JPH06224604A - High frequency signal line - Google Patents

High frequency signal line

Info

Publication number
JPH06224604A
JPH06224604A JP5027378A JP2737893A JPH06224604A JP H06224604 A JPH06224604 A JP H06224604A JP 5027378 A JP5027378 A JP 5027378A JP 2737893 A JP2737893 A JP 2737893A JP H06224604 A JPH06224604 A JP H06224604A
Authority
JP
Japan
Prior art keywords
line
ground
signal line
frequency signal
high
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5027378A
Other languages
Japanese (ja)
Other versions
JP3282870B2 (en
Inventor
Fumio Miyagawa
Kinji Nagata
文雄 宮川
欣司 永田
Original Assignee
Shinko Electric Ind Co Ltd
新光電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
Application filed by Shinko Electric Ind Co Ltd, 新光電気工業株式会社 filed Critical Shinko Electric Ind Co Ltd
Priority to JP02737893A priority Critical patent/JP3282870B2/en
Publication of JPH06224604A publication Critical patent/JPH06224604A/en
Application granted granted Critical
Publication of JP3282870B2 publication Critical patent/JP3282870B2/en
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=12219388&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JPH06224604(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Anticipated expiration legal-status Critical
Application status is Ceased legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for

Abstract

PURPOSE:To prevent production of parasitic resonance due to a high frequency signal propagated through a signal line by reducing an interval between simulated ground walls comprising plural viae arranged to both sides of signal lines to be narrow so as to increase the parasitic resonance frequency of the signal line. CONSTITUTION:Lots of viae 500 comprizing metallized conductor poles or the like connecting ground lines 30a, 30b and a ground plane 40 are provided to insulation boards 20 just beneath the ground lines 30a, 30b while allowing the viae to approach the signal line 10 at a small pitch. The interval between simulated ground walls 502 comprising lots of the vias 500 arranged at both sides is reduced to increase the parasitic resonance frequency of the signal line 10. Furthermore the pitch of the viae 500 being components of the simulated ground walls 502 is reduced to prevent it that the high frequency signal propagated through the signal line 10 is leaked to the outside of the viae 500 being components of the simulating ground walls 502 through gaps among the viae 500.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【産業上の利用分野】本発明は、10GHz以上等の高周波信号を伝える高周波用信号線路に関する。 The present invention relates to a high-frequency signal transmission line for transmitting a high frequency signal, such as more than 10 GHz.

【0002】 [0002]

【従来の技術】上記高周波用信号線路として、従来より、図3に示したような、信号線路が知られている。 2. Description of the Related Art As the high-frequency signal transmission line, conventionally as shown in FIG. 3, the signal line is known.

【0003】この信号線路は、セラミック等の誘電体からなる絶縁基板20表面に、信号線路10を備えて、その信号線路10両側の絶縁基板20表面に、グランド線路30a、30bを信号線路10と平行に並べて備えている。 [0003] The signal line is on the insulating substrate 20 surface made of a dielectric such as ceramic, and a signal line 10, the insulating substrate 20 surface of the signal line 10 on both sides, the ground lines 30a, 30b and the signal line 10 and a side-by-side in parallel. それと共に、信号線路10下方の絶縁基板20裏面に、グランドプレーン40を広く層状に備えている。 At the same time, the insulating substrate 20 backside of the signal line 10 downward, are provided in widely layered ground plane 40.
そして、信号線路10を、グランド付きコプレナー線路構造化して、その信号線路10の特性インピーダンスを50Ω等にマッチングさせている。 Then, the signal line 10, and to ground with coplanar line structured, by matching the characteristic impedance of the signal line 10 to 50Ω, and the like.

【0004】このグランド付きコプレナー線路構造化した高周波用信号線路においては、グランド線路30a、 [0004] In this ground with coplanar line structured high-frequency signal transmission line is a ground line 30a,
30b直下の絶縁基板20に、グランド線路30a、3 The insulating substrate 20 right under 30b, ground lines 30a, 3
0bとグランドプレーン40とを接続するメタライズ等の導体ポールからなるビア(以下、単にビアという)5 Via made of a conductor pole metallization for connecting the 0b and the ground plane 40 (hereinafter, simply referred to as vias) 5
0を複数本並べて備えて、グランド線路30a、30b 0 provided side by side a plurality of ground lines 30a, 30b
をグランドプレーン40と同一グランド電位に保持している。 It is held at the same ground potential as the ground plane 40.

