JPH06322249A - Polycarbonate resin composition - Google Patents

Abstract

PURPOSE:To prevent the thermal decomposition or hydrolysis of a polycarbonate resin and reinforce, extend, and impart dimensional stability and special functions thereto by compounding it with a specific inorg. filler. CONSTITUTION:A polycarbonate resin is compounded with a basic or strongly acidic inorg. filler coated with 0.1-30% silicon compd. of which at least a part is an organosilicon compd. having an 18C or lower alkyl, cycloalkyl, or aralkyl group and a hydrolyzable group in a wt. ratio of the resin to the filler of (99.5:0.5)-(50:50). An example of the filler is a potassium titanate whisker, and the organosilicon compd. is a silane compd. of the formula (wherein R<1> is 18C or lower alkyl, cycloalkyl, or aralkyl; R<2> is lower alkyl or alkoxyalkyl; and n is 1-3), e.g. an alkyltrialkoxysilane.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polycarbonate resin composition which is heat-stabilized and is provided with a reinforcing effect, a weight increasing effect, a dimensional stability and a special function due to a composite.

[0002]

2. Description of the Related Art Polycarbonate resins are widely used because of their transparency and impact resistance. On the other hand, when higher mechanical strength, heat resistance and dimensional stability are required, inorganic fillers are used. It is actively being combined with.
In particular, many grades prepared by blending polycarbonate resin with glass fiber or carbon fiber are commercially available.

[0003]

However, when the inorganic filler is basic or strongly acidic, it has a high activity for the polycarbonate resin, so that the bridging groups such as the propylidene group of the polycarbonate resin due to thermal oxidation or hydrolysis during kneading. It was difficult to form a composite because it causes cleavage of a bond or a carbonate bond and a decrease in molecular weight.

The following mechanism is presumed for the thermal decomposition process of the polycarbonate resin. (1) Cleavage of bridge bond;

[Chemical 3] In the formula, Φ represents a paraphenylene group.

(2) Cleavage of carbonate bond

[Chemical 4] These thermal decompositions are significantly accelerated by the presence of basic or strongly acidic substances and the presence of water.

The present invention is intended to solve the above problems, and provides a polycarbonate resin composition which is heat-stabilized and which is provided with a reinforcing effect, an increasing effect, a dimensional stability and a special function due to the compounding. The purpose is to

[0007]

In order to achieve the above object, the present invention was coated with 0.1 to 30% by weight of a silicon compound per inorganic filler as an inorganic filler to be blended with a polycarbonate resin. A basic or strongly acidic inorganic filler is used, and an organosilicon compound having an ethylenically unsaturated group and a hydrolyzable group is used as at least a part of the silicon compound.

In the polycarbonate resin composition of the present invention, as the silicon compound, a first organic silicon compound having an ethylenically unsaturated group and a hydrolyzable group, an epoxy group, an alkyl group, a cycloalkyl group and an aromatic group are used. It is particularly preferable in terms of thermal stability to use a combination of a second organosilicon compound having a group selected from the group consisting of group-substituted alkyl groups and a hydrolyzable group.

[0009]

According to the present invention, 0.1 to 3 per inorganic filler is used.
Using a basic or strongly acidic inorganic filler coated with 0% by weight of a silicon compound, and using an organosilicon compound having an ethylenically unsaturated group and a hydrolyzable group as at least a part of the silicon compound. As a result, it is possible to suppress the thermal decomposition and hydrolysis of the polycarbonate and to impart a reinforcing effect, an increasing effect, a dimensional stability and a special function by blending these inorganic fillers.

As already pointed out in the above "Chemical formula 1" and "Chemical formula 2", the cleavage of the bridge bond and the cleavage of the carbonate bond such as the propylidene group of polycarbonate proceed via free radicals (free radicals), Moreover, it proceeds at the interface with the basic or strongly acidic inorganic filler.

The surface of the inorganic filler used in the present invention is coated with an organic silicon compound, and since this organic silicon compound has a hydrolyzable group, it is strongly bonded to the surface of the inorganic filler through a siloxy group. Is chemically bonded to. Therefore, direct contact between the surface of the inorganic filler and the polycarbonate is avoided, and the catalytic decomposition reaction by the surface of the basic or strongly acidic inorganic filler is suppressed. Moreover, this organosilicon compound has an ethylenically unsaturated group together with a hydrolyzable group, and since this ethylenically unsaturated group easily reacts with a free radical (free radical), the propylidene group of polycarbonate, etc. Therefore, the decomposition due to the cleavage of the bridge bond and the decomposition due to the cleavage of the carbonate bond are suppressed.
Further, the coating of the organosilicon compound is hydrophobic, so that the adsorption of water on the surface of the basic or strongly acidic inorganic filler is suppressed, and the promotion of hydrolysis by the adsorbed water is prevented.

