JPH0631619A - Machining method for metal surface - Google Patents

Abstract

PURPOSE:To simply stabilize the reflection characteristic by uniformly coating the solder resist at the preset thickness on a metal surface in the surface machining for unifying the light power of the regular reflected light and the irregular reflected light of a light spot beam fed vertically to the metal surface for the surface of the preset area. CONSTITUTION:Gold or palladium 12 provided with an adhesive 10, a copper foil 11, and lustrous nickel plating as a backing is provided at the preset thickness on a printed board 8 made of glass epoxy resin, for example. Solder resist 30 is coated by screen printing at the film thickness of 5-35mum on the surface of the board 8. The metal surface may be polished several times with a solid rubber containing abrasive grains having the grain size of 10-200mum, or a pit having the surface roughness of about 1mum and the pitch of 10-200mum on the alternating shaped cross section may be pressed for a shape transfer.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for processing a metal surface, and more particularly to a method for processing light power of specular reflection light and diffuse reflection light of a light spot beam vertically incident on a metal surface having high reflectance to a predetermined range. The present invention relates to a method for processing a metal surface so as to obtain each metal surface at a uniform level.

In recent years, a so-called wiring frame (MDF: Main Distributing Frame) for changing the connection between a subscriber cable and an exchange cable due to new installation or relocation of a telephone has been automated. In this automation, the robot replaces MDF jumpers in place of the conventional manual operation. At that time, the robot accurately attaches jumper pins to a large number of conductive difference holes provided on the jumper matrix board. Need to be inserted and removed. The present invention is suitable for the surface treatment of a conductive print pattern on such a matrix board, and an example of automatic MDF will be described below.

FIG. 9 is a diagram for explaining an example of a matrix board section. FIG. 9A is a front view of the matrix board section. In the figure, 10 is a matrix board section, 8 is a printed circuit board, 1 to 4 are reference marks for positioning, 5 is a print pattern section, 6 is a print pattern, and 7 is a print pattern. Are approximately 5000 difference point holes provided in the print pattern portion 5. A robot (not shown) replaces the connection between N subscriber cables and M exchange cables by inserting / removing jumper pins into / from the individual difference holes 7.

FIG. 9B is a partially enlarged view of the print pattern portion. In the figure, C is the center of the difference point hole, and 9 is the difference point hole 7.
It is a jumper pin inserted in. As shown,
The matrix board unit 10 is configured by alternately stacking a printed board having a horizontal (X axis) print pattern and a printed board having a vertical (Y axis) print pattern.

FIG. 9C is a sectional view taken along line AA of FIG. 9B.
8 in the figure₁~ 8₇Printed circuit board, 6₁, 6
₃, 6_Five, 6₇Is the contact terminal on the matrix board side,
9₁, 9 ₂Is a spring contact terminal of the jumper pin 9. Figure
With the jumper pin 9 inserted as shown,
The pair wires A and B on the bull (N) side and the exchange cable (M) side
Pair wires A and B are connected to each other, and a jumper
These are cut when the pin 9 is removed.

FIG. 10 is a view for explaining an example of an optical sensor section, and this optical sensor section functions as an eye when the robot inserts and removes the jumper pin 9. FIG. 10A is a diagram showing the configuration of the optical sensor section, in which 21 is a beam splitter, 22 is a λ / 4 wavelength plate, 23 is a one-dimensional light receiving element array such as CCD, 24 is a condenser lens, and 25 is a condenser lens. Is a single light receiving element such as a photodiode.

