JPH0630373B2 - Wafer transfer device - Google Patents

Description

The present invention relates to a wafer transfer device used when inserting a wafer into a furnace for heat treatment and chemical treatment.

<Prior Art> Conventionally, when a wafer is subjected to a CVD (Chemical Vapor Deposition) process, a wafer transfer device for transferring the wafer stored in a carrier cassette to a quartz, SiC, or metal boat There are leaf type and collective type. This single wafer type wafer transfer apparatus is an apparatus configured by an orthogonal robot or a mechanism similar to this, and there is one that attaches a vacuum chuck to the hand of the robot and transfers wafers one by one from a carrier cassette to a boat. On the other hand, the batch type wafer transfer device collectively transfers the number of wafers stored in the carrier cassette to the boat.

However, in the case of either of the above two wafer transfer devices, as shown in FIG. 17, since the surface 1a which is the processing surface of the wafers 1, 1 ... There is a problem in that the space occupied by each of the wafers 1, 1, ... Is large, and the number of wafers 1, 1 ,.

Further, when the wafer 1 is subjected to the CVD process, the back surface 1b of the wafer 1 which does not need to be processed is processed, and the back surface 1b has an oxide film,
Since the insulating film is covered, there is a problem in that the number of steps is increased due to the addition of a back surface etching step in a later step.

<Object of the Invention> Therefore, an object of the present invention is to transfer a large number of wafers back to back automatically and quickly at the same time when transferring wafers to a boat, and to transfer wafers safely. It is an object of the present invention to provide a wafer transfer device capable of reducing the number of post-processes of a wafer.

<Structure of the Invention> In order to achieve the above object, the wafer transfer device of the present invention is a cassette table in which a cassette containing wafers arranged in a predetermined forward direction is placed, and a cassette table that moves in one direction, A boat table on which the boat is placed and moves in the one direction, an operation of lifting only the wafer from the cassette in which the wafers are stored from a plane on which the cassette table moves, and the lifted wafers in the lifting direction. Wafer raising and lowering rotation means capable of rotating 180 degrees about the axis of the extending shaft and lowering the lifted wafer and storing it in a cassette; first and second holding members sandwiching the outer periphery of the wafer. A forward direction wafer lifted from the cassette by the wafer elevating and rotating means. The outer periphery of the wafer is sandwiched by the first holding members from both sides, the forward wafers are held and received at a predetermined distance from each other, and further rotated by 180 degrees by the wafer elevating and rotating means, and then the cassette. The reverse wafer lifted from the cassette by the wafer lifting / lowering and rotating means is sandwiched by the second holding members from both sides, and the reverse wafer is held and received in each gap between the forward wafers. A wafer holding means for holding the state in which the forward wafer and the backward wafer are arranged back to back by alternately arranging the forward wafer and the backward wafer, and a holder and a wafer guide attached to the holder. And a driving means for driving the holder and the wafer guide, and the wafer holding means arranges the outer circumference of the wafer arranged back to back to the holder. And a wafer contact means for receiving the wafers arranged back to back from the wafer holding means, and guiding the wafer by the wafer guide to bring the wafers into contact with each other back to back. A table moving means for moving the table on which the holding means and the wafer adhering means are attached onto the cassette and the boat, and a pair of back-to-back wafers are moved from the wafer adhering state to the boat. And a wafer moving means for moving the wafer.

<Operation> A boat table on which an empty boat is placed and a cassette table on which a plurality of cassettes storing wafers arranged in the forward direction are placed are carried to a predetermined position. The wafers housed in half of the cassettes are sequentially lifted above the cassette by the wafer lifting / lowering rotation means, and the wafers are rotated about the axis extending in the lifting direction 18 times.
The direction is changed by 0 degrees.

Next, the wafer whose direction has been changed by 180 degrees is lowered by the wafer raising and lowering rotation means, and is accommodated in the cassette in a state of being arranged in the opposite direction. Next, the table to which the wafer holding means and the wafer contacting means are attached is moved by the table moving means onto a cassette that stores wafers arranged in the forward direction. Next, the wafer elevating and rotating means lifts the wafers arranged in the forward direction from the cassette and stops at a predetermined level in the table. The lifted wafers in the forward direction are held at the wafer holding means by sandwiching the outer periphery from both sides by the first and second holding members which the driving means swings while keeping a predetermined distance from each other. While the wafers arranged in the forward direction are held by the wafer holding means, the table is moved by the table moving means onto a cassette containing the wafers arranged in the reverse direction. The wafers in the reverse direction are lifted by the wafer elevating and rotating means and enter between the wafers in the forward direction.
Thus, the forward wafer and the backward wafer are arranged back to back. Next, by the operation of the driving means, the forward wafer and the backward wafer are moved from the wafer holding means to the wafer contacting means. That is, the wafer holding means sandwiches the outer periphery of the wafers arranged back to back with the holder from both sides. Then, the wafers are guided by the operation of the wafer guide in the wafer contact state, and are brought into close contact with each other back to back. In this way, a set of two back-to-back wafers is produced. This back-to-back wafer is moved to the top of the boat by the platform moving means. Then, the back-to-back wafers are moved by the wafer moving means from the wafer contact means to the boat and stored in the boat.