It is also important that the inorganic filler used in the present invention is coated with 0.1 to 30% by weight of a silicon compound based on the inorganic filler. When the amount of the silicon compound is less than the above range, it is unsatisfactory in terms of suppressing thermal decomposition and hydrolysis, while even when it is more than the above range, improvement of the effect in terms of suppressing thermal decomposition and hydrolysis cannot be expected. However, the processing cost becomes large, which is disadvantageous.

In the present invention, the silicon compound comprises a first organic silicon compound having an ethylenically unsaturated group and a hydrolyzable group, an epoxy group, an alkyl group, a cycloalkyl group and an aromatic substituted alkyl group. It is particularly preferable from the viewpoint of thermal stability to use a combination of a second organic silicon compound having a group selected from the group and a hydrolyzable group. Although the action of the first organic silicon compound is as described above, the second organic silicon compound has a barrier property at the interface between the inorganic filler and the polycarbonate resin to suppress the decrease in the molecular weight due to the inorganic filler to some extent. Further, the adhesiveness between the inorganic filler and the polycarbonate is increased, and the mechanical strength of the composite material can be improved.

[0014]

Preferred Embodiment of the Invention

[Polycarbonate] The polycarbonate resin used in the present invention is not particularly limited, and various conventionally known polycarbonate resins can be used.

The polycarbonate resin has the general formula

[Chemical 5] A resin having a repeating unit represented by is exemplified.

This polycarbonate resin has the general formula

[Image Omitted] HO-Φ-Y-Φ-OH In the formula, Y is the same as Y in the above-mentioned "Chemical formula 5", and the paraphenylene ring may have a lower alkyl group or a halogen atom. It is a polymer carbonate of a dihydroxydiaryl compound.

Specific examples of the dihydroxydiaryl compound represented by the above formula include bis (4-hydroxyphenyl) methane, 1,1-bis (4-hydroxyphenyl) ethane and 2,2-bis (4-). Hydroxyphenyl) propane, 2,2-bis (4-hydroxyphenyl)
Butane, 2,2-bis (4-hydroxyphenyl) octane, bis (4-hydroxyphenylmethane), 2,2-bis (4-hydroxy-3-methylphenyl) propane,
1,1-bis (4-hydroxy-3-tert-butylphenyl) propane, 2,2-bis (4-hydroxy-3-bromophenyl) propane, 2,2-bis (4-hydroxy-)
3,5-Dibromophenyl) propane, 2,2-bis (4-
Bis (hydroxyaryl) alkanes such as hydroxy-3,5-dichlorophenyl) propane, bis such as 1,1-bis (4-hydroxyphenyl) cyclopentane, 1,1-bis (4-hydroxyphenyl) cyclohexane (Hydroxyaryl) cycloalkanes, 4,4'-
Dihydroxy diphenyl ether, dihydroxy diaryl ethers such as 4,4'-dihydroxy-3,3'-dimethyldiphenyl ether, 4,4'-dihydroxydiphenyl sulfide, 4,4'-dihydroxy-3,3'-dimethyldiphenyl sulfide Dihydroxydiaryl sulfides, 4,4'-dihydroxydiphenyl sulfoxide, 4,4-dihydroxy-3,3'-dimethyldiphenyl sulfoxide, such as dihydroxydiaryl sulfoxides, 4,4'-dihydroxydiphenyl sulfone, 4,4 '
Examples thereof include dihydroxydiarylsulfones such as -dihydroxy-3,3'-dimethyldiphenylsulfone.

Among these polycarbonate resins,
Polycarbonate resins made from 2,2-bis (4-hydroxyphenyl) propane (bisphenol A) are preferred.

Examples of the method for producing the polycarbonate resin include a phosgene method in which bisphenol A and phosgene are reacted or a transesterification method in which bisphenol A and a carbonic acid ester such as diphenyl carbonate are reacted.

[Inorganic Filler] As the inorganic filler, any of basic or strongly acidic inorganic fillers, which have been difficult to mix with a polycarbonate resin, is used. These inorganic fillers may be powder or fibrous. May be Suitable examples are one or more selected from the group consisting of clay, talc, mica, wollastonite, calcium carbonate, aluminum hydroxide, titanium oxide, potassium titanate whiskers and zinc oxide whiskers, but of course It is not limited to these examples.

