JPH06112243A - Multi-plunger mold press system - Google Patents

Abstract

PURPOSE:To improve manufacture efficiency of a multi-plunger mold press system for forming a resin package of a semiconductor device. CONSTITUTION:A supply side stocker 8 where a lead frame magazine(L/F magazine), in which a lead frame(L/F) or a resin material, going to be a resin package, is housed, or a resin magazine is stared in a specified position is provided. Mold devices 2-7 for molding the resin package on the L/F, a take-out side stocker 9 which houses a stack magazine, in which the L/F where the resin package is formed is housed, and a carrier robot 10 for carrying the L/F and resin materials between the mold devices 2-7 and stockers 8 and 9 are provided. In addition, a line controller 11 for controlling the operation of stockers 8 and 9, the mold devices 2-7, and the carrier robot 10 are provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-plunger mold press system, and more particularly to a multi-plunger mold press system for forming a resin package of a semiconductor device.

Generally, in forming a resin package in a semiconductor device manufacturing process, a multi-plunger mold device is used.

Further, in recent years, there has been a demand for cost reduction of semiconductor devices, and simplification and automation of the manufacturing process of semiconductor devices have been promoted.

Therefore, there is a demand for automation and unmanned operation of the multi-plunger mold device in the resin package manufacturing process.

[0005]

2. Description of the Related Art A multi-plunger mold device adopts a method in which a pick pot or the like provided in the center of a mold in a conventional transfer mold device is abolished and a resin material is directly injected into each cavity in the mold under pressure. This is a device, and by using a multi-plunger mold device, it is possible to improve the efficiency of use of the resin and shorten the manufacturing time.

This multi-plunger molding device (hereinafter, simply referred to as a molding device) is provided with a tablet-shaped resin material (hereinafter, referred to as a tablet) and a lead frame on which a semiconductor chip is mounted, and is provided with an internal mold. After the lead frame is mounted on the mold, a molding process is performed to form a resin package on the lead frame.

Specifically, the supplied lead frame is once housed in a lead frame magazine, and the lead frame is mounted on a mold by a mounting device from the lead frame magazine. Further, the tablet is configured to be supplied to the molding device from a parts feeder arranged in parallel in the molding device. Further, when the resin package is formed on the lead frame, the lead frame on which the resin package is formed is taken out from the mold by the take-out device and housed in the take-out magazine.

[0008]

However, in the above molding apparatus, since the lead frame magazine and the take-out magazine are manually fed and ejected, it takes time to perform the feeding and ejecting work and the type of the lead frame is determined. However, there is a problem in that it is troublesome to manage the lead frame magazine to be processed because it is determined by the operator.
As described above, since the feeding / discharging operation of each magazine was performed manually, the feeding / discharging position of each magazine was provided on the front side or the side portion of the molding apparatus.

Further, since the tablets are supplied by using the parts feeder, there is a problem that it is difficult to manage the number of pieces and the elapsed time, and the tablets are likely to be chipped.

Further, although a plurality of lead frames can be mounted on the mold, if a fraction is generated with respect to the number of mounted frames, the conventional molding apparatus can only manage magazine units, and lots (same) Since it is not possible to manage each type of set), a dummy frame must be set, which causes a problem of lowering manufacturing efficiency.

The present invention has been made in view of the above points, and an object of the present invention is to provide a multi-plunger mold press system capable of improving manufacturing efficiency.

[0012]

SUMMARY OF THE INVENTION In a multi-plunger mold press system for forming a resin package by a multi-plunger on a lead frame that constitutes a semiconductor device, the above-mentioned problems can be solved by selecting a resin material for the lead frame and the resin package. Separately, a supply side stocker housed in a predetermined magazine, a lead frame and a resin material are supplied, a resin sealing device for molding a resin package on the lead frame, and the resin package are formed. The pick-up side stocker that stores the selected lead frame in a predetermined position according to the type, and the lead frame and the resin material are taken out from the above-mentioned supply side stocker and are supplied to the resin sealing device, and at the same time, the resin package is used by the resin sealing device The lead frame on which That it comprises a conveying device for conveying to a predetermined position of the out side stocker can be solved by a multi-plunger mold press system according to claim.

