JPH0615683A - Transfer molding apparatus and object to be molded thereof - Google Patents

Abstract

PURPOSE:To surely and efficiently perform the sealing of a thin electronic part by providing an air vent discharging air in a runner, a cavity and a pot and uniformizing the flow speed of the resin flowing in to the cavity. CONSTITUTION:A cavity 3 is formed by an upper mold 1 and a lower mold 2. The resin melted in the pot 5 of the lower mold 2 is sent under pressure by a plunger 9 to be sent into the cavity 3 through a runner 6 and a gate. An air vent 12 is provided to one end of the runner 6 and a air vent 18 discharging the air in the pot 5 is provided to the runner 6 so as to be adjacent to the pot 5 and the entrapping of air in the resin allowed to fill the cavity 3 is prevented. When the surface of the part excepting the area opposed to the object to be sealed of the cavity 3 is roughened at the time of resin sealing, the flow speed of the resin becomes uniform and filling defect can be prevented. Further, when a constricted part is provided on the way of the gate and a molded product is cut at the constricted part simultaneously with demolding, the generation of a crack in the vicinity of the gate can be prevented.

Description

Detailed Description of the Invention

 [Object of the Invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer molding apparatus suitable for, for example, encapsulating an IC card or a semiconductor device, and a body to be molded thereof.

[0002]

2. Description of the Related Art Generally, an electronic component is enclosed in a plastic, and through this plastic, airtightness is maintained to be protected from the outside air and the environment, and its mechanical stability is enhanced to make it more stable. It can exhibit electrical performance. By the way, initially, the potting method or the casting method using a liquid epoxy resin was the mainstream for the sealing of this electronic component, but in the age of IC and LSI, the number of input / output pins increased and the package outline Preciseness is now required, and because the quantity has increased, a production method suitable for mass production has come to be required, and there is a strong demand for higher reliability. Therefore, a transfer molding method using powdered epoxy resin has been introduced. Since then, this transfer molding method has been mainstream until today. Sealing by this transfer molding method
Although air tightness is inferior to can encapsulation and ceramic encapsulation, it can be mass-produced cheaply, and reliability has been greatly improved due to improvements in element passivation technology and dramatic improvements in encapsulation materials. Therefore, it is the mainstream of today's electronic component encapsulation.

However, recently, due to the need for high-density packaging, the ratio of thin and small packages called surface-mount packages such as SOP (Small Outline Package) is increasing. Therefore, in response to this, the mold for transfer molding, the shape of the lead frame, the sealing resin, and the like have been improved. However, since the surface mount type package has a thickness of several mm or less, the incidence of unfilling failure in which the resin is not filled in the cavity, the occurrence of cracks and voids, the deformation of leads, and the like increases, and It is the cause of the decrease in the stay.

[0004]

As described above, various molding defects tend to occur frequently in the sealing of thin and small semiconductor devices by the transfer molding method due to the demand for high-density packaging.

The present invention has been made in consideration of the above circumstances, solves the technical problem of the above-mentioned conventional transfer molding method, and can be applied to thin electronic components such as surface mount semiconductor devices. An object of the present invention is to provide a transfer molding device and a molded object for the transfer molding which can perform sealing reliably and efficiently. [Constitution of Invention]

[0006]

The transfer molding apparatus of the present invention is specially provided with an air vent for discharging the air in the pot. The transfer molding apparatus of the present invention is one in which the inner wall surface of the cavity is formed to be a rough surface excluding a portion facing the die pad. The transfer molding apparatus of the present invention is provided with a constricted portion in the middle of the gate. In the transfer molding apparatus of the present invention, at the time of vacuum molding, at least the air vent connected to the cavity can be opened and closed.

The object to be molded of the present invention comprises a lead frame and
A semiconductor element mounted on the lead frame and a resin portion for sealing the semiconductor element. The lead frame is provided in an outer frame and a central portion surrounded by the outer frame. A die pad on which a semiconductor element is mounted, suspension pins bridging the die pad and the outer frame, leads protruding from the inner side of the outer frame in a comb-like shape toward the die pad, and these leads and the semiconductor element. A thin wire for electrical connection is provided, and a portion other than the thin wire connecting portion of the lead and a cross section of the hanging pin are formed in a bent or curved shape.