<Example> Hereinafter, the present invention will be described in detail with reference to illustrated examples.

In FIGS. 1, 2, and 3, 11 is a casing, 12 is attached to the upper surface of the casing 11, a boat table on which the boat 14 is placed and moves along the X direction, and 15 is attached to the upper surface of the casing 11. Disk-shaped wafer 1
8 cassettes 17, 17 ...
A cassette table, which is placed in parallel with each other in two rows and moves along the X direction, is a cassette table 18 that lifts only the wafers 16, 16 ... From a cassette 17 that stores the wafers 16, 16.
A wafer elevating and rotating means for changing the direction by 80 degrees, 21 a drive motor as a table moving means for moving the table 22 mounted on the casing 11 from the cassette 17 to the boat 14, and 30 a control box.

As shown in FIG. 2, the boat table 12 is a rectangular plate material, and the four corners of the bottom surface of the boat table 12 are fitted to the rails 13 and 19 on both sides, and the casing 1
Connection members 34, 34 for guiding the boat table 12 from one end to the other are fixed. In the boat table 12, a rectangular hole 20 is formed at a place where the boat 14 is placed. The boat 14 is, as shown in FIGS.
It is a rectangular plate material. Inside the boat 14, a column-shaped recess 23 having a notched upper half is formed, and a plurality of grooves 24, 24 ... Are formed in the recess 23 at regular intervals along the X direction. The outer peripheral ends of a set of two wafers 16, 16 with their rear surfaces superposed on each other are fitted into the respective grooves 24, 24 of the boat 14 so that the wafers 16, 16 ...
I try to store it inside. A rectangular hole 25 is formed on the bottom surface of the boat 14, and the hole 25 and the boat table 12 are formed.
The holes 20 are aligned with each other.

On the other hand, the cassette table 15 is a rectangular plate material as shown in FIGS.
Connection members (not shown) for guiding the cassette table 15 from end to end of the casing 11 are fixed to the four corners of the bottom surface of the casing along the rails 36 and 37 on both sides. A rectangular hole 26 is formed in the cassette table 15 at a position where the cassette 17 is placed. As shown in FIG. 3, the cassette 17 has a box shape with an open upper surface, and 25 grooves 27 into which the outer peripheral ends of the wafers 16, 16 ... The bottom of the cassette 17 has a rectangular hole 28
To form this hole 28 and the hole 26 of the cassette table 15.
Are supposed to match. When the boat 14 is placed on the boat table 12 and the eight cassettes 17, 17 ... Are placed at predetermined positions on the cassette table 15, the boat 1
4 on both sides of the groove 24, 24 and both sides of the cassette 17, 17 ...
The grooves 27, 27, 27, 27, 27 at both ends of the cassette are substantially aligned on the same line in the Y direction.
All the wafers 16, 16 stored in 7, 17 ... Can be stored in the boat 14 by stacking two wafers.

The drive motor 3 is provided inside the rear end of the casing 11.
1 is provided, and the drive motor 31 is connected with a screw rod 32 extending to a substantially front end portion of the casing 11. Screw rod 3
The tip end of 2 is rotatably supported by a support member 33.
A connecting member 35 for simultaneously moving the boat table 12 and the cassette table 15 is screwed onto the screw rod 32.

The wafer elevating / rotating means 18 is composed of a rectangular wafer support 42, a rotary actuator 43, and a drive motor 45, and is located substantially in the center of the moving line of each row of the cassettes 17 and 17 of the cassette table 15 inside the casing 11. It is provided in the section. A rod member 46 is connected to the rotary actuator 43. The wafer supports 42, 42 are fixed to the tips of the rods 46. On the upper surface of the wafer support 42, V-grooves 29, 29 ... Supporting the wafers 16, 16 ... And grooves 55, 55 ... into which the outer peripheral ends of the wafers 16, 16 ... fit are alternately arranged at regular intervals. 25 pieces are provided. A pulley 47 is attached to the drive motor 45. Another pulley 51 is attached to the base of a screw rod 48 standing upright adjacent to the rod member 46, and a belt 52 connects the two pulleys 47, 51. The connecting member 54 rotatably attached to the rod member 46 is screwed into the screw rod 48 and guided by the guide rod 53. Drive motor 45
The screw rod 48 is rotated by the driving of, and the wafer support 42 is moved up and down via the connecting member 54 and the rod member 46. On the other hand, a drive motor (not shown) is provided in the casing 11 in the substantially central portion on the moving line of the boat table 12. By the rotation of this drive motor,
A wafer support 39 that is moved up and down via a screw rod is provided. On the upper surface of the wafer support 39, 25 grooves 40 into which the two stacked wafers 16 and 16 are fitted are provided at regular intervals.

