JPH06211613A - Vendor board having at least one exposed surface - Google Patents

Abstract

PURPOSE: To provide a benderboard acting as a barrier to the passage of terrestrial snails and slugs. CONSTITUTION: This benderboard includes a substrate having exposed surfaces consisting of a copper matrix contg. 5 to 95 wt.%, more preferably 20 to 95 wt.% copper particles and 5 to 95 wt.%, more preferably 5 to 80 wt.% polymer (e.g.: polyvinyl chloride, polyurethane, polyethylene). The snail-proof benderboard barrier is produced by heating the benderboard substrate to form sticky surfaces on the benderboard and bringing the copper particles into contact with the surfaces, then cooling the benderboard.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION This invention relates generally to pest control,
And more specifically, agricultural edging, which acts as a barrier to the passage of terrestrial snails and slugs
About making.

[0002]

BACKGROUND OF THE INVENTION Terrestrial gastropods such as snails and slugs eat leaves and are a major cause of plant damage in both agriculture and home gardening. Conventional techniques for controlling snails and slugs include methods such as hand removal of these organisms, use of snail poison bait, and electrical control.

It is most effective to harvest snails and slugs from leaves at night or in the early morning hours, because these organisms are nocturnal and forage at night and hide during the day. Because I have. The details of collecting these organisms and then killing them are very uncomfortable for many.

It is also possible to utilize snail poison bait. However, all snail poisons have undesirable characteristics. The use of snail poison bait may be inappropriate where infants and animals can approach. There are also many oppositions as toxic substances gradually spread to the environment.

Various forms of electrical barriers have been developed for the purpose of keeping insects and animals out of the area to be protected or eliminating these organisms, or especially in the case of insects, for the purpose of eradicating them. These prior art systems are not particularly suited for simple removal of snails and slugs. These systems continually consume electrical energy, such as by requiring an external power source such as a battery or by utilizing a connection to a utility power line. These systems tend to be complex and expensive and require significant maintenance.

Aquatic mollusks, crustaceans, and algae are a problem for freshwater and seawater vessels and other structures present in the aquatic environment. For example, germicidal paints and coatings are used on surface vessels to minimize the ingress of plants and animals on the surfaces of ships, piers, power plants and freshwater plants. Aquatic germicidal paints generally work by leaching a small amount of harmful chemicals into the water surrounding the treated surface.

[0007]

SUMMARY OF THE INVENTION Copper metal particles in a polymeric matrix are placed on the surface of a horticultural benderboard to provide a deterrent barrier for snails and slugs. The material of the barrier does not kill the animal, but is simply a deterrent as it attempts to cross the barrier. By providing the barrier of the present invention, it is possible to demarcate a specific area and keep the terrestrial gastropod within or outside that boundary.

The copper metal particles are present in the polymeric material and the concentration is generally about 5 to 95% by weight copper particles and about 95 to about 5% by weight polymeric matrix. Copper molecules are dispersed fairly uniformly in the polymeric material.

The polymeric copper matrix may be provided on a variety of rigid substrates such as agricultural vendor boards and other borders. It is possible to provide a polymeric copper matrix on a flexible or tape-like backing, and in particular on an adhesive backing, for use on and around planters, shrubs, plows etc. The polymeric copper matrix can be provided as a sheet that can be made or cut to the desired size and shape. Finally, the polymeric copper matrix can be provided in liquid form for application to existing fences or other structures. The liquid dries to form the desired partition material.

A method for making a copper matrix barrier comprises the steps of providing a tacky or tacky surface on a polymeric substrate and contacting copper particles with the tacky surface to bond the copper to the substrate. And curing the surface to reduce or eliminate tackiness. Alternatively, copper is contacted with the surface of the vendor board and the copper / vendor board surface is heated to form a matrix. The matrix solidifies upon cooling. This method provides copper particles retained within the polymeric matrix at the surface of the polymeric material.
In the preferred embodiment, the greasy surface is produced by heating the polymeric substrate and reduced or eliminated by cooling.