【0005】又は、それに加えて、図4に示したように、絶縁基盤20端面にグランド線路30a、30bとグランドプレーン40とを接続する導体線路30c、3 [0005] or, in addition, as shown in FIG. 4, the ground lines 30a in the insulating base 20 end surfaces, the conductor line 30c, 3 for connecting the 30b and the ground plane 40
0dをそれぞれ備えて、グランド線路30a、30bをグランドプレーン40と同一グランド電位に的確に保持できるようにしている。 Comprise 0d respectively, so that can be accurately maintained at the ground line 30a, the same ground potential as the ground plane 40 and 30b.

【0006】 [0006]

【発明が解決しようとする課題】しかしながら、上記グランド付きコプレナー線路構造化した高周波用信号線路の信号線路10に10GHz以上等の高周波信号を伝えた場合には、その高周波信号の挿入損失、反射損失等が増大して、その信号線路10を高周波信号を伝送損失少なく伝えることができなかった。 However [0007], when the convey high-frequency signals, such as more than 10GHz to the signal line 10 of the ground with a coplanar line structure of high-frequency signal transmission line, the insertion loss of the high-frequency signal, the reflection loss etc. and increased, it could not tell the signal line 10 a high-frequency signal transmission loss less.

【0007】そのため、種々の実験をして、その原因を追求したところ、上記高周波用信号線路においては、信号線路10両側にそれぞれ複数本並べて備えたビア50 [0007] Therefore, by various experiments, was pursued the cause, in the high-frequency signal transmission line, via 50 with each arrayed plurality of the signal line 10 on both sides
からなる擬似グランド壁52間の間隔が広く空いているために、それらの擬似グランド壁52で囲まれた信号線路10の寄生共振周波数が、信号線路10を伝わる高周波信号帯域内にあって、信号線路10を伝わる高周波信号により、信号線路10に寄生共振が生じてしまい、信号線路10を高周波信号を伝送損失少なく伝えることができなくなるからであることが判明した。 In the interval between the pseudo ground wall 52 is vacant widely made of the parasitic resonant frequency of their pseudo-ground walls 52 signal line 10 surrounded by the, in the high-frequency signal in the band transmitted through the signal line 10, the signal the high-frequency signal transmitted through the line 10, will occur a parasitic resonance in the signal line 10, that the signal line 10 it becomes impossible to convey the high-frequency signal transmission loss less were found.

【0008】それと共に、グランド線路30a、30b [0008] At the same time, the ground line 30a, 30b
をグランドプレーン40に接続するためのビア50を、 Vias 50 for connecting to the ground plane 40,
粗いピッチで複数本並べて備えているため、信号線路1 Due to the provision of side by side a plurality of a coarse pitch, signal lines 1
0を伝わる波長の短い高周波信号が、その広く空いたビア50間からビア50外方に漏れ出してしまうからであることが判明した。 Short high-frequency signal wavelength transmitted through the 0, it has been found that because leaks in via 50 outwardly from between the wide open vias 50.

【0009】そこで、本発明者らは、これらの実験結果に基づいて、グランド線路30a、30bとグランドプレーン40とを接続するビア50をグランド線路30 [0009] Accordingly, the present inventors have, based on these experimental results, the ground lines 30a, 30b and the ground plane 40 and ground vias 50 connecting the line 30
a、30b直下の絶縁基板20に信号線路10側に寄せて複数本並べて備えると共に、信号線路10両側に擬似グランド壁52形成用のビア50を小ピッチで多数本並べて備えて、信号線路10に10GHz以上等の高周波信号を伝えたところ、信号線路10を10GHz以上等の高周波信号をその挿入損失、反射損失等を少なく抑えて効率良く伝えることができることが判明した。 a, together with the Preface to the signal line 10 side to the insulating substrate 20 right under 30b provided side by side a plurality of, the vias 50 for the pseudo ground walls 52 formed on both sides the signal line 10 provided side by side large number of small pitch, the signal line 10 was reportedly a high-frequency signal, such as above 10 GHz, the insertion loss high frequency signal such as a signal line 10 or 10 GHz, while suppressing decrease the reflection loss and the like that can be transmitted efficiently found.