The optical sensor unit is roughly moved in advance, for example, on the reference mark 1 by an encoder mechanism unit (not shown). In this optical sensor section, a P-polarized laser spot beam LB having a spot diameter of about 200 μm is scanned in the direction of arrow B,
The P-polarized light becomes circularly polarized light at the λ / 4 wavelength plate 22 and is vertically incident on the surface of the reference mark 1. The reference mark 1 has a high-reflectance metal surface plated with 35 μm thick copper foil and 2 μm thick gold (Au) or palladium (Pd) on a glossy nickel plating as a base, Moreover, fine and uniform irregularities are provided on the surface thereof. Then, the circularly polarized light Rφ ₀ specularly reflected in the vertical direction on the surface of the reference mark 1 becomes S-polarized light by the λ / 4 wavelength plate 22, is further split by the beam splitter 21, and enters the light-receiving element array 23. In this state, the optical power of each scan frame accompanying the fine movement of the optical sensor unit in the X and Y directions is monitored, and the X and Y positions of the reference mark 1 and the rotation about the X, Y and Z axes are image-analyzed. This controls the X, Y position and posture of the robot hand unit (not shown).

On the other hand, the height h of the optical sensor section is controlled by the following method. That is, when the optical sensor portion is at the prescribed height h, the component Rφ _{1 in the} predetermined direction of the light diffusely reflected on the surface of the reference mark ₁ is refracted through the condenser lens 24 as shown in the figure, and the light receiving element 25 Incident on. This reference mark 1
Since the surface properties of R are uniform, a uniform diffuse reflection component Rφ ₁ is obtained over the entire surface thereof, so that substantially constant optical power is always incident on the light receiving element 25. However, when the optical sensor portion is deviated from the specified height h in the direction of arrow C, for example, there is a diffused reflected light component Rφ ₂ of the same optical power as Rφ ₁ also in this direction. The component Rφ ₂ is refracted by the lens 24 as shown in FIG.
It cannot enter 5. In this way, the height (Z position) h of the optical sensor unit is also controlled to be constant. In addition, the above-mentioned operation is performed by the other reference marks 2 to 4 and the print pattern portion 5.
The same is true for.

Thus, it is possible to obtain the optical power of specular reflection light and diffuse reflection light of a light spot beam vertically incident on a metal surface having high reflectance at a uniform level for a metal surface having a predetermined width. It is desired to provide a metal surface processing method that is simple, stable, and excellent in mass productivity. FIG. 10 (B) is a partially enlarged view of the reference mark 1. The roughness of the metal surface that satisfies the requirements of the above example has a ten-point average roughness R.
_Z is 1 μm or less.

[0010]

2. Description of the Related Art Conventionally, gold (Au) or palladium (P
Uniform unevenness was provided by an etching method on the surface of the copper foil or the copper plating before the plating treatment according to d).

[0011]

However, according to the etching method, it takes a long time for the chemical treatment, and the mass productivity is poor. Further, in the etching method, since it is necessary to immerse the entire surface of the printed board in the etching solution, there is an inconvenience that unevenness is provided even inside the difference hole.

An object of the present invention is to obtain the optical power of the regular / diffuse reflected light of a light spot beam vertically incident on a metal surface having a high reflectance at a uniform level for a metal surface having a predetermined width. (EN) It is possible to provide a method of processing a metal surface that is simple, has stable reflection characteristics obtained, and is excellent in mass productivity.

[0013]

According to the processing method of the present invention (1), the optical power of specular reflection light and irregular reflection light of a light spot beam vertically incident on a metal surface having a high reflectance is set to a predetermined range. In the metal surface processing method for obtaining a uniform level for each metal surface, a solder resist having a film thickness of 5 to 35 μm is uniformly applied to the metal surface.

In the processing method of the present invention (2), the optical powers of specular reflection light and irregular reflection light of the light spot beam vertically incident on the metal surface having a high reflectance are uniform on the metal surface having a predetermined width. In the method of processing a metal surface for obtaining a high level, the metal surface is polished plural times with solid rubber containing abrasive particles having a particle diameter of 10 to 200 μm. According to the processing method of the present invention (3), the optical powers of specular reflection light and diffuse reflection light of a light spot beam vertically incident on a metal surface having a high reflectance are uniformly distributed on a metal surface having a predetermined width. In the method of processing a metal surface for obtaining, the shape is transferred by pressing the metal surface with a bit having a ten-point average roughness R _Z of the surface of approximately 1 μm and a pitch of the cross-sectional alternating shape of 10 to 200 μm.

