JPH06335789A - Cutting method for glass substrate - Google Patents

Cutting method for glass substrate

Info

Publication number
JPH06335789A
JPH06335789A JP5125853A JP12585393A JPH06335789A JP H06335789 A JPH06335789 A JP H06335789A JP 5125853 A JP5125853 A JP 5125853A JP 12585393 A JP12585393 A JP 12585393A JP H06335789 A JPH06335789 A JP H06335789A
Authority
JP
Japan
Prior art keywords
glass substrate
cutting
dummy
cut
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5125853A
Other languages
Japanese (ja)
Inventor
Katsuyuki Imoto
克之 井本
Original Assignee
Hitachi Cable Ltd
日立電線株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd, 日立電線株式会社 filed Critical Hitachi Cable Ltd
Priority to JP5125853A priority Critical patent/JPH06335789A/en
Publication of JPH06335789A publication Critical patent/JPH06335789A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/07Cutting armoured, multi-layered, coated or laminated, glass products
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/08Severing cooled glass by fusing, i.e. by melting through the glass
    • C03B33/082Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser

Abstract

PURPOSE:To enable a cutting work with a high perpendicularity and like a mirror surface even when a substrate is thick. CONSTITUTION:A glass substrate 12 for dummy, is placed upon a glass substrate 7 for working. Both substrates are fixed so that they are not separated and dislocated at the time of cutting. A CO2 laser beam emitted from a CO2 laser 1 enters a cylinder 3, is reflected by a mirror 2, is converged by a lens 4, and is outputted from a gas nozzle 5. For the CO2 laser beam outputting from the gas nozzle 5, its outer periphery is enveloped by the flows of gas 61 and 62, and the CO2 laser beam focuses on the surface of the glass substrate 12 for dummy. Consequently, after the glass substrate 12 for dummy is cut, the glass substrate 7 for working is cut.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of cutting a glass substrate by irradiating a carbon dioxide laser beam with a good verticality.

[0002]

2. Description of the Related Art Research and development of a waveguide type optical component using a glass waveguide has been activated. In order to put this optical component into practical use, a technique for connecting an optical fiber to the end face of the waveguide is essential. In order to realize this connection with low loss, it is a basic condition that the end face of the waveguide is mirror-finished and polished with good verticality.

As a method of polishing the end face of the waveguide in a mirror state and with good verticality, the present inventor has proposed a method of simultaneously performing cutting and polishing in contrast to the conventional process using dicing and polishing processes. (Japanese Patent Application No. 4-201520).
As shown in FIG. 6, the light of the carbon dioxide gas (CO 2 ) laser 1 is focused on the cutting position of the processing glass substrate (waveguide substrate) 7, and the processing glass substrate 7 is cut along the cutting direction. This is a method of cutting by moving or moving the CO 2 laser 1 along the cutting direction, and using light energy to finish the cut surface into a mirror surface. In this method, in order to realize the combined vertical cutting and mirror surface of the glass substrate 7, optimization of the optical power 〓CO 2 laser 1, ¬ symmetric distribution of light power of the CO 2 laser 1 at the focal position reduction, ¬ suppression of variation in the optical power of the CO 2 laser 1 at the focal position 8, ¬ optimization of the moving speed, ¬ optimize the beam spot diameter of CO 2 laser 1 at the focal position 8, for ¬ condensed It is necessary to consider the optimization of the focal length of the lens 4, the optimization of the oscillation wavelength of the CO 2 laser 1, the prevention of adhesion of scattered glass fine powder to the glass substrate, and the like.

In the configuration of FIG. 6, the light of the CO 2 laser 1 is reflected by the mirror 2 and is focused on the surface of the processing glass substrate 7 by the condenser lens 4, and In order to suppress the fluctuation of the optical power and to prevent the scattered glass fine powder from adhering to the glass substrate 7,
The gas is made to flow in the direction from arrow 61 to 62 to protect the CO 2 laser light.