The organosilicon compound used for the coating treatment of the inorganic filler is one having an ethylenically unsaturated group bonded to a silicon atom and a hydrolyzable group, and a suitable compound is represented by the formula: ¹ n Si (OR ² ) _{4-n In the} formula, R ¹ is a monovalent hydrocarbon group containing ethylenic unsaturation, R ² is a lower alkyl or alkoxyalkyl group, and n is an integer of 1 to 3. The silanes are represented by. Examples of the monovalent hydrocarbon group containing ethylenic unsaturation include a vinyl group, an alkenyl group such as an allyl group, and a vinyl aromatic group such as a styryl group.

Suitable examples of the organosilicon compound are vinyltrialkoxysilanes such as vinyltrimethoxysilane, vinyltriethoxysilane and vinyltri (β-ethoxyethoxy) silane.

The second organic silicon compound used in combination with the first organic silicon compound is a group selected from the group consisting of an epoxy group, an alkyl group, a cycloalkyl group and an aromatic substituted alkyl group, and a hydrolyzable group. And has a barrier property and forms a dense coating on the surface of the filler. The silicon compound has the formula "Formula 2" ^{R 3 m Si (OR 2)} 4-m type, R ³ is the group consisting of epoxy group, an alkyl group, a cycloalkyl group and an aromatic-substituted alkyl group having 18 or less carbon atoms R ² is a lower alkyl group or an alkoxyalkyl group, and m is an integer of 1 to 3.

Suitable examples thereof are epoxytrimethoxysilane, 2-ethylhexyltriethoxysilane, benzyltriethoxysilane, cyclohexyltriethoxysilane and the like.

The coating treatment of the inorganic filler with the silicon compound may be such that a coating of the silicon compound is uniformly formed on the surface of the basic or strongly acidic inorganic filler. The silicon compound is sprinkled in the form of a solution on the mixture, stirred well, and then dried to form a coating. The silicon compound is preferably used in an amount of 0.1 to 30% by weight, particularly 0.5 to 5.0% by weight, based on the inorganic filler. According to a preferred embodiment of the present invention, when a silicon compound is used in combination, the first organic silicon compound and the second organic silicon compound are in the ratio of 1: 0.2 to 1: 5, particularly 1: 0. It is preferred to use it in a weight ratio of 5 to 1: 0.5.

[Polycarbonate Resin Composition] In the present invention, the above-mentioned polycarbonate resin and the surface-treated inorganic filler are mixed in a weight ratio of 99.5: 0.5 to 50:50, particularly 95:10 to 70:30. Blend in the weight ratio of. When the blending amount of the surface-treated inorganic filler is less than the above range, the reinforcing effect by the blending of the filler, the increasing effect, the dimensional stability and the imparting of the special function are insufficient,
If the amount is larger than the above range, the moldability and strength properties will be unsatisfactory.

In blending these, various compounding agents known per se, for example, other inorganic fillers,
Oxidation stabilizer, weather resistance stabilizer, light resistance stabilizer, antistatic agent,
Processing aids, pigments, carbon black and the like may be added in amounts known per se.

The blending can be carried out using a Henschel mixer, Banbury mixer, V type blender, pellet mill, etc., but it can also be carried out by melt kneading in an extruder. Since the decrease in the molecular weight of the polycarbonate resin is significantly promoted by the presence of water, it is important to sufficiently dry the raw materials in advance when subjecting the polycarbonate resin composition to the melt-kneading and melt-molding processing steps. . The resin composition of the present invention thus obtained is excellent in thermal stability, injection molding, extrusion molding, blow molding,
By various means known per se such as plug-assist molding and vacuum molding, various molded products such as building materials, housings, machine parts,
It can be molded into containers and used for various purposes.

In the polycarbonate resin composition of the present invention, the thermal decomposition of the polycarbonate is remarkably suppressed despite the addition of the basic or strongly acidic inorganic filler. This thermal decomposition is confirmed by molecular weight measurement,
Further, it is also confirmed by various methods such as an infrared method, a pyrolysis gas chromatograph method, a mass vector method, an NMR spectrum method and an ESR spectrum method. For example, when a structural change due to thermal decomposition is detected by an infrared spectrum method, the characteristic absorption of a polycarbonate bond (—O—CO—O—) is 1,780.
cm ⁻¹ , and the decrease in polycarbonate bond can be _{detected by} the change in the absorbance ratio (D ₁₇₈₀ / D ₃₀₈₀ ).