A vertically long box-shaped casing 11a is provided in the casing 11 near the wafer lifting / lowering rotation means 18. As shown in FIGS. 1 and 4, a box-shaped stand 22 to which a wafer holding means 56 and a wafer contacting means 57 are attached is provided above the casing 11a. The table 22 is composed of a wafer holding section 61 at the center and driving sections 62, 62 on both sides.

The wafer holding means 56 includes a first drive cylinder 58, a second drive cylinder 63, and a first holder 65 as drive means.
And the second holder 66 and the upper, middle and lower hold members 67, 6
8 and 71. The first and second drive cylinders 5
8, 63 and the first and second holders 65, 66 are provided in pairs on the drive units 62, 62 on both sides, and the upper, middle, and lower hold members 67, 68, 71 are the central wafer holding unit 61.
It is provided in. The lower ends of the first holders 65, 65 on both sides support both ends of the upper and lower hold members 67, 71. The upper end of the first holder 65 is attached to the tip of the piston of the first drive cylinder 58. First drive cylinder 5
The tip end of 8 supports the middle part of the first holder 65 of the other stand 22 opposite to the middle shaft 72 rotatably via the bush. The intermediate shafts 72, 72 extend laterally in the drive parts 62, 62 on both sides, and support both ends of the intermediate shaft 72 by bearings. As shown in FIG. 5, the first holder 65 is a long plate member having a U-shaped bent portion that is bent toward the wafer in the middle. As shown in FIGS. 6 and 7, the upper hold member 67 is a long plate member, and the upper hold member 67 has a groove 73 into which the wafer 16 is fitted and a V groove 74 in which the outer peripheral end of the wafer 16 is held. And 25 are alternately provided at regular intervals along the axial direction. On the other hand, the lower hold member 7
As shown in FIGS. 8 and 9, 1 is a long plate member, and the lower hold member 71 has a groove 73 of the upper hold member 67.
Further, a groove 75 and a V groove 76 having the same pitch as the V groove 74 are formed. The depth of the groove 75 of the lower hold member 71 into which the wafer 16 is fitted is equal to that of the groove 73 of the upper hold member 67.
Deeper than. On the other hand, the lower ends of the second holders 66, 66 support both ends of the middle hold member 68 located between the upper and lower hold members 67, 71. The upper end of the second holder 66 is attached to the tip of the piston of the second drive cylinder 63. The base end of the second drive cylinder 63 is attached to the upper end of the second holder 66 of the other stand 22 that faces the second drive cylinder 63. The intermediate portion of the second holder 66 is rotatably supported by the intermediate shaft 72 via a bush. Second holder 6
As shown in FIG. 5, reference numeral 6 is a plate member having a U-shaped bent portion that is bent toward the wafer in the middle. As shown in FIGS. 10 and 11, the middle hold member 68 holds a groove 77 into which the wafer 16 is fitted and a V holding the outer peripheral end of the wafer 16.
The grooves 78 are alternately formed on the upper and lower sides of the lower holding members 67, 71 at the same pitches as the pitches of the grooves 73, 75 and the V-grooves 74, 76, respectively, in the axial direction.
Then, as shown in FIG. 5, the vertical positional relationship of the V grooves 74, 78, and 76 of the upper, middle, and lower hold members 67, 68, 71 is as follows. That is, the V grooves 74 and 76 of the upper and lower hold members 67 and 71 are at positions corresponding to the grooves 77 of the middle hold member 68, and the V grooves 78 of the middle hold member 68 are the upper and lower hold members 67 and 71.
The groove 73, 75 is located at a position corresponding to the groove. Also, the upper, middle and lower hold members 67, 68, 71
The V-shaped grooves 74, 78, and 76 are formed in an arc shape that can follow the outer periphery of the wafer 16.