[0005]

However, the above-mentioned waveguide cutting / polishing method has the following problems. (1) When the thickness of the processing glass substrate 7 is thin, it can be processed into a mirror surface state with good verticality. However, when the thickness of the substrate becomes thick (> 0.7 mm), the CO 2 laser light Since the optical power must be high output (> 50 W) and the moving speed must be slow (<1 mm / sec), the upper part of the cut end face is melted by excessive heat energy and sags, resulting in vertical Sex (θ 1 = θ 2 = 90 °)
It was found that the above was not obtained (Fig. 7). When the glass substrate 7 having the thickness t shown in FIG. 7A is to be cut by the CO 2 laser beam 10 along the cutting line 11, for example, FIG.
The cutting example 1 is a case where the optical power is too strong and the moving speed is slow, and the cutting example 2 in FIG. 7C is a case where the moving speed is faster than that of the cutting example 1. In this way, the surface side of the glass substrate is sagged and cut non-vertically.

(2) However, the glass substrate has a cladding layer (thickness 20 to 100 μm) on the surface side, and a core layer (thickness several μm to several tens μm) through which light propagates thereunder. It has been found that when the core layer sags and is cut in a non-vertical manner, it is difficult to connect with the optical fiber and the connection loss increases.

The object of the present invention is to solve the above-mentioned problems of the prior art and to improve the verticality even when the substrate is thick.
An object of the present invention is to provide a method for cutting a glass substrate that can be cut into a mirror surface.

[0008]

[Summary of the first invention, a CO 2 laser beam was irradiated on the glass substrate, when cutting the glass substrate by moving either or glass substrate or CO 2 laser beam Is a method in which a dummy glass substrate is superposed on the glass substrate, CO 2 laser light is irradiated from the dummy glass substrate, and the processing glass substrate is cut into a mirror-finished state with good verticality. .

A second invention is the same as the first invention, except that CO
2 laser light was allowed to pass through the cylinder, it is a method of cutting the glass substrate with flowing gas along the outer periphery of the CO 2 laser beam in the cylinder.

A third aspect of the present invention is the method according to the first or second aspect of the present invention, in which the dummy glass substrate and the processing glass substrate are cut in a fixed state so that they are not separated and blown off during cutting.

A fourth invention is a method according to any one of the first to third inventions, in which a dummy glass substrate is provided with a gap, and a CO 2 laser beam is irradiated along the gap to cut. This gap may be provided halfway through the dummy glass substrate or may reach the back surface.

A fifth aspect of the present invention is the same as the fourth aspect of the present invention, in which C is provided on both side surfaces (gap surface) excluding the bottom surface forming the gap.
A reflective film for reflecting the O 2 laser light is formed.

The glass substrate to which the present invention can be applied is a quartz type (SiO 2 ) or multi-component type (SiO 2 -B 2 O 3-).
Na 2 O) and the like, but it is also possible to apply to a ferroelectric crystal substrate, a compound semiconductor substrate, etc. in addition to the glass substrate.

[0014]

According to the first aspect of the present invention, the glass substrate for dummy has the edge of the cut end face sagging and the verticality is impaired, but the glass substrate for processing has good verticality and can be cut into a mirror state. . In other words, the edge portion of the dummy glass substrate has a long irradiation time, and sagging occurs due to scattering of fine glass powder due to evaporation, and the angle θ 1 becomes 90 ° or more. However, as it goes in the depth direction, the angle approaches 90 °. Therefore, the processing glass substrate under the dummy glass substrate is processed with a value close to 90 ° with good verticality. That is, the end faces of the clad layer and the core layer near the surface of the glass substrate for processing are kept substantially vertical, and it is possible to reduce the connection loss.

According to the second invention, by flowing a gas along the outer periphery of the CO 2 laser beam, it is possible to suppress power fluctuation of the CO 2 laser beam due to a disturbance. Further, since the glass substrate surface is cut while always maintaining a clean atmosphere, the cut end surface can be made into a mirror surface state. Further, it is possible to suppress the temperature rise on the surface of the glass substrate, and it becomes possible to perform a cutting process by making more effective use of light energy.

According to the third aspect of the present invention, by fixing the dummy glass substrate and the processing glass substrate, they are not separated and blown off during cutting. Therefore,
It will be possible to cleanly process the processed substrate without adding extra scratches.

