JPH06152149A - Method of boring multilayer printed wiring board - Google Patents

Method of boring multilayer printed wiring board

Info

Publication number
JPH06152149A
JPH06152149A JP30514392A JP30514392A JPH06152149A JP H06152149 A JPH06152149 A JP H06152149A JP 30514392 A JP30514392 A JP 30514392A JP 30514392 A JP30514392 A JP 30514392A JP H06152149 A JPH06152149 A JP H06152149A
Authority
JP
Japan
Prior art keywords
hole
wiring board
printed wiring
multilayer printed
boring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP30514392A
Other languages
Japanese (ja)
Inventor
Hisato Shirasawa
久人 白澤
Fumio Imahashi
富美雄 今橋
Yoshiaki Fuse
良明 布施
Original Assignee
Hitachi Ltd
株式会社日立製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, 株式会社日立製作所 filed Critical Hitachi Ltd
Priority to JP30514392A priority Critical patent/JPH06152149A/en
Publication of JPH06152149A publication Critical patent/JPH06152149A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To enhance the high-accuracy hole position accuracy and the boring and working efficiency of the title method by a method wherein a displacement amount in the stacking and molding operation of an inner-layer core is confirmed by X-rays and a reference hole for boring use is bored. CONSTITUTION:A reference hole 2 used from the formation of an inner-layer pattern up to a lamination operation is bored in copper-clad laminated boards 1a, 1b and an inner-layer pattern 5 is then formed on the inner-layer core 1a. After that, the copper-clad laminated boards 1a, 1b are stacked, a pin 6 for lamination use is inserted into the reference hole 2, this assembly is heated, pressurized for lamination, and a multilayer printed wiring board 1 is formed. The displacement amount of the inner-layer pattern 5 on the multilayer printed wiring board 1 which has been laminated is measured by X-rays 7, the average displacement amount DELTAx=(DELTAx1+DELTAx2)/2 of DELTAx1 and DELTA2 is found, a reference hole 3 for boring use is bored in the multilayer printed wiring board 1 by correcting the average displacement amount DELTAx. After that, a pin 8 for boring use is inserted into the reference hole 3 for boring use, this assembly is fixed to a table at an NC boring machine, and a product inner hole 4 is bored.