As shown in FIG. 4, the wafer contact means 57 includes a drive motor 81 as drive means, an upper and lower cylindrical groove cam holders 82 and 83, an upper and lower cylindrical groove cam shafts 85 and 86, and
It is composed of lower cylindrical groove cams 87 and 88 and a third drive cylinder 91. Upper and lower cylindrical groove cam holders 82, 83 and upper,
The lower cylindrical groove cam shafts 85 and 86 and the third drive cylinder 91 are provided in pairs with the drive portions 62 and 62 on both sides of the base 22. On the other hand, the drive motor 81 and the upper and lower cylindrical groove cams 8
7, 88 are provided on the wafer holding part 61 in the central part. Both ends of the lower cylindrical groove cam shaft 86 are supported by the lower ends of the lower cylindrical groove cam holders 83, 83 on both sides via sleeves. Both ends of the lower cylindrical groove cam 88 are connected between the lower cylindrical groove cam shafts 86, 86 on both sides. The upper end of the lower cylindrical groove cam holder 83 is attached to the tip of the piston of the third drive cylinder 91. The base end of the third drive cylinder 91 is attached to the upper end of the lower cylindrical groove cam holder 83 of the other base 22 that faces the third drive cylinder 91. An intermediate portion of the lower cylindrical groove cam holder 83 is rotatably supported by the intermediate shaft 72 via a bush. On the upper part of the lower cylindrical groove cam holder 83, the fourth and fifth
As shown in the figure, the connecting member 95 made of a rectangular plate having the angular projections 93 is fixed. The upper cylindrical groove cam holder 82 is connected to the lower cylindrical groove cam holder 83 by fitting the projection 93 of the connecting member 95 into the hole at the upper end of the upper cylindrical groove cam holder 82 located inside the lower cylindrical groove cam holder 83. The lower ends of the upper cylindrical groove cam holders 82, 82 on both sides support both ends of the upper cylindrical groove cam shafts 85, 85 via sleeves. Both ends of the upper cylindrical groove cam 87 are connected between the upper cylindrical groove cam shafts 85, 85 on both sides. An intermediate portion of the upper cylindrical groove cam holder 82 is rotatably supported by the intermediate shaft 72 via a bush. As shown in FIG. 5, the spring 100 is contracted between the upper and lower cylindrical groove cam holders 82 and 83, and the upper cylindrical groove cam holder 82 is pulled by the lower cylindrical groove cam holder 83 by the spring force of the spring 100. There is. As shown in FIG. 4, a belt 98 is stretched between the drive motor 81 and the sleeve of the intermediate shaft 72, and a belt 98 is stretched between the sleeve of the intermediate shaft 72 and the sleeve of the upper cylindrical groove cam shaft 85. A belt 98 is hung between the sleeve of the shaft 72 and the sleeve of the lower cylindrical groove cam shaft 86 to simultaneously transmit the rotational force of the drive motor 81 to the upper and lower cylindrical groove cam shafts 85 and 86 via the intermediate shaft 72. The upper and lower cylindrical groove cams 87 and 88 are rotated by a predetermined angle. The upper cylindrical groove cam holder 82 has a fifth
As shown in the figure, it is a rectangular plate material, and the lower cylindrical groove cam holder 83 is composed of a rectangular plate material with its axis displaced in the upper part and the lower part in the substantially central part.

On the other hand, the upper and lower cylindrical groove cams 87 and 88 have the same shape, and only the upper cylindrical groove cam 87 will be described below. On the outer periphery of the upper cylindrical groove cam 87,
As shown in FIGS. 3 and 14, fifty Y-shaped V-shaped grooves 102 are formed at regular intervals in the longitudinal direction. The V groove 102 is composed of a forked portion 103 and a confluent portion 104. The bifurcated portion 103 of the V-groove 102 has a circumference of approximately 1
/ 2, and the remaining merged portion 104 occupies approximately 1/2 of the circumference. The forked portion 103 of the V groove 102 of the upper and lower cylindrical groove cams 87, 88 and the upper, middle and lower hold members 6
The positional relationship between the V-grooves 74, 78 and 76 of 7, 68 and 71 is as follows. That is, the upper and lower cylindrical groove cams 87, 8
The two pitches 103, 103 of the V-grooves 102, 102 of 8 are the upper, middle, lower holding members 67, 68, 71.
It corresponds to the one pitch of the V grooves 74, 78, 76.

As shown in FIGS. 1 and 2, a drive motor 21 for the table is arranged at the same level as the table 22 in the upper part of the casing 11a. A screw rod 105 is connected to the drive motor 21, and the tip of the screw rod 105 is rotatably supported by a support member 106 in the casing 11a. Screw rod 105
A connecting member 108 is screwed onto the connection member. Connecting member 108
Is fixed to the back surface of the base 22 and fixed to the projecting member 107 that projects into the casing 11a.

As shown in FIG.
A drive motor 112 having 11 is provided. The roller 111 of the drive motor 112 is used for the wafer 1 in the cassette 17.
.. are in contact with the outer circumferences of. This drive motor 11
By rotating the roller 111 by 2, the flat portions of the wafers 16, 16 ... In the cassette 17 are positioned in a predetermined direction so that the wafers 16, 16 ... Are correctly arranged in the cassette 17.