The polymeric material can be provided as a variety of rigid or semi-rigid substrates, and vendor boards or other partitions, especially for agricultural applications. Alternatively, the barrier material may be provided as a sheet that can be cut to the desired size and shape.

[0012]

DISCLOSURE OF THE INVENTION INCLUDING BEST MODE The drawings are drawn for clarity and are not drawn to scale. Like numbers refer to like structures throughout the drawings.

The term "vendor board" as used herein refers to a rigid or semi-rigid garden border. It may be a strip of such material or may include a decorative cutout or ornament. Alternatively, it may include a flowerpot, drip pan, seedling container, etc., which is made of a polymeric material and which is easy to treat on its surface to be provided with a snail prevention material using the method of the present application. Vendor boards useful herein are those made from polymeric materials such as polyethylene, vinyl chloride (PVC), polypropylene, resins, other rigid plastics.

The term "snail" as used herein refers to terrestrial snails and / or slugs.

As used herein, “copper matrix”
Refers to a material that terrestrial snails dislike so that it does not traverse the surface containing or made from a continuous copper matrix border. The copper matrix contains from about 5 to about 95% by weight of copper molecules and from about 5 to about 95%.
Contains wt% polymer. Preferably, about 20 to about 95 wt% copper particles and about 5 to about 80 wt% polymer are present in the polymeric material. More preferably, the copper metal particles are present in the polymeric material at about 20-30% by weight copper particles with the balance being polymer.

"Barrier material" is the copper matrix exposed on the surface of the material used to define agricultural partitions. Barrier materials are used to stop snails from crossing defined partitions.

Unlike the bactericidal paints, snail poisoners and electric snail extermination devices, the copper matrix of the present application does not kill snails that come into contact with this matrix. Rather, snails simply dislike the chemical properties of the copper matrix. The exact reason why snails hate polymeric copper barrier materials is unclear. It is thought that snails avoid them because the "taste" of copper metal is unpleasant for snails. It is also considered that the electrons are easily transmitted from the copper particles to the snails, which gives a stimulus such as an electric “shock” which is not fatal. The copper uptake process by which snails incorporate copper into their diet may be "overloaded" by the copper in the copper matrix. Mammals and birds with ferrous blood are not deterred by this partition.

In the preferred embodiment, when the copper matrix completely covers the underlying structure, the copper matrix provides protection to the underlying structure. For example, it is possible to coat the exposed surface of a wood or polymer vendor board with the copper matrix of this invention. Preferably, the copper matrix helps prevent the coated vendor board from degrading due to sunlight, water, chemicals, or temperature.

The copper matrix of the present application is particularly effective at inhibiting slow-moving terrestrial gastropods that form a layer of mucus, such as snails and slugs. Termites and other wood-dwelling insects are also deterred by this copper matrix material. However, for purposes of simplicity and not limitation, the present invention will be described in terms of a snail barrier.

By utilizing the present invention, snails can be significantly eliminated from home gardens or large agricultural land. An unbroken partition of barrier material is used to define the area where snails should be excluded. Borders are appropriately installed along the ground, which is the normal path for snails to enter agricultural land. If desired, for individual trees and other finely divided leaves that overlap the border of the ground, use these leaves as a passageway and even protect them individually to minimize snail invasion. Good. If individual plants are protected, borders can be placed either outside of the plant container or on the tree trunk itself. Snails in the border are either grabbed by hand or removed using toxic materials. Snails will be prevented from passing through the containment border, and movement into that area will be significantly reduced.

Within agricultural land, snail deterrence borders can be set up before planting a crop. After demarcating the fallow with border material, it may be grabbed by hand or sprinkled with poison to control the snails inside. Seeds or seedlings can be sown or planted after the snail-free zone has been established.

Many home gardens do not remain fallow for long periods of time. In these areas, the perimeter of the snail suppression border can be set and then snail control in the desired area can be performed. Care should be taken to minimize the invasion of new snails from overlying leaves.

