JPH06128788A - Precision electroformed mold - Google Patents

Precision electroformed mold

Info

Publication number
JPH06128788A
JPH06128788A JP30643392A JP30643392A JPH06128788A JP H06128788 A JPH06128788 A JP H06128788A JP 30643392 A JP30643392 A JP 30643392A JP 30643392 A JP30643392 A JP 30643392A JP H06128788 A JPH06128788 A JP H06128788A
Authority
JP
Japan
Prior art keywords
layer
alloy
electroformed
mold
precision
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP30643392A
Other languages
Japanese (ja)
Inventor
Kazuhisa Mitani
和久 三谷
Toshihiro Sannomiya
利宏 三宮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mishima Kosan Co Ltd
Original Assignee
Mishima Kosan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mishima Kosan Co Ltd filed Critical Mishima Kosan Co Ltd
Priority to JP30643392A priority Critical patent/JPH06128788A/en
Publication of JPH06128788A publication Critical patent/JPH06128788A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B11/00Pressing molten glass or performed glass reheated to equivalent low viscosity without blowing
    • C03B11/06Construction of plunger or mould
    • C03B11/08Construction of plunger or mould for making solid articles, e.g. lenses
    • C03B11/084Construction of plunger or mould for making solid articles, e.g. lenses material composition or material properties of press dies therefor
    • C03B11/086Construction of plunger or mould for making solid articles, e.g. lenses material composition or material properties of press dies therefor of coated dies
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B11/00Pressing molten glass or performed glass reheated to equivalent low viscosity without blowing
    • C03B11/06Construction of plunger or mould
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B2215/00Press-moulding glass
    • C03B2215/02Press-mould materials
    • C03B2215/08Coated press-mould dies
    • C03B2215/10Die base materials
    • C03B2215/11Metals
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B2215/00Press-moulding glass
    • C03B2215/02Press-mould materials
    • C03B2215/08Coated press-mould dies
    • C03B2215/14Die top coat materials, e.g. materials for the glass-contacting layers
    • C03B2215/16Metals or alloys, e.g. Ni-P, Ni-B, amorphous metals
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B2215/00Press-moulding glass
    • C03B2215/02Press-mould materials
    • C03B2215/08Coated press-mould dies
    • C03B2215/30Intermediate layers, e.g. graded zone of base/top material
    • C03B2215/32Intermediate layers, e.g. graded zone of base/top material of metallic or silicon material

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE:To produce a precision electroformed mold enhanced in transfer accuracy and excellent in high-temp. hardness, heat resistance, wear resistance and shape holding property by electroplating the surface of a matrix with Ni or Co and thickly forming an Ni-alloy electroformed layer thereon. CONSTITUTION:The surface of a pretreated wooden matrix 1 is electroplated 2 with Ni or Co in about 1-2mum thickness. This electroplating layer 2 is excellent in adhesion and firmness of attachment to the matrix 1, and high transfer accuracy is secured. An Ni-alloy electroless plating layer contg. about 0.1-1.0% B is then formed, as required, on the layer in about 10-50mum thickness, an Ni-alloy contg. about 8-10% Fe is electroformed to obtain an Ni-alloy electroformed layer 3 having about 0.3-5mm thickness. A backing member 5 of epoxy resin, etc., is formed on the layer 3. The matrix 1 is then released to obtain a precision electroformed mold 6.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、プラスチック成形・ガ
ラス成形等の成形を行うための転写精度の高い精密電鋳
金型に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a precision electroforming mold having a high transfer accuracy for performing molding such as plastic molding and glass molding.

【0002】[0002]

【従来の技術】従来、この種の精密転写金型としては、
Ni電鋳層を母型表面に施して裏打部材を取付けて脱型
した表面がNi電鋳層のみの金型が知られている。又、
Ni電鋳層に代えてNi合金電鋳層のみを施して裏打ち
した金型も知られている。
2. Description of the Related Art Conventionally, as this type of precision transfer mold,
There is known a mold in which a Ni electroformed layer is applied to the surface of a mother die, a backing member is attached to the die, and the surface is demolded. or,
There is also known a die which is lined with only a Ni alloy electroformed layer in place of the Ni electroformed layer.