[0030]

【Example】

Example 1 Polycarbonate resin (manufactured by Nippon GE Plastics Co., Ltd., trade name Lexan-141) hereinafter referred to as Lexan-141 70 wt% surface-treated potassium titanate whisker (Otsuka Chemical Co., Ltd. trade name Tismo-N) Tismo- 30 wt% referred to as N (however, Tismo-N is coated with 5 wt% decyltrimethoxysilane and 5 wt% vinyltrimethoxysilane on Tismo-N) Processing stabilizer IRGAFOS 168 (CIBA-GEIGY) ) 0.1 wt% was kneaded at 300 ° C. for 30 minutes, and the molecular weight of the polycarbonate before and after kneading was measured. For the molecular weight measurement, the intrinsic viscosity was used, and the viscosity average molecular weight was calculated from the viscosity of the solution dissolved in a methylene chloride solvent. The same experiment was conducted with the weight ratio of Lexan-141 and Tismo-N being 85 wt% and 15 wt%. Further, the same experiment was conducted by setting the kneading temperature to 270 ° C.

Example 2 Lexan-141 70 wt% (85 wt%) Tismo-N 30 wt% (15 wt%) (However, Tismo-N is 5 wt% decyltrimethoxysilane and 3 wt% vinyltris with respect to Tismo-N. (Coated with methoxysilane) IRGAFOS 168 0.1 wt% was kneaded in the same manner as in Example 1 at 300 ° C. and 270 ° C. for 30 minutes.

Comparative Example 1 Lexan-141 70 wt% Tismo-N 30 wt% (however, Tismo-N is untreated) was kneaded in the same manner as in Example 1 at 300 ° C. and 270 ° C. for 30 minutes.

Comparative Example 2 100% by weight of Lexan-141 was kneaded in the same manner as in Example 1 at 300 ° C. for 30 minutes.

Comparative Example 3 Lexan-141 70 wt% glass fiber (Unitika Co., Ltd. Glass Co., Ltd. average fiber length 6
0 μm) 30 wt% was kneaded in the same manner as in Example 1 at 300 ° C. for 30 minutes.
The results obtained are shown in Table 1.

[0035]

[Table 1]

[0036]

EFFECTS OF THE INVENTION According to the present invention, the amount of inorganic filler per inorganic filler is 0.
Organosilicon compound using a basic or strongly acidic inorganic filler coated with 1 to 30% by weight of a silicon compound and having an ethylenically unsaturated group and a hydrolyzable group as at least a part of the silicon compound By using the above, it is possible to suppress the thermal decomposition and hydrolysis of the polycarbonate, and it becomes possible to impart a reinforcing effect, an increasing effect, a dimensional stability and a special function by blending these inorganic fillers.

[Procedure amendment]

[Submission date] September 3, 1993

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be amended] Claims

[Correction method] Change

[Correction content]

[Claims]

Embedded image In the formula, R ¹ n Si (OR ² ) _4-n , R ¹ is an alkyl group having 18 or less carbon atoms, cycloalkyl
A kill group or an aromatic-substituted alkyl group, R ² is lower alkyl or alkoxyalkyl radical, n is claim 1 is an integer of 1 to 3, in a represented by silanes
The resin composition described.

_Embedded image In the formula R ³ m Si (OR ² ) _4-m , R ³ is an epoxy group having 18 or less carbon atoms, and ethyl
A silane group represented by the formula : R ² is a lower alkyl or alkoxyalkyl group, and m is an integer of 1 to 3; The resin composition according to claim 6.

[Procedure Amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0007

[Correction method] Change

[Correction content]

[0007]

In order to achieve the above object, the present invention was coated with 0.1 to 30% by weight of a silicon compound per inorganic filler as an inorganic filler to be blended with a polycarbonate resin. A basic or strongly acidic inorganic filler is used, and as at least a part of the silicon compound, an alkyl group having a carbon number of 18 or less, a cycloalkyl group.
An organic silicon compound having a hydroxyl group or an aromatic substituted alkyl group and a hydrolyzable group is used.

[Procedure 3]

[Document name to be amended] Statement

[Correction target item name] 0008

[Correction method] Change

[Correction content]

In the polycarbonate resin composition of the present invention, as the silicon compound, a first organic silicon compound having an alkyl group and a hydrolyzable group, an epoxy group,
It is particularly preferable in terms of thermal stability to use a combination of a second organic silicon compound having a group selected from the group consisting of and an ethylenically unsaturated group and a hydrolyzable group.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0009

[Correction method] Change

[Correction content]

[0009]

According to the present invention, 0.1 to 3 per inorganic filler is used.
Use of a basic or strongly acidic inorganic filler coated with 0% by weight of a silicon compound, and an alkyl group or a cycloalkyl group as at least a part of the silicon compound.
Alternatively, by using an organic silicon compound having an aromatic-substituted alkyl group and a hydrolyzable group, it is possible to suppress the thermal decomposition and hydrolysis of the polycarbonate, and to enhance the reinforcing effect, the weight increasing effect, and the dimensional stability of the inorganic filler. It is also possible to add special functions.