Since the snail can enter the agricultural land through a route other than crossing the ground (eg, being carried by a bird or falling from a leaf in contact with it), it is sometimes necessary to control the snail from the protected area. May be. However, by minimizing the potential for importation, the effective use of snail borders may minimize or eliminate the need for such work.

Placing a barrier of treated vendor board material at the soil-planter boundary will prevent snails from entering the potted plant. Without harming pets or wildlife with the borders of treated vendor boards placed on or around the outer surface of the dish,
Snails are prevented from infesting the food and water sources placed outside for these pets or wildlife.

Since the barrier does not kill or damage the snails, the vendor board barriers can also be used as borders in areas containing snails for harvesting purposes, such as edible (escargot), research or other purposes. The border material encloses snails within a given fence and contains them within a given area, but does not harm these animals.

In general, the preferred method of making the treated vendor board involves forming a greasy or some fluid surface on the vendor board substrate while maintaining the integrity of the vendor board core. The sticky surface of the vendor board is brought into contact with the copper particles. The copper particles adhere to the surface of the vendor board and the softened vendor board surface material constitutes the matrix of the surface of the vendor board. The matrix is cured to give a finished vendor board with a snail barrier treated surface. The treated surface is about 5% to 95
% Copper particles (wt%) and about 5% to 95% polymer (wt%) matrix. In a preferred embodiment, excess copper is removed by cleaning, brushing, and / or blowing the excess copper, and the removed copper is recycled for later use.

A production line for manufacturing the vendor board of the present application is shown in FIG. For purposes of illustration and not limitation, this process is shown using polyethylene benderboard. Other vendor board materials may require changing temperatures, processing requirements, etc.

Vendor board 10 enters the system at feeder 12. In one embodiment, feeder 12 is an extrusion die that forms a continuous length of vendor board material 10. Methods and apparatus for making long, standard untreated vendor boards are well known in the art and may be provided in place of feeder 12. In an alternative embodiment, a reel or other supply of preformed vendor board material is provided in the feeder and conditioned and introduced into the barrier forming system.

A variety of known non-toxic water soluble polymeric materials can be used to form the vendor board 10. In general, such polymeric materials should preferably be able to withstand normal fatigue to the environment of use. The polymer is preferably resistant to sunlight, water, agrochemicals and the extremes of temperatures above and below those found in normal terrestrial environments. Where a rigid matrix is preferred, polymers such as those currently used in rigid agricultural lip or device constructions are generally preferred. For example, polypropylene, polyester, polyurethane, polybenzimidazole, polycarbonate, polyester resin, high density polyethylene, polyurethane, polyvinyl derivatives, other rigid plastics, combinations thereof, etc. may be used. Ethyl cellulose, polyimide, polybutylene, low density polyethylene, polypropylene, polyurethane, polyvinyl chloride (PVC), polyamide, polyester, polystyrene, polymethylmethacrylate, and other flexible plastics if a more flexible matrix is preferred. Etc. can be used.

After long-term exposure to the atmosphere, metallic copper is often referred to as patina, which is green hydroxide basic copper carbonate (C).
Corrosion to u ₂ (OH) ₂ CO ₃ ). Patina is not an effective deterrent to snails. Atmospheric corrosion of copper limits the useful life of the copper matrix. Therefore, in the preferred embodiment, the copper matrix is slowly abraded by normal fatigue to be removed and fresh metal copper exposed each time a patina is formed. The "self-polishing", slowly removable polymer matrix provides a longer functional life of the copper matrix and thus extends its useful life as a snail barrier.

In the preferred embodiment, the vendor board material is slowly removable, thus exposing a fresh copper surface for an extended period of time. Preferred removable polymers include oil modified polyurethane and ethyl cellulose. Particularly preferred polymeric materials include slowly removable polymers such as polyurethane, polyvinyl chloride, ethyl cellulose. Other materials may be added to the vendor board material if desired. For example, as known in the art, antioxidants, stabilizers, fillers,
Dyes, plasticizers, etc. may be added.