【0003】[0003]

【発明が解決しようとする課題】従来のNi電鋳層のみ
の金型では、硬さが室温においてHV=200程で軟ら
かく200〜600℃のプラスチック成形・ガラス成形
を圧入すればNi電鋳層が変形したり摩耗が進行してミ
クロンの単位の精度が確保できなかった。又、Ni合金
電鋳層のみの金型では、硬さが室温においてHV=40
0〜500で高温硬度で摩耗と変形は少ないが電着応力
が大であるため、電着中に0.1〜0.2mmで母型表
面から剥離することが多くなり、不良品として使用出来
ないという問題点がある。
In the conventional mold having only the Ni electroformed layer, the hardness is as soft as HV = 200 at room temperature and the Ni / electroformed layer is soft when 200 to 600 ° C. plastic molding / glass molding is press-fitted. However, the accuracy of the unit of micron could not be ensured due to the deformation and abrasion. Further, in the case of a die having only the Ni alloy electroformed layer, the hardness is HV = 40 at room temperature.
0 to 500, high temperature hardness, little wear and deformation, but large electro-deposition stress. Therefore, it often peels from the surface of the mold at 0.1-0.2 mm during electro-deposition and can be used as a defective product. There is a problem that it does not exist.

【0004】更に、Ni合金無電解メッキ層のみでは、
HV=400〜600で室温や高温硬度に優れている
が、数10μmの厚みしか形成できず、且つ電着応力が
大きく剥離も大きいという問題点があるため型の形成が
できなかった。
Further, with only the Ni alloy electroless plating layer,
Although HV = 400 to 600 and excellent in room temperature and high temperature hardness, a mold could not be formed due to the problems that only a thickness of several tens of μm can be formed, and the electrodeposition stress is large and peeling is large.

【0005】本発明が解決しようとする課題は、従来の
これらの金型の問題点を解消し、転写精度が高いととも
に高温硬度が高く、耐熱性・耐摩耗性と保形性に優れた
精密電鋳金型を提供することにある。
The problem to be solved by the present invention is to eliminate the problems of these conventional molds, and to obtain a high precision with high transfer accuracy, high temperature hardness, and excellent heat resistance, wear resistance and shape retention. It is to provide an electroformed mold.

【0006】[0006]

【課題を解決するための手段】かかる課題を解決した本
発明の要旨は、 1) 母型表面にNi又はCoの電気メッキを施し、そ
の上にNi合金電鋳層を厚く形成させた後、母型を脱型
させて製造される精密電鋳金型 2) 母型表面にNi又はCoの電気メッキを施し、そ
の上にNi合金系無電解メッキ層を形成し、更にその表
面にNi合金電鋳層を厚く形成させた後、母型を脱型さ
せて製造される精密電鋳金型 3) Ni合金電鋳層の表面に裏打部材を取付けた1又
は2記載の精密電鋳金型にある。 ここで、Ni又はCoの電気メッキは1〜2μm程の厚
み、又Ni合金無電解メッキは10〜50μm程の厚
み、Ni合金電鋳は0.3〜5mm程の厚みとするのが
望ましい。
Means for Solving the Problems The gist of the present invention which has solved the above problems is as follows: 1) After electroplating Ni or Co on the surface of a mother die and forming a thick Ni alloy electroformed layer thereon, Precision electroforming mold manufactured by demolding the master mold 2) Ni or Co electroplating is applied to the master mold surface, a Ni alloy-based electroless plating layer is formed on the master mold, and the Ni alloy electroplating layer is further formed on the surface. A precision electroformed mold produced by forming a thick cast layer and then removing the mother die. 3) The precision electroformed mold according to 1 or 2, wherein a backing member is attached to the surface of the Ni alloy electroformed layer. Here, it is desirable that the electroplating of Ni or Co be about 1 to 2 μm, the Ni alloy electroless plating be about 10 to 50 μm, and the Ni alloy electroforming be about 0.3 to 5 mm.

【0007】[0007]

【作用】本発明では、母型表面に接触するのがNi又は
Coの電気メッキ層であるので、母型との付着性・密着
性に優れて高い転写精度を確保するとともに、そのN
i,Coの電気メッキ層の上に耐熱性があって硬度に優
れたNi合金電鋳層が形成されているので、硬度・強度
があり保形性があってプラスチック注入圧・ガラス注入
圧に対して変形しないようにしている。
In the present invention, since the Ni or Co electroplating layer is in contact with the surface of the mother die, the adhesion and adhesion to the mother die are excellent and a high transfer accuracy is ensured.
Since the Ni alloy electroformed layer, which has heat resistance and excellent hardness, is formed on the i, Co electroplated layer, it has hardness, strength, and shape retention properties, and is suitable for plastic injection pressure and glass injection pressure. I try not to deform it.