In the molded body of the present invention, a recess for accommodating a semiconductor element is formed in the semiconductor element mounting portion of the lead frame, and the depth of this recess is set to be substantially the same as the thickness of the semiconductor element. The semiconductor element and the lead frame housed in the same are flush with each other.

[0009]

In the transfer molding apparatus of the present invention, air is prevented from being entrained in the molten resin filled in the cavity, so that the generation of voids as molding defects can be prevented.

In the transfer molding apparatus of the present invention, when the molten resin flows into the cavity from the gate, the flow rate of the molten resin is made uniform, so that the occurrence of unfilled defective molten resin can be suppressed.

Since the transfer molding apparatus of the present invention is provided with a constricted portion in the middle of the gate, it is possible to prevent peeling between the resin portion and the insert portion of the body to be molded and the occurrence of cracks in the vicinity of the gate portion. It can contribute to the improvement of the stay.

The transfer molding apparatus of the present invention can remarkably increase the exhaust speed for forming the reduced pressure atmosphere before resin molding, and can contribute to the improvement of molding efficiency.

In the molded body of the present invention, the rigidity of the leads and the suspension pins is enhanced, so that the transfer molding is performed at the time of transfer molding.
It is prevented from being deformed by the inflow pressure of the molten resin, and it is possible to prevent the occurrence of defects such as disconnection, short circuit of the thin metal wire, and exposure from the resin portion of the lead frame, which impair the reliability.

In the object to be molded of the present invention, the molten resin flowing from the gate does not hinder the flow, and the flow rate of the molten resin becomes uniform, so that the occurrence of unfilled defects can be suppressed.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings.

1 and 2 show a transfer molding apparatus M of this embodiment. This transfer molding apparatus includes a mold part M0 composed of an upper mold 1 and a lower mold 2, a plurality of cavities 3 formed by the mold part M0 ... (Between the inner bottom surfaces 1a and 2a of the upper mold 1 and the lower mold 2). The distance is 900μ
m) <Refer to FIG. 3 and FIG. 4>, and a pot 5 for storing and melting a resin tablet 4 provided in the lower mold 2 and formed in a columnar shape and made of, for example, an epoxy resin, and the pot 5.
Molten resin R produced by melting the resin tablet 4 at
And the runner 6 for guiding the air to the cavity 3 ...
From which the molten resin R branched and melted corresponding to each cavity 3 is guided to the cavities 3 and the upper mold 1.
And the resin tablet 4 installed in the lower mold 2 in the pot 5
A heater (not shown) for melting the resin by induction heating,
A plunger 9 slidably fitted in the pot 5, a plunger drive mechanism 10 for driving the plunger 9 in its axial direction, a mold opening mechanism 11 for bringing the upper mold 1 into and out of contact with the lower mold 2, and a runner 6 It comprises an air vent mechanism 12 for bleeding out the air inside, and a mold release mechanism 14 provided on the lower mold 2 and projecting a molding target L (see FIGS. 3 and 4). The runner 6 is linearly provided so as to cross the center of the lower mold 2. Then, one end of the runner 6 is opened to the outside via an air vent 15 which forms a part of the air vent mechanism 12. The other end of the runner 6 is connected to the pot 5 at one side of the lower mold 2. The gates 7 branch off at equal intervals on both sides of the runner 6, one at a time. Further, the cavities 3 are connected to the gates 7 ... Thus, the gates 7 are provided at the parting line positions of the upper mold 1 and the lower mold 2 so as to be positioned at the central portion in the thickness direction of the cavities 3. As shown in FIGS. 3 and 4, the inner wall surfaces of the cavities 3 ... Are formed on the rough surfaces 3a ... Except for a portion facing a die pad 24. The release mechanism 14 is provided with four ejector pins 16 arranged equidistantly around the pot 5, and ejector pin drive (not shown) for driving the ejector pins 16 ... It consists of means. Further, the air vent mechanism 12 includes the above-described air vent 15, a ring-shaped groove 17 engraved around the pot 5, and the groove 17
And a ring-shaped air vent 18 for communicating the pot 5 with each other.