Further, in the multi-plunger mold press system in which a resin package is formed by a multi-plunger on a lead frame forming a semiconductor device, the resin material to be the lead frame and the resin package is predetermined by type. A supply side stocker housed in a predetermined lead frame magazine and a resin magazine, a resin sealing device that molds a resin package on the lead frame by supplying the lead frame and the resin material, and the resin package is formed. The pick-up side stocker that stores the selected lead frame in a predetermined position according to the type, the lead frame and the resin material are taken out from the above-mentioned supply side stocker, and are supplied to the resin sealing device, and at the same time the resin packaging device Was formed A conveying device for conveying to a predetermined position of the take-out side stocker the lead frame, the supply side stocker,
A control device for controlling the operations of the resin sealing device, the stocker on the take-out side, and the transfer device is provided, and this control device manages the lead frame magazine, the resin magazine, and each stocker in association with each other. It can be solved by the multi-plunger mold press system.

Further, the above-mentioned resin sealing device is effectively solved by providing the lead frame magazine and the resin magazine containing the supplied lead frame and the resin material at the back surface of the device. Things will come.

Further, by providing the structure in which the information about the lead frame or the resin material housed in the lead frame magazine and the resin magazine can be exchanged with the resin sealing device and the conveying device, more effectively. Can be resolved.

[0016]

According to the first aspect of the present invention, the multi-plunger mold process can be performed without manual labor, and the manufacturing efficiency of the semiconductor device can be improved.

According to the second aspect of the present invention, the multi-plunger mold process can be performed without manual labor, and the lead frame magazine, the resin magazine and each stocker can be managed in correspondence with each other by the control device. Therefore, it is possible to manage the lead frame to be processed in lot units (type units), and it is possible to cope with small lot production of a wide variety of products.

Further, according to the third aspect of the invention, since the lead frame magazine and the resin magazine can be fed and discharged on the back surface of the apparatus, the degree of freedom in arranging the carrier device can be improved.

Further, according to the invention of claim 4, since information regarding the lead frame or the resin material housed in the lead frame magazine and the resin magazine can be exchanged between the resin sealing device and the carrying device, a plurality of types can be exchanged. Even if the lead frames are mixed, it is possible to discriminate the mixed lead frames, and it is not necessary to set the dummy frame even when a fraction is generated with respect to the number of mounted molds, and the manufacturing efficiency can be improved.

[0020]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a schematic configuration diagram of a multi-plunger mold press system 1 (hereinafter, simply referred to as a system) which is an embodiment of the present invention, and FIG. 2 is a diagram showing a configuration of a control system of the system 1.

The system 1 according to this embodiment is roughly composed of six multi-plunger molding apparatuses 2 to 7 (hereinafter simply referred to as molding apparatuses), a stocker 8 on the supply side, a stocker 9 on the takeout side, a transfer robot 10, and a line controller. 11 and the like. The molding devices 2 to 7 have the same structure.

The molding apparatuses 2 to 7 are the transfer robot 10.
Three units are arranged with the semiconductor chip sandwiched therebetween, and a resin material serving as a material for the lead frame on which the semiconductor chip is mounted and the resin package is supplied to form a resin package on the lead frame.

FIG. 3 is an internal structural view showing one of the molding apparatuses 2 to 7 in an enlarged manner. In the figure, 12
Is a resin magazine supply unit, and the resin magazine containing the resin material is supplied from the resin magazine supply unit 12 to the molding apparatuses 2 to 7. Reference numeral 13 denotes a resin magazine take-out section, and the resin material remaining after the resin package is formed is taken out from the resin magazine take-out section 13.

As described above, in the conventional apparatus, the parts feeder was used as a means for supplying the resin material to the apparatus, but in the molding apparatuses 2 to 7 according to this embodiment, the resin magazine is set as described above. A dedicated tablet magazine system for supplying the resin material to the molding devices 2 to 7 was adopted. This makes it possible to manage the resin material in magazine units, prevent chipping of the tablet-shaped material resin, and perform good molding processing.

Reference numeral 14 is a lead frame magazine supply unit (hereinafter referred to as an L / F magazine supply unit). The lead frame magazine accommodating the lead frame on which the resin package is formed is stored in the L / F magazine supply unit 14. Supplied. Reference numeral 15 is a lead frame magazine take-out section (hereinafter referred to as an L / F magazine take-out section), and the used lead frame magazine is taken out from the L / F magazine take-out section 15. Further, 16 is a dummy lead frame supply / discharge unit for supplying / discharging a dummy lead frame described later.

The resin material supplied from the resin magazine supply unit 12 is sent to the preheater 18 via the tablet take-out table 17 and heated. Further, the lead frame supplied from the L / F magazine supply unit 14 is conveyed to the lead frame distribution unit 19 via the lead frame elevator 20, and is distributed to a predetermined state here. Reference numeral 21 is a dummy lead frame elevator for carrying the dummy lead frame.