[Procedure Amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0011

[Correction method] Change

[Correction content]

The surface of the inorganic filler used in the present invention is coated with an organic silicon compound, and since this organic silicon compound has a hydrolyzable group, it is strongly bonded to the surface of the inorganic filler through a siloxy group. Chemically bond to.
In addition, the alkyl group present in the organosilicon compound is not
Provide barrier property at the interface between filler and polycarbonate
It Therefore, direct contact between the surface of the inorganic filler and the polycarbonate is avoided, and the decomposition reaction due to the cleavage on the surface of the basic or strongly acidic inorganic filler is suppressed. Furthermore, above
Coating the serial organosilicon compounds are hydrophobic, adsorption of basic or moisture to the strongly acidic inorganic filler surface is also suppressed, will be blocked even hydrolysis promotion by adsorbed moisture.

[Procedure correction 6]

[Document name to be amended] Statement

[Correction target item name] 0013

[Correction method] Change

[Correction content]

[0013] In the present invention, as the silicon compound, Al
A first organosilicon compound having a kill group and a hydrolyzable group, and a second organosilicon compound having a group selected from the group consisting of an epoxy group and an ethylenically unsaturated hydrocarbon group and a hydrolyzable group. It is particularly preferable to use a combination with a compound in terms of thermal stability. Although the action of the first organic silicon compound are as described above, the second organosilicon compound, these functional
The group suppresses decomposition due to cleavage of the polycarbonate resin
Thus, the decrease in molecular weight due to the inorganic filler can be suppressed to some extent, and the adhesiveness between the inorganic filler and the polycarbonate can be increased to improve the mechanical strength of the composite material.

[Procedure Amendment 7]

[Document name to be amended] Statement

[Correction target item name] 0021

[Correction method] Change

[Correction content]

The organosilicon compound used for the coating treatment of the inorganic filler has a carbon atom bonded to a silicon atom of 18 or less.
Alkyl group, cycloalkyl group or aromatic substituted
A suitable compound having a killed group and a hydrolyzable group is represented by the formula "Chemical formula 1" R ¹ n Si (OR ² ) _4-n , wherein R ¹ is an alkyl group having a carbon number of 18 or less, cycloalkyl
And a substituted alkyl group , R ² is a lower alkyl group or an alkoxyalkyl group, and n is an integer of 1 to 3.

[Procedure Amendment 8]

[Document name to be amended] Statement

[Name of item to be corrected] 0022

[Correction method] Change

[Correction content]

A suitable example thereof is 2-ethylhexyltrier.
Toxysilane, benzyltriethoxysilane, cyclohexyl
Examples include xyltriethoxysilane.

[Procedure Amendment 9]

[Document name to be amended] Statement

[Name of item to be corrected] 0023

[Correction method] Change

[Correction content]

The second organic silicon compound used in combination with the first organic silicon compound is an epoxy group and an ethylenic group.
It has a group selected from the group consisting of unsaturated monovalent hydrocarbon groups and a hydrolyzable group, and adheres to the surface of the filler.
It forms a precise and dense coating. This silicon compound has the following formula: R ³ m Si (OR ² ) _4-m where R ³ is an epoxy group having 18 or less carbon atoms, and ethylene.
A silane represented by a group selected from the group consisting of unsaturated monovalent hydrocarbon groups , R ² is a lower alkyl or alkoxyalkyl group, and m is an integer of 1 to 3. Is good. Monovalent hydrocarbon containing ethylenic unsaturation
As an elementary group, an alkenyl group such as a vinyl group or an allyl group
And vinyl aromatic groups such as styryl groups.
It

[Procedure Amendment 10]

[Document name to be amended] Statement

[Name of item to be corrected] 0024

[Correction method] Change

[Correction content]

Suitable examples of the organosilicon compound include epoxide.
Citrimethoxysilane, vinyltrimethoxysilane, vinyl
Nyltriethoxysilane, vinyltri (β-ethoxyethylene
A vinyltrialkoxysilane such as toxy) silane
It

[Procedure Amendment 11]

[Document name to be amended] Statement

[Correction target item name] 0036

[Correction method] Change

[Correction content]

[0036]

EFFECTS OF THE INVENTION According to the present invention, the amount of inorganic filler per inorganic filler is 0.
A basic or strongly acidic inorganic filler coated with 1 to 30% by weight of a silicon compound is used, and an organosilicon compound having an alkyl group or the like and a hydrolyzable group is used as at least a part of the silicon compound. As a result, it is possible to suppress the thermal decomposition and hydrolysis of the polycarbonate and to impart a reinforcing effect, an increasing effect, a dimensional stability and a special function by blending these inorganic fillers.