On the other hand, FIGS. 3 and 4 show a molded body L molded by the transfer molding apparatus M of this embodiment. The molded body L includes a thin plate-shaped lead frame 19 having a thickness of 100 μm, and the lead frame 19
A semiconductor element 20 having a thickness of, for example, 200 μm mounted on
, And the thickness for sealing the semiconductor element 20 ... For example, 90
0 μm resin portion 21 ... As shown in FIG. 5, the lead frame 19 is in the form of a strip as a whole, and is formed by repeatedly forming the units 22 ... For each of the semiconductor elements 20. The unit 22 includes a rectangular outer frame 23, a rectangular die pad 24 disposed in a central portion surrounded by the outer frame 23, the die pad 24 and the outer frame 2.
A pair of suspension pins 25, 25 bridging with 3 and the outer frame 23
A plurality of leads 26 ... Protruding in a comb shape from the inside to the die pad 24. That is, the resin portion 21 is used for the lead frame 19 and the semiconductor element 20.
Is insert-molded. Therefore, the hanging pins 25, 25 are provided on both sides of the die pad 24 so as to match the longitudinal direction of the lead frame 19. Then, the hanging pins 25, 25 are bent downward in the middle, and the die pad 24 is separated from the outer frame 23 by Δ.
The height is lower by L so that the central portion of the semiconductor element 20 mounted on the die pad 24 in the thickness direction and the outer frame 23 have the same height. Further, the longitudinal directions of the leads 26 are provided so as to be orthogonal to the longitudinal direction of the lead frame 19. The metal thin wires G ... Are connected by wire bonding between the terminals of the semiconductor element 20 and the tips of the leads 26. By the way, the hanging pins 25, 25 and the leads 26 ...
As shown in FIG. 6 or FIG. 7, except the portion where the ... Is joined, the cross section is formed in a V-shape or a U-shape (may be wavy or saw-tooth shape) (two-dot chain line in FIG. 5). Area), the rigidity is high. Then, when molding the molding target L by the transfer molding apparatus M, first, the upper mold 1 is separated from the lower mold 2 by the mold opening mechanism 11. Then, the lead frame 19 is positioned at a predetermined position on the cavities 3 of the lower mold 2. Next, the upper mold 1 is brought into close contact with the lower mold 2 by the mold opening mechanism 11, and the mold is clamped. Then, the resin tablet 4 is loaded in the pot 5, and the resin tablet 4 is melted by the heater. This resin tablet 4 includes an epoxy resin (for example, bisphenol A type epoxy resin), a curing agent (for example, amines), a curing accelerator (for example, nitrogen-containing compounds), a flexible agent (for example, silicone oil, rubber), It is a mixture of a filler (for example, fused silica), a coupling agent (for example, epoxy silane), a flame retardant aid (for example, antimony trioxide), a colorant (for example, carbon black), a release agent (for example, waxes) and the like. The mold temperature at this time is 160 to 19
0 ° C is optimal. Then, move the plunger 9 to the arrow A1.
The molten resin R in the pot 5 to, for example, 30
~ 100 kgf / mm ² Pressurize with. Then, the molten resin R is filled from the pot 5 into the cavities 3 via the runner 6 and the gates 7. With the flow of the molten resin R, the air in the runner 6 is discharged from the air vent 15 provided at the end of the runner 6. Further, in the pot 5, the air staying between the pot 5 and the molten resin R is discharged to the groove 17 side through the air vent 18, and the ejector pin 16 is inserted into the hole. It is discharged to the outside via. As a result, the air in the pot 5 is entrained in the molten resin R, and the molten resin R
At the same time, it is possible to prevent air from flowing into the cavities 3 to generate voids.