In the wafer transfer device having the above configuration, the cassettes 17 and 1
The wafers 16, 16 ... Stored in 7 ... Are to be transferred from the cassettes 17, 17. As shown in FIGS. 1 and 2, eight wafers 16 are housed with the wafers 16, 16 ... Arranged in the forward direction, that is, with the surface oriented in one direction (only three are shown in the drawing)
Are placed at predetermined positions on the cassette table 15 on the upper surface of the casing 11. The button of the control box 30 is pressed to operate the drive motor 31. Boat table 12 and cassette table 15
Moves along the X direction. The leftmost cassette 1 in the figure
7 and 17 move to a position where the Y-axis of the cassette 17 and the Y-axis of the wafer support 42 coincide with each other and stop. Wafer support 42 of the second row cassette 17
However, when driven by the drive motor 45, the drive motor 45 moves upward via the pulley 47, the belt 52, another pulley 48, the screw rod 48, the connecting member 54, the guide rod 53, and the rod member 46. At this time,
Since the wafer support 42 moves upward by guiding the connecting member 54 with the guide rod 53, the wafer support 42 can move stably. The wafer support 42 is the hole 2 of the cassette table 15.
6 and the holes 28 in the cassette 17 and through the wafers 16, 1
Only 6 ... is lifted above the cassette 17 and stopped.
The outer peripheral ends of the wafers 16, 16 ... Are held in the grooves 29 of the wafer support 42. The rotary actuator 43 is driven to change the direction of the wafer support 42 by 180 degrees so that the wafers 16, 16 ... The rotary actuator 43 is stopped and the drive motor 45 is driven.
The wafer support 42 has the wafers 16 arranged in the opposite direction,
16 is placed and moved downward, passes through the hole 28 of the cassette 17 and the hole 26 of the cassette table 15, and stops in the casing 11. Also at this time, the wafer support 42 is stably moved downward by the guide rod 53. The wafers 16, 16 ... Are housed in the cassette 17 in a state of being arranged in the opposite direction. The cassette table 15 includes a wafer support 42 and a Y axis of the leftmost cassette 17, 17 driven by the drive motor 31.
It moves until it coincides with the Y-direction axis line and stops. The drive motor 21 for the table 22 is driven. The base 22 is a screw rod 1
05 and the connecting member 108 to move along the Y direction, and stop at a position where the X direction axis of the leftmost cassette 17 in the first row and the X direction axis of the base 22 coincide. The drive motor 45 of the wafer support 42 is driven. The wafer support 42 moves up through the hole 26 of the cassette table 15 and the hole 28 of the cassette 17. Wafer support 4
The outer peripheral end portions of the wafers 16, 16, ...
6 is retained. The wafers 16, 16 ... Are lifted by the upward movement of the wafer support 42, and are stopped by stopping the drive motor 45 at a predetermined position in the table 22. The first drive cylinders 58 on both sides shown in FIG. 4 are simultaneously extended. The first holders 65, 65 swing around the intermediate shafts 72, 72. The upper and lower hold members 67 and 71, whose both ends are fixed to the lower ends of the first holders 65 and 65, respectively,
Insert 16 ... from both sides. As shown in FIG. 5, the V grooves 74 and 76 of the upper and lower hold members 67 and 71 are attached to the wafer 16,
The outer peripheral ends on both sides of the lower part of 16 are held. in this way,
Upper and lower hold members 6 that support the wafers 16, 16 ...
Since both ends of 7, 71 are fixed to the first holders 65, 65, the upper and lower hold members 67, 71 are strong in strength, and can reliably and stably hold the wafers 16, 16. Further, the wafers 16, 16 ...
Since the upper and lower hold members 67 and 71 are held by the first holders 65 and 65 by the driving of 8, 58, the wafers 16, 16 ... Can be held accurately. Next, as shown in FIG. 2, the drive motor 21 for the table 22 is driven.
The table 22 moves along the Y direction, and stops at a position where the X-axis axis of the cassette 17 on the leftmost side of the second row and the X-axis of the table 22 coincide with each other. The drive motor 45 of the wafer support 42 is driven. The wafer support 42 passes through the holes 26 of the cassette table 15 and the holes 28 of the cassette 17, and the wafers 16 arranged in the opposite direction in the cassette 17,
Place 16 ... and move up. As shown in FIG. 5, the wafers 16, 16 ...
Forward wafers 16, 16 supported by 7, 71 ...
Through the gap and the grooves 73 and 75 of the upper and lower hold members 67 and 71, and rises in the opposite direction.
The wafer support 42 is stopped at the position where the axis of 6 ... Aligns with the axes of the wafers 16 in the forward direction. Next, the second drive cylinders 63, 63 simultaneously extend and pinch the wafer, and the wafer support 42 descends.
In this way, the wafers 16, 16 ... In the forward direction and the wafers 16, 16 ... In the reverse direction are alternately arranged. As shown in FIG. 15, the third drive cylinder 91 of the wafer contacting means 57,
91 simultaneously extends. The lower cylindrical groove cam holders 83, 83 on both sides swing around the intermediate shafts 72, 72 and pass through the spaces of the bent portions of the first and second holders 65, 66.
The V-shaped grooves 102, 102 ... Of the lower cylindrical grooved cams 88, 88, both ends of which are supported by the lower cylindrical grooved cam holders 83, 83, are arranged with the back surfaces thereof alternately facing in the forward and reverse directions. Hold the outer peripheral edges on both sides of the lower part of.
On the other hand, the upper cylindrical groove cam holders 82, 82 on both sides are connected to each other by the swinging movement of the lower cylindrical groove cam holders 83, 83.
It swings around the intermediate shafts 72, 72 via 5, 95. The V-grooves 102, 102 ... Of the upper cylindrical groove cams 87, 87, whose both ends are supported, press the wafers 16, 16 ... With the spring force of the spring 100 and support the outer peripheral ends of the upper sides of the wafers 16, 16. To do. First and second holders 65 and 6
5, 66, 66 swing to release the wafer holding. Next, the drive motor 81 of the wafer contact means 57 shown in FIG. 5 is driven. The intermediate shafts 72, 72 on both sides rotate through a belt 98 by a predetermined angle. Upper and lower cylindrical groove cams 87, 87,
88, 88 rotate a predetermined angle via the belt 98. The wafers 16, 16 ... Which are sequentially arranged in the forward direction and the reverse direction are set to Y.
16 are guided by the V-shaped grooves 102, 102 of the V-shaped two-part portion to the grooves 104, 104 of the merging portion, and the back surfaces 16a, 16a of the wafers 16, 16 are closely attached as shown in FIG. As a result, a set of two wafers 16, 16 ... Is produced. In this way, since both ends of the upper and lower cylindrical groove cams 87 and 88 are fixed by the upper and lower cylindrical groove cam holders 82, 82, 83 and 83, the strength is strong and a large number of wafers 16 and 16 at a time. Can handle ... reliably.

