JPH06302936A - Formation of conductor pattern for glass substrate - Google Patents

Abstract

PURPOSE:To provide a conductor pattern forming method of a glass substrate excellent in heat resistance wherein sufficient adhesion is obtained at a low cost, and film quality does not change, by a method wherein the glass plate surface is subjected to sand blast, the surface is roughened by patterning, and only the roughened surface is plated with metal. CONSTITUTION:The manufacturing method of a glass substrate consists of the following; a process for forming a resist pattern 2A on a glass plate 1, a process for roughening the resist patter 2A by sand blast, and forming a pattern having an uneven surface 3 on the glass plate 1, a process for giving and activating catalyst 5 for electroless metal plating to the glass plate, and a process for performing electroless plating on the pattern having the uneven surface 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a conductor pattern on a glass substrate which is inexpensive and has heat resistance.

[0002]

2. Description of the Related Art Conventionally, there have been the following two general methods for forming a conductor pattern on a glass substrate. (1) A clean glass substrate is patterned with a resist using a photolithography process, a conductor film is formed by a vapor deposition method, a sputtering method, or the like, and patterned.

This method will be described with reference to the flowchart of FIG. First, a glass plate is set (step S1) and preheated (step S2). next,
A resist is applied (step S3) and heated (step S4). Next, the resist is exposed (step S
5) and develop (step S6). Next, a conductor pattern is formed by vapor deposition or sputtering (step S7), and the resist is peeled off (step S8).

(2) I patterned on the glass substrate
By applying a catalyst to the TO film, performing electroless Ni plating, and further performing Au plating on the Ni plating,
A conductor film is formed and patterned. This method will be described with reference to the flowchart of FIG. First, a glass plate is set (step S11), and an ITO film is formed on the entire surface of the glass plate by vapor deposition or sputtering (step S12). Next, a resist is applied (step S1
3), the resist is exposed (step S14) and developed (step S15).

Next, the ITO film is etched (step S16) to form an ITO film pattern (step S1).
7). Next, the resist is peeled off (step S18), the glass plate is dried (step 19), and then the glass plate surface is cleaned (step S20). After cleaning, wash with water. Next, the surface of the glass plate is activated (step S
21).

Next, pre-dip of the glass plate (step S22) is performed. Next, a catalyst for electroless metal is applied to the glass plate (step S23). After applying the electroless metal catalyst, it is washed with water. Next, the electroless metal catalyst is activated (step S24). Next, electroless Ni plating is applied (step S25), and finally Au plating is applied on the Ni plating (step S26).

[0007]

However, both the above-mentioned conventional method for forming a conductor pattern on a glass substrate (1) and (2) require a vacuum process, and therefore, a large-area glass substrate can be manufactured. It becomes expensive, and heat resistance is low for vapor deposition and sputtered films. Further, in the conventional method (2) for forming a conductor pattern on a glass substrate, the formation and patterning of the ITO film is expensive, and further, it is necessary to perform Ni plating on the ITO film, and then Au plating or the like. However, the Ni component diffuses into the upper Au metal film after the high temperature process and changes the quality of the outermost metal film.

The present invention has the above-mentioned problem of high price,
In order to eliminate the problem of diffusion to the upper metal film of the underlying metal film due to the high temperature atmosphere, the glass surface is patterned by sandblasting to roughen the surface, and metal plating is performed only on this roughened surface. It is an object of the present invention to provide a method for forming a conductor pattern on a glass substrate, which has excellent heat resistance and which does not cause a change in film quality, with excellent adhesion.

[0009]

In order to achieve the above object, the present invention provides a method for forming a conductor pattern on a glass substrate, which comprises the steps of forming a resist pattern on a glass plate and roughening the resist pattern by sandblasting. A step of forming a pattern having an uneven surface on the glass plate, a step of applying and activating an electroless metal plating catalyst to the glass plate, and a step of performing electroless metal plating on the pattern having the uneven surface It is something that is applied.

