JPH06314893A - Waterproof heat radiation box for housing electric circuit component - Google Patents

Abstract

PURPOSE:To provide a box for housing electric circuit components which is simple and provides all functions, such as heat resistance and waterproof and maintenability. CONSTITUTION:A thick heat sink plate 2 is vertically installed at the upper part of a board 1. A plurality of heat pipes 3 are buried into the thick heat sink plate 2 in the vertical direction and projected upward where radiating fins 4 are installed to the upper parts of the pipes. Furthermore, a water receiving board 7, which constitutes a peripheral wall 8, is mounted to the upper part of the thick heat sink plate 2. A cylinder-shaped cover 10 is removably mounted between the surrounding upper part of the water receiving board 7 and the surrounding wall of the board 1 in water tight in structure. Furthermore, a penetration hole 5 is formed from the upper part of the thick heat sink plate 2 to the lower part while a drain hole 9 or the like is formed in spots of the board 1 and the water receiving board 7, corresponding to the penetration hole 5.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a waterproof heat dissipation box for installing electric circuit parts.

[0002]

2. Description of the Related Art In an electric circuit for controlling electric power, such as a controller for a driving motor of an electric vehicle, a relatively large amount of heat is generated from a power semiconductor element or the like during operation, and this heat is generated by the semiconductor element. This may cause thermal runaway or decrease in reliability, so when installing these parts,
How well to dissipate the generated heat, that is, heat dissipation is one of the important issues.

Further, regarding an electric circuit such as the above-mentioned controller which is likely to have adverse conditions such as infiltration of water after installation, how to ensure waterproofness when installing the parts, that is, waterproofness is also an important issue. Is one.

Further, in the installation of electric circuit parts, it is one of the important issues to install the electric circuit parts so that they can be easily replaced or repaired in case of maintenance or failure.

[0005]

A box for installing electric circuit parts, which has all of the above heat dissipation, waterproofness, and maintainability and has a simple structure, has not yet been provided. For example, if a forced air cooling method using a fan or a forced liquid cooling method using a pump is applied as a method for efficiently dissipating the heat of the power semiconductor element, that is, a cooling method, the configuration becomes complicated or waterproof. There is a problem that the structure becomes difficult. Further, when a heat dissipation method using a heat pipe is applied as another method, the configuration is simplified, but it is usually difficult to provide a waterproof property and good maintainability. The present invention aims to solve such problems.

[0006]

In order to solve the above-mentioned problems, according to the present invention, a heat dissipation thick plate is erected on the upper side of a substrate, and a plurality of heat pipes are vertically arranged on this heat dissipation thick plate. It is embedded and protrudes upward, and heat dissipation fins are provided on top of them, and a water receiving plate that constitutes a peripheral wall is attached to the upper side of the heat dissipation thick plate, and between the upper side of the water receiving plate and the periphery of the substrate. The cylindrical lid is watertightly attached and detached, and a through hole is formed from the upper side to the lower side of the heat dissipation thick plate, and the water is provided at the substrate and the water receiving plate corresponding to the through hole. We propose a waterproof heat dissipation box with holes for electrical circuit parts installation.

Further, in the present invention, in the above structure, it is proposed that one heat radiating thick plate is erected at the center of the substrate.

Further, in the present invention, in the above structure, it is proposed that the substrate is made of aluminum together with the heat dissipation thick plate.

Further, in the present invention, it is proposed that in the above-mentioned structure, a cylindrical wall is formed in the drain hole by burring, and the cylindrical wall is mounted in the through hole of the heat radiating plate.

[0010]

The electric circuit component, particularly the power semiconductor element, is attached to the heat radiating slab by performing a predetermined electrical insulation and thermally coupling it. Further, other components are attached to a heat dissipation thick plate or are attached and installed on a substrate, and a predetermined electric circuit is configured by wiring using a bus bar, an electric wire or the like.

Next, the tubular lid is covered from above through the fins for heat radiation, watertightly mounted between the upper side of the periphery of the water receiving plate and the periphery of the substrate, and fixed with clamps or bolts to a predetermined installation state.

In this installed state, the heat generated in the power semiconductor element during operation is transmitted from the heat-dissipating slab for heat dissipation to the heat pipe, and efficiently by the heat pipe via the heat dissipation fin outside the box. It is released to the outside.