On the other hand, since the inner wall surfaces of the cavities 3 have a rough surface 3a except for the portions facing the die pads 24, when the molten resin R flows into the cavities 3 from the gates 7 ... The flow rate of the molten resin R is made uniform. That is, if the inner wall surface of the cavity 3 is a rough surface 3a.
.., the front and back portions of the die pad 24 are narrower than the other portions, so that the flow rate of the molten resin R is reduced at the front and back portions of the die pad 24.
As a result, the molten resin R is unevenly filled in the cavities 3 ... As a result, unfilling failure is caused. However, in this embodiment, since the roughened surfaces 3a are formed, the flow rate of the molten resin R becomes uniform, so that the occurrence of unfilled defects can be suppressed.

Further, when the molten resin R flows into the cavities 3, ..., Excessive pressure is applied to the suspension pins 25, 25 and the leads 26. In this embodiment, these suspension pins 25, 25 and the leads are provided. Since 26 ... have a V-shaped or U-shaped cross section and have increased rigidity, they can withstand deformation caused by the inflow of the molten resin R. As a result, it is possible to prevent the occurrence of defects such as disconnection and short circuit of the thin metal wire and exposure of the lead frame 19 from the resin portion 21 which impair reliability.

In the above embodiment, the air which has passed through the air vent 18 is discharged to the outside through the groove 17 and the hole into which the ejector pins 16 are fitted. However, as shown in FIG. 8, the air that has passed through the air vent 18 may be discharged through the air discharge groove 27 that opens to the outside of the mold.

Further, as shown in FIGS. 9 and 10, there is shown a molded body L1 according to another embodiment of the present invention. The molded body L1 is a thin lead frame 30 having a thickness of 400 μm, for example. And a semiconductor element 31 having a thickness of, for example, 200 μm mounted on the lead frame 30, and a resin portion 32 for sealing the semiconductor element 31. Then, in the portion of the lead frame 30 where the semiconductor element 31 is mounted, a recess 33 for storing the semiconductor element 31 is formed. The depth of these recesses 33 is equal to the semiconductor element 3
The thickness is set to 200 μm, which is the same as the thickness of No. 1, and the semiconductor element 31 and the lead frame 30 housed in the recess 33 are flush with each other.

When the molded object L1 having such a structure is molded by using the transfer molding apparatus M, the distance D1 between the inner bottom surface 1a of the upper mold 1 and the upper surface of the semiconductor element 31 and the upper surface of the lead frame 30 Distance D2 from the inner bottom surface 1a of the mold 1
Then, the distance D3 between the inner bottom surface 2a of the lower die 2 and the lower surface of the die pad 31a on which the semiconductor element 31 is mounted is equal to the distance D4 between the inner bottom surface 2a of the lower die 2 and the lower surface of the lead frame 30. Therefore, the molten resin R flowing in from the gate 7 does not hinder the flow, and as a result of the uniform flow rate, it is possible to prevent the occurrence of unfilled defects.

In this case, the thickness of the lead frame 30 is not limited to the same, but only in the cavity 3 as in the case of the molded body L2 shown in FIGS. 11 and 12, for example. For example 400μ
Even when the thickness is m and the thickness of the lead frame 30 inserted by the upper mold 1 and the lower mold 2 is 100 μm, for example, the same effect can be obtained. Further, like the molded body L3 shown in FIG. 13, the leads 26 of the lead frame 30 ...
The wire G ... Connection portion may be thinned to a thickness of 100 μm, for example.