Next, the drive motor 21 for the table 22 is driven. The table 22 has the wafers 16, 16 ... Up, the lower cylindrical groove cams 87, 87,
While being held by 88, 88, it moves along the Y direction, and the X direction axis of the base 22 and the wafer support 3 for the boat 14 are held.
It stops at the position where the X-axis of 9 coincides. The drive motor of the wafer support 39 is driven. The wafer support 39 is raised by the rotation of the screw rod, and the boat table 1
, Which is held by upper and lower cylindrical grooved cams 87, 87, 88, 88, through the hole 20 of the boat 2 and the hole 25 of the boat 14, and supports the two stacked wafers 16, 16, 16, 16 ... Stop by stopping. Third drive cylinder 9
1 contracts. Upper and lower cylindrical groove cam holders 82, 8
2, 83, 83 swing around the intermediate shafts 72, 72. The upper and lower cylindrical groove cams 87, 87, 88, 88 are separated from the wafers 16, 16, 16, 16, ... Wafer 16,
16 is the groove 4 of the wafer support 39 at the lower outer peripheral edge.
0, 40 ... Are fitted and supported by the wafer support 39. The drive motor drives. The wafer support 39 is lowered by the rotation of the screw rod in the opposite direction to the above, and the boat support 39 is lowered.
Through hole 25 of 4 and hole 20 of boat table 12,
Stop inside the casing 11. Wafer support 39 supported by wafer support 39 closely attached to each other to form a set of wafers 1
6, 16, 16, 16 ... are the grooves 24, 24 ... of the boat 14.
It is housed in the boat 14 by fitting the outer peripheral ends on both lower sides into the. The above operation is sequentially repeated for each of the cassettes 17, 17 ... And all the wafers 16, 16 ... In the cassettes 17, 17 ... Are transferred to the boat 14. In this way, the back surface of the wafers 16, 16 ...
The upper and lower cylindrical groove cams 87 and 88 attached to
Further, the stacked wafers 16, 16, 16, 16, ... Are held by the upper and lower cylindrical groove cams 87, 88, and the cassette 1
Since the wafers 17, 17, ... Are transferred to the boat 14, the wafers 16, 16, ... Can be transferred with a simple structure, and the cost can be reduced. Also, both ends are upper and lower cylindrical groove cam shafts 85, 85,
86, 86 and upper and lower cylindrical groove cam holders 82, 8
Upper and lower cylindrical groove cams 87 fixed to 2, 83, 83,
Since the wafers 16, 16, ... Are transferred by 87, 88, 88, the strength is strong, and stable transfer of the wafers 16, 16 ,. Further, since the wafers 16, 16 ... Are automatically transferred, a large amount of wafers can be transferred quickly. Further, since the wafers 16, 16 ... In the boat 14 are arranged in a set of two wafers, the wafers 16, 16 ...
Since the space occupied by the wafers is reduced, the number of wafers 16, 16 ... That can be processed at one time can be increased. Also,
Since the back surfaces of the unprocessed wafer 16 are aligned with each other, the back surface of the wafer 16 is not covered with an oxide film or an insulating film. Therefore, the step of etching the back surface of the wafer 16 can be omitted in the subsequent step. Since the wafer 16 is automatically transferred to the boat 14, the transfer operation can be performed quickly and easily, and the amount of dust generated can be reduced.