According to the fourth aspect of the invention, the CO 2 laser light is irradiated along the gap formed in the dummy glass substrate, so that the optical power of the CO 2 laser light is reduced or the cutting movement speed is increased. It is possible to raise. In addition, the gap serves as a mark to facilitate the setting of the position of the cutting line.

According to the fifth invention, CO 2 is formed on the gap surface.
By forming the laser light reflection film, the CO 2 laser light can be condensed within the gap width, and the CO 2 laser light can be cut into a mirror surface with better verticality.

[0019]

Embodiments of the method for cutting a glass substrate of the present invention will be described below with reference to the drawings.

(Outline of Examples) FIG. 1 shows a schematic view of an example of a cutting apparatus for carrying out the method for cutting a glass substrate by irradiation of CO 2 laser light according to the present invention. This device uses CO 2
A laser 1, a CO 2 laser light protection cylinder 3 that guides the laser light to the processing glass substrate 7, a mirror 2 that is provided at a corner of the cylinder 3 to change the path of the laser light, and a condenser for collecting the laser light Lens 4 and cylinder 3 provided near the exit of cylinder 3
A gas nozzle 5 for injecting gas toward the outlet is provided therein. Then, a dummy glass substrate 12 to be stacked on the processing glass substrate 7 is prepared.

As a result, the CO 2 laser light output from the CO 2 laser 1 enters the cylinder 3, is reflected by the mirror 2, is condensed by the condenser lens 4, and is then formed into the dummy glass substrate 1.
2 is configured to focus on the surface.

[0022] The gas nozzle 5 along the outer periphery of the CO 2 laser beam as indicated by arrow 61 gas (air, N 2,
Ar, He, O 2 and the like) are caused to flow and the CO 2 laser light is suppressed from fluctuating due to external disturbance. In addition, this gas also has a function of keeping the cutting surface clean at all times, so that the cutting surface can be mirror-finished. Furthermore, the glass substrate surface is CO
(2) The temperature rise due to the heat energy due to laser light irradiation is suppressed, and the effect of cutting with the light energy instead of the heat energy is provided.

The cylinder 3 is for protecting the CO 2 laser light,
It is provided to prevent impurities from adhering to the surfaces of the mirror 2 and the condenser lens 4 and deteriorating the optical characteristics.

The dummy glass substrate 12 is a dummy glass for cutting the processing glass substrate 7 into a mirror surface with good verticality. The dummy glass substrate 12 also helps prevent the adhesion of fine glass powder and impurities to the surface and the cut surface of the processing glass substrate 7.

The material of the dummy glass substrate 12 is substantially the same as the material of the processing glass substrate 7 or a material having a higher softening temperature than that. For example, when a quartz glass substrate is used as the processing glass substrate 7, the same glass substrate is used as the dummy glass substrate 12. When multi-component glass (borosilicate glass such as 7059 glass and 7740 glass manufactured by Corning Glass, lead glass, phosphate glass, etc.) is used for the processing glass substrate 7, the dummy glass substrate 12 is Quartz glass, high silicate glass, etc. are used. The dummy glass substrate 12 is placed on the processing glass substrate 7, and any of the substrates is cut while being fixed by an appropriate means so as not to be separated and displaced during cutting.

(Explanation of Cutting) FIG. 2 shows a schematic view of cutting, (A) before cutting, (B) cut surface of the separated glass substrates 71 and 72 for processing after cutting. Shows the shape of. In (A), the CO 2 laser beam 13 is applied in the AA ′ direction indicated by the cutting line 14. Although the sagging occurs near the edge of the dummy glass substrate 12, the sagging disappears as it goes in the depth direction, and the processing glass substrate 7 has its cut end faces 91 and 92 substantially vertical (θ) as shown in (B). It is cut to 1 〓 θ 2 〓 90 °) and separated into two substrates 71 and 72. Here, the thickness d of the dummy glass substrate 12 is preferably approximately the same as or thinner than that of the processing glass substrate 7. That is, the thickness of the processing glass substrate 7 is usually 0.5 m.
Since the thickness of the dummy glass substrate 12 is about m to 2 mm, the thickness d of the dummy glass substrate 12 may be about 0.2 mm to 1.5 mm.