[0010]

According to the present invention, as shown in FIG. 1, the surface of the glass plate 1 is patterned with a resist 2 and the surface of the glass plate 1 is roughened by sandblasting to form a pattern having an uneven surface 3. Then, the smooth surface 4 of the glass plate 1 surface
And the uneven surface 3 by utilizing the difference in the adhesion of the catalyst to the uneven surface 3.
Only by applying and activating the electroless metal plating catalyst 5,
Electroless metal plating 6 is applied to the pattern having the uneven surface 3.

Therefore, the roughened concavo-convex surface makes it possible to widen the adhesion area, obtain a sufficient adhesion at a low cost, and form a conductor pattern of a glass substrate having good heat resistance without causing a change in film quality. can do. Further, the depth of the uneven surface is preferably 2 μm or less. The electroless metal plating will be sequentially deposited from the concave portion of the uneven surface, and if the uneven surface becomes too deep, it becomes a metal plating smallpox shape, and it is difficult to achieve uniform adhesion and the adhesion is also reduced. There is a risk of

[0012]

Embodiments of the present invention will be described in detail below with reference to the drawings. FIG. 1 is a sectional view showing a step of forming a conductor pattern on a glass substrate showing an embodiment of the present invention, and FIG. 2 is a flowchart showing a step of forming a conductor pattern on a glass substrate showing the embodiment of the present invention.

An outline of the process for forming a conductor pattern on a glass substrate showing an embodiment of the present invention will be described below. First, Fig. 1
As shown in (a), a clean glass plate 1 is set.
Next, as shown in FIG. 1B, a resist 2 is applied to the glass plate 1. Next, as shown in FIG. 1C, the resist 2 is exposed to light, and the exposed resist 2 is developed to form a resist pattern 2A in which the surface of the glass plate 1 is exposed only where the conductor film is attached.

Next, as shown in FIG. 1 (d), the surface of the glass plate 1 exposed by sandblasting is cut to roughen the surface of the glass plate 1 to form an uneven surface 3. Next, as shown in FIG. 1E, the resist pattern 2A is peeled off to form the uneven surface 3 and the smooth surface 4. Next, FIG.
As shown in (f), the surface of the glass plate 1 is activated, the glass plate 1 is pre-dipped, and the catalyst 5 for electroless metal plating is applied to the glass plate 1.

Next, as shown in FIG. 1 (g), the electroless metal plating catalyst 5 is activated to form electroless metal plating 6 on the roughened surface of the roughened glass plate 1. Give. Since the smooth surface 4 of the glass plate 1 is not plated with metal, it can be patterned. Next, details of the step of forming a conductor pattern on a glass substrate showing an example of the present invention will be described with reference to FIG.

First, as shown in step S31, a clean glass plate is set. Next, as shown in step S32, the clean glass plate is preheated (heated at about 80 ° C. for 10 minutes) to warm the glass plate. Next, as shown in step S33, a dry film pressure bonding machine is used to resist the glass plate (Odeal BF-
201) is thermocompression bonded.

Then, as shown in step S34, the glass plate is heated again (heating at about 80 ° C. for 5 minutes). Next, as shown in step S35, the resist is exposed. Next, as shown in step S36, the exposed resist is developed, and the resist is peeled off only where the conductor film is attached.

Next, as shown in step S37, after forming a patterned resist on the surface of the glass plate, the pattern portion is cut by sandblasting to roughen the surface of the glass plate. Here, as the sand (powder), Fuji random (Fuji Seisakusho) # 1500 was sprayed at a spray pressure of 5 Kg / cm ² , and the glass plate surface was processed until irregularities of about 1 μm were formed on the glass plate surface. .

Next, as shown in step S38, the resist is stripped. Next, as shown in step S39,
Dry the glass plate. Next, as shown in step S40, in order to remove (degrease) fingerprints, sands, and resist residues on the surface of the glass plate, the surface of the glass plate is cleaned by immersing it in an alkaline chemical. After cleaning, wash with water to remove chemicals.

