JPH06191182A - Ic card device - Google Patents

Abstract

PURPOSE:To mount a paper-type battery low in height and facilitate a battery replacement and am assembly of an IC card device with a paper-type battery mounted on a substrate of a module IC. CONSTITUTION:A paper-type battery 5 is fitted in an opening provided in a substrate 1. A conductive pattern is formed around the opening. An IC, a capacitor, and a connecting terminal 6 are connected by solder 1. If failure of the battery 5 is detected by electrically checking the module IC, the battery can be easily replaced. This module IC is integrally formed out of a resin.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card device, and more specifically to an IC card device in which components, especially paper-type batteries, are mounted on a substrate of a module IC built in the IC card.

[0002]

2. Description of the Related Art FIGS. 6 to 8 show a conventional IC card device in which positive and negative electrode conductor patterns (2a) and (2b) are formed on a component mounting board (1). There is. (3) is a semiconductor element (hereinafter referred to as IC), (4) is a component such as a resistor or a capacitor, (5) is a paper battery,
(6) is a connection terminal, (7) is a solder for connecting components, and (8) is an Ag paste for bonding a paper battery.

Next, mounting of each component will be described. On the substrate (1) on which the conductor patterns (2a), (2b) of the electrodes are formed,
Connect C (3) and resistor or capacitor (4) with solder (7). Then, the paper type battery (5) and the conductor pattern (2b) of the electrode are cured at a low temperature or room temperature by the Ag paste (8). Further, in order to connect the paper battery (5) and the + electrode conductor pattern (2a), solder the connection terminal (6).
Install with (7) to establish electrical continuity.

Alternatively, after the connection terminal (6) is attached to the conductor pattern (2a) of the + electrode, the paper type battery (5) and the conductor pattern (2b) of the-electrode are adhered by Ag paste (8).

[0005]

In the conventional IC card device, since the module IC or the paper type battery (5) is mounted as described above, it is necessary to cure the Ag paste (8). Since the paper battery (5) is vulnerable to heat stress, it has to be cured at room temperature or low temperature. This room temperature or low temperature curing requires a long working time, resulting in poor productivity.

Also, since the paper type battery (5) has a problem because it is adhered by the Ag paste (8),
The battery could not be replaced. Alternatively, since the paper-type battery is adhered to the surface of the substrate, in the case of a thin IC card, the paper-type battery (5) portion becomes thick and it is difficult to form a card.

The present invention has been made in order to solve the above-mentioned problems, and a paper type battery can be mounted low, and when the paper type battery has a defect, the battery can be replaced and the workability is improved. The purpose of the present invention is to obtain an IC card device.

[0008]

In the IC card device according to the present invention, an opening is provided in a substrate of a battery mounting portion, a conductor pattern of + -electrodes is formed around the opening, and a paper is formed in the opening. The battery is mounted, and the connection terminals are attached to the conductor patterns of the electrodes so that the paper battery can be mounted.

[0009]

In the present invention, the opening or the opening is provided in the substrate of the paper battery mounting portion, so that the battery can be easily mounted or removed.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. In the figure, (1) is a module IC substrate, BT or glass epoxy substrate, (2a) is a + electrode conductor pattern, (2b) is a-electrode conductor pattern provided around the opening of the substrate, and (9) is It is a board opening into which the paper battery (5) is fitted. In addition, the same reference numerals as those in FIGS. 6 to 8 denote the same parts.

Next, mounting of a battery or the like will be described. substrate
The opening (9) is provided in (1), and the IC pattern is formed on the substrate where the conductor patterns (2a) and (2b) of + to − electrodes are formed around the opening (9)
Solder (3), resistor, capacitor (4), connection terminal (6)
Connect by.

Next, connect the paper type battery (5) to the connection terminal.
Insert and mount between (6) and the conductor pattern (2b) of the electrode. Next, if the battery is defective by the electrical check of the module IC, it is replaced with a new battery. FIG. 4 shows a thin IC card (10) having a built-in module IC having the above structure, which is integrally molded with resin (11).

In the above embodiment, the opening (1) is formed in the substrate (1).
Although (9) is provided and the conductor pattern (2b) of the − (or +) electrode is provided on the periphery of the surface of the substrate (1), it is mounted, but as another embodiment, as shown in FIG. Provide a conductor pattern (2b) for the- (or +) electrode on the back side of the board
The paper type battery (5) may be mounted by attaching (6), and the same effect is obtained.

[0014]

As described above, according to the present invention, since the paper type battery is mounted in the opening provided in the substrate, the paper type battery can be mounted without applying thermal stress, and the Ag paste is applied. Workability because it does not require
Productivity is improved. Further, there is an effect that a battery that can be replaced can be obtained.

[Brief description of drawings]

FIG. 1 is a top view of essential parts of an embodiment of the present invention.

2 is a side view of that of FIG. 1. FIG.

FIG. 3 is a partially enlarged view of FIG.

FIG. 4 is a cross-sectional view of an IC card incorporating the module IC of the embodiment.

FIG. 5 is a top view of a main part of another embodiment.

FIG. 6 is a top view of a main part of a conventional IC card device.

FIG. 7 is a side view of that of FIG. 6;

FIG. 8 is a partially enlarged view of FIG.

[Explanation of symbols]

 1 Substrate 2a, 2b Electrode conductor pattern 3 IC 4 Resistor or capacitor 5 Paper battery 6 Connection terminal 7 Solder 9 Opening 10 Thin IC card

Front page continuation (72) Inventor Kenji Kimura 3-13-21 Hisayo, Kawanishi City, Hyogo Prefecture

Claims (1)

[Claims] 1. An IC card device comprising an opening in a substrate on which a semiconductor element, a resistor, a capacitor, and a paper-type battery are mounted, and a module IC in which the paper-type battery is removably mounted in the opening.