(Example of Gap Formation) In FIG. 3, two glass substrates 121 and 122 are used as dummy glass substrates, and these are parallel gaps 16 in which the gaps are equidistant in the depth direction.
It is arranged on the processing glass substrate 7 so as to have a (gap width G). This is effective when the optical power of the CO 2 laser beam 13 is made as small as possible or when cutting is performed at the highest moving speed. Further, the two dummy glass substrates 121 and 122 also serve as marks for the cutting line BB'15, which facilitates the position setting of the cutting line when cutting. The gap width G of the gap 16 is C
It is preferable that the value is similar to or smaller than the value of the spot diameter of the O 2 laser beam 13. That is, the dummy substrates 121 and 122 have an optical mask effect.

(Example of forming tapered gap) FIG. 4 shows a dummy glass substrate 12 having a tapered gap 17 in which the gap becomes narrower in the depth direction than the parallel gap shown in FIG.
1 and 122 are provided. Gap G in this case
2 is also preferably a value that is approximately the same as or smaller than the value of the spot diameter of the CO 2 laser beam 13.

(Example of Forming Reflective Film) FIG. 5 shows CO 2 on the tapered gap surfaces of the dummy glass substrates 121 and 122 shown in FIG.
Reflective films 181 and 182 that reflect laser light (for example,
Si or Z made of the same material as the reflective film used for the mirror 2
nSe, Ge, etc.) is formed. The reflective films 181 and 182 allow the CO 2 laser beam 13 to have a gap width G
2 has an effect of condensing the light inside, and as a result, the surface of the processing glass substrate 7 is irradiated with CO 2 laser light having a narrowed spot diameter, which is more vertical and has a mirror surface. Can be cut into

(Specific Example) A core layer (thickness: 10 μm, width: 10 μm) and a clad layer (thickness: 40 μm) actually formed on a quartz glass substrate (thickness: 1 mm) by the above method.
.mu.m) with a relative refractive index difference of 0.25% is cut, and a core diameter of 10 .mu.m and a cladding diameter of 125
A value of 0.2 dB was obtained as a result of measuring the connection loss by connecting optical fibers having a μm and a relative refractive index difference of 0.25%. This value was about the same as the connection loss of 0.12 dB when the optical fiber was connected by polishing the end face of the waveguide by the conventional polishing method.

Further, this cutting method completes the cutting within a few minutes, whereas the conventional method using the dicing and polishing steps takes more than one day. Therefore, the method of this embodiment is overwhelming. The cost can be reduced.

[0032]

【The invention's effect】

(1) According to the glass substrate cutting method of claim 1, since the dummy glass substrate is superposed on the processing glass substrate, the cutting end face has good verticality even if the processing glass substrate is thick, And it can be cut into a mirror surface.
Also, when the processing glass substrate is a glass waveguide,
When an optical fiber is connected to the cut end face of the waveguide, if the end face is sagged, the splice loss is significantly increased. However, since the sag can be eliminated by the cutting method of the present invention, the splice loss should be made extremely small. You can

(2) According to the glass substrate cutting method of the second aspect , by flowing the gas along the outer periphery of the CO 2 laser light, the fluctuation of the CO 2 laser light power due to disturbance can be suppressed. . Further, since the glass substrate surface is cut while always maintaining a clean atmosphere, the cut end surface can be made into a mirror surface state. Further, it is possible to suppress the temperature rise on the surface of the glass substrate, and it becomes possible to perform a cutting process by making more effective use of light energy.

(3) According to the glass substrate cutting method of the third aspect, by fixing the dummy glass substrate and the processing glass substrate, the dummy glass substrate and the processing glass substrate are prevented from being separated and blown off at the time of cutting. Therefore, it is possible to perform a clean cutting process without giving an extra scratch to the processed substrate.