[Procedure amendment]

[Submission date] October 1, 1993

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be amended] Claims

[Correction method] Change

[Correction content]

[Claims]

Embedded image In the formula, R ¹ n Si (OR ² ) _4-n , R ¹ is an alkyl group having 18 or less carbon atoms, cycloalkyl
A kill group or an aromatic-substituted alkyl group, R ² is lower alkyl or alkoxyalkyl radical, n is claim 1 is an integer of 1 to 3, in a represented by silanes
The resin composition described.

_Embedded image In the formula, R ³ m Si (OR ² ) _4-m , R ³ is an epoxy group having 18 or less carbon atoms, an amino group,
A group selected from the group consisting of methacryloxy group, vinyl group and hydrocarbon group , R ² is a lower alkyl or alkoxyalkyl group, and m is an integer of 1 to 3,
The resin composition according to claim 6, which is a silane represented by:

[Procedure Amendment 2]

[Document name to be amended] Statement

[Name of item to be corrected] 0003

[Correction method] Change

[Correction content]

[0003]

[SUMMARY OF THE INVENTION However, when an inorganic filler is basic or strongly acidic, due to high activity against a polycarbonate resin, racks etc. Purobiriden groups of the polycarbonate resin by thermal oxidation or hydrolysis during kneading
It is difficult to form a composite because it causes cleavage of a bridge bond or a carbonate bond and causes a decrease in molecular weight.

[Procedure 3]

[Document name to be amended] Statement

[Correction target item name] 0007

[Correction method] Change

[Correction content]

[0007]

In order to achieve the above object, the present invention was coated with 0.1 to 30% by weight of a silicon compound per inorganic filler as an inorganic filler to be blended with a polycarbonate resin. A basic or strongly acidic inorganic filler is used, and as at least a part of the silicon compound, an alkyl group having a carbon number of 18 or less, a cycloalkyl group.
An organic silicon compound having a hydroxyl group or an aromatic substituted alkyl group and a hydrolyzable group is used.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0008

[Correction method] Change

[Correction content]

In the polycarbonate resin composition of the present invention, as the silicon compound, a first organic silicon compound having an alkyl group and a hydrolyzable group, an epoxy group,
It is particularly preferable from the viewpoint of thermal stability to use a combination of a second organosilicon compound having a group selected from the group consisting of an amino group, a methacryloxy group and a vinyl group and a hydrolyzable group.

[Procedure Amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0009

[Correction method] Change

[Correction content]

[0009]

According to the present invention, 0.1 to 3 per inorganic filler is used.
Use of a basic or strongly acidic inorganic filler coated with 0% by weight of a silicon compound, and an alkyl group or a cycloalkyl group as at least a part of the silicon compound.
Alternatively, by using an organosilicon compound having an aromatic-substituted alkyl group and a hydrolyzable group, it is possible to suppress the thermal decomposition and hydrolysis of the polycarbonate, and to enhance the reinforcing effect, the weight increasing effect, and the dimensional stability of these inorganic fillers. It is also possible to add special functions.

[Procedure correction 6]

[Document name to be amended] Statement

[Correction target item name] 0011

[Correction method] Change

[Correction content]

The surface of the inorganic filler used in the present invention is coated with an organic silicon compound, and since this organic silicon compound has a hydrolyzable group, it is strongly bonded to the surface of the inorganic filler through a siloxy group. Chemically bond to.
In addition, the alkyl group present in the organosilicon compound is not
Provide barrier property at the interface between filler and polycarbonate
It Therefore, direct contact between the surface of the inorganic filler and the polycarbonate is avoided, and the decomposition reaction due to the cleavage on the surface of the basic or strongly acidic inorganic filler is suppressed. Furthermore, above
Coating the serial organosilicon compounds are hydrophobic, adsorption of basic or moisture to the strongly acidic inorganic filler surface is also suppressed, will be blocked even hydrolysis promotion by adsorbed moisture.