【0008】特に、Ni又はCoの電気メッキ層の上に
Ni合金無電解メッキを施し、更にNi合金電鋳層を形
成させるものは、Ni合金無電解メッキ層が高温硬度に
優れているとともに、Ni・Co電解メッキ層とNi合
金電鋳層との接合力を発生させ、より強度が高く耐圧・
耐熱性に優れたものとなっている。
Particularly, in the case where the Ni alloy electroless plating is performed on the Ni or Co electroplating layer and the Ni alloy electroforming layer is further formed, the Ni alloy electroless plating layer has excellent high temperature hardness, and Generates a bonding force between the Ni / Co electroplating layer and the Ni alloy electroformed layer, and has higher strength and pressure resistance.
It has excellent heat resistance.

【0009】[0009]

【実施例】以下、実施例を図面に基いて説明する。図1
は請求項1記載の金型であって裏打ちのある精密電鋳金
型の実施例の断面図であり、図2は請求項2記載の金型
であって裏打ちのある精密電鋳金型7の実施例の断面図
である。
Embodiments will be described below with reference to the drawings. Figure 1
2 is a cross-sectional view of an embodiment of a precision electroformed mold having a backing and a die according to claim 1, and FIG. 2 is an implementation of a precision electroformed mold 7 having a backing and a die according to claim 2. It is sectional drawing of an example.

【0010】図1に示す実施例は、前処理された木製の
母型1の表面にNi電気メッキ2を2μm施し、この上
にFeを8〜10%含有するNi合金の電鋳を行い、3
mmのNi合金電鋳層3を形成し、その上にエポキシ系
樹脂の裏打部材5を取付ける。その後母型1を脱型させ
て製造した金型である。この精密電鋳金型6は、Ni電
気メッキ層2が母型1に正確に密着してサブミクロン単
位の精密の転写表面をもち、又硬さと強度はNi合金電
鋳層3が分担して成形材料の注入圧で変形もないものに
できた。又、耐熱性もNi合金電鋳層3によって優れた
ものとしている。又Ni電気メッキ層2が摩耗しても下
層のNi合金電鋳層3が表面に露出して耐久性が増大す
る。
In the embodiment shown in FIG. 1, 2 μm of Ni electroplating 2 is applied to the surface of a pretreated wooden mother die 1, and a Ni alloy containing 8 to 10% Fe is electroformed on the surface. Three
A Ni alloy electroformed layer 3 of mm is formed, and an epoxy resin backing member 5 is attached thereon. After that, the mold is manufactured by demolding the mother die 1. This precision electroforming mold 6 has a Ni electroplating layer 2 that is in close contact with the mother die 1 and has a precise transfer surface in the submicron unit, and the Ni alloy electroforming layer 3 shares the hardness and strength in forming. It was possible to avoid deformation by the injection pressure of the material. Further, the heat resistance is also made excellent by the Ni alloy electroformed layer 3. Further, even if the Ni electroplated layer 2 is worn, the lower Ni alloy electroformed layer 3 is exposed on the surface and durability is increased.

【0011】図2に示す実施例の精密電鋳金型7は、N
i電気メッキ層2とNi合金電鋳層3との間にBを0.
5〜1.0%含有するNi合金無電解メッキ層4を0.
03mmの厚み形成させたものであり、この中間のNi
合金無電解メッキ層4によって高温における硬度を更に
高め且つNi合金電鋳層3とNi電気メッキ層2との結
合力を強めている。
The precision electroformed mold 7 of the embodiment shown in FIG.
i between the electroplated layer 2 and the Ni alloy electroformed layer 3
The Ni alloy electroless plating layer 4 containing 5 to 1.0% of the Ni alloy.
It was formed with a thickness of 03 mm, and Ni in the middle
The alloy electroless plating layer 4 further enhances the hardness at high temperature and strengthens the bonding force between the Ni alloy electroformed layer 3 and the Ni electroplated layer 2.

【0012】[0012]

【発明の効果】以上の様に、本発明によれば、母型との
密着性が良好で0.1〜0.2μm単位の高精度の転写
が得ることができ、しかも高温硬度・強度が得られて耐
摩耗性が優れて且つ高温における変形が少なく耐久性の
ある精密金型にできた。
As described above, according to the present invention, the adhesiveness to the mother die is good, and the highly accurate transfer of 0.1 to 0.2 μm unit can be obtained, and the high temperature hardness and strength are high. As a result, a precision mold having excellent wear resistance, little deformation at high temperatures, and durability was obtained.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例を示す断面図である。FIG. 1 is a sectional view showing an embodiment of the present invention.