In the processing method of the present invention (4), the optical powers of specular reflection light and irregular reflection light of the light spot beam vertically incident on the metal surface having a high reflectance are uniform on the metal surface having a predetermined width. In a method of processing a metal surface to obtain a high level, the metal surface is polished with a brush in which rigid wire rods having a diameter of 100 to 500 μm are bundled.

[0016]

In the processing method of the present invention (1), the film thickness of 5 to
Since the 35 μm solder resist is uniformly applied to the metal surface, the metal surface can be protected and insulation deterioration can be prevented, and the parallel light flux incident on the metal surface can be colloidal or particle-like existing in the solder resist. Depending on the structure, the optical powers of the specular reflection light and the diffuse reflection light are scattered so as to have a uniform level on a metal surface having a predetermined width.
Moreover, if the thickness of the solder resist is appropriately selected within the range of 5 to 35 μm, the optical power ratio of specular reflection light and diffuse reflection light can be selected as desired.

In the processing method of the present invention (2), since the metal surface is polished a plurality of times with solid rubber containing abrasive particles having a particle diameter of 10 to 200 μm, each time the polishing number is increased, scratches (copper on the metal surface) When the metal surface is relatively soft, such as gold plating applied on the foil, the wrinkles on the metal surface will gradually become finer, randomized, and uniformized. A uniform level of optical power of specular reflection light and irregular reflection light can be obtained.
Moreover, when the number of polishing times exceeds a predetermined number, the regular reflection light Rφ
_Since the optical power ratio (Rφ _i / Rφ ₀ ) between ₀ and the diffusely reflected light Rφ _i changes relatively gently, a metal surface having stable reflection characteristics can be obtained by a simple method.

In the processing method of the present invention (3), the shape is transferred by pressing the metal surface with a bit having a ten-point average roughness R _Z of the surface of about 1 μm and a cross-sectional alternating shape pitch of 10 to 200 μm. , A desired cross-section alternating shape is obtained on the metal surface so that a large amount of optical power is obtained only for the specular reflection light Rφ ₀ and the specific diffuse reflection light component Rφ ₁ , and a bit having a desired cross-section alternating shape is once formed. Then, a metal surface having stable reflection characteristics can be easily mass-produced.

In the processing method of the present invention (4), since the metal surface is polished with a brush (preferably a wide roll brush) in which rigid wire rods having a diameter of 100 to 500 μm are bundled,
As the polishing process progresses, scratches (or wrinkles on the metal surface) on the metal surface are gradually miniaturized, randomized, and made uniform, whereby a uniform level of specular reflection light is obtained for each metal surface having a predetermined size. And, the optical power of diffusely reflected light can be obtained. Moreover, when the polishing process proceeds more than a predetermined amount, the optical power ratio of the regular reflection light Rφ ₀ and the irregular reflection light Rφ _i (Rφ _i /
Since Rφ ₀ ) tends to change relatively gently, a metal surface with stable reflection characteristics can be obtained all at once by a simple method.

[0020]

Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The same reference numerals denote the same or corresponding parts throughout the drawings. FIG. 1 is a diagram for explaining the solder resist coating method of the embodiment. (A) in FIG. 1 in cross-sectional view of a solder resist coating method, printed circuit board 8, for example, a glass epoxy resin in FIG, 1 ₀ thickness 20μ
m adhesive, 1 ₁ of a thickness of 35μm copper foil, 1 ₂ plating gold thickness of about 2μm having a gloss nickel plating as a base (Au) or palladium (Pd), 30 is a solder resist is there.