The anti-snail bender board 10 is preferably manufactured by a continuous process as shown in FIG. However, a batch or semi-batch process may be used if desired.

Various idler wheels 14 are shown.
This particular idler wheel is shown for illustrative purposes only. If desired, various idler wheels 14 can be used to redirect the vendor board 10 within a particular line design. The use of such idler wheels 14 is of course at the discretion of the plant designer.

If the surface of the vendor board is not tacky as it is introduced into the system, it will be tacky or some melting will occur before or at the same time it contacts the copper material.

In the embodiment of FIG. 1, a preformed (and especially recycled) polyethylene bender board is introduced for the snail resistant treatment. The polyethylene bender board stock is heated between two heater units 16 to make its surface sticky. Generally, this surface is about 350 to 400 degrees Fahrenheit.
Heated to a temperature in the range of degrees. Watlow Radiant Panel Heaters 2.5k
The use of W is sufficient. The temperature of the heater can be adjusted,
The throughput rate of the vendor board or the distance of the heater from the vendor board stream can be adjusted to maximize process efficiency.

In an alternative embodiment, the surface of the vendor board is chemically treated to be tacky, for example by pouring or spraying a suitable solvent that softens the polymer surface. The vendor board is then passed through a copper powder and the copper / polymer surface is cured using heat to evaporate the solvent and create a solid surface. Alternatively, the vendor board may be formed and treated such that the surface of the vendor board remains tacky after its initial formation and is not fully cured until after the treatment to create the copper matrix surface. This embodiment is particularly suitable when the vendor board core is formed and immediately provided with an anti-snail coating as part of one continuous process. In another embodiment, discussed with reference to FIG. 2, a vendor board is introduced into the heated copper flake powder and the copper particles are applied to the surface of the vendor board while the surface is tacky at the same time. Make the surface of the board sticky.

The snail-resistant surface on the vendor board will be defined by the area in which the copper particles are prepared to be introduced into the polymer matrix and the area in which the copper particles are in contact. If the surface is made sticky by heating, it is convenient to prepare (sticky) all the surfaces of the vendor board before contacting the copper particles. Alternatively, only one side or one edge of the vendor board can be made sticky. In another embodiment, strips of vendor board having a particular length l, width w, and d may be tacky. The copper that contacts the vendor board will bond with the tacky surface, but will be easily removed from the solid non-sticky surface. The length 1 of the strip processed depends on the substrate used and the application. In general, the strip length l is the length of the strip on the vendor board. Preferably, the width w of the snail-proof surface is at least the width of the snail found in its environment. This avoids the snail'bridging 'the strip with its body as it crosses the border. The depth d of the copper matrix can be varied depending on the application the border will exhibit and the desired effective use length. Generally, the copper matrix depth d will be at least 25 millimeters.

The surface of the vendor board, once tacky, is quickly introduced into the container 18 containing the copper particles 20. Copper particles 20 typically include a distribution of copper particle sizes. Generally, the copper particles 20 will pass through a 100 or finer mesh screen. Preferably the copper particles 20 are 32
Pass through a 5 mesh screen. Alternatively, the copper particles 20 pass through a 800 or finer mesh screen. In general, the barrier is more effective at lower weight percent copper concentrations when finer-sized copper particles are present. If copper particles of larger size are present,
Greater weight percent copper needs to be used to provide an effective snail deterrence barrier.

The copper particles are metallic copper. The copper particles are, for example, flaked, chipped, stripped or powdered to form a small volume of metallic copper and a unit having a relatively large surface area. A wide range of copper metal and alloy particles are available. In general,
The copper metal particles are at least 90% by weight copper. Preferably, the copper metal is at least 95% by weight copper. More preferably, the copper metal is at least 99% copper by weight.
Copper particles with a purity of 99.5% and a mesh size of 325 or 800 are available from Alcan (New Jersey).