The heated resin material and the distributed lead frame are conveyed by the loader 22 and mounted on the multi-plunger mold 28, the semiconductor chip is sealed with the resin, and the lead frame is covered with the resin package. It is formed.

On the other hand, reference numeral 23 in the drawing denotes a stack magazine supply section to which a stack magazine (in which the lead frame after the molding process is stored) is supplied, and 24 denotes a stack magazine take-out section from which the stack magazine is taken out. Reference numeral 25 denotes a dummy stack magazine supply / discharge unit for supplying / discharging a dummy stack magazine in which a molded dummy lead frame is stored.

The lead frame in which the resin package is formed in the multi-plunger mold 28 is stored in the stack magazine via the loader 22 and the unloading carrier 26. At this time, when the dummy lead frame is transported, it is stored in the dummy stack magazine. The stack magazine and the dummy stack magazine are taken out from the molding apparatuses 2 to 7 via the stack magazine take-out section 24 and the dummy stack magazine feeding / discharging section 25. Reference numeral 27 is a controller for managing the molding process and the supply / discharge of each lead frame.

In the molding apparatuses 2 to 7 having the above-mentioned structure, the lead frame (including the dummy lead frame)
Alternatively, all the constituent devices 12 to 16 and 23 to 25 for supplying and discharging the resin material to the molding devices 2 to 7 are the molding device 2.
7 to 7, that is, they are collectively disposed on the rear side of the transfer robot 10. Therefore, with the above configuration, it is possible to supply and discharge the lead frame and the resin material using the transfer robot 10.

Although it is possible to provide the lead frame and the supply / discharge of the resin material at the side positions of the molding apparatuses 2 to 7, in this structure, the transfer robot 10 is provided on the side of the molding apparatuses 2 to 7. Each magazine must be transported to the set position, which complicates the configuration. However, as described above, the lead frame and the resin material are molded into the molding device 2 to
By arranging the components 12 to 16 and 23 to 25 for supplying and discharging to and from the molding device 7 on the back side of the molding devices 2 to 7, the structure of the transfer robot 10 can be simplified.

Further, the molding apparatuses 2 to 7 are internally provided with a waste conveying apparatus for vacuum-packing and discharging the culls and runners generated by the molding process in a vinyl bag. The vacuum-packed waste is discharged from the lower part on the rear side of the apparatus (on the side where the transfer robot 10 is arranged), and is carried out to another room by a belt conveyor (not shown). By providing the waste transport device and the belt conveyor, the waste can be automatically transported, which also eliminates the need for manpower.

Returning to FIGS. 1 and 2, the description will be continued. The supply-side stocker 8 is a device for temporarily storing the lead frame supplied from the line for performing the wire bonding process, which is a pre-process of the resin package forming process of the semiconductor manufacturing process, and the resin material that is the material of the resin package. Yes, a lead frame, a dummy lead frame, a plurality of lead frame magazines containing a resin material, a dummy lead frame magazine, and a resin magazine are mounted for each type. Each magazine is provided with an identifier such as a barcode. The supply-side stocker 8 is configured to be able to identify each magazine to be stored, and its identification data is supplied to the line controller 11 using a communication cable (indicated by a broken line in the figure).

The take-out stocker 9 is a device for storing a plurality of stack magazines or dummy stack magazines in each of which a lead frame or a dummy lead frame which has been molded is stored in units. Each stack magazine is also provided with an identifier such as a barcode. Each magazine in which the take-out stocker 9 is also stored can be identified, and the identification data is supplied to the line controller 11 using a communication cable (indicated by a broken line in the figure).

The transfer robot 10 takes out the stack magazine, the dummy stack magazine, or the resin magazine from the supply-side stocker 8 and transfers the stack magazine, the dummy stack magazine, or the resin magazine to predetermined molding devices 2 to 7, and the respective supply parts 12, 14 of the molding devices 2 to 7. 1
6 has a first function of supplying to magazine 6, and a second function of taking out each magazine from each of take-out parts 13, 15 and 16 after receipt of the molding process and storing it in the supply-side stocker 8, and a predetermined function of being accommodated in the take-out stocker 9. The third function of mounting the stocker in the magazine supply units 23 and 25 of the molding apparatuses 2 to 7, and the take-out unit 24 of the molding apparatuses 2 to 7 in which the magazines accommodating the lead frames accommodating the resin packages are accommodated. , Take out from 25 and take out stocker 9
And a fourth function of mounting it at a predetermined position. The transfer robot 10 includes a line controller 11
Its drive is controlled by.