【図2】本発明の他の実施例を示す断面図である。FIG. 2 is a sectional view showing another embodiment of the present invention.

【符号の説明】 1 母型 2 Ni電気メッキ層 3 Ni合金電鋳層 4 Ni合金無電解メッキ層 5 裏打部材 6 精密電鋳金型 7 精密電鋳金型[Explanation of reference numerals] 1 mother die 2 Ni electroplating layer 3 Ni alloy electroforming layer 4 Ni alloy electroless plating layer 5 Backing member 6 Precision electroforming die 7 Precision electroforming die

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 C25D 7/00 F ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location C25D 7/00 F

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 母型表面にNi又はCoの電気メッキを
施し、その上にNi合金電鋳層を厚く形成させた後、母
型を脱型させて製造される精密電鋳金型。
1. A precision electroforming mold manufactured by electroplating Ni or Co on the surface of a mother die, forming a thick Ni alloy electroformed layer on the surface, and then removing the mother die.
【請求項2】 母型表面にNi又はCoの電気メッキを
施し、その上にNi合金系無電解メッキ層を形成し、更
にその表面にNi合金電鋳層を厚く形成させた後、母型
を脱型させて製造される精密電鋳金型。
2. The surface of the master mold is electroplated with Ni or Co, a Ni alloy-based electroless plating layer is formed thereon, and a Ni alloy electroformed layer is thickly formed on the surface of the master mold. Precision electroforming mold manufactured by demolding.
【請求項3】 Ni合金電鋳層の表面に裏打部材を取付
けた請求項1又は2記載の精密電鋳金型。
3. The precision electroformed mold according to claim 1, wherein a backing member is attached to the surface of the Ni alloy electroformed layer.
JP30643392A 1992-10-19 1992-10-19 Precision electroformed mold Pending JPH06128788A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30643392A JPH06128788A (en) 1992-10-19 1992-10-19 Precision electroformed mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30643392A JPH06128788A (en) 1992-10-19 1992-10-19 Precision electroformed mold

Publications (1)

Publication Number Publication Date
JPH06128788A true JPH06128788A (en) 1994-05-10

Family

ID=17956960

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30643392A Pending JPH06128788A (en) 1992-10-19 1992-10-19 Precision electroformed mold

Country Status (1)

Country Link
JP (1) JPH06128788A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005290429A (en) * 2004-03-31 2005-10-20 Seiko Instruments Inc Method for producing electroformed component using low melting point metal
JP2007131919A (en) * 2005-11-10 2007-05-31 Iwate Univ Method for producing electroforming die
WO2012124449A1 (en) * 2011-03-17 2012-09-20 コニカミノルタアドバンストレイヤー株式会社 Method for producing resin molding die, resin molding die, resin molding die set, method for producing microchip substrate, and method for producing microchip using said die

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS537545A (en) * 1976-07-09 1978-01-24 Seikosha Kk Electrocasted cavity and its production method
JPS648766U (en) * 1987-07-03 1989-01-18
JPS6451552A (en) * 1987-08-21 1989-02-27 Fujitsu Ltd Data transfer control system

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS537545A (en) * 1976-07-09 1978-01-24 Seikosha Kk Electrocasted cavity and its production method
JPS648766U (en) * 1987-07-03 1989-01-18
JPS6451552A (en) * 1987-08-21 1989-02-27 Fujitsu Ltd Data transfer control system

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005290429A (en) * 2004-03-31 2005-10-20 Seiko Instruments Inc Method for producing electroformed component using low melting point metal
JP4530262B2 (en) * 2004-03-31 2010-08-25 セイコーインスツル株式会社 Manufacturing method of electroformed parts using low melting point metal
JP2007131919A (en) * 2005-11-10 2007-05-31 Iwate Univ Method for producing electroforming die
WO2012124449A1 (en) * 2011-03-17 2012-09-20 コニカミノルタアドバンストレイヤー株式会社 Method for producing resin molding die, resin molding die, resin molding die set, method for producing microchip substrate, and method for producing microchip using said die
US9023269B2 (en) 2011-03-17 2015-05-05 Konica Minolta, Inc. Manufacturing method of resin molding mold, resin molding mold, resin molding mold set, manufacturing method of microchip substrate, and manufacturing method of microchip using said mold
JP5725155B2 (en) * 2011-03-17 2015-05-27 コニカミノルタ株式会社 Manufacturing method of injection mold, injection mold, injection mold set, manufacturing method of microchip substrate, and microchip manufacturing method using this mold

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