【0010】本発明は、このような実験結果に基づいて開発されたものであって、グランド付きコプレナー線路構造化した信号線路を10GHz以上等の高周波信号をその挿入損失、反射損失等を少なく抑えて効率良く伝えることのできる高周波用信号線路を提供することを目的としている。 The present invention, which has been developed on the basis of such experimental results, the insertion loss high frequency signal coplanar line structured signal line 10GHz or more such as with ground, kept less the reflection loss, etc. and its object is to provide a high-frequency signal transmission line capable of efficiently transmitted Te.

【0011】 [0011]

【課題を解決するための手段】上記目的を達成するために、本発明の高周波用信号線路は、誘電体からなる絶縁基板表面に備えた信号線路両側にグランド線路をそれぞれ並べて備えると共に、信号線路下方の前記絶縁基板裏面にグランドプレーンを備えて、前記信号線路をグランド付きコプレナー線路構造化した高周波用信号線路において、前記グランド線路直下の絶縁基板に、グランド線路と前記グランドプレーンとを接続するビアを、前記信号線路側に寄せて小ピッチで複数本並べて備えたことを特徴としている。 To achieve the above object, according to the Invention The high-frequency signal transmission line of the present invention, together with includes side by side ground lines each to a signal line on both sides with an insulating surface of a substrate made of a dielectric, the signal line provided with the insulating substrate rear surface to the ground plane of the lower, in the signal line ground with a coplanar line structure of high-frequency signal line and connected to the insulating substrate immediately below the ground line, and said the ground line ground plane vias and it is characterized by comprising arranging a plurality of small pitch closer to the signal line side.

【0012】本発明の高周波用信号線路においては、絶縁基板端面に、グランド線路とグランドプレーンとを接続する導体線路を備えることを好適としている。 [0012] In the high-frequency signal transmission line of the present invention, the insulating substrate end face, and the preferred in that it comprises a conductor line for connecting the ground line and the ground plane.

【0013】 [0013]

【作用】上記構成の高周波用信号線路においては、グランド線路とグランドプレーンとを接続するビアであって、信号線路両側に擬似グランド壁を形成するためのビアを、信号線路側に寄せて複数本並べて備えている。 [Action] In the high-frequency signal transmission line having the above structure, a via for connecting the ground line and the ground plane, the via for forming the pseudo-ground walls to the signal lines on both sides, a plurality of Intention to signal line side side by side are provided.

【0014】そのため、信号線路両側の複数本のビアからなる擬似グランド壁間の間隔が狭められて、信号線路の持つ寄生共振周波数が、信号線路を伝わる10GHz [0014] Therefore, narrowed spacing of the pseudo ground walls made of plurality of vias of the signal lines on both sides, the parasitic resonant frequency with the signal line, 10 GHz transmitted a signal line
以上等の高周波信号帯域より高められる。 It is higher than the high-frequency signal band, such as more than. そして、信号線路を伝わる高周波信号により、信号線路に寄生共振が発生するのが防止される。 Then, by the high frequency signal transmitted through the signal line, the parasitic resonance signal lines can be prevented from occurring.

【0015】それと共に、上記構成の高周波用信号線路においては、擬似グランド壁を形成するためのビアを、 [0015] At the same time, the high-frequency signal transmission line having the above structure, the vias to form the pseudo-ground walls,
信号線路両側にそれぞれ小ピッチで複数本並べて備えている。 To the signal lines on both sides are provided side by side a plurality of small pitch.

【0016】そのため、信号線路を伝わる高周波信号が、ビア間の隙間を通して、擬似グランド壁を形成しているビア外方に漏れ出すのが防止される。 [0016] Therefore, the high frequency signal transmitted through the signal line is, through the gap between the vias, is prevented from leaking via outwardly forming a pseudo ground walls.