[0035] (4) According to the cutting method of a glass substrate according to claim 4, by which is adapted to irradiate the CO 2 laser light along a gap formed in the dummy glass substrate, a CO 2 laser beam It is possible to reduce the optical power or increase the cutting movement speed. In addition, the gap serves as a mark to facilitate the setting of the position of the cutting line.

[0036] (5) According to the cutting method of a glass substrate according to claim 5, by forming the CO 2 laser beam reflecting film on the gap surface, that condenses the CO 2 laser beam to the gap width It is possible, and it is possible to cut into a mirror surface with better verticality.

[Brief description of drawings]

FIG. 1 is a schematic diagram showing an embodiment of a cutting apparatus for carrying out the glass substrate cutting method of the present invention.

FIG. 2 is an explanatory view of a glass substrate before and after cutting according to this embodiment.

FIG. 3 is an explanatory diagram of a glass substrate having a gap according to this embodiment.

FIG. 4 is an explanatory diagram of a glass substrate having a tapered gap according to this embodiment.

FIG. 5 is an explanatory view of a glass substrate having a reflective film formed on a gap surface according to the present invention.

FIG. 6 is a schematic view of a cutting device for performing a conventional cutting method.

FIG. 7 is an explanatory view of a glass substrate before and after cutting by a conventional cutting method.

[Explanation of symbols]

1 CO 2 Laser 2 Mirror 3 Tube 4 Condensing Lens 5 Gas Nozzle 61 Gas 62 Gas 7 Processing Glass Substrate 8 Focal Position 12 Dummy Glass Substrate

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location C03B 33/08 9041-4G

Claims (5)

[Claims]
1. When cutting a glass substrate for processing by moving a CO 2 laser beam relative to the glass substrate for processing, a glass substrate for dummy is placed on the glass substrate for processing, and a glass for dummy is formed. A method for cutting a glass substrate, in which a glass substrate for processing is cut by irradiating a CO 2 laser beam from above the substrate.
2. The method for cutting a glass substrate according to claim 1, wherein CO 2 laser light is passed through the inside of the cylinder, and C
A method for cutting a glass substrate, in which a glass substrate for processing is cut while flowing a gas along the outer circumference of an O 2 laser beam.
3. The glass substrate cutting method according to claim 1 or 2, wherein when the dummy glass substrate and the processing glass substrate are cut, the glass substrates are cut in a fixed state so as not to be separated and blown off. How to cut a substrate.
4. The glass substrate cutting method according to claim 1, wherein a gap is formed in the dummy glass substrate, and CO 2 laser light is irradiated along the gap. Cutting method.
5. The method of cutting a glass substrate according to claim 4, wherein after forming a gap in the dummy glass substrate, C
A method for cutting a glass substrate, characterized in that a reflective film for reflecting CO 2 laser light is formed on the gap surface before irradiating with O 2 laser light.
JP5125853A 1993-05-27 1993-05-27 Cutting method for glass substrate Pending JPH06335789A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5125853A JPH06335789A (en) 1993-05-27 1993-05-27 Cutting method for glass substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5125853A JPH06335789A (en) 1993-05-27 1993-05-27 Cutting method for glass substrate

Publications (1)

Publication Number Publication Date
JPH06335789A true JPH06335789A (en) 1994-12-06

Family

ID=14920565

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5125853A Pending JPH06335789A (en) 1993-05-27 1993-05-27 Cutting method for glass substrate

Country Status (1)

Country Link
JP (1) JPH06335789A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008063207A (en) * 2006-09-11 2008-03-21 Tosoh Quartz Corp Manufacturing method of quartz glass member, and quartz glass member
DE102010012265A1 (en) * 2010-03-22 2011-11-17 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method and apparatus for separating single sheets from a composite glass sheet

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008063207A (en) * 2006-09-11 2008-03-21 Tosoh Quartz Corp Manufacturing method of quartz glass member, and quartz glass member
DE102010012265A1 (en) * 2010-03-22 2011-11-17 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method and apparatus for separating single sheets from a composite glass sheet
DE102010012265B4 (en) * 2010-03-22 2012-09-06 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for separating individual slices from a composite glass sheet and use of a device therefor

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