JPH06220834A - Improving method for heaved ground - Google Patents

Improving method for heaved ground

Info

Publication number
JPH06220834A
JPH06220834A JP2178193A JP2178193A JPH06220834A JP H06220834 A JPH06220834 A JP H06220834A JP 2178193 A JP2178193 A JP 2178193A JP 2178193 A JP2178193 A JP 2178193A JP H06220834 A JPH06220834 A JP H06220834A
Authority
JP
Japan
Prior art keywords
ground
water
cut earth
crushed
rocks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2178193A
Other languages
Japanese (ja)
Other versions
JP2515682B2 (en
Inventor
Hidemichi Hida
田 秀 道 陽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP5021781A priority Critical patent/JP2515682B2/en
Publication of JPH06220834A publication Critical patent/JPH06220834A/en
Application granted granted Critical
Publication of JP2515682B2 publication Critical patent/JP2515682B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PURPOSE:To prevent the damage caused by the heaving of the ground due to aridity by crushing the ground surface, spraying water over the whole surface, drying it, then rolling it flat. CONSTITUTION:The cut earth ground is excavated to the specific depth below the ground surface with a ripper and the like. The excavation depth is set to about 1(m) as a standard. Rocks at the cut earth ground portion are crushed to the diameter of about 5-6cm, for example, and are efficiently brought into contact with air and water. Crushed rocks are again spread and rolled. Rocks are further crushed. Water is sprayed over the whole cut earth ground. The whole surface may be exposed to a rainfall. The cut earth ground is properly dried and rolled flat with a roller. The improved ground having more voids and gaps than the original cut earth ground is obtained. The occurrence of the ground stress due to the crystallization pressure of sulfate minerals causing the heaving can be prevented.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、中生代・最末期の白堊
期、新生代の第三紀及び第四紀洪積世の砂質及び泥岩の
堆積岩により形成されている切土地盤等の乾燥すること
により盤膨れする地盤の改良法に関する。
BACKGROUND OF THE INVENTION The present invention relates to the drying of cut grounds formed by sedimentary rocks of sandy and mudstones of the Mesozoic / latest Hakukai period, Cenozoic Tertiary and Quaternary Pleistocene. The present invention relates to a method for improving the ground that swells due to swelling.

【0002】[0002]

【従来の技術】従来、モンモリロナイトのような膨潤性
の強い鉱物を多く含む岩盤が、水を吸収することによっ
て「盤膨れ」を引き起こすことはよく知られている。
2. Description of the Related Art Conventionally, it is well known that bedrock containing a large amount of swelling minerals such as montmorillonite causes "swelling" by absorbing water.

【0003】ところが、中生代・最末期の白堊期、新生
代の第三紀及び第四紀洪積世の砂質及び泥岩の堆積岩で
構成されている地盤のかなりのものが、「吸水すること
による膨潤」とは反対に、「乾燥することによる盤膨
れ」を引き起こすことが、最近各地で知られるようにな
った。
However, a considerable part of the ground consisting of sedimentary rocks of sandy and mudstones of the Mesozoic-latest White Sakai period, Cenozoic Tertiary and Quaternary Pleistocene "swelling due to water absorption". On the contrary, it has recently become known in various places that it causes "a blister caused by drying".

【0004】しかし、従来、この「乾燥することによる
盤膨れ」の現象の原因も未だ充分に究明されておらず、
まだその対策が確立されていないまま放置されているの
が現状である。
However, in the past, the cause of the phenomenon of "plate swelling due to drying" has not yet been sufficiently investigated,
The current situation is that the measures have not been established yet.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、切土地
盤における乾燥することによる盤膨れ(以下、単に盤膨
れという)は、家や工場を建てると、該地盤が乾燥して
盤膨れがあらわれるため、「盤膨れ」による隆起現象で
家や工場が変状してしまう被害が発生する。そのため補
修、建替え、移転等を余儀なくされ、問題が起きてから
の対策費は膨大なものになってしまう。
However, the swelling of the cut ground due to drying (hereinafter simply referred to as swelling) is caused by the fact that the ground is dried and swelling appears when a house or factory is built. The uplifting phenomenon caused by "bulging" causes damage to the houses and factories. Therefore, repairs, rebuilding, relocation, etc. are forced, and the cost of countermeasures after a problem occurs becomes enormous.

