addition, since oxygen is removed from the water droplets in the initial stage because it is dried in a vacuum, and since the pressure is controlled by an inert gas during the drying process, there is almost no oxidation during drying that causes water marks, No watermark is generated.

[Brief description of drawings]

FIG. 1 is a schematic explanatory view showing an embodiment of the present invention.

FIG. 2 is a schematic explanatory view of the inside of a vacuum container.

[Explanation of symbols]

 1 Vacuum Container 2 Vacuum Ejector 14 Nozzle (Inert Gas Injecting Means) 20 Top Lid 21 Halogen Lamp 22 Reflective Hood 23 Container Body 24 Nozzle (Inert Gas Injecting Means) 28 Drain Port A Vacuum Drying Mechanism B Water Drop Removal Mechanism

Claims (2)

[Claims] 1. Vacuum drying comprising a water drop removing mechanism provided with an inert gas injection means and a drain port in a container body, and an inert gas injection means provided in a vacuum container and a vacuum evacuation means for vacuumizing the vacuum container. A vacuum drying device comprising a mechanism. 2. A halogen lamp is arranged in the lower part of the vacuum container, a reflection hood is provided above the halogen lamp, and a light reflection plate is provided on the inner surface of the vacuum container and the inner surface of the lid. The vacuum drying device according to claim 1, wherein