Next, the processed wafers 16, 16, 1 on the boat 14
It is assumed that 6, 16, ... Are stored in cassettes 17, 17.
In FIGS. 1 and 2, the drive motor 31 is driven. The boat table 12 on which the processed wafers 16, 16, 16, 16 ... Are mounted and the empty cassettes 17, 17 ... The cassette table 15 on which they are mounted moves along the X direction, and the cassettes 17, 17 on the leftmost side in FIG. Stop when the wafer comes over the wafer supports 42, 42. The drive motor 21 for the table 22 is driven. The table 22 moves in the Y direction and stops on the wafer support 39 for the boat 14. Wafer support 3
9 moves up and the two wafers 16, 1 in the boat 14 are stacked.
Lift up 6, 16, 16 ... The third drive cylinder 91 in the table 22 shown in FIG. 4 is extended. The upper and lower cylindrical groove cam holders 82, 82, 83, 83 swing. Up,
.. of the lower cylindrical groove cams 87, 87, 88, 88 at the confluence of the wafers 16, 16, 1,
Holds 6, 16 ... The wafer support 39 descends. The drive motor 81 is driven. The upper and lower cylindrical groove cam shafts 85 and 86 are rotated by a predetermined angle by transmission of the belt 98. The pair of wafers 16, 16, 16, 16 ... Is guided into the V-grooves 102, 102 ... It That is, the wafers 16, 16 ... In the forward direction and the wafers 16, 16 ... In the reverse direction are alternately arranged and separated. The drive motor 21 for the table 22 is driven. Stand 22
2, while holding the wafers 16, 16 ... With upper and lower cylindrical groove cams 87, 87, 88, 88, Y
It moves along the direction and stops on the cassette 17 of the cassette table 15. First and second drive cylinders 58, 5
8, 63, 63 are extended. First and second holders 65,
65, 66, 66 swing around the intermediate shafts 72, 72. Upper, middle and lower hold members 67, 67, 68, 6
The V grooves 74, 75, 76 of 8, 71, 71 hold the wafers 16, 16, ... Held by the upper and lower cylindrical groove cams 87, 87, 88, 88. Upper and lower cylindrical groove cam holder 8
The upper and lower cylindrical grooved cams 87, 87, 88, 88 are separated from the wafers 16, 16, ... The wafers 16, 16 ... In the forward direction are held by the middle holding members 68, 68, while the wafers 16, 1 in the reverse direction are held.
6 are held by upper and lower hold members 67, 67, 71, 71. Next, the wafer support 42 for two rows of the cassette table 15 is moved upward by the drive motor 45. The outer peripheral ends of the wafers 16, 16 ... In the opposite direction are fitted into the V grooves 29, 29 ... Of the wafer support 42. The third drive cylinder 91 of the table 22 contracts. The wafer support 42 moves up. The second drive cylinders 63, 63 contract, and the middle holding members 68, 68 release the holding of the wafers 16, 16. The wafers 16, 16 ... Are held by the wafer support 42. The wafer support 42 is moved downward by driving the drive motor 45. The wafers 16, 16 ... In the reverse direction are stored in the cassette 17 on the leftmost side of the second row of the cassette table 15. The table 22 is driven by the drive motor 21. Stand 22
Moves further in the Y direction and stops on the first left side cassette 17 in the first row. The wafer support 42 is moved upward by driving the drive motor 45. Upper and lower hold members 6
The forward wafers 16, 16, ... Held by 7, 67, 71, 71 fit into the grooves 55, 55. The first drive cylinders 58, 58 are contracted. By swinging the first holders 65, 65, the upper and lower hold members 67, 67, 71, 71 are moved to the wafers 16, 16, ...
Get away from. The wafers 16, 16 ... Are moved from the upper and lower hold members 67, 67, 71, 71 to the wafer support 42 and held. Drive motor 45 for wafer support 42
Is driven. Wafer support 42 descends and cassette 1
It passes through the hole 28 of No. 7 and the hole 26 of the cassette table 15, and stops in the casing 11. Forward wafer 1
6 and 16 are grooves 27 and 2 of the cassette 17 from the boat 14
It is housed in the cassette 17 by being fitted into 7 ... In this way, the sequentially processed wafers 16, 16 ...
It is stored in 7 ... Since the transfer of the wafers 16, 16 ... Is automatically performed in this manner, the wafers can be transferred from the boat 14 to the cassette 17 quickly and safely.