Description

【発明の詳細な説明】Detailed Description of the Invention
【0001】[0001]
【産業上の利用分野】本発明は、多層プリント配線板の
製造方法に係り、特に高精度の穴位置を要求される多層
プリント配線板において、穴明け用の基準穴明けを行な
い、多層プリント配線板に穴明けする方法に関するもの
である。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer printed wiring board, and in particular, in a multilayer printed wiring board which requires highly accurate hole positions, a reference hole for drilling is performed to obtain a multilayer printed wiring board. It concerns the method of drilling a plate.
【0002】[0002]
【従来の技術】従来の多層プリント配線板に穴明けする
ための基準穴には、特開平01−303796号公報及
び積層成形に使用した基準穴などが利用されていた。
2. Description of the Related Art As a reference hole for making a hole in a conventional multilayer printed wiring board, Japanese Patent Laid-Open No. 01-303796 and the reference hole used for laminate molding have been used.
【0003】[0003]
【発明が解決しようとする課題】上記従来技術では、多
層プリント配線板に使用する内層材に基準穴明けを行な
い、内層材にパターン形成を行ない、基準穴にピンを挿
入して積層成形した後、ピンを挿入した基準穴を使用し
て穴明けを行なっていた。
In the above prior art, the inner layer material used for the multilayer printed wiring board is formed with reference holes, the inner layer material is subjected to pattern formation, and the pins are inserted into the reference holes to form laminated layers. I used to drill holes using the reference holes with pins inserted.
【0004】そのため、積層成形に使用した基準穴が変
形を起こしたり、個々の基板で積層成形時の寸法変化量
の差があるために前記基準穴と内層パターンの位置関係
が異なることがある。このため、多層プリント配線板へ
高精度の穴位置を満足する穴明けができないという問題
があった。
Therefore, the reference hole used for the lamination molding may be deformed, and the positional relationship between the reference hole and the inner layer pattern may be different due to the difference in the dimensional change amount during the lamination molding between individual substrates. For this reason, there has been a problem in that it is not possible to form a hole in the multilayer printed wiring board that satisfies a highly accurate hole position.
【0005】本発明の目的は、積層成形した多層プリン
ト配線板に穴明け用基準穴明けを行ない、高精度な穴位
置精度及び穴明け加工能率の向上を提供することにあ
る。
SUMMARY OF THE INVENTION An object of the present invention is to provide a multi-layer printed wiring board formed by lamination with reference drilling for drilling to provide highly accurate hole positioning accuracy and improvement of drilling efficiency.
【0006】[0006]
【課題を解決するための手段】上記目的を達成するた
め、積層成形した多層プリント配線板の内層コアのずれ
量をX線により測定を行ない、そのずれ量分を穴明け用
基準穴位置に補正して、穴明けを行なう。その後、穴明
け用基準穴にピンを挿入し、NC穴明け機のテーブル基
準穴に多層プリント配線板を固定し、製品内穴明けを行
なう。
In order to achieve the above object, the displacement amount of the inner layer core of the multilayer printed wiring board formed by lamination is measured by X-ray, and the displacement amount is corrected to the reference hole position for drilling. And make a hole. After that, the pin is inserted into the reference hole for drilling, the multilayer printed wiring board is fixed to the table reference hole of the NC drilling machine, and the product is drilled.
【0007】[0007]
【作用】積層成形した後に穴明けした穴明け用基準穴
は、内層コア材の積層成形時のずれ量を確認した後穴明
けを行なう。その基準穴にピンを挿入してNC穴明け機
に固定し、製品内の穴明けを行なう。このとき多層プリ
ント配線板の穴明け用基準穴とピンのギャップは、0〜
0.05mmの間とする。
Function: The reference hole for drilling, which has been drilled after the lamination molding, is performed after confirming the amount of deviation of the inner core material during the lamination molding. A pin is inserted into the reference hole and fixed to the NC drilling machine to drill the inside of the product. At this time, the gap between the reference hole for drilling and the pin of the multilayer printed wiring board is 0 to
The distance is 0.05 mm.
【0008】以上のように、多層プリント配線板に穴明
け用基準穴を穴明けすることにより、基準穴の変形が無
くなり、製品内に高精度の穴明けをすることができる。
As described above, by forming the reference hole for forming a hole in the multilayer printed wiring board, the reference hole is not deformed, and it is possible to form a highly accurate hole in the product.
【0009】[0009]
【実施例】以下、本発明の実施例を図1及び図2により
説明する。
Embodiments of the present invention will be described below with reference to FIGS.
【0010】図1は、多層プリント配線板1に穴明け用
基準穴3を使用して製品内穴4を穴明けした状態を示
す。
FIG. 1 shows a state in which a multi-layer printed wiring board 1 is provided with a reference hole 3 for drilling and an inner hole 4 for a product is drilled.
【0011】図2(a)〜(e)は、本発明の実施例で
ある。
2A to 2E show an embodiment of the present invention.
【0012】銅張り積層板1a及び1bに内層パターン
形成から積層成形までに使用する基準穴2を穴明けした
後、内層コア1aに内層パターン5を形成する。その
後、銅張り積層板1aと1bを重ね合わせて基準穴2に
積層成形用ピン6を挿入し加熱・加圧して積層成形を行
ない多層プリント配線板1にする。
After forming a reference hole 2 used from the formation of the inner layer pattern to the lamination molding in the copper clad laminates 1a and 1b, the inner layer pattern 5 is formed on the inner layer core 1a. After that, the copper-clad laminates 1a and 1b are superposed on each other, and the lamination molding pin 6 is inserted into the reference hole 2 and is heated and pressed to laminate the laminate to obtain the multilayer printed wiring board 1.
【0013】[0013]
【数1】 [Equation 1]
【0014】積層成形された多層プリント配線板1の内
層パターン5のずれ量をX線7により測定を行ない平均
ずれ量Δxを数1より求め、多層プリント配線板1に穴
明け用基準穴3を平均ずれ量Δx分補正して穴明けす
る。その後、穴明け用基準穴3に穴明け用ピン8を挿入
してNC穴明け機のテーブルに固定して製品内穴4の穴
明けを行なう。
The displacement amount of the inner layer pattern 5 of the multilayer printed wiring board 1 formed by lamination is measured by X-ray 7 and the average displacement amount Δx is obtained from the equation 1, and the reference hole 3 for drilling is formed in the multilayer printed wiring board 1. The average deviation amount Δx is corrected to make a hole. After that, the pin 8 for drilling is inserted into the reference hole 3 for drilling and fixed to the table of the NC drilling machine to drill the inner hole 4 of the product.
【0015】[0015]
【発明の効果】本発明によれば、多層プリント配線板へ
高精度の穴明け及び穴明け加工能率の向上を図ることが
できる。
According to the present invention, it is possible to improve the precision of drilling and the efficiency of drilling in a multilayer printed wiring board.
【図面の簡単な説明】[Brief description of drawings]
【図1】本発明による多層プリント配線板の平面図であ
る。
FIG. 1 is a plan view of a multilayer printed wiring board according to the present invention.
【図2】本発明による多層プリント配線板の製造方法を
示す図である。
FIG. 2 is a diagram showing a method for manufacturing a multilayer printed wiring board according to the present invention.
【符号の説明】[Explanation of symbols]
1…多層プリント配線板、 1a…銅張り積層板(内層コア)、 1b…銅張り積層板(外層コア)、 2…積層工程迄の基準穴、 3…穴明け用基準穴、 4…製品穴、 5…内層信号層パッド、 6…積層成形用ピン、 7…X線写真、 8…穴明け用ピン。 1 ... Multilayer printed wiring board, 1a ... Copper clad laminate (inner core), 1b ... Copper clad laminate (outer core), 2 ... , 5 ... inner layer signal layer pad, 6 ... laminated molding pin, 7 ... X-ray photograph, 8 ... drilling pin.