【0017】また、絶縁基板端面にグランド線路とグランドプレーンとを接続する導体線路を備えた上記構成の高周波用信号線路にあっては、導体線路により、グランド線路とグランドプレーンとが同一グランド電位に的確に保持されて、信号線路の特性インピーダンスが一定値の50Ω等に正確にマッチングする。 Further, in the high-frequency signal transmission line of the configurations with conductor line for connecting the ground line and the ground plane on the insulating substrate end face, the conductor line, is the same ground potential as the ground line and the ground plane It is accurately retained, the characteristic impedance of the signal line is matched exactly to the 50Ω such constant value.

【0018】 [0018]

【実施例】次に、本発明の実施例を図面に従い説明する。 EXAMPLES Next, an example of the present invention in accordance with the accompanying drawings. 図1は本発明の高周波用信号線路の好適な実施例を示し、詳しくはその一部拡大斜視図を示している。 Figure 1 shows a preferred embodiment of the high frequency signal transmission line of the present invention, specifically shows the partially enlarged perspective view. 以下に、この高周波用信号線路を説明する。 The following describes the high-frequency signal lines.

【0019】図において10は、メタライズ等からなる細帯状の信号線路である。 [0019] In Figure 10, a strip-like signal line made of a metallized or the like.

【0020】信号線路10は、セラミック等の誘電体からなる絶縁基板20表面に備えている。 The signal line 10 is provided with the insulating substrate 20 surface made of a dielectric such as ceramic.

【0021】信号線路10両側の絶縁基板20表面には、メタライズ等からなる細帯状のグランド線路30 The signal lines in the 10 opposite sides of the insulating substrate 20 surface, strip-like ground lines consisting of metallized like 30
a、30bを、信号線路10と平行に並べてそれぞれ備えている。 a, a 30b, are provided respectively side by side in parallel with the signal line 10.

【0022】信号線路10下方の絶縁基板20裏面には、メタライズ等からなるグランドプレーン40を広く層状に備えている。 [0022] The insulating substrate 20 backside of the signal line 10 downward, are provided in widely layered ground plane 40 made of metallized or the like.

【0023】これらのグランド線路30a、30b、グランドプレーン40は、信号線路10をグランド付きコプレナー線路構造化していて、信号線路10の特性インピーダンスを一定値の50Ω等にマッチングさせている。 [0023] These ground lines 30a, 30b, the ground plane 40, a signal line 10 are ground with coplanar line structured, and the characteristic impedance of the signal line 10 is matched to 50Ω such constant value.

【0024】以上の構成は、従来の高周波用信号線路と同様であるが、図の高周波用信号線路では、グランド線路30a、30b直下の絶縁基板20に、グランド線路30a、30bとグランドプレーン40とを接続するメタライズ等の導体ポールからなるビア(以下、単にビアという)500を、信号線路10側に寄せて小ピッチで多数本並べて備えている。 The above configuration is similar to the conventional high-frequency signal transmission line, the high-frequency signal transmission line of FIG., The ground line 30a, the insulating substrate 20 right under 30b, ground line 30a, and 30b and the ground plane 40 a conductor pole metallization for connecting the vias (hereinafter simply via that) 500 comprises arranged large number of small pitch closer to the signal line 10 side.

【0025】具体的には、図1に示したように、例えば直径が約0.1mmの小径のビア500を、グランド線路30a、30bの信号線路10に対向する内側縁直下の絶縁基板20に、約0.4mmの小ピッチで多数本並べて備えている。 [0025] Specifically, as shown in FIG. 1, for example, the diameter of the via 500 with a diameter of about 0.1 mm, the ground lines 30a, the insulating substrate 20 immediately below the inner edge facing the 30b signal line 10 of includes side by side present a number of small pitch of about 0.4 mm.