[Procedure Amendment 7]

[Document name to be amended] Statement

[Correction target item name] 0012

[Correction method] Change

[Correction content]

It is also important that the inorganic filler used in the present invention is coated with 0.1 to 30% by weight of a silicon compound based on the inorganic filler. When the amount of the silicon compound is less than the above range, it is unsatisfactory in terms of suppressing thermal decomposition and hydrolysis, while even when it is more than the above range, improvement of the effect in terms of suppressing thermal decomposition and hydrolysis cannot be expected. However , the physical properties are likely to be deteriorated, the processing cost is increased, and it is disadvantageous.

[Procedure Amendment 8]

[Document name to be amended] Statement

[Correction target item name] 0013

[Correction method] Change

[Correction content]

[0013] In the present invention, as the silicon compound, Al
A first organic silicon compound having a kill group and a hydrolyzable group , and an epoxy group , an amino group, a methacryloxy group and a vinyl group.
It is particularly preferable in terms of thermal stability to use a combination of a second organosilicon compound having a group selected from the group consisting of a nyl group and a hydrolyzable group. Although the action of the first organic silicon compound are as described above, the second organosilicon compound, this
Degradation of these functional groups by cleavage of polycarbonate resin
By suppressing the decrease in molecular weight due to the inorganic filler to some extent, and further increasing the adhesiveness between the inorganic filler and the polycarbonate, it becomes possible to improve the mechanical strength of the composite material.

[Procedure Amendment 9]

[Document name to be amended] Statement

[Correction target item name] 0020

[Correction method] Change

[Correction content]

[Inorganic Filler] As the inorganic filler, any of basic or strongly acidic inorganic fillers, which have been difficult to mix with a polycarbonate resin, is used. These inorganic fillers may be powder or fibrous. May be Suitable examples are clay, talc, mica, wollastonite, calcium carbonate, aluminum hydroxide, titanium oxide, potassium titanate whiskers, zinc oxide whiskers and boro.
It is one or more selected from the group consisting of aluminum acid whiskers and the like , but is not limited to these examples.

[Procedure Amendment 10]

[Document name to be amended] Statement

[Correction target item name] 0021

[Correction method] Change

[Correction content]

The organosilicon compound used for the coating treatment of the inorganic filler has a carbon atom bonded to a silicon atom of 18 or less.
Alkyl group, cycloalkyl group or aromatic substituted
A suitable compound having a killed group and a hydrolyzable group is represented by the formula "Chemical formula 1" R ¹ n Si (OR ² ) _4-n , wherein R ¹ is an alkyl group having a carbon number of 18 or less, cycloalkyl
And a substituted alkyl group , R ² is a lower alkyl group or an alkoxyalkyl group, and n is an integer of 1 to 3.

[Procedure Amendment 11]

[Document name to be amended] Statement

[Name of item to be corrected] 0022

[Correction method] Change

[Correction content]

A suitable example thereof is hexadecyltrimethoxy.
Sisilane, dodecyltrimethoxysilane, decyl trimethyl
Toxysilane, octyltrimethoxysilane, hexato
Limethoxysilane and the like.

[Procedure Amendment 12]

[Document name to be amended] Statement

[Name of item to be corrected] 0023

[Correction method] Change

[Correction content]

The second organic silicon compound used in combination with the first organic silicon compound is an epoxy group, an amino group,
It has a group selected from the group consisting of methacryloxy group and vinyl group and a hydrolyzable group, and has a
It forms an adhesive and dense coating. This silicon compound has the following formula: R ³ m Si (OR ² ) _{4-m wherein} R ³ is an epoxy group having 18 or less carbon atoms, an amino group,
It is preferable that the silane is a group selected from the group consisting of a methacryloxy group and a vinyl group , R ² is a lower alkyl or alkoxyalkyl group, and m is an integer of 1 to 3.

[Procedure Amendment 13]

[Document name to be amended] Statement

[Name of item to be corrected] 0024

[Correction method] Change

[Correction content]

A suitable example of the organosilicon compound is γ-g
Lysidoxypropyltrimethoxysilane, β- (3,4
Epoxycyclohexyl) ethyltrimethoxysilane,
N-phenyl-γ-aminopropyltrimethoxysila
Γ-methacryloxypropyltrimethoxysilane,
Vinyltrimethoxysilane, vinyltris (β-methoxy
(Ethoxy) silane.