In the embodiment shown in FIG. 1, the container 18 containing the copper particles 20 is made of plastic or a metal such as aluminum. The material must be resistant to degradation with the temperature used. Preferably this container 1
8 is reasonably hermetic and reduces copper debris and maintains the atmosphere within the container 18. When the container 18 is maintained at an elevated temperature, the copper particle powder is preferably maintained under nitrogen or another inert atmosphere. The inert atmosphere prevents the copper from oxidizing to form patina or other copper compounds. In some embodiments, the atmosphere is a nitrogen rich gas. However, at room temperature this becomes less critical and the air atmosphere within the container 18 may be sufficient.

Container 18 seals the supply of copper powder as described above. The fine copper particles act as a fluid in the container 18. In the illustrated embodiment, the vendor board is tacky on both of its opposing surfaces. Copper powder is brought into contact with both sides simultaneously (shown) or sequentially (not shown). In the illustrated embodiment, a coating wheel 22 is used to ensure that the copper particles are evenly applied to both sides of the vendor board 10. The illustrated coating wheel 22 has a radial support member extending from the central core. This helps support the vendor board at a stable distance from the hub and minimizes the area obstructed by the support structure.

The treated vendor board can be subjected to a preliminary recycling step even before it is completely cured. In the illustrated embodiment, the vendor board is passed through a pair of rotating brushes 24 before exiting the container 18. The rotating brush 24 has a function of removing copper particles that have not been welded to the surface of the bender board. In use, these brushes become saturated with copper particles, so after a period of time both brushes act to remove excess copper and sweep the copper into areas of low copper concentration.

The second set of heaters 26 can be used to complete the welding of the vendor board to the copper. Generally, the surface is heated to a temperature in the range of about 350 degrees Fahrenheit to about 400 degrees Fahrenheit. Watora Diant panel heater 2.5k
The use of W is sufficient. The temperature of the heater can be adjusted,
The throughput of the vendor board or the distance from the vendor board stream to the heater can be adjusted to maximize process efficiency. Generally, the vendor board is then cooled or chemically cured to make the surface solid.

To reduce cost, the vendor boards of the present application typically include a copper-free core. The composition of the inner core of the vendor board is largely unrelated to these properties, as the properties that the copper matrix exhibits that snails dislike are surface phenomena. Given this and the fact that copper particles are one of the more expensive components of treated bender boards, the copper matrix can only form on one or more exposed surfaces of the bender board. preferable.

The completed copper welded vendor board can be subjected to an additional copper recycling process. A second set of rotating brushes (not shown) can be applied after the surface of the vendor board has solidified. In the illustrated embodiment, the vendor board includes one or more spray nozzles 30 that apply water or other fluid to the surface of the vendor board.
Into the chamber 28 containing Copper particles not fully deposited on the vendor board are washed off the surface and collected at the bottom of chamber 28. Water is generally the preferred fluid because copper particles tend to float above the surface of water due to the high surface tension of water. Skimmer 32 can be utilized to remove copper particles from water. This copper can be dried and reused.

The copper-deposited bender board is preferably wound or dried, preferably before being cut to the appropriate length. Air dry is appropriate. However,
A forced air dryer 34 that gently blows warm air over the surface of the vendor board 10 can be used to speed up this process.

The dried and finished vendor board is cut to length or wound into coils 36 for packaging or shipping.

FIG. 2 illustrates an alternative manufacturing method of the present invention.
In this example, the heating of the vendor board and the contact with the copper particles are performed simultaneously, i.e., each aspect of the heating and contacting steps are performed sequentially or simultaneously in a semi-batch process. This method eliminates the need for pretreatment to make the surface of the vendor board sticky. Also, the heating step after the copper contact shown in FIG. 1 may be omitted.