The solder resist 30 is applied to the printed board by a known screen printing method, dry film method, liquid resist method or the like. In the case of the screen printing method, the solder resist ink is rubbed off with a squeegee through a screen plate, and the solder resist ink is applied on the printed board to a predetermined film thickness within the range of 5 to 35 μm (20 μm in this example). To do. If the accuracy of the film thickness obtained by one screen printing cannot be obtained, the film thickness obtained by one screen printing may be thinned and this may be repeated as many times as necessary. As the solder resist, commercially available products such as GS-1, GSL and GSVC were used. Further, any of heat-drying type ink, heat-curing type ink, ultraviolet ray-curing type ink and the like may be used.

When the dry film method is used, the lower layer carrier film, the intermediate layer photoresist (photosensitive resin) having a film thickness of 5 to 35 μm, and the upper layer protective film sandwiched are removed from the lower layer carrier film. At the same time, it is laminated on a printed board, and a positive or negative exposure film corresponding to each of the differential holes 7 in FIG. 9 is brought into close contact therewith, and the pattern of the differential holes is exposed to ultraviolet rays by a photo tool. After that, the exposure film and the upper protective film are removed, and the photoresist layer in the portion of each difference point hole 7 is dissolved and removed with a predetermined developing solution. According to this method, a desired accurate film thickness can be obtained on a wide range of print patterns in a single coating process.

In the case of the liquid resist method, a photosensitive solder resist ink is formed on the entire surface of the printed board in a thickness of 5 to 35.
After coating so as to have a predetermined film thickness within the range of μm, exposure is performed using a mask film for a difference point hole, and the portion of each difference point hole 7 is dissolved and removed by development. Figure 1 (B)
Is a partial enlarged view of the solder resist layer, and if the thickness of the solder resist 30 is selected within the range of 5 to 35 μm as shown in the figure,
Parallel light flux LB incident perpendicularly on the surface of the gold plating layer 1 _2.
Is scattered by the colloidal or smaller particle structure existing inside the solder resist 30 so that the optical power of the specular reflection light and the diffuse reflection light becomes a uniform level for a metal surface of a predetermined width. To be done. Hereinafter, this point will be described based on experimental data.

FIG. 2 is a diagram showing an example of regular / diffuse reflection detection signals of the solder resist-coated product of the embodiment. The horizontal axis of the diagram is taken on the print pattern 6 as shown in FIG. 9A at appropriate intervals. The sampling position, and the vertical axis represents the distance (mm) from the substrate surface detected based on the detection voltage (V) of the amount of regular and irregularly reflected light and the light receiving power of the light receiving element 25. FIG. 10 shows the print pattern surface of the solder resist-coated product of the example.
As a result of scanning with the optical sensor unit as shown in FIG. 5, the signal of the amount of specular reflection light, the signal of the amount of irregular reflection light and the detection signal of the distance from the substrate surface as shown in the figure were obtained. According to this graph, the specularly reflected light Rφ ₀ and the irregularly reflected light Rφ of the light spot beam LB incident perpendicularly on the surface of the print pattern 6 are shown.
It can be seen that the ratio of the optical power of ₁ is substantially constant, and the optical power of each is obtained at a uniform level over the sampling positions 2 to 4. As a result, the height h of the optical sensor unit is also kept constant. In addition, sampling position 1
The peak signals generated between .about.2 and 4 to 5 are obtained by scanning the end portion of the print pattern 6.

FIG. 3 is a diagram for explaining the reflection characteristics of the solder resist coated product of the embodiment. FIG. 3A is a graph showing the reflection characteristics of the solder resist-coated products of the examples. The horizontal axis of the figure is the solder resist film thickness (μm), and the vertical axis is the regular reflectance (%) and regular / random reflection. It is the S / N (dB) of light. Screen printing of the solder resist 30 was repeated for the first, second and third times, and the film thickness of the solder resist 30 was sequentially changed to inspect the reflection characteristics of the print pattern 6, and as a result, the specular reflectance and specular reflection S / N as shown in the figure were obtained. And diffuse reflection S / N characteristics were obtained. The specular reflectance is (optical power of specularly reflected light Rφ ₀ ) / (optical power of incident light LB) expressed as a percentage, and specular and irregularly reflected light S / N are signals of specularly reflected light and irregularly reflected light, respectively. It is a noise-to-noise ratio.