【0026】図1に示した高周波用信号線路は、以上のように構成していて、この高周波用信号線路においては、信号線路10両側の多数本並べて備えたビア500 The high frequency signal transmission line shown in Figure 1, have been constructed as described above, in the high-frequency signal line is via 500 with side by side the number of signal lines 10 on both sides
からなる擬似グランド壁502間の間隔を狭めて、信号線路10の寄生共振周波数を高めている。 By narrowing the spacing between the pseudo ground walls 502 made of, to enhance the parasitic resonant frequency of the signal line 10. それと共に、 At the same time,
擬似グランド壁502を形成しているビア500のピッチを狭めて、信号線路10を伝わる高周波信号がビア5 By narrowing the pitch of the vias 500 forming the pseudo ground wall 502, the high frequency signal via transmitting through the signal line 10 5
00間の隙間を通して擬似グランド壁502を形成しているビア500外方に漏れ出すのを防いでいる。 It is prevented from leaking via 500 outwardly to form a pseudo-ground walls 502 through the gap between the 00. そして、信号線路10を高周波信号をその挿入損失、反射損失等を少なく抑えて効率良く伝えることができるようにしている。 Then, a signal line 10 the insertion loss high-frequency signals, while suppressing decrease the reflection loss and the like so that it can efficiently transmitted.

【0027】図2は本発明の高周波用信号線路の他の好適な実施例を示し、詳しくはその一部拡大斜視図を示している。 [0027] Figure 2 shows another preferred embodiment of the high frequency signal transmission line of the present invention, specifically shows the partially enlarged perspective view. 以下に、この高周波用信号線路を説明する。 The following describes the high-frequency signal lines.

【0028】図の高周波用信号線路では、絶縁基板20 [0028] In the high frequency signal path diagram, the insulating substrate 20
端面に、グランド線路30a、30bとグランドプレーン40とを接続するメタライズ等からなる細帯状の導体線路30c、30dをそれぞれ備えている。 The end face is provided with a ground line 30a, the strip-like consisting of metallized for connecting the 30b and the ground plane 40 conductor lines 30c, 30d, respectively. そして、擬似グランド壁502を形成している多数本のビア500 Then, the multiplicity of forming a pseudo-ground walls 502 via 500
に加えて、導体線路30a、30bにより、グランド線路30a、30bをグランドプレーン40と同一グランド電位に的確に保持して、信号線路10の特性インピーダンスを一定値の50Ω等に正確にマッチングさせることができるようにしている。 In addition to the conductor line 30a, by 30b, ground line 30a, and accurately holds the 30b to the ground plane 40 and the same ground potential, that the characteristic impedance of the signal line 10 is accurately matched to 50Ω such constant value It is possible way.

【0029】その他は、前述図1に示した高周波用信号線路と同様に構成していて、その作用も前述図1に示した高周波用信号線路と同様であり、その同一部材には同一符号を付し、その説明を省略する。 [0029] others, have constructed similarly to the high-frequency signal transmission line shown in the aforementioned Figure 1, its effect is also similar to the high frequency signal line shown in the aforementioned Figure 1, the same reference numerals to the same members assigned, and a description thereof will be omitted.

【0030】参考までに、前述図1に示した高周波用信号線路と従来の高周波用信号線路との比較実験例を、図5に示す。 [0030] For reference, a comparative experimental example of the high-frequency signal line and the conventional high-frequency signal transmission line shown in the aforementioned Figure 1, shown in FIG.

【0031】図5に示した実験例においては、絶縁基板20にアルミナの含有率が92%で厚さが0.4mmのアルミナセラミック基板を用いた。 [0031] In the experimental example shown in FIG. 5, the content of alumina in the insulating substrate 20 is thick at 92% using alumina ceramic substrate of 0.4 mm. ビア500には、直径が約0.1mmのメタライズ導体ポールを用いた。 The vias 500, diameter was used metallized conductor pole about 0.1 mm. 信号線路10には、厚さが20μmで幅が0.36mmのメタライズ線路を用いた。 The signal line 10, a thickness of width 20μm was used metallization lines 0.36 mm. グランド線路30a、30b Ground line 30a, 30b
には、厚さが20μmのメタライズ線路を用いた。 The thickness was used 20μm metallization lines. 信号線路10両側縁とそれらに対向するグランド線路30 The signal line 10 side edges and the ground line facing them 30
a、30b内側縁との間の距離は、0.38mmとした。 a, the distance between the 30b inner edge was set to 0.38 mm. グランドプレーン40には、厚さが20μmのメタライズ層を用いた。 The ground plane 40, thickness using metallized layer of 20 [mu] m.