[Procedure Amendment 14]

[Document name to be amended] Statement

[Name of item to be corrected] 0025

[Correction method] Change

[Correction content]

The coating treatment of the inorganic filler with the silicon compound may be such that a coating of the silicon compound is uniformly formed on the surface of the basic or strongly acidic inorganic filler. The silicon compound is sprinkled in the form of a solution on the mixture, stirred well, and then dried to form a coating. The silicon compound is preferably used in an amount of 0.1 to 30% by weight, particularly 0.5 to 5.0% by weight, based on the inorganic filler. According to a preferred embodiment of the present invention, when used in combination with silicon compound, and said first organosilicon compound a second organic silicon compound, 1: 0.1 to 1: 10, particularly 1: 0. It is preferred to use it in a weight ratio of 2 to 1: 5 .

[Procedure Amendment 15]

[Document name to be amended] Statement

[Name of item to be corrected] 0030

[Correction method] Change

[Correction content]

[0030]

Example 1 Polycarbonate resin (trade name: Lexan-141 manufactured by Nippon GE Plastics Co., Ltd.) 70 wt% surface-treated potassium titanate whiskers (trade name: Tismo-N manufactured by Otsuka Chemical Co., Ltd.) hereinafter referred to as Lexan-141 ) Hereinafter, referred to as Tismo-N 30 wt% (however, Tismo-N is coated with 5 wt% decyltrimethoxysilane and 5 wt% vinyltrimethoxysilane on Tismo-N) Processing stabilizer IRGAFOS 168 (CIBA -Manufactured by GEIGY) 0.1 wt% was kneaded at 300 ° C for 30 minutes, and the molecular weight of the polycarbonate before and after kneading was measured. Intrinsic viscosity method
Using the viscosity of the solution dissolved in methylene chloride solvent,
The viscosity average molecular weight was calculated. The same experiment was conducted with the weight ratio of Lexan-141 and Tismo-N being 85 wt% and 15 wt%. Further, the same experiment was conducted by setting the kneading temperature to 270 ° C.

[Procedure Amendment 16]

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[Correction target item name] 0036

[Correction method] Change

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[0036]

EFFECTS OF THE INVENTION According to the present invention, the amount of inorganic filler per inorganic filler is 0.
A basic or strongly acidic inorganic filler coated with 1 to 30% by weight of a silicon compound is used, and an organosilicon compound having an alkyl group or the like and a hydrolyzable group is used as at least a part of the silicon compound. As a result, it is possible to suppress the thermal decomposition and hydrolysis of the polycarbonate and to impart a reinforcing effect, an increasing effect, a dimensional stability and a special function by blending these inorganic fillers.

Claims (8)

[Claims] 1. A polycarbonate resin composition containing an inorganic filler, wherein the inorganic filler is 0.1 per inorganic filler.
Is a basic or strongly acidic inorganic filler coated with 30 to 30% by weight of a silicon compound, and at least a part of the silicon compound is an organosilicon compound having an ethylenically unsaturated group and a hydrolyzable group. A polycarbonate resin composition comprising: 2. The inorganic filler is one or more selected from the group consisting of clay, talc, mica, wollastonite, calcium carbonate, aluminum hydroxide, titanium oxide, potassium titanate whiskers and zinc oxide whiskers. The resin composition according to claim 1, which is 3. The resin composition according to claim 1, wherein the weight ratio of the thermoplastic resin to the inorganic filler is 99.5: 0.5 to 50:50. 4. The organosilicon compound is represented by the formula: R ¹ n Si (OR ² ) _4-n , wherein R ¹ is a monovalent hydrocarbon group containing ethylenic unsaturation, and R ² is The resin composition according to claim 1, which is a silane represented by a lower alkyl or alkoxyalkyl group and n is an integer of 1 to 3. 5. The resin composition according to claim 1, wherein the organosilicon compound is vinyltrialkoxysilane. 6. A second organic silicon in which another part of the silicon compound has a group selected from the group consisting of an epoxy group, an alkyl group, a cycloalkyl group and an aromatic substituted alkyl group, and a hydrolyzable group. The resin composition according to claim 1, which comprises a compound. 7. The second organosilicon compound is represented by the formula: R ³ m Si (OR ² ) _4-m , wherein R ³ is an epoxy group having 18 or less carbon atoms, an alkyl group, a cycloalkyl group, and 7. A silane represented by a group selected from the group consisting of aromatic-substituted alkyl groups, R ² is a lower alkyl or alkoxyalkyl group, and m is an integer of 1 to 3. 7. Resin composition. 8. The resin composition according to claim 6, wherein the first organic silicon compound and the second organic silicon compound are present in a weight ratio of 1: 0.2 to 1: 5.