Next, as shown in step S41, the glass plate surface is activated. That is, the glass plate surface is lightly etched by immersing it in a chemical to expose a clean glass plate surface. After activating the glass plate surface, it is washed with water to remove the drug. Next, as shown in step S42, the glass plate is pre-dipped. Next, step S
As shown at 43, a catalyst for electroless metal is applied to the glass plate. After applying the catalyst, it is washed with water.

Next, as shown in step S44, the catalyst is activated. Next, as shown in step S45, electroless metal plating is applied to the roughened surface of the glass plate surface roughened in step 37. Since the smooth surface of the glass plate is not plated with metal, it can be patterned. Although the process of metal plating is slightly different depending on the desired metal, basically, the surface of the glass plate is degreased (step S40) and activated (step S41) for electroless metal plating. A catalyst is added (step S43). Then, the catalyst is activated (step S44) and desired electroless metal plating is performed (step S45).

Here, the case of Ni plating will be described as an example of the electroless metal plating in step 45. First, ultrasonic waves are applied to an ITO cleaner (Okuno Pharmaceutical Co., Ltd.) to degrease it (step S40), and then the glass plate surface is activated with an ITO reducer (Okuno Pharmaceutical Co., Ltd.) (step S41). Furthermore, pre-dip (step S42) with ITO-SAL (manufactured by Okuno Seiyaku), and then ITO
-Catalyst (Okuno Pharmaceutical Co., Ltd.) and ITO-SAL (Okuno Pharmaceutical Co., Ltd.) are used to apply the catalyst (step S43). Finally, the catalyst is activated (step S44) with an ITO accelerator (Okuno Pharmaceutical Co., Ltd.), and electroless Ni plating is applied.

In this way, the glass plate can be plated with Ni. In addition, when heat resistance is secured and wire bonding is performed in a later step, after roughening the surface of the glass plate, a catalyst for electroless Au plating is added, and Au plating is performed, there is no change in film quality. It is possible to stably wire bond. Further, it is possible to improve the adhesion by performing annealing after plating.

Further, the depth of the uneven surface described above is 1 to 2 in consideration of the uniform adhesion and adhesion strength of the electroless metal plating.
About μm is good. Further, electroless Cu plating may be applied instead of electroless Ni plating or electroless Au plating. It should be noted that the present invention is not limited to the above-described embodiments, and various modifications can be made based on the spirit of the present invention, and they are not excluded from the scope of the present invention.

[0025]

As described above in detail, according to the present invention, the glass plate surface is patterned with a resist, and the glass plate surface is roughened by sandblasting to form a pattern having an uneven surface. Then, by utilizing the difference in the adhesion of the catalyst to the smooth surface of the glass plate surface and the uneven surface, the catalyst for electroless metal plating is applied and activated only on the uneven surface to form the electroless metal on the pattern having the uneven surface. Since the plating is carried out, it is possible to form a conductive pattern of a glass substrate which is inexpensive, provides sufficient adhesion, does not cause a change in film quality as in the conventional case, and has good heat resistance.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a process for forming a conductor pattern on a glass substrate showing an example of the present invention.

FIG. 2 is a flow chart showing a process for forming a conductor pattern on a glass substrate showing an embodiment of the present invention.

FIG. 3 is a flowchart showing a conventional conductor pattern forming process for a first glass substrate.

FIG. 4 is a flowchart showing a conventional conductive pattern forming process for a second glass substrate.

[Explanation of symbols]

 1 glass plate 2 resist 2A resist pattern 3 uneven surface 4 smooth surface 5 catalyst for electroless metal plating 6 electroless metal plating

Claims (1)

[Claims] 1. (a) a step of forming a resist pattern on a glass plate; (b) a step of roughening the resist pattern by sandblasting to form a pattern having an uneven surface on the glass plate; (c) the glass. Add a catalyst for electroless metal plating to the plate.
A method for forming a conductor pattern on a glass substrate, which comprises performing an activating step and (d) a step of performing electroless metal plating on the pattern having the uneven surface.