Claims (2)

    【特許請求の範囲】[Claims]
  1. 【請求項1】多数枚の内層コアからなる多層プリント配
    線板に穴明けする方法において、多数枚の内層コアを重
    ね合わせて積層成形した後、内層コアの積層成形時のず
    れ量をX線により確認し穴明け用基準穴明けを行ない、
    製品内の穴明けをすることを特徴とする多層プリント配
    線板の穴明け方法。
    1. A method for making a hole in a multilayer printed wiring board comprising a large number of inner layer cores, wherein after laminating a large number of inner layer cores and laminating and molding the inner layer cores, the deviation amount at the time of laminating and molding is determined by X-ray Check and make a reference hole for drilling,
    A method for boring a multilayer printed wiring board, which comprises boring a hole in a product.
  2. 【請求項2】請求項1において、個々の多層プリント配
    線板についてずれ量を確認し穴明け用基準穴を穴明け
    し、各基板の穴明け補正を統一することを特徴とする多
    層プリント配線板の穴明け方法。
    2. The multilayer printed wiring board according to claim 1, wherein the deviation amount is confirmed for each multilayer printed wiring board, a reference hole for drilling is punched, and the punching correction of each board is unified. How to drill holes.
JP30514392A 1992-11-16 1992-11-16 Method of boring multilayer printed wiring board Pending JPH06152149A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30514392A JPH06152149A (en) 1992-11-16 1992-11-16 Method of boring multilayer printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30514392A JPH06152149A (en) 1992-11-16 1992-11-16 Method of boring multilayer printed wiring board

Publications (1)

Publication Number Publication Date
JPH06152149A true JPH06152149A (en) 1994-05-31

Family

ID=17941601

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30514392A Pending JPH06152149A (en) 1992-11-16 1992-11-16 Method of boring multilayer printed wiring board

Country Status (1)

Country Link
JP (1) JPH06152149A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102291949A (en) * 2010-06-18 2011-12-21 富葵精密组件(深圳)有限公司 Manufacturing method of multi-layer circuit board
CN104325174A (en) * 2014-10-09 2015-02-04 梅州市志浩电子科技有限公司 Printed circuit board hole drilling positioning device and method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102291949A (en) * 2010-06-18 2011-12-21 富葵精密组件(深圳)有限公司 Manufacturing method of multi-layer circuit board
CN104325174A (en) * 2014-10-09 2015-02-04 梅州市志浩电子科技有限公司 Printed circuit board hole drilling positioning device and method

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