FIGS. 14 and 15 show a transfer molding apparatus M1 according to another embodiment of the present invention. The transfer molding apparatus M1 has a mold part composed of an upper mold 41 and a lower mold 42. 42 and a plurality of cavities 43 formed by the mold part 42 (the distance between the inner bottom surfaces 41a, 42a of the upper mold 41 and the lower mold 42 is 900 μm, for example)
And a resin tablet (not shown) made of, for example, an epoxy resin, which is provided in the upper mold 41 and is formed into a cylindrical shape.
And a runner 46 for guiding the resin tablet (not shown) melted in the pot (not shown) to the cavities 43 ... Gate 47 that branches corresponding to the cavities 43 and guides the molten resin R to the cavities 43.
A heater (not shown) provided in the upper mold 41 and the lower mold 42 to melt the resin tablets in the pot by induction heating, and a plunger (not shown) slidably fitted in the pot. An air vent mechanism 50 for removing the air in the runner 46, a sealing mechanism 51 for hermetically sealing the runner 46 and the cavities 43 and the gate 47 formed by the upper mold 41 and the lower mold 42, and the sealing mechanism 51. It is composed of a decompression mechanism 52 for decompressing the formed sealed space 51a. Thus, the air vent mechanism 50 includes a first air vent 53 provided at the end of the runner 46 opposite to the pot and a second air vent 53 provided at the end opposite to the runner 6 of the cavities 43. The air vents 54 ... And these second air vents 54 ...
Side pin 5 slidably inserted into lower mold 42
5 (see FIG. 16) and air cylinders (not shown) for driving these side pins 55 forward and backward in the axial direction. Here, the width of the side pins 55 ... Is set to be substantially equal to the width of the cavities 43. On the other hand, the sealing mechanism 51 includes an upper mold frame 56 integrally mounted on the upper mold 41 so as to surround its side wall, and a lower mold frame integrally mounted on the lower mold 42 so as to surround its side wall. 57, and the upper mold 41 and the lower mold 42 are provided in close contact with each other, and at the same time, the upper mold 56 and the lower mold 57 are provided in close contact with each other in an airtight manner. Further, the decompression mechanism 52 includes a vacuum pump 58.
And a decompression duct 59 connected between the vacuum pump 58 and the sealing mechanism 51 for guiding the air in the sealed space 51a to the vacuum pump 58.

Therefore, this transfer molding apparatus M1
First, the upper die 41 and the lower die 42 are clamped. Then, the side pin 55 ...
Is lowered in the direction of arrow B1. Then, the side pin 55
Between the upper mold 41 and the ... Vent hole 6 as shown in FIG.
0 ... is formed. The ventilation holes 60 ... Are much larger than the second air vents 54. Then, the vacuum pump 58 is activated to remove the air in the sealed space 51a from the decompression duct 5
Remove via 9. Along with this, the air in the runner 6, the gate 47, ... And the cavities 43 ... Is exhausted via the first air vent 53 and the vent holes 60.
After the exhaust is completed, the side pins 55 ... Are raised in the direction of arrow B2 to return to the original position. In such exhaust work, the ventilation holes 60 are much larger than the second air vents 54, so that the exhaust speed is significantly higher than that in the case of exhausting through the second air vents 54. After that, there is an advantage that it is possible to quickly shift to a molding operation performed similarly to the transfer molding apparatus M.

In the above embodiment, a plurality of side pins 55 ... Is provided for each cavity 43 .. However, as shown in FIG. 17, one side block 61 is provided.
Even if it is attached to the lower mold 42 so as to move back and forth with respect to the upper mold 41, the same operational effect can be achieved.

Further, in the above embodiment, the width of the plurality of side pins 55 is set to be substantially equal to the width of the cavities 43, but there is no particular limitation to this.
The width of the side pins 55 may be smaller than the width of the cavities 43.

Further, in the above embodiment, the second air vents 54 ... Are provided at the upper end portions of the side pins 55 ... However, the second air vents 54 ... Are omitted and the position adjustment of the side pins 55 ... You may make it form an air vent by. Further, the first air vent 53 may be opened and closed similarly to the second air vent 54 ....