According to this graph, the solder resist 3
When the film thickness of 0 reaches 46.0 μm, the regular / diffuse reflected light S / N
Are both below 0 dB. That is, most of the incident light LB is absorbed by the solder resist 30. Therefore, the thickness of the solder resist 30 is preferably 5 to 35 μm. As for the variation in the film thickness due to the first screen printing, the average film thickness was 13.6 μm, and the standard deviation σ was 1.4.
μm, maximum film thickness is 15.0 μm, minimum film thickness is 10.0 μm
It was m.

FIG. 3B is a graph showing the results of accelerated tests of the solder resist coated products of the examples. The horizontal axis of the figure is the number of temperature / humidity cycles, and the vertical axis is the regular reflectance (%) and regular / random reflection. It is the S / N (dB) of light. This type of device (printed board)
Although the specified temperature and humidity cycle was added up to 12 cycles, the characteristics of specular reflectance, specular reflection S / N, and diffuse reflection S / N hardly changed.

FIG. 4 is a view for explaining the polishing method using the abrasive particle rubber of the embodiment. FIG. 4A is a sectional view of the abrasive particle rubber polishing method. In the figure, 40 is an abrasive particle rubber (so-called sand eraser), 40 ₁ is a rubber portion, and 40 ₂ is a rubber portion 40 ₁ mixed randomly and uniformly. The abrasive particles have a particle diameter of 10 to 200 μm. The abrasive particle rubber 40 is repeatedly moved in the arrow A and / or B direction on the printed board while applying a constant pressure from the upper surface of the abrasive particle rubber 40 in the arrow C direction. As described above, when the abrasive particle rubber 40 is repeatedly driven in a certain direction (for example, the Y-axis direction of the printed board), a certain abrasive particle 40 ₂
Gold plating that has been carved (or wrinkled) by
Mountain _second surface continues other abrasive particles 40 ₂ results carved again slightly out of phase by, with the overlapping習動number of such predetermined direction, unevenness of the gold-plated surface gradually finer, It will be randomized and uniform.

FIG. 4B is a partially enlarged view of the gold-plated surface. The ten-point average roughness R _Z is 1 μm or less in the direction perpendicular to the moving direction of the abrasive rubber 40 (X-axis direction of the printed board). The face has been obtained. Thus, a gold plating layer 1 parallel light beam incident normal to the _second surface LB its regularly reflected light R [phi] ₀ and the diffuse reflection R [phi] ₁ by random uneven surface at the gold-plated surface topography, the optical power of the R [phi] _i is a predetermined wide The metal surface is scattered to a uniform level.
When the particle size is as small as 10 μm, the resulting irregularities are relatively steep and the average pitch P of the mountains is small. Further, even when the particle diameter is as large as 200 μm, the average pitch P of the peaks becomes smaller as the number of movements is increased, and the irregularities are relatively smooth. Spot shape of incident beam LB (100 to 200 μ
m) and the like to select an appropriate particle size.

FIG. 5 is a diagram showing the reflection characteristics of the abrasive particle rubber polishing product of the embodiment. The horizontal axis of the figure shows the number of polishing, the vertical axis shows the regular reflectance (%) and the S / N (dB of regular / diffuse reflected light). ). As a result of repeating the above-described polishing for 1 to 100 times and inspecting the reflection characteristics, the specular reflectance, specular reflection S / N and irregular reflection S / N characteristics shown in the figure were obtained.