A preformed continuous or semi-continuous supply of vendor board 10 enters the system at feeder 12 as described above. Various idler wheels 1
4 is shown and may be used to reorient the vendor board 10 as needed depending on the particular location or method requirements. In the preferred embodiment, it is not necessary to pre-treat the surface of the vendor board prior to introducing the vendor board into container 18. The vendor board is installed in a container 18 made of metal or refractory ceramic and preferably aluminum. The vessel is heated and the copper particles 20 in the vessel are maintained at a temperature of about 350-400 degrees Fahrenheit. Copper particles 20
Includes the distribution of copper particle size as described above.

Introduction of the vendor board 10 into the heated container 18 will result in some melting of the surface of the vendor board 10. Copper particles 20 with heated vendor board
When the copper particles 20 are brought into contact with the surface of the bender board 10, melting locally occurs and the surface becomes sufficiently sticky, and the copper particles 20 adhere to the surface of the vendor board 10. A copper-polymer matrix as described above is formed.

As mentioned above, the container 18 is preferably generally hermetic and seals the atmosphere of nitrogen or other inert gas. This inert atmosphere prevents the oxidation of copper and the formation of patina or other copper compounds.

The process of forming the anti-snail barrier material is complete when the vendor board is cooled or cured. The copper particles are present in a concentration of about 5 to about 95% by weight and about 5
To about 85% by weight of polymer is present. Preferably, the concentration of copper metal particles present in the polymeric material is about 2
0 to about 95% by weight and the polymer is about 5 to about 80% by weight. More preferably, the concentration of copper metal particles present in the polymeric material is from about 20 to about 30% by weight.
And the rest is polymer.

As mentioned above, the vendor board containing the anti-snail matrix is subjected to various copper recycling processes. For example, a pair of rotating brushes 24 can be contained within the container 18. As mentioned above, the rotating brush 24 acts to remove copper particles that have not been sufficiently deposited on the surface of the vendor board. In use, these brushes are saturated with copper particles so that after a period of time both will remove excess copper and sweep the copper to areas of lower copper concentration.

The copper recycling process provides a chamber 28 having, for example, one or more spray nozzles 30 and a skimmer system as described above to facilitate the recycling of incompletely deposited copper. If a water system is used, the vendor board 10 is preferably dried using an air dryer or forced air dryer 34,
The dried and finished bender board is then cut to length or wound into coils 36.

FIG. 3 illustrates a preferred alternative manufacturing method of the present invention. In this example, the vendor board contacts the copper particles by passing the vendor board through a copper supply. Electrostatic forces hold the copper particles against the vendor board. The copper and vendor board are then heated to fuse the copper and polymer to form a snail barrier. This method eliminates the need to pre-treat the vendor board surface to make it sticky.

A continuous or semi-continuous supply of vendor board 10 preformed as described above enters the system at feeder 12. Various idler wheels 14 are shown and can be used to change the orientation of the vendor board 10 as needed for a particular location or process requirement. In the preferred embodiment, it is not necessary to pretreat the surface of the vendor board prior to introducing the vendor board into container 18. The vendor board is introduced into a container 18 containing a supply of copper particles 20. The copper particles 20 usually have a copper particle size distribution as described above.

Even if the surface of the vendor board is not sticky, the copper particles 20 adhere to the surface of the vendor board by electrostatic force. In one preferred embodiment, a pair of electrostatic brushes 25 act to remove excess copper particles from the surface of the vendor board. In use, these brushes 2
5 was saturated with copper particles and after a period of time both acted to remove excess copper and sweep the copper into areas of low copper concentration.

The copper coated vendor board is then heated to melt the polymer and copper into a matrix. For example, 2 for polyethylene vendor board stock
Heated between two heater units 26 to melt the surface and form a copper / polymer matrix. Generally, the surface is heated to a temperature of about 350 to 400 degrees Fahrenheit. A 2.5 kW Watlowa Diant panel heater is sufficient. The heater temperature can be adjusted, the vendor board throughput rate can be adjusted, or the distance of the heater from the vendor board stream can be adjusted to maximize process efficiency. This method of forming a snail barrier material is complete when the vendor board cools.

As mentioned above, the vendor board containing the anti-snail matrix can be subjected to various copper recycling processes.