Further, the transfer robot 10 is provided with a reading device for reading an identifier provided in each magazine and an information transmitting device for exchanging information with each of the molding devices 2-7. There is. Therefore, the lead frame data (such as data indicating the type of lead frame),
Data such as resin material data (data indicating the type of resin) and production data (for example, data indicating the processing method) can be exchanged between the transfer robot 10 and the molding apparatuses 2 to 7. .

The line controller 11 is connected to the above-described molding apparatuses 2 to 7, the supply-side stocker 8, the take-out stocker 9, and the transfer robot 10 by a communication cable, and these equipments / devices constituting the system 1 are connected to each other. The operation is totally controlled. The operation performed by the line controller 11 during the molding process will be described below with reference to FIG.

The line controller 11 activates the operation of the molding process when a molding processing start request signal is output from any of the molding apparatuses 2 to 7. Further, since the line controller 11 carries out the same processing regardless of which of the molding apparatuses 2 to 7 outputs the request signal, in FIG. 4, when the request signal is output from any one of the molding apparatuses. The processing will be described (in the following description, it is assumed that the molding device 2 outputs the request signal).

When the above-mentioned request signal is transmitted from the molding apparatus 2 to the line controller 11 (step 1, the step is abbreviated as S hereinafter), the line controller 11 is executed.
Drives the transfer robot 10 (S3). At this time, the request signal includes data indicating the type of the resin material and the lead frame. Therefore, the transfer robot 10 takes out the resin magazine containing the required type of resin material and the resin magazine containing the required type of lead frame from the supply-side stocker 8 (S3) and conveys the resin magazine to the molding apparatus 2. .

After transporting each magazine to the molding apparatus 2, the transport robot 10 subsequently mounts each magazine on each supply unit 12, 14 of the molding apparatus 2. When wearing this,
Since each magazine is provided with an identifier and the above-mentioned information transmission means is provided between the molding device 2 and the transfer robot 10, various information necessary for forming a resin package (hereinafter, referred to as this information). Information is called production information)
Are transferred between the molding apparatus 2 and the transfer robot 10 (S4).

As described above, each magazine has a molding device 2
Then, the line controller 11 drives the molding device 2 to start the molding process of the resin package (S5). Since this molding process is carried out based on the above production information, the molding process adapted to the lead frame and the resin material supplied to the molding apparatus 2 is carried out. As described above, even when the molding apparatus 2 starts the molding process, it is not necessary to manually input the production information into the molding apparatus 2, so that the manufacturing efficiency can be improved and an artificial input error can be prevented. be able to.

In the molding apparatus 2, the supplied lead frame is aligned and mounted on the mold of the multi-plunger mold 28 by the lead frame distributing unit 19, and the supplied resin material is heated by the preheater and then mounted on the mold. To form a resin package. Further, the lead frame on which the resin package is formed is stored in the stack magazine (S6).

When this lead frame is aligned and mounted in the mold, and if a fraction is generated with respect to the number of the mounted mounts, in the system 1 according to the present embodiment, the magazine (lot) containing the lead frame to be subjected to the next molding process is stored. Molding device 2
It is configured to supply to. As a result, different types of lead frames can be mixed and attached to the mold even when a fraction is generated with respect to the number of attachments, and it is not necessary to attach a dummy lead frame, thus improving manufacturing efficiency. it can. Further, when the resin package is formed in such a state that different types of lead frames are mixed, the lead frames on which the resin package is formed are respectively housed in different stackers.

In the case where a fraction of the number of mounted sheets is generated as described above, when the lead frame magazine (lot) to be subjected to the next mold processing is not supplied to the molding apparatus 2 even after a certain period of time or more, the conventional method is used. Similarly, the dummy lead frame is automatically installed,
The molding process is configured not to be stopped.

At S6, when the lead frame on which the resin package is formed is stored in the stack magazine,
The line controller 11 drives the transfer robot 10 (S7) and takes out each stack magazine from the molding apparatus 2. Even when the stack magazine is taken out from the molding apparatus 2, the production information is exchanged between the molding apparatus 2 and the transfer robot 10, and the production information data is also transmitted to the line controller 11 (S9).

The transfer robot 10 that has taken out the stack magazine from the molding apparatus 2 transfers the stack magazine to the take-out stocker 9 and stores the stack magazine in a predetermined storage position (S10).

As described above, since the operation of each of the constituent devices 2, 8 to 10 constituting the system 1 is controlled by the line controller 11, it becomes possible to completely automate the molding process, and the resin package. The manufacturing efficiency of can be significantly improved. Further, in the present system 1, one type of lead frame for one magazine,
Alternatively, since one magazine / one lot that stores a predetermined number of fat materials is used for one magazine and the production information can be exchanged during the supply / discharge processing of each magazine, the resin magazine / lead frame The correspondence between the magazines / stockers 8 and 9 can be set to 1: 1: 1 and high-mix low-volume production can be realized.