According to this graph, the specular reflection S / N and the irregular reflection S / N are observed after the number of polishing times exceeds the fifth.
It can be seen that the value of becomes stable. Therefore, the number of times of polishing can be roughly determined to be 20, for example, and a mass-produced product having stable reflection characteristics can be obtained also by this. FIG. 6 is a diagram for explaining the shape transfer method by coining of the embodiment.

FIG. 6A is a sectional view of the coining method.
In the figure, reference numeral 50 indicates that the ten-point average roughness R _Z of the surface is about 1 μm and the pitch P of the cross-sectional alternating shape is 10 to 200 μ.
It is the bit selected between m. The cross-sectional alternating shape of the bottom surface of the bit 50 may be, for example, triangular, trapezoidal or sinusoidal. These shapes are formed by a mechanical polishing method, an etching method, or the like. Then, it added a uniform and constant pressing on the entire surface in the direction of arrow C from the upper surface of the bit 50 is transferred in a uniform pressure sectional alternating shape of the bottom surface of the bit 50 to gold-plated layer 1 ₁ of the surface.

FIG. 6B is a partially enlarged view of the gold-plated surface, and the ten-point average roughness R _Z is 1 in the direction of the X axis of the printed board.
An uneven surface of about μm is obtained. Where bit 50
If choose sectional alternating shape for example in a shape such that only the optical power of the positive reflected light R [phi] ₀ and a predetermined irregularly reflected light R [phi] ₁ is obtained many respective parallel light beam incident perpendicularly to the gold-plated layer 1 ₂ of surface Most of the optical power of LB is specularly reflected light Rφ.
₀ and the optical power of the diffusely reflected light Rφ ₁ are branched. If the bottom area of the bit 50 is wide, the shapes can be transferred onto all the print patterns at once.

FIG. 7 is a diagram showing the reflection characteristic of the coined product of the embodiment. The horizontal axis of the figure is the pitch of the cross-section alternating shape, the vertical axis is the regular reflectance (%) and the S / N (dB) of the regular / diffuse reflected light. ). As a test, the reflection characteristics were examined when the cross-sectional alternating shape of the bit 50 was a triangle and the pitch was 50 μm and 150 μm. According to this graph, the characteristics of the regular reflectance and the regular reflection S / N are not sufficiently obtained, but a considerable value is obtained for the irregular reflection S / N. If the cross-sectional alternating shape is trapezoidal or sinusoidal, the component of the specular reflection light Rφ ₀ is increased, and this is considered to improve the characteristics of specular reflectance and specular reflection S / N.

In practice, there is always an alternating cross-sectional shape and pitch on the print pattern suitable for the photodetection structure of the photosensor section, and in particular, the pitch P is 10 in this example.
.About.200 .mu.m, the regular reflection S / N and diffuse reflection light S / N can both be increased if the matching is obtained. FIG. 8 is a diagram for explaining the brush polishing method of the embodiment.

FIG. 8A is a sectional view of the brush polishing method.
In the figure, 60 ₂ has a length of 30 mm and a diameter of 100 2.
A rigid brush wire (for example, carborundum # 800) selected in the range of ˜500 μm, 60 ₁ is a large number of brush wires 60 ₂ having a diameter 6 across a width of 550 mm in the X-axis direction.
Pipes that are tightly bundled and supported / fixed on a circumference of 0 mm,
A roll brush 60 is composed of a pipe 60 ₁ and a brush wire 60 ₂ .

On the printed board, the roll brush 60 rotating clockwise or counterclockwise is moved once or twice or more in the arrow A and / or B directions while applying a constant pressure to the pipe 60 _{1 in the} arrow C direction. Let By doing this, a certain rigid wire rod 60
Was carved by ₂ (or toll was) of the gold plating layer 1 ₁ surface mountain continued results carved again slightly out of phase by other rigid wires 60 _2, the rotation and movement of the roll brush 60 Accordingly, the irregularities on the gold plating surface are gradually made finer, randomized, and uniformed. The diameter of the brush wire 60 ₂ was selected in the range of 100 to 500 μm in consideration of the carborundum length, rigidity, bendability and the like.