Next, FIGS. 18 and 19 show a main part of a transfer molding apparatus M2 according to another embodiment of the present invention. The transfer molding apparatus M2 comprises an upper mold 71 and a lower mold 72. A mold part M2O, a plurality of cavities 73 formed by the mold part M2O, and a resin tablet (not shown) made of, for example, an epoxy resin and formed in a cylindrical shape provided in the upper mold 71 are stored. A melting pot (not shown), a runner 76 that guides the molten resin R melted by a resin tablet (not shown) in the pot into the cavity 73, and a branch from the runner 76 corresponding to the cavity 73. Then melt resin R into cavity 7
3, a gate 77 for guiding to 3, a heater (not shown) provided in the upper mold 71 and the lower mold 72 for melting a resin tablet in a pot by induction heating, and a plunger slidably fitted in the pot (Fig. (Not shown), an air vent mechanism (not shown) for bleeding air from the runner 76, a plunger drive mechanism (not shown) that drives this plunger in its axial direction, and a lower die 72 as an upper part. It includes a mold opening mechanism (not shown) for bringing the mold 71 into and out of contact with the mold 71, and a mold releasing mechanism 78 provided in the lower mold 72 for ejecting the molding target L4. The mold release mechanism 78 includes an ejector pin 79 slidably fitted in the upper mold 71, an ejector pin drive mechanism 80 for driving the ejector pin 79 in the axial direction thereof.
A gate cutting mechanism 77a for cutting the gate 77 in synchronization with the operation of the ejector pin drive mechanism 80 after the molding is completed.
It consists of Then, the ejector pin 79 abuts on a part of the runner 76 and separates the molding target L4 from the upper mold 71. Furthermore, gate 77 ...
Has a waist 81 formed in the middle thereof. That is,
The thickness of the gate 77 ... is the constricted portion 81 from the runner 76 side.
It is provided such that it decreases as it approaches to, and the thickness increases from the constricted portion 81 toward the cavity 73 side. Further, the width of the gates 77 is reduced so as to approach the constricted portion 81 from the runner 76 side, and the width increases as it goes from the constricted portion 81 to the cavity 73 side. And the gate cut mechanism
The constriction 81 is set to be cut.

Thus, this transfer molding device M2
The molded object L4 molded by is an IC card, for example, and includes a substrate 82, a semiconductor element (not shown) mounted on the substrate 82, and the semiconductor element (not shown) in an airtight manner. And a resin portion 84 for sealing.
That is, this molded body L4 is transferred to the transfer molding device M2.
Is insert-molded by.

When insert molding of such a molded body L4 by the transfer molding apparatus M2, first, the substrate 82 on which the semiconductor element is mounted is inserted between the upper die 71 and the lower die 72. Next, the molten resin R is caused to flow from the pot into the cavity 73 via the runner 76 and the gate 77, the cavity 73 is filled with the molten resin R, and the semiconductor element is sealed by the resin portion 84. After the resin portion 84 is solidified, the lower mold 72 is moved to the upper mold 7 by the mold opening mechanism.
Separated from 1. Then, the ejector pin 79 of the releasing mechanism 78 is brought into contact with the runner 76 to release the molded body L4 from the lower die 72, and at the same time, the constricted portion 81 is cut by the gate cutting mechanism. In this case, the stress associated with the cutting is concentrated on the constricted portion 81, and therefore the resin portion 84 is separated from the substrate 82 91 (see FIG. 20) and the crack 92 (see FIG. 21) near the gate 77 of the resin portion 84 is generated. Can be prevented. As a result, it can greatly contribute to the improvement of molding quality and yield.

[0032]

Since the transfer molding apparatus of the present invention is specially provided with the air vent for discharging the air in the pot, the molten resin filled in the cavity is prevented from being entrapped in air. Therefore, it is possible to prevent the occurrence of voids as molding defects.

Further, the transfer molding apparatus of the present invention is
Since the inner wall surface of the cavity is formed to be a rough surface except for the portion facing the die pad, the flow rate of the molten resin becomes uniform when the molten resin flows into the cavity from the gate. Therefore, it is possible to prevent the defective filling of the molten resin from occurring.

Further, the transfer molding apparatus of the present invention is
Since the constricted portion is provided in the middle of the gate, it is possible to prevent peeling between the resin portion and the insert portion of the body to be molded and cracks in the vicinity of the gate portion, which contributes to improvement in molding quality and yield.

Further, in the transfer molding apparatus of the present invention, at the time of vacuum molding, at least the air vents connected to the cavity can be opened and closed, so that the exhaust speed for forming the reduced pressure atmosphere before resin molding is significantly increased. It becomes possible to contribute to the improvement of molding efficiency.