【0032】図5(A)は、ビア500を信号線路10 [0032] FIG. 5 (A), the via 500 signal lines 10
側縁より0.52mm外側の信号線路10側寄りのグランド線路30a、30b内側縁直下の絶縁基板20に約0.4mmの小ピッチで多数本並べて備えて、その信号線路10に高周波信号を伝えた場合の高周波信号の挿入損失値を示している。 Ground line 30a of 0.52mm outer signal line 10 side nearer than the side edge, provided with a number present side by side with a small pitch of about 0.4mm in the insulating substrate 20 right under 30b inner edge, convey a high frequency signal to the signal line 10 It shows the insertion loss value of the high frequency signal if.

【0033】図5(B)は、ビア500を信号線路10 [0033] FIG. 5 (B), the via 500 signal lines 10
側縁より0.52mm外側の信号線路10側寄りのグランド線路30a、30b内側縁直下の絶縁基板20に約1.2mmの粗いピッチで複数本並べて備えて、その信号線路10に高周波信号を伝えた場合の高周波信号の挿入損失値を示している。 Ground line 30a of 0.52mm outer signal line 10 side nearer than the side edge, provided side by side a plurality of coarse pitch of approximately 1.2mm in the insulating substrate 20 right under 30b inner edge, convey a high frequency signal to the signal line 10 It shows the insertion loss value of the high frequency signal if.

【0034】図5(C)は、ビア500を信号線路10 [0034] FIG. 5 (C) the via 500 signal lines 10
側縁より1.8mm外側のグランド線路30a、30b Ground line 30a of 1.8mm outside of the side edge, 30b
のほぼ中央部直下の絶縁基板20に約0.4mmの小ピッチで多数本並べて備えて、その信号線路10に高周波信号を伝えた場合の高周波信号の挿入損失値を示している。 Almost many small pitch of about 0.4mm in the insulating substrate 20 immediately below the central portion comprises side by side present, shows the insertion loss value of the high-frequency signal when the transmitted RF signal on the signal line 10 of.

【0035】これらの図5(A)、(B)、(C)の比較実験結果から、図1に示した高周波用信号線路のように、ビア500を、グランド線路30a、30b直下の絶縁基板20に信号線路10側に寄せて小ピッチで多数本並べて備えれば、図5(A)の実験結果のように、信号線路10を10GHz以上等の高周波信号をその挿入損失、反射損失等を少なく抑えて効率良く伝えることができることが判る。 [0035] These of FIG. 5 (A), the comparison results of experiments (B), (C), as the high-frequency signal transmission line shown in FIG. 1, the via 500, ground lines 30a, an insulating substrate directly under 30b if Sonaere a number present side by side with a small pitch closer to the signal line 10 side 20, as the experimental results of FIG. 5 (a), the insertion loss high frequency signal such as a signal line 10 or 10 GHz, the reflection loss, etc. less restrained and it can be seen that it is possible to communicate efficiently.

【0036】 [0036]

【発明の効果】以上説明したように、本発明の高周波用信号線路によれば、信号線路両側の複数本並べて備えたビアからなる擬似グランド壁間の間隔を狭めて、信号線路の寄生共振周波数を高め、信号線路を伝わる高周波信号により信号線路に寄生共振が生ずるのを防止できる。 As described in the foregoing, according to the high-frequency signal transmission line of the present invention, by narrowing the interval between the pseudo ground walls consisting of vias having side by side a plurality of signal lines on both sides, the parasitic resonant frequency of the signal line enhanced, by the high frequency signal transmitted through the signal line can be prevented from parasitic resonance signal line occurs.

【0037】それと共に、擬似グランド壁を形成している複数本のビアのピッチを狭めて、ビア間の隙間を通して信号線路を伝わる高周波信号が擬似グランド壁を形成しているビア外方に漏れ出すのを防止できる。 [0037] At the same time, by narrowing the pitch of the plurality of vias to form a pseudo-ground walls, the high frequency signal transmitted through the signal line is leaking via outwardly forming a pseudo ground walls through gaps between the vias that the can be prevented.