FIG. 8B is an enlarged view of a portion of the gold-plated surface. The ten-point average roughness R _Z is 1 in the X-axis direction of the printed board.
An uneven surface of about μm is obtained. Regarding the reflection characteristics of the brush-polished products of the examples, it goes without saying that the reflection characteristics similar to those of the abrasive-particle rubber-polished products of FIG. 5 were obtained. However,
In the case of brush polishing, since the roll brush 60 is rotating, a polishing product having stable reflection characteristics can be obtained in a shorter working time than in the case of polishing abrasive rubber particles.

In each of the above embodiments, the printed pattern surface processing method has been described. However, the present invention is a processing method for obtaining the above-described regular / diffuse reflected light from other general metal surfaces at a predetermined ratio. Can also be applied to.

[0040]

As described above, the present invention has the above-described structure. Therefore, the optical power of the regular / diffuse reflected light of the light spot beam vertically incident on the metal surface having a high reflectance can be obtained for a metal surface having a predetermined width. It is possible to obtain a uniform level for each
It is possible to provide a method for processing a metal surface which is simple and has stable reflection characteristics and is excellent in mass productivity.

[Brief description of drawings]

FIG. 1 is a diagram illustrating a solder resist coating method according to an embodiment.

FIG. 2 is a diagram showing an example of regular / diffuse reflection detection signals of a solder resist-coated product according to an embodiment.

FIG. 3 is a diagram for explaining the reflection characteristics of the solder resist-coated product of the example.

FIG. 4 is a diagram illustrating a polishing method using abrasive particle rubber according to an embodiment.

FIG. 5 is a diagram showing a reflection characteristic of an abrasive particle rubber-polished product of an example.

FIG. 6 is a diagram illustrating a shape transfer method by coining according to an embodiment.

FIG. 7 is a diagram showing the reflection characteristics of the coined product of the example.

FIG. 8 is a diagram illustrating a brush polishing method according to an embodiment.

FIG. 9 is a diagram illustrating an example of a matrix board unit.

FIG. 10 is a diagram illustrating an example of an optical sensor unit.

[Explanation of symbols]

8 Printed circuit board 1 ₁ Copper foil 1 ₂ Gold plating layer 30 Solder resist 40 Abrasive particle rubber 50 bit 60 Roll brush

Claims (4)

[Claims] 1. A metal surface for obtaining the optical power of specular reflection light and diffuse reflection light of a light spot beam vertically incident on a high-reflectance metal surface at a uniform level for each metal surface having a predetermined width. In the processing method of, the metal surface is uniformly coated with a solder resist having a film thickness of 5 to 35 μm. 2. A metal surface for obtaining the optical power of specular reflection light and diffuse reflection light of a light spot beam vertically incident on a high-reflectance metal surface at a uniform level for each metal surface having a predetermined width. In the processing method of 1., the metal surface is polished a plurality of times with solid rubber containing abrasive particles having a particle diameter of 10 to 200 μm. 3. A metal surface for obtaining the optical power of specular reflection light and diffuse reflection light of a light spot beam vertically incident on a metal surface having high reflectance at a uniform level for each metal surface having a predetermined width. In the processing method, the ten-point average roughness (R _Z ) of the surface is approximately 1 μm, and the shape of the metal surface is transferred by pressing the metal surface with a bit having a cross-sectional alternating shape pitch of 10 to 200 μm. Processing method. 4. A metal surface for obtaining the optical power of specular reflection light and diffuse reflection light of a light spot beam vertically incident on a metal surface having high reflectance at a uniform level for a metal surface having a predetermined width. The method for processing a metal surface, wherein the metal surface is polished by a brush in which rigid wires having a diameter of 100 to 500 μm are bundled.