The copper recycling process can provide a chamber 28 having, for example, one or more nozzles 30 and a skimmer system, which, as mentioned above, allows reuse of incompletely deposited copper. Is planned. When a water system is used, the vendor board 10 is preferably dried utilizing an air dryer or forced air dryer 34, after which the dried and finished vendor board is cut to length or wound into coils 36. To be

FIG. 4 shows a strip of rigid bender board 110. As mentioned above, a wide range of vendor boards 110
Are known and used for various functional and decorative purposes. Generally, a vendor board 110 used as an agricultural lip has an upper area 11 exposed to the elements.
2 and a stock region 114 that holds the lip in place below ground level 116.

The illustrated vendor board 110 includes a corrugated top lip commonly used in gardens. Such decorations are not normally present in industrial applications or large scale agricultural vendor board applications. Extensive polymer vendor board 1
10 is commercially available in a rigid or bendable form. For ease of description and not for purposes of limitation, vendor board 110 will be described with reference to a polyethylene vendor board that has been treated to form a snail barrier material thereon.

The snail barrier material is provided on a rigid or semi-rigid substrate and the method according to the present application allows the vendor board 1
When formed, the barrier typically extends from one end of the substrate toward the opposite end. Individual lengths of vendor boards are aligned or end-to-end to provide a continuous snail restraint border. Vendor boards may have some overlap at the edges to ensure that there is no path that would allow the snail to move across the board.

5 (a)-(d) show several alternative embodiments of the agricultural barrier of FIG. 4, taken along the line 5-5.

FIG. 5A shows an embodiment of a certain cross section shown in FIG. In this example, all exposed surfaces of the vendor board 110 show a snail barrier material 118 that acts to inhibit the terrestrial snail 120. The rigid or semi-rigid (foldable) core 122 is completely covered with the barrier material 118. The snail 120 does not climb the barrier and therefore does not pass through the enclosed area.

Since the copper matrix is present on all surfaces of the vendor board 110, it is the preferred embodiment for ease of manufacture. This embodiment is also more preferred because the vendor board 110 can be mounted in any desired orientation and provides a ground level barrier to the passage of the snail 32.

FIG. 5B is an embodiment of another sectional view of the vendor board 110 of FIG. In this example, only one lateral surface of the vendor board 110 shows the snail barrier material 118. A copper matrix of such a pattern can be produced, for example, by making only one surface of the vendor board sticky during production or by applying copper particles to only one surface of the vendor board. This embodiment is less preferred because the vendor board 110 is "directional", that is, the treated surface 118a is a valid snail barrier while the untreated surface 122a is not. is there. Care must be taken to apply the vendor board 110 to the proper orientation and to abut the treated surfaces so that there is no path for the snail 120 to pass through. This means that, for example, the barrier material 11
This can easily be done by giving 8 a different color or texture than core 122, which allows strips of barrier material to be aligned and abutted using a visible guide.

As shown, snail 120a will encounter and avoid treated surface 118a. Snail 120b encountering untreated surface 122a is not restrained from climbing the border. In a preferred embodiment, when one side is left untreated, the top surface of the vendor board 110 includes a barrier material that causes the snail to traverse over an agricultural barrier (not shown). Try not to move.

FIG. 5C shows another embodiment of the vendor board 110 shown in FIG. In this example, each lateral surface of the vendor board 110 includes a longitudinal strip of snail barrier material 118 integrated into a rigid or foldable core 122. The snail 120 will climb the rim until it encounters the barrier material. The snail avoids the longitudinal strips of barrier material 118 and therefore does not pass around the enclosed area.

This embodiment is less preferred because the vendor board 110 is somewhat "directional".
Because. Care must be taken to apply the vendor board 110 to the proper orientation and abut the strips of barrier material so that there is no path for the snail 120 to pass. This can be easily done by having the barrier material 128 be of a different color or texture than the core 122, as described above, so that the strips of barrier material 118 are aligned using visible markers. And can be abutted.