【0006】本発明は、このような点に鑑み「盤膨れ」
する地盤の改良法を提供し、もって地盤の盤膨れを防止
することを目的とするものである。
In view of such a point, the present invention is "disc swelling".
It is an object of the present invention to provide a method for improving the ground, thereby preventing the ground from expanding.

【0007】[0007]

【課題を解決するための手段】本発明は、前記目的を達
成するため、乾燥することにより盤膨れする切土地盤の
地表部を適宜の深さ掘り起こして破砕した後、その全面
に亘って水を散布し、乾燥した後転圧して平坦化するこ
とを特徴とする。
Means for Solving the Problems In order to achieve the above-mentioned object, the present invention digs up the ground surface portion of a cut ground that swells by drying and crushes it to an appropriate depth, and then water the entire surface. Is sprayed, dried and then rolled to flatten.

【0008】[0008]

【作用】本発明者は鋭意研究の結果、「盤膨れ」は次の
ような原因で発生することを究明した。すなわち、地盤
の表面(いわゆる地表)から地表下数10メートルまで
の間には、雨・雪等が降り注いで地盤の中に直接にしみ
込んだ水と、そのような水が更に横方向のベクトルをも
って地盤の中をゆっくりと流れている地下水とがあり、
いずれも空気中を高空から降り注いだ雨水に起源をもっ
ていることから、酸素を十分に溶かし込んでいる。
As a result of earnest research, the present inventor has determined that "disc swelling" occurs due to the following causes. That is, between the surface of the ground (so-called ground surface) and several tens of meters below the ground, water that has rained, snowed, and soaked into the ground directly, and such water has a lateral vector. There is groundwater slowly flowing in the ground,
Since both of them have their origins in rainwater that has poured into the air from a high altitude, they are sufficiently dissolved with oxygen.

【0009】そのような酸素を含んで地下に染み込んだ
水は、地盤の中を流れ移動する間に地盤を構成している
色々な種類の鉱物と反応して、幾つかの鉱物の成分を溶
かし込む。酸素を含む地下水と最も反応しやすい鉱物は
黄鉄鉱(FeS2 )である。
The water that contains oxygen and soaks underground reacts with various kinds of minerals that compose the ground while flowing through the ground and melts some mineral components. Put in. The mineral most likely to react with oxygen-containing groundwater is pyrite (FeS 2 ).

【0010】黄鉄鉱は浅海底で泥や砂が堆積して地層が
形成される過程での還元条件のもとでの鉄バクテリアの
分解によって最もできやすい。我が国では新生代の第三
紀層の砂岩・泥岩層には黄鉄鉱がごく普遍的に数%くら
いの割合で含まれている。特に植物質物質が強還元条件
のもとで炭化した石灰〜亜灰層を介在する第三紀〜第四
紀の砂質・泥質の堆積岩には黄鉄鉱の含有が極めて普通
である。
Pyrite is most likely to be formed by the decomposition of iron bacteria under reducing conditions in the process of forming a stratum by depositing mud and sand on the shallow sea floor. In Japan, the Cenozoic Tertiary sandstone and mudstone layers contain pyrite, which is universally contained in a proportion of about several percent. In particular, pyrite content is extremely common in sandy and pelitic sedimentary rocks of the Tertiary to Quaternary period, in which a lime-subash layer in which plant material is carbonized under strongly reducing conditions intervenes.

【0011】雨水・雪水として地表から地盤に直接にし
み込んだ水や、近隣の地盤から流れ込んだ酸素を含む地
下水は黄鉄鉱と反応して化1のように硫酸根(SO4
を含む地下水となる。
Water that has infiltrated directly from the ground surface into the ground as rainwater or snow water or groundwater containing oxygen that has flowed in from the adjacent ground reacts with pyrite to produce sulfate radicals (SO 4 ) as in chemical formula 1.
It becomes groundwater including.

【化1】 SO4 を含む地下水は地盤の中で地盤を構成している主
要な鉱物である斜長石、角閃石、輝石等と反応して、こ
れらの鉱物の中のCa・Na・Mg等を溶かし込む。
[Chemical 1] Groundwater containing SO 4 reacts with plagioclase, amphibolite, pyroxene, etc., which are the main minerals that make up the ground, and dissolves Ca, Na, Mg, etc. in these minerals.