<Effects of the Invention> As described above, the wafer transfer apparatus of the present invention is provided with a cassette table in which a cassette containing wafers arranged in a predetermined forward direction is placed, a cassette table that moves in one direction, and a boat. Is mounted and moves in the one direction, and an operation of lifting only the wafer from the cassette storing the wafer from a plane in which the cassette table moves, and extending the lifted wafer in the lifting direction. A wafer lifting / lowering rotation means capable of rotating the wafer about 180 degrees around the axis and an operation of lowering the lifted wafer and storing it in the cassette, and a wafer driving up / down rotation means to drive the wafer up / down rotation means from the cassette. The lifted forward wafer is received, and further rotated by 180 degrees by the wafer lifting / lowering rotation means. The backward wafers stored in the cassette and then lifted from the cassette by the wafer elevating / rotating means are arranged, the forward wafers and the backward wafers are alternately arranged, and the forward wafers and the backward wafers are placed back to back. Wafer holding means for holding the state of being aligned side by side and wafer adhering means driven by the driving means to receive the wafers arranged back to back from the wafer holding means and bring the wafers into close contact with each other back to back A table moving means for moving a table on which the wafer holding means and the wafer adhering means are attached onto the cassette and the boat, and a pair of back-to-back wafers from the wafer adhering means. Since the wafer moving means for moving to the boat is provided, the wafer holding means and the wafer contacting means have a simple structure. It can be in close contact with the wafer to the back-to-back. Further, according to the present invention, since two wafers are processed in close contact with each other back to back, many wafers can be stored in the boat, and the number of wafers processed at one time can be increased.

Further, according to the present invention, since the back surfaces that do not require treatment are in close contact with each other, the back surface is not covered with the oxide film or the insulating film, and the step of etching the back surface oxide film or the like unlike the conventional example is performed. It can be omitted. In addition, wafers can be automatically transferred from the cassette to the boat. Wafer transfer can be performed easily, quickly and safely.

[Brief description of drawings]

1 is a front view of an embodiment of the present invention, FIG. 2 is a plan view of the above embodiment, FIG. 3 is a side view of the above embodiment, FIG. 4 is a view showing a base of a base moving means, and FIG. FIG. 6 is a view for explaining the operation, FIG. 6 is a view showing an upper hold member of the holding means, FIG. 7 is a view taken along the line VII-VII of FIG. 6, and FIG. 8 is a view showing a lower hold member of the holding means. FIG. 9 is a view taken along the line IX-IX in FIG.
FIG. 0 is a view showing the middle holding member of the holding means, FIG. 11 is a view taken along the line XI-XI of FIG. 10, FIG. 12 is a view showing a cylindrical groove cam of the contact means, and FIG. 13 is a cylindrical groove cam. FIG. 14 is an enlarged view of an essential part of FIG. 14, FIG. 14 is a cross-sectional view taken along the line XIV-XIV of FIG. 12, FIG. 15 is an operation explanatory view, FIG. 16 is a view in which wafers are closely arranged back to back, and FIG. It is a layout plan of an example wafer. 12, 15 ... table, 14 ... boat, 16 ... wafer, 17 ... cassette, 18 ... wafer rotating means, 21 ... stand moving means, 22 ... stand, 56 ... wafer holding means, 57 ... ... Wafer contact means, 58, 63, 91 ... Drive means.

Claims (1)

[Claims] 1. A cassette table in which a cassette containing wafers arranged in a predetermined forward direction is placed and moves in one direction; and a boat table in which a boat is placed and moves in the one direction. An operation of lifting only the wafer from the cassette in which the wafer is stored from a plane on which the cassette table moves, an operation of rotating the lifted wafer by 180 degrees around an axis extending in the lifting direction, and the lifting. Wafer raising and lowering rotation means capable of lowering the wafer and storing it in a cassette, first and second holding members sandwiching the outer periphery of the wafer, and driving means for rocking the first and second holding members. And the outer periphery of the forward direction wafer lifted from the cassette by the wafer elevating and rotating means is sandwiched from both sides by the first holding member, The wafers are held and received at a predetermined distance from each other, further rotated by 180 degrees by the wafer elevating and rotating means, housed in a cassette, and then lifted from the cassette by the wafer elevating and rotating means. The outer periphery of the wafer is sandwiched by the second holding members from both sides, and the backward wafers are held and received in the gaps between the forward wafers, and the forward wafers and the backward wafers are alternately arranged to form the forward wafers. A wafer holding means for holding a state in which the directional wafer and the reverse wafer are arranged back to back, a holder and a wafer guide attached to the holder,
A wafer having the holder and a driving means for driving the wafer guide, and the wafer holding means arranged back to back with the outer circumference of the wafer sandwiched by the holder from both sides, and the wafer holding means arranged back to back. Further, a wafer contact means for guiding the wafer by the wafer guide and contacting the wafers back to back with each other, a wafer holding means, and a base to which the wafer contact means are attached are mounted on the cassette and the boat. A wafer transfer device comprising: a table moving means for moving the wafer to the top of the table; and a wafer moving means for moving the pair of back-to-back wafers from the wafer contacting means to the boat.