Further, when the box is covered with water in the installed state, the water temporarily collects on the water receiving plate, but it flows into the through hole from the water draining hole and drops, and then passes through the water draining hole of the substrate. It is discharged from the lower side of the box. In this way, the water dropped on the water receiving plate is discharged one after another without staying, so that it is possible to prevent the water from entering the box from the mounting portion of the cylindrical lid and the water receiving plate.

At this time, if a cylindrical wall is formed in the water draining hole of the water receiving plate by burring and the cylindrical wall is mounted in the through hole of the heat radiating plate, the seal between the water receiving plate and the heat radiating plate is sealed. Water can be prevented from entering even when the water becomes loose.

In case of maintenance or failure of the parts in the box,
After releasing the clamps, bolts and the like, the tubular lid body is moved upward and removed to inspect and repair the parts.

An appropriate number of heat-dissipating thick plates can be installed, but at least one heat-dissipating thick plate can be erected and circuit components can be installed on both sides thereof.

Further, by composing the board together with the heat dissipation thick plate with a metal material having a large heat conductivity such as aluminum, the heat dissipation from the heat pipe through the heat dissipation fins and the heat dissipation through the board are also performed. Done.

[0018]

Embodiments of the present invention will now be described with reference to the accompanying drawings. FIG. 1 shows an embodiment of a portion excluding the cylindrical lid in the structure of the waterproof heat dissipation box for installing an electric circuit component of the present invention. (Note that the tubular lid is indicated by a chain double-dashed line.) Also, FIGS. 2 and 3 are cross-sectional views of a state where the tubular lid is mounted, and are line AA and line BB in FIG. 1, respectively. It shows a cross section of a portion corresponding to. Further, FIG. 4 is a diagram for explaining the mounting or removing operation of the tubular lid body by the cross section of the portion corresponding to the line AA in FIG. 1.

In these drawings, reference numeral 1 is a rectangular substrate, and the substrate 1 is made of an aluminum plate. At the center of the substrate 1, a heat dissipation thick plate 2 is provided upright in parallel with the long side. The heat-dissipating thick plate 2 is made of an aluminum plate, and the seven heat pipes 3 are embedded at predetermined intervals so that the upper portions thereof project upward. A common heat radiation fin 4 is provided on top of them.

Through-holes 5 that penetrate vertically are formed between the heat pipes 3 that are embedded in the heat-dissipating thick plate 2, and drainage holes are formed at the portions of the substrate 1 corresponding to these through-holes 5. 6 is formed.

Reference numeral 7 is a water receiving plate forming a peripheral wall 8'having a flange portion 8. The water receiving plate 7 is attached to the upper side of the heat radiating plate 2, and the heat radiating plate 2 is attached. Drain hole 9 at the location corresponding to through hole 5 formed in
Is formed. A side wall 9'is formed below the drain hole 9 by burring, and the side wall 9'is mounted in the through hole 5.

Therefore, the water on the water receiving plate 7 flows into the through hole 5 from the water draining hole 9 and drops inside the heat radiating plate 2, so that the substrate 1
Through the water draining hole 6 of the above and falls downward.

Reference numeral 10 is a tubular lid, and an upper edge 12 having a hanging wall 11 located inside the peripheral wall 8 of the water receiving plate 7 is formed on the upper side of the tubular lid 10, and the lower edge is formed. Is formed with a lower edge 14 having a hanging wall 13 corresponding to the outside of the outer periphery of the substrate 1. The opening 15 surrounded by the upper edge 12 is larger than the planar shape of the heat dissipation fin 4 of the heat pipe 3.

In the above structure, the tubular lid 10 can be attached / detached by passing the heat radiation fin 4 through the opening 15. When the tubular lid 10 is mounted, the watertight packing 16 is interposed between the upper edge 12 and the flange portion 8 of the water receiving plate 7, and the lower edge 14 and the substrate 1
A watertight packing 17 is interposed between the peripheral edges of the above, and in this state, it can be placed in an installed state by fixing with a clamp device or the like (not shown).

A groove 18 is formed on the peripheral edge of the substrate 1 inside the abutting portion of the watertight packing 17, and a drain hole 19 opening to the lower surface of the substrate 1 is formed in a part of the groove 18. ing.

For this reason, if a small amount of water is used, the watertight packing 1
Even if it enters through 7, the water falls into the groove 18 and is discharged from the drain hole 19.