【0012】この様にして、SO4 ・Ca・Na・Mg
を溶かし込んだ地下水は、地盤の表層部が乾燥すると、
地盤の中の割れ目や鉱物粒子間隙を通ってゆっくりと毛
細管現象によって地表部に移動して、遂には地表部近く
に達する。
In this way, SO 4 , Ca, Na and Mg
When the surface layer of the ground becomes dry,
It slowly moves to the surface by capillary action through cracks in the ground and the gaps between mineral particles, and finally reaches near the surface.

【0013】その様な地下水のSO4 ・Ca・Na・M
g濃度は地表での蒸発散作用によって著しく高くなり、
地表近くの(数cm〜数10cm又は数m位の深部まで
の)地盤の割れ目や微細な間隙と地盤表面に沿って次の
様な各種の硫酸塩鉱物(以下塩類という)が結晶する様
になる。 石膏 CaSO4 ・2H2 O エプソマイト MgSO4 ・7H2 O テナーダイト Na2 SO4 ミラビライト Na2 SO4 ・10H2 O これらのうち、石膏が最も普通に形成される塩類鉱物で
ある。
SO 4 · Ca · Na · M of such groundwater
The g concentration increases significantly due to evapotranspiration on the surface,
The following various sulfate minerals (hereinafter referred to as salts) crystallize along the surface of the ground and cracks and minute gaps in the ground (up to a depth of several cm to several tens of cm or several meters) near the surface of the earth Become. Gypsum CaSO 4 .2H 2 O Epsomite MgSO 4 .7H 2 O Tenardite Na 2 SO 4 Mirabilite Na 2 SO 4 .10H 2 O Of these, gypsum is the most commonly formed salt mineral.

【0014】上に述べた塩類が地盤の中の割れ目や微細
間隙に結出・充填するに伴って、塩類の晶出圧による応
力が地盤内に発生して地盤が膨張して、いわゆる「盤膨
れ」が発生する。又、地盤表面での塩類層の直接的析出
成長も「盤膨れ」発生の大きな原因となるのである。
As the above-mentioned salt is condensed and filled in the cracks and fine gaps in the ground, stress due to the crystallization pressure of the salt is generated in the ground and the ground expands, so-called "ground "Blistering" occurs. In addition, the direct precipitation growth of the salt layer on the ground surface is also a major cause of the occurrence of "bed swelling".

【0015】しかして、本発明のように地表部所定深さ
の部分を掘り起こし、破砕された岩片を再び敷きつめて
転圧すると、地表下掘り起こし部分の深部までは元の地
層地盤に比べてはるかに多くの空隙・隙間をもつように
なる。従って、地盤表層部の乾燥によって、その様な多
孔質の部分(空隙率の高い部分)にSO4 ・Ca・Na
・K・Mgをとかし込んだ地下水が上昇して来ても、地
表での水の蒸発散によって析出した塩類は、破砕によっ
て形成された岩石塊の間のこれらの空隙・隙間を満たす
のみで、地盤内に晶出圧による応力が発生しない。又、
地表部での塩類の直接晶出が発生しにくい。
However, when a portion having a predetermined depth on the surface of the ground is excavated as in the present invention, and the crushed rock fragments are spread again and compacted, the depth of the excavated portion below the surface is far deeper than the original stratum ground. It will have many voids and gaps. Therefore, when the surface layer of the ground is dried, SO 4 · Ca · Na is added to such a porous portion (portion having a high porosity).
-Even if groundwater containing K / Mg rises, the salts deposited by evapotranspiration of water on the surface only fill these voids / gaps between rock masses formed by crushing, Stress due to crystallization pressure does not occur in the ground. or,
Direct crystallization of salts on the surface is unlikely to occur.

【0016】また、掘削・破砕して降雨にさらすか、散
水することで、硫酸イオンが希釈流出し影響範囲(深度
約1m)絶対量か極端に減少する。
[0016] Further, by excavating and crushing and exposing to rain, or by spraying water, sulfate ions are diluted and run out, and the absolute amount of the influence (depth about 1 m) or absolute amount is reduced.

【0017】更に、掘削・破砕の工事中における降雨に
よる湿潤や日射通風による乾燥で、化学変化が促進され
る。残留分が化学変化を起こしたとしても、その量は微
量で被害を感じさせるには至らない。
Furthermore, during excavation and crushing work, the chemical change is promoted by the wetness caused by rainfall and the dryness caused by solar radiation. Even if the residue causes a chemical change, the amount is very small and does not make you feel any damage.