On the other hand, the molded body of the present invention comprises a lead frame, a semiconductor element mounted on the lead frame, and a resin portion for sealing the semiconductor element, and the lead frame is external. A frame, a die pad disposed in a central portion surrounded by the outer frame and on which the semiconductor element is mounted, suspension pins bridging the die pad and the outer frame, and a plurality of die pins from the inside of the outer frame toward the die pad. It has leads protruding in a comb shape and fine wires that electrically connect these leads to the semiconductor element, and the portions other than the fine wire connecting portions of the leads and the cross section of the hanging pin are formed in a bent shape. Therefore, the rigidity is higher than the linear shape. As a result, these leads and suspension pins will not be deformed by the inflow pressure of the molten resin during transfer molding, and the occurrence of defects that impair reliability, such as disconnection of metal thin wires, short circuits, and exposure from the resin portion of the lead frame. Can be prevented.

Furthermore, in the molded body of the present invention, a recess for storing the semiconductor element is formed in the semiconductor element mounting portion of the lead frame, and the depth of the recess is set to be substantially the same as the thickness of the semiconductor element. Since the semiconductor element stored in the recess and the lead frame are flush with each other,
The molten resin flowing from the gate does not hinder the flow, and the flow rate of the molten resin is made uniform. As a result, the occurrence of unfilled defects can be suppressed.

[Brief description of drawings]

FIG. 1 is a sectional front view of a main part of a transfer molding apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of a main part of the transfer molding apparatus according to the embodiment of the present invention.

FIG. 3 is a cross-sectional view of a molding target according to an embodiment of the present invention.

FIG. 4 is an IV-I of FIG. 3 of a molding target according to an embodiment of the present invention.
It is an arrow sectional view which follows the V line.

FIG. 5 is a plan view of a main part of a molding target according to an embodiment of the present invention.

FIG. 6 is a cross-sectional view of a main part of a body to be molded according to an embodiment of the present invention.

FIG. 7 is a cross-sectional view of essential parts showing a modified example of the molding target according to the embodiment of the present invention.

FIG. 8 is a cross-sectional front view of essential parts showing a modified example of the transfer molding apparatus according to the embodiment of the present invention.

FIG. 9 is a cross-sectional view of a molded body according to another embodiment of the present invention.

FIG. 10 is a view of a molded body according to another embodiment of the present invention.
FIG. 6 is a sectional view taken along line XX of FIG.

FIG. 11 is a cross-sectional view of an essential part showing a modified example of the molding target in another embodiment of the present invention.

FIG. 12 is an X of FIG. 11 of a molded body according to another embodiment of the present invention.
It is an arrow sectional view which follows the II-XII line.

FIG. 13 is a cross-sectional view of an essential part showing a modified example of the molding target in another embodiment of the present invention.

FIG. 14 is a sectional front view of a main part of a transfer molding apparatus according to another embodiment of the present invention.

FIG. 15 is a plan view of an essential part of a transfer molding apparatus according to another embodiment of the present invention.

FIG. 16 is an operation explanatory view of the transfer molding apparatus according to another embodiment of the present invention.

FIG. 17 is a main part plan view showing a modified example of the transfer molding apparatus according to another embodiment of the present invention.

FIG. 18 is a plan view of an essential part of a transfer molding apparatus according to another embodiment of the present invention.

FIG. 19 is a sectional front view of a main part of a transfer molding apparatus according to another embodiment of the present invention.

FIG. 20 is a cross-sectional front view of essential parts showing a molding defect of a conventional transfer molding apparatus.

FIG. 21 is a sectional front view of an essential part showing a molding defect of a conventional transfer molding apparatus.