As described above, the heat-dissipating thick plate 2 is provided upright in the central portion of the substrate 1 in parallel with the long sides, and the component installation spaces are formed on both sides thereof. Then, each component is attached and installed on the heat dissipation thick plate 2 or the substrate 1.

For example, reference numeral 20 is a power semiconductor element such as a power transistor, and this semiconductor element 20 is attached to the heat radiating plate 2 by being electrically coupled to the heat radiating plate 2. Reference numeral 21 is a contactor, 22 is a DC-DC converter, and these components are also mounted with the heat radiating thick plate 2 as a supporting member. Reference numerals 23 and 24 respectively denote a condenser and a control board, which are mounted on the board 1.

[0029]

As described above, the present invention has the following effects. The heat generated in the power semiconductor element etc. installed in the box can be efficiently dissipated to the outside through the heat pipe embedded in the heat dissipation thick plate with the power semiconductor element attached, and the heat dissipation is good. In addition, the configuration is simple. In addition, the box lid can be easily removed without being disturbed by the heat radiation fins of the heat pipe, so it is easy to maintain each part installed, and to repair or replace it at the time of failure. Good nature. Moreover, even if the box is covered with water, it can be surely prevented from entering the inside, and the box has a good waterproof property.

Since the present invention has both the effects of, as described above, a relatively large amount of heat is generated at the time of operation and water is adversely affected, such as a controller for a drive motor in an electric vehicle. It is most suitable as a box for installing parts of electric circuits used in devices where conditions are considered.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of a portion excluding a cylindrical lid body in the configuration of the waterproof heat dissipation box for installing an electric circuit component of the present invention.

FIG. 2 is an explanatory view showing a usage state of the waterproof heat dissipation box for installing an electric circuit component of the present invention as a cross section of a portion corresponding to a line AA in FIG.

FIG. 3 is an explanatory view showing a usage state of the waterproof heat dissipation box for installing an electric circuit component of the present invention as a cross section of a portion corresponding to a line BB in FIG. 1.

FIG. 4 is a view showing the operation of mounting or removing the cylindrical lid in the waterproof heat radiating box for installing an electric circuit component of the present invention, taken along the line AA in FIG.
It is explanatory drawing represented as a cross section of the part corresponding to a line.

[Explanation of symbols]

 1 board 2 heat dissipation thick plate 3 heat pipe 4 heat dissipation fin 5 through hole 6 drain hole 7 water receiving plate 8 peripheral wall 9 drain hole 9'cylindrical wall 10 cylindrical lid 11 hanging wall 12 upper edge 13 hanging wall 14 Lower edge 15 Opening 16 Watertight packing 17 Watertight packing 18 Groove 19 Drain hole 20 Power semiconductor element 21 Contactor 22 DC-DC converter 23 Capacitor 24 Control board

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Masatsugu Kobayashi 1-3-1 Shimotsuruma, Yamato-shi, Kanagawa Vehicle Industry Co., Ltd. (72) Inventor Juzo Kawanaka 2-6-1, Marunouchi, Chiyoda-ku, Tokyo No. Furukawa Electric Co., Ltd. (72) Inventor Takashi Murase 2-6-1, Marunouchi, Chiyoda-ku, Tokyo Within Furukawa Electric Co., Ltd.

Claims (4)

[Claims] 1. A heat dissipation thick plate is erected on the upper side of a substrate, and a plurality of heat pipes are vertically embedded in the heat dissipation thick plate so as to project upward, and heat dissipation fins are provided on top of them. , A water receiving plate that constitutes a peripheral wall is attached to the upper side of the heat dissipation thick plate, and a cylindrical lid is detachably and watertightly attached between the upper side of the water receiving plate and the periphery of the substrate. Water radiating for electric circuit parts installation characterized in that through holes are formed from the upper side to the lower side of the thick plate for use, and water drain holes are formed in the parts of the board and the water receiving plate corresponding to these through holes. box 2. The heat-dissipating slab of claim 1 is provided at the center of the substrate.
Waterproof heat dissipation box for installation of electric circuit parts characterized by standing upright 3. A waterproof heat dissipation box for installing electric circuit parts, wherein the board according to claim 1 is made of aluminum together with a heat dissipation thick plate. 4. A drainage hole of the water receiving plate according to claim 1, wherein a cylindrical wall is formed downward by burring, and the cylindrical wall is mounted in a through hole of the heat dissipation thick plate. Waterproof heat dissipation box for circuit parts installation