【0018】[0018]

【実施例】以下、本発明の実施例について図面と共に詳
細に説明する。図1乃至図5は、本発明の実施例の工程
を示す説明図である。図1は盤膨れする切土地盤(以
下、単に地盤という)1を断面で示している。この地盤
1は、図2に示すように地表下所定深さまでリッパー等
で掘削して掘り起す。
Embodiments of the present invention will now be described in detail with reference to the drawings. 1 to 5 are explanatory views showing the steps of the embodiment of the present invention. FIG. 1 shows a cross section of a swollen cut ground (hereinafter, simply referred to as ground) 1. As shown in FIG. 2, the ground 1 is excavated by a ripper or the like to a predetermined depth below the surface of the earth.

【0019】この掘削深度は、標準的には略1メートル
位でよいが、これは地形によって決定する。例えば、標
準とは地形がおおよそ四方50メートル位が略水平の場
合であって、もしも地盤1より周囲の地形が低い場合
は、また、建物の位置がその低い部分に近い場合は、1
メートルでは不足でそれ以上に深く必要である。逆に周
囲や背面に高い山などがある場合は、地下水が補給され
るので、1メートルより浅くてよいし、場合によっては
無処理でもよい。また、工場のように建物のスパンが大
きい場合には、深度を増す必要がある。
This excavation depth may be about 1 meter as a standard, but this is determined by the topography. For example, the standard is a case where the terrain is approximately horizontal about 50 meters, and if the surrounding terrain is lower than the ground 1, and if the position of the building is close to the lower part, then 1
Meters are scarce and need more deeply. On the contrary, if there are high mountains around or on the back, groundwater will be replenished, so it may be shallower than 1 meter or may be untreated in some cases. In addition, when the span of a building is large, such as in a factory, it is necessary to increase the depth.

【0020】前記掘削して掘り起した地盤部分2の岩石
3は、破砕して細かくする。この破砕の粒度としては、
細かいほど空気と水に接する率が高くなるので好ましい
が、径5〜6cm程度でよい。この掘り起し破砕した岩
石は、図3に示すように再び敷きつめ転圧する。この転
圧によっても岩石は更に破砕される。
The rock 3 of the ground portion 2 excavated and excavated is crushed into fine pieces. As the particle size of this crushing,
The smaller the diameter, the higher the ratio of contact with air and water. The rock thus excavated and crushed is laid again and compressed as shown in FIG. The rock is further crushed by this compaction.

【0021】次に前記破砕して敷きつめ転圧した地盤4
には、図4に示すようにその全面に亘って水を散布す
る。この水の散布は、強制的に散布してもよいし、降雨
にさらしてもよい。散布する水の量としては略10〜3
0mm/時間位の降雨に相当する量でよい。
Next, the ground 4 which has been crushed and spread and compacted
As shown in FIG. 4, water is sprayed over the entire surface. This water application may be forced or it may be exposed to rainfall. The amount of water sprayed is about 10-3
An amount equivalent to 0 mm / hour of rainfall is sufficient.

【0022】最後に前記散水した地盤5は、適当に乾燥
したあと、図5に示すように転圧機(シープローラ、振
動ローラ、タイヤローラ、ブルトーザー)7で転圧し平
坦化し、改良地盤6が完成する。
Finally, the sprinkled soil 5 is appropriately dried and then flattened by compacting with a compactor (sheep roller, vibrating roller, tire roller, bulltozer) 7 as shown in FIG. 5 to complete the improved soil 6. .

【0023】この完成した改良地盤6の一部を拡大した
断面図が図6である。この図6から理解できる通り改良
地盤6には多数の空隙・隙間が生じている。
FIG. 6 is an enlarged sectional view of a part of the completed improved ground 6. As can be understood from FIG. 6, the improved ground 6 has many voids and gaps.