【0038】そして、信号線路を10GHz以上等の高周波信号を伝送損失少なく効率良く伝えることが可能となる。 [0038] Then, it is possible to tell good transmission loss less efficient high-frequency signal, such as more than 10GHz signal line.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】本発明の高周波用信号線路の一部拡大斜視図である。 1 is a partially enlarged perspective view of the high frequency signal transmission line of the present invention.

【図2】本発明の高周波用信号線路の一部拡大斜視図である。 Figure 2 is a partially enlarged perspective view of the high frequency signal transmission line of the present invention.

【図3】従来の高周波用信号線路の一部拡大斜視図である。 3 is a partially enlarged perspective view of a conventional high-frequency signal transmission line.

【図4】従来の高周波用信号線路の一部拡大斜視図である。 Figure 4 is a partially enlarged perspective view of a conventional high-frequency signal transmission line.

【図5】本発明の高周波用信号線路と従来の高周波用信号線路とに高周波信号をそれぞれ伝えた場合の信号線路に生じた高周波信号の挿入損失の比較実験結果を示す説明図である。 5 is an explanatory diagram showing a comparative experiment result of the insertion loss of the high-frequency signal high frequency signal line and conventional in the high-frequency signal transmission line RF signal generated in the signal line when informed of the invention respectively.

【符号の説明】 DESCRIPTION OF SYMBOLS

10 信号線路 20 絶縁基板 30a、30b グランド線路 30c、30d 導体線路 40 グランドプレーン 50、500 ビア 52、502 擬似グランド壁 10 signal line 20 insulating substrate 30a, 30b ground lines 30c, 30d conductor line 40 the ground plane 50, 500 via 52,502 pseudo ground walls

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl. 5識別記号 庁内整理番号 FI 技術表示箇所 H01P 3/08 ────────────────────────────────────────────────── ─── front page continued (51) Int.Cl. 5 in identification symbol Agency Docket No. FI art display portion H01P 3/08

Claims (2)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 誘電体からなる絶縁基板表面に備えた信号線路両側にグランド線路をそれぞれ並べて備えると共に、信号線路下方の前記絶縁基板裏面にグランドプレーンを備えて、前記信号線路をグランド付きコプレナー線路構造化した高周波用信号線路において、前記グランド線路直下の絶縁基板に、グランド線路と前記グランドプレーンとを接続するビアを、前記信号線路側に寄せて小ピッチで複数本並べて備えたことを特徴とする高周波用信号線路。 With 1. A comprising arranging respective signal lines on both sides to the ground line with an insulating surface of a substrate made of a dielectric, provided with a ground plane on the insulating substrate rear surface of the signal line downward, ground with coplanar line the signal line in structured high-frequency signal transmission line, and wherein the insulating substrate immediately below the ground line, to a via which connects the the ground line ground plane, comprising arranging a plurality of small pitch closer to the signal line side high-frequency signal line for.
  2. 【請求項2】 絶縁基板端面に、グランド線路とグランドプレーンとを接続する導体線路を備えた請求項1記載の高周波用信号線路。 Wherein the insulating substrate end face, a high-frequency signal transmission line of claim 1, further comprising a conductor line for connecting the ground line and the ground plane.
JP02737893A 1993-01-22 1993-01-22 High-frequency signal line Ceased JP3282870B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP02737893A JP3282870B2 (en) 1993-01-22 1993-01-22 High-frequency signal line

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP02737893A JP3282870B2 (en) 1993-01-22 1993-01-22 High-frequency signal line

Publications (2)

Publication Number Publication Date
JPH06224604A true JPH06224604A (en) 1994-08-12
JP3282870B2 JP3282870B2 (en) 2002-05-20

Family

ID=12219388

Family Applications (1)

Application Number Title Priority Date Filing Date
JP02737893A Ceased JP3282870B2 (en) 1993-01-22 1993-01-22 High-frequency signal line

Country Status (1)