The pattern of the copper matrix material shown in FIG. 5 (c) is, for example, only a part of the surface of the vendor board is made sticky, or copper particles are locally applied to the surface of the vendor board by using a mask or the like. Can be manufactured by

FIG. 5D shows another embodiment of the vendor board 110 shown in FIG. In this embodiment, the vendor board 11
The upper region of 0 contains a longitudinal strip of snail barrier material 118. Snail 120 is barrier material 1
Climb the rim until you encounter 18. The snail avoids the area of barrier material 118 and therefore does not pass around the enclosed area.

For another embodiment, the illustrated vendor board 110 is somewhat "directional" and therefore applies the vendor board 110 in the proper orientation and there is no path for the snail 32 to pass through. Care must be taken to abut the strips. This can be easily done by making the barrier material 28 a different color or texture than the support 30, as described above, which will result in a barrier material 28.
The strips are easily aligned and abutable.

Although the present invention has been described in relation to particular embodiments, those skilled in the art will recognize that various modifications can be made within the principles described herein.
Such modifications of the invention, including deviations from the disclosure that are within the scope of embodiments known or routine in the art,
Modifications, uses, or adaptations are included within the scope of the invention as defined by the appended claims.

[Brief description of drawings]

FIG. 1 shows an apparatus for heating a vendor board, applying copper to the surface of the vendor board, and cooling the vendor board, and also illustrates a copper recycling method.

FIG. 2 illustrates an alternative apparatus for heating a vendor board, applying copper to the surface of the vendor board, and cooling the vendor board, illustrating a copper recycling method.

FIG. 3 is a diagram illustrating a preferred manufacturing line for manufacturing a vendor board.

FIG. 4 is a diagram showing a vendor board including a barrier material.

5 (a)-(d) are cross-sectional views of the vendor board of FIG. 4 showing various embodiments of barrier materials in connection with suitable substrates.

[Explanation of symbols]

 10 ... Vendor board 12 ... Feeder 14 ... Idler wheel 16 ... Heater unit 30 ... Spray nozzle 32 ... Skimmer

Front Page Continuation (72) Inventor William Schoffer United States, 92705 California, Santa Ana, Castrey Rock Lane, 1072 (72) Inventor Robert Staniek United States, 90293 Playa Del Rey, California, USA Vista Del Mar, 6514 (72) Inventor Malcolm McClann Edgecliff Drive, 1653, Los Angeles, CA, 90026 California, USA

Claims (8)

[Claims] 1. A vendor board comprising a substrate having at least one exposed surface, said exposed surface comprising a copper matrix. 2. The vendor board of claim 1, wherein the copper matrix comprises about 5 wt% to about 95 wt% copper particles and about 5 wt% to about 95 wt% polymer. 3. The polymer is polyvinyl chloride, urethane,
The vendor board of claim 2, selected from the group consisting of polyethylene, polypropylene, polyester, polystyrene, and mixtures thereof. 4. A method of making an anti-snail polymer material comprising: (a) producing a polymer substrate having a tacky surface thereon, and (b) contacting the tacky surface of the polymer substrate with copper particles. And (c) curing the surface of the polymer substrate to form a copper / polymer matrix thereon. 5. A method of manufacturing an anti-snail bender board barrier, comprising: (a) heating a polymer bender board substrate to produce a sticky surface on the bender board; and (b) making the sticker board sticky. A method comprising: contacting copper particles with a surface; and (c) cooling a vendor board. 6. A barrier material for the exclusion of terrestrial gastropods, comprising: (a) a polymeric material and (b) copper metal particles dispersed within the polymeric material. 7. A barrier material for inhibiting terrestrial gastropods from crossing a predetermined area on a surface, comprising: (a) about 5 to about 95% by weight polymeric material; and (b) about 95. To about 5 wt% copper particles. 8. A method for eliminating gastropods from a land area comprising a barrier material consisting essentially of (a) a polymeric material and (b) copper metal particles dispersed in said polymeric material. A method comprising demarcating the region.