【0024】[0024]

【発明の効果】以上説明の通り、本発明によれば、地表
下掘り起こし部分の深部までは元の地層地盤に比べては
るかに多くの空隙・隙間を持つようになる。従って、地
盤表層部の乾燥によって、その様な多孔質の部分(空隙
率の高い部分)にSO4 ・Ca・Na・K・Mgをとか
し込んだ地下水が上昇して来ても、地表での水の蒸発散
によって析出した塩類は、破砕によって形成された岩石
塊の間のこれらの空隙・隙間を満たすのみで、地盤内に
晶出圧による応力が発生しない。又、地表部での塩類の
直接晶出が発生しにくい。
As described above, according to the present invention, far more voids and gaps are formed up to the deep part of the excavated portion of the surface of the earth as compared with the original stratum. Thus, the drying of the ground surface layer portion, even come such porous portions groundwater elaborate dissolved SO 4 · Ca · Na · K · Mg (the high porosity portion) is increased, at the surface The salt precipitated by the evapotranspiration of water only fills these voids and gaps between the rock masses formed by crushing, and stress due to crystallization pressure does not occur in the ground. Also, direct crystallization of salts on the surface of the ground is unlikely to occur.

【0025】また、掘削・破砕して降雨にさらすか、散
水することで、硫酸イオンが希釈流出し影響範囲(深度
約1m)絶対量か極端に減少する。
Further, by excavating and crushing and exposing to rain, or by spraying water, sulfate ions are diluted and flow out, and the absolute amount of the influence range (depth about 1 m) is extremely reduced.

【0026】更に、掘削・破砕の工事中における降雨に
よる湿潤や日射通風による乾燥で、化学変化が促進され
る。残留分が化学変化を起こしたとしても、その量は微
量で被害を感じさせるには至らない。
Furthermore, during excavation and crushing work, the chemical change is promoted by the wetness caused by rainfall and the drying caused by solar radiation. Even if the residue causes a chemical change, the amount is very small and does not make you feel any damage.

【0027】よって、本発明に係る地盤改良法によれ
ば、盤膨れの発生を防止することができる。
Therefore, according to the ground improvement method of the present invention, it is possible to prevent the occurrence of swelling.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例を示す工程説明図である。FIG. 1 is a process explanatory view showing an example of the present invention.

【図2】本発明の実施例を示す次の工程説明図である。FIG. 2 is a next process explanatory view showing the embodiment of the present invention.

【図3】本発明の実施例を示す更に次の工程説明図であ
る。
FIG. 3 is an explanatory view of the next step showing the embodiment of the present invention.

【図4】本発明の実施例を示す更に次の工程説明図であ
る。
FIG. 4 is an explanatory diagram of the next step showing the embodiment of the present invention.

【図5】本発明の実施例を示す更に次の工程説明図であ
る。
FIG. 5 is an explanatory view of the next step showing the embodiment of the present invention.

【図6】改良地盤の部分拡大断面図である。FIG. 6 is a partially enlarged cross-sectional view of the improved ground.

【符号の説明】[Explanation of symbols]

1 盤膨れする切土地盤 2 掘り起こした地盤部分 3 岩石 4 破砕して敷きつめ転圧した地盤 5 改良地盤 1 Ground that swells 2 Ground that has been dug up 3 Rock 4 Rock that has been crushed and spread 5 Improved ground

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 乾燥により盤膨れする切土地盤の地表部
を適宜の深さ掘り起して破砕した後、その全面に亘って
水を散布し、乾燥した後転圧して平坦化することを特徴
とする盤膨れ地盤改良法。
1. After digging the ground surface portion of the cut ground board that swells due to drying to an appropriate depth and crushing it, water is sprayed over the entire surface, and after it is dried, it is compacted to be flattened. A characteristic method for improving the swelling ground.
JP5021781A 1993-01-16 1993-01-16 Swelling ground improvement method Expired - Lifetime JP2515682B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5021781A JP2515682B2 (en) 1993-01-16 1993-01-16 Swelling ground improvement method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5021781A JP2515682B2 (en) 1993-01-16 1993-01-16 Swelling ground improvement method

Publications (2)

Publication Number Publication Date
JPH06220834A true JPH06220834A (en) 1994-08-09
JP2515682B2 JP2515682B2 (en) 1996-07-10

Family

ID=12064610

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5021781A Expired - Lifetime JP2515682B2 (en) 1993-01-16 1993-01-16 Swelling ground improvement method

Country Status (1)

Country Link
JP (1) JP2515682B2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0574644A (en) * 1991-09-12 1993-03-26 Sony Corp Mounting method of chip type multilayered ceramic capacitor

Patent Citations (1)

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