Country Link
JP (1) JP3282870B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002252505A (en) * 2001-02-26 2002-09-06 Kyocera Corp Wiring board for high frequency
US6768401B2 (en) * 2001-03-22 2004-07-27 Kyocera Corporation Wiring board with a waveguide tube and wiring board module for mounting plural wiring boards
US6774748B1 (en) 1999-11-15 2004-08-10 Nec Corporation RF package with multi-layer substrate having coplanar feed through and connection interface
US8154364B2 (en) 2006-09-01 2012-04-10 Nec Corporation High-frequency transmission line having ground surface patterns with a plurality of notches therein
WO2012165557A1 (en) * 2011-05-31 2012-12-06 住友大阪セメント株式会社 High-frequency electrical signal transmission line
WO2017212966A1 (en) * 2016-06-09 2017-12-14 三菱電機株式会社 Flexible printed board

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6774748B1 (en) 1999-11-15 2004-08-10 Nec Corporation RF package with multi-layer substrate having coplanar feed through and connection interface
JP2002252505A (en) * 2001-02-26 2002-09-06 Kyocera Corp Wiring board for high frequency
US6768401B2 (en) * 2001-03-22 2004-07-27 Kyocera Corporation Wiring board with a waveguide tube and wiring board module for mounting plural wiring boards
US8154364B2 (en) 2006-09-01 2012-04-10 Nec Corporation High-frequency transmission line having ground surface patterns with a plurality of notches therein
WO2012165557A1 (en) * 2011-05-31 2012-12-06 住友大阪セメント株式会社 High-frequency electrical signal transmission line
JP2012253433A (en) * 2011-05-31 2012-12-20 Sumitomo Osaka Cement Co Ltd Transmission channel for high-frequency electrical signal
CN103650236A (en) * 2011-05-31 2014-03-19 住友大阪水泥股份有限公司 High-frequency electrical signal transmission line
US8975987B2 (en) 2011-05-31 2015-03-10 Sumitomo Osaka Cement Co., Ltd. Transmission line having band-shaped resistors connected to outer sides of ground electrodes in the transmission line
WO2017212966A1 (en) * 2016-06-09 2017-12-14 三菱電機株式会社 Flexible printed board
GB2565453A (en) * 2016-06-09 2019-02-13 Mitsubishi Electric Corp Flexible printed board

Also Published As

Publication number Publication date
JP3282870B2 (en) 2002-05-20

Similar Documents

Publication Publication Date Title
US3573670A (en) High-speed impedance-compensated circuits
JP3241139B2 (en) A film carrier signal transmission line
US4291312A (en) Dual ground plane coplanar fed microstrip antennas
EP0901181B1 (en) Microstrip to coax vertical launcher using conductive, compressible and solderless interconnects
US5238414A (en) High-speed transmission electrical connector
US4527165A (en) Miniature horn antenna array for circular polarization
CN1274056C (en) Adapting of waveguide to strip line
JP2595339B2 (en) Planar antenna
JP2751683B2 (en) Multi-array antenna apparatus
US4313095A (en) Microwave circuit with coplanar conductor strips
EP0845832A2 (en) Method and apparatus for the interconnection of radio frequency (RF) monolithic microwave integrated circuits
US4647878A (en) Coaxial shielded directional microwave coupler
US6359590B2 (en) Antenna feeder line, and antenna module provided with the antenna feeder line
CN1108006C (en) High density interstitial connector system
CN1151589C (en) Dielectric antenna and radio apparatus
US6023210A (en) Interlayer stripline transition
JP2003515896A (en) The difference signal electrical connector
US5625169A (en) Electronic parts with an electrode pattern between two dielectric substrates
CN102456945B (en) Antenna module and antenna unit thereof
JP2002026611A (en) Filter
JP2004327641A (en) Electronic component module
JPH0946130A (en) Waveguide feeding plane slot array and double polarized wave common aperture array formed by linear short-circuit back fire array
JPH0884005A (en) Interconnection between layers of strip line or micro-strip passing through slot in cavity
JP2004153368A (en) High frequency module, and mode converting structure and method
JP2008251538A (en) Termination assembly for grouped element transmission channel link

Legal Events

Date Code Title Description
RVOP Cancellation by post-grant opposition