[Explanation of symbols]

1: upper mold, 2: lower mold, 3: cavity, 5: pot,
6: runner, 7: gate, 18: air vent, 19: lead frame, 20: semiconductor element, 21: resin part, 2
4: die pad, 25: hanging pin, 26: lead, 3
0: lead frame, 31: semiconductor element, 33: recess,
41: upper mold, 42: lower mold, 43: cavity, 46: runner, 47: gate, 51: sealing mechanism, 52: pressure reducing mechanism, 53: first air vent, 54: second air vent, 55: side pin , 60: vent hole, 71: upper mold, 7
2: Lower mold, 73: Cavity, 76: Runner, 77: Gate, 79: Ejector pin, 81: Constricted part, L1,
L2, L3, L4: molded objects.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Internal reference number FI technical display location B29L 31:34 4F

Claims (6)

[Claims] 1. A mold part comprising an upper mold and a lower mold, a cavity formed along the contact and separation surfaces of the upper mold and the lower mold of the mold part, and a pot for storing a molten resin. A runner that guides the molten resin from the pot, a gate that is interposed between the runner and the cavity and that guides the molten resin to the cavity, and a slidably fit into the pot to feed the molten resin to the cavity side. A first air vent serving as a discharge passage for air in the runner and the cavity, and a second air vent provided adjacent to the pot and serving as a discharge passage for air in the pot. A transfer molding device characterized by: 2. A mold part comprising an upper mold and a lower mold, a cavity formed along the contact and separation surfaces of the upper mold and the lower mold of the mold part, and a pot for storing a molten resin. A runner that guides the molten resin from the pot, a gate that is interposed between the runner and the cavity and that guides the molten resin to the cavity, and a slidably fit into the pot to feed the molten resin to the cavity side. In a transfer molding apparatus, which comprises a plunger for pressure-feeding to the cavity, and resin-encapsulates an object to be sealed, which is fixed on a substrate to be inserted into the cavity, except a portion of the cavity facing the object to be sealed. A transfer molding apparatus, characterized in that a portion is formed on a rough surface. 3. A mold part comprising an upper mold and a lower mold, a cavity formed along the contact and separation surfaces of the upper mold and the lower mold of the mold part, and a pot for storing a molten resin. A runner that guides the molten resin from the pot, a gate that is interposed between the runner and the cavity and that guides the molten resin to the cavity, and a slidably fit into the pot to feed the molten resin to the cavity side. A transfer molding apparatus, comprising: a plunger for pressure-feeding the inner surface of the gate; and a constricted portion provided in the middle of the gate. 4. A mold part composed of an upper mold and a lower mold, a cavity formed along the contact and separation surfaces of the upper mold and the lower mold of the mold part, and a pot for storing a molten resin. A runner that guides the molten resin from the pot, a gate that is interposed between the runner and the cavity and that guides the molten resin to the cavity, and a slidably fit into the pot to feed the molten resin to the cavity side. A plunger that is pressure-fed to the air, an air vent that serves as an exhaust passage for air in the runner and the cavity, a sealing means that hermetically seals at least the close parts of the upper mold and the lower mold while the air vent is open, and A transfer molding apparatus, comprising: a decompression unit for decompressing a space surrounded by a sealing unit, the air vent being provided so that an opening amount thereof can be adjusted. 5. A thin plate-shaped lead frame, a semiconductor element mounted on the lead frame, and a resin portion for sealing the semiconductor element, and the lead frame includes an outer frame and A die pad, which is disposed in a portion surrounded by an outer frame and to which the semiconductor element is fixed, a plurality of suspension pins bridging the outer frame and the die pad, and a plurality of comb-teeth-shaped teeth from the inner side of the outer frame toward the die pad Has a lead projecting from the end and the semiconductor element and a lead electrically connected to each other through a thin metal wire, and a portion of the lead other than the thin metal wire connecting portion and a cross section of the hanging pin are bent or An object to be molded, which is formed in a curved shape and has enhanced rigidity. 6. An outer frame, a die pad arranged in a region surrounded by the outer frame, a plurality of suspension pins bridging the outer frame and the die pad, and a plurality of hanging pins extending from the inside of the outer frame toward the die pad. The leads protruding in the form of comb teeth, the semiconductor element bonded on the die pad by die bonding, the fine metal wires electrically connecting the tip of the lead and the semiconductor element, and the metal wire formed on the die pad. And a resin portion for sealing the semiconductor element, forming a recess for storing the semiconductor element in the semiconductor element mounting portion of the die pad, and the depth of the recess is approximately equal to the thickness of the semiconductor element. A molded object, which is set to be the same, wherein the semiconductor element stored in the recess and the die pad are flush with each other.