Further, in the present system 1, the process of supplying / discharging the magazines to the stockers 8 and 9 and the molding apparatuses 2 to 7 is performed between the notification of the drive start / drive completion of the transfer robot 10. During that time (that is, while the transport robot 10 is moving), the magazine is interlocked so that the magazine is not fed or discharged, and the safety is improved.

[0049]

As described above, according to the present invention, the following effects can be realized.

According to the first aspect of the present invention, it is possible to perform the multi-plunger mold processing without any manual labor.
The manufacturing efficiency of semiconductor devices can be improved.

According to the second aspect of the present invention, since the multi-plunger mold process can be performed without manpower, the lead frame magazine, the resin magazine and each stocker can be managed in association with each other by the control device. It is possible to manage lots (types) of lead frames to be processed, and it is possible to handle high-mix low-volume production.

According to the third aspect of the present invention, since the lead frame magazine and the resin magazine can be fed and discharged on the back surface of the apparatus, the degree of freedom in arranging the conveying apparatus can be improved.

According to the fourth aspect of the present invention, since information regarding the lead frame or the resin material housed in the lead frame magazine and the resin magazine can be exchanged with the resin sealing device and the transfer device, a plurality of types of leads can be obtained. Even if the frames are mixed, it is possible to discriminate this, and even if a fraction is generated with respect to the number of mounted molds, it is not necessary to set a dummy frame, and the manufacturing efficiency can be improved.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram of a system that is an embodiment of the present invention.

FIG. 2 is a diagram showing a configuration of a control system of a system that is an embodiment of the present invention.

FIG. 3 is an internal configuration diagram showing a mold device in an enlarged manner.

FIG. 4 is a flowchart showing an operation performed by a line controller during a molding process.

[Explanation of symbols]

 1 System 2 to 7 Molding device 8 Supply side stocker 9 Ejection side stocker 10 Transfer robot 11 Line controller 12 Resin magazine supply part 13 Resin magazine extraction part 14 L / F magazine supply part 15 L / F magazine extraction part 23 Stack magazine supply part 24 Stack magazine take-out section

Claims (4)

[Claims] 1. A multi-plunger mold press system for forming a resin package by a multi-plunger on a lead frame constituting a semiconductor device, wherein a resin material for the lead frame and the resin package is predetermined by type. A supply side stocker (8) housed in a magazine, a resin sealing device (2 to 7) to which the lead frame and the resin material are supplied, and which molds the resin package to the lead frame, and the resin. A take-out side stocker (9) for accommodating the lead frame having the package formed at a predetermined position for each type, and the lead frame and the resin material from the supply side stocker (8), and the resin sealing device ( 2 to 7) and a resin package is formed by the resin sealing device (2 to 7). The extraction side stocker lead frame (9)
The multi-plunger mold press system, comprising: a transport device (10) for transporting the multi-plunger mold to the predetermined position. 2. A multi-plunger mold press system for forming a resin package by a multi-plunger on a lead frame constituting a semiconductor device, wherein a resin material for the lead frame and the resin package is predetermined by type. A supply side stocker (8) housed in a lead frame magazine and a resin magazine, and a resin sealing device (2 to 7) that is supplied with the lead frame and the resin material and molds the resin package on the lead frame. ), A lead-side stocker (9) for storing the lead frame on which the resin package is formed in a predetermined position according to type, and the lead-frame and resin material taken out from the supply-side stocker (8). While supplying to the resin sealing device (2 to 7), the resin sealing device (2 A lead frame resin package is formed by 7) the extraction side stocker (9)
(10) for conveying to a predetermined position of the supply side, a control device for controlling the operations of the supply side stocker (8), the resin sealing device (2 to 7), the takeout side stocker (9) and the transfer device (10) (11) is provided, and the control device (11) manages the lead frame magazine, the resin magazine, and each stocker in association with each other, respectively. 3. The resin encapsulation device (2 to 7) is configured such that the lead frame magazine and the resin magazine containing the supplied lead frame and resin material can be attached / detached on / from the rear surface of the device. Claim 1 characterized by
Or the multi-plunger mold press system described in 2. 4. The lead frame magazine and the resin magazine exchange information regarding the contained lead frame or resin material with the resin sealing device (2 to 7) and the transfer device (10). The multi-plunger mold press system according to any one of claims 1 to 3, wherein the multi-plunger mold press system is configured to have a variable structure.