JPH0579216B2 - - Google Patents
Info
- Publication number
- JPH0579216B2 JPH0579216B2 JP62133858A JP13385887A JPH0579216B2 JP H0579216 B2 JPH0579216 B2 JP H0579216B2 JP 62133858 A JP62133858 A JP 62133858A JP 13385887 A JP13385887 A JP 13385887A JP H0579216 B2 JPH0579216 B2 JP H0579216B2
- Authority
- JP
- Japan
- Prior art keywords
- die
- cut
- resin
- substrate
- hollow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 30
- 238000000465 moulding Methods 0.000 claims description 29
- 239000011347 resin Substances 0.000 claims description 27
- 229920005989 resin Polymers 0.000 claims description 27
- -1 polypropylene Chemical group 0.000 claims description 14
- 239000004743 Polypropylene Chemical group 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical group C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 8
- 229920001155 polypropylene Chemical group 0.000 claims description 8
- 239000004698 Polyethylene Substances 0.000 claims description 7
- 229920003002 synthetic resin Polymers 0.000 claims description 7
- 239000000057 synthetic resin Substances 0.000 claims description 7
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 229920000573 polyethylene Polymers 0.000 claims description 6
- 229920005992 thermoplastic resin Polymers 0.000 claims description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 6
- 229920001887 crystalline plastic Polymers 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229930182556 Polyacetal Natural products 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000000113 methacrylic resin Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920006324 polyoxymethylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 241000086550 Dinosauria Species 0.000 description 1
- 229920001871 amorphous plastic Polymers 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000009415 formwork Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は模型、玩具類若しくは知育器具等を構
成する型抜製品及びその成形方法に関するもので
あり、基板と共に一体的に型成形された部分を基
板から分離して使用できるように構成された物と
その製造方法に関する。Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a die-cut product constituting a model, a toy, an educational device, etc., and a method for molding the same. The present invention relates to a device configured so that it can be used separately from a substrate, and a method for manufacturing the same.
（従来の技術）
射出成形により複数の部品等を型成形する場
合、従来の方法では、各部品はランナーにより接
続されることはあるが、部品毎にばらばらの関係
にあるため紛失したり破損したりするおそれがあ
る。そこで本発明者は、部品等を使用時まで固定
する方法について研究を進め本発明を開発した。(Prior art) When molding multiple parts by injection molding, in the conventional method, each part may be connected by a runner, but each part is in a separate relationship, so there is a risk of loss or damage. There is a risk of Therefore, the present inventor conducted research on a method for fixing parts and the like until use, and developed the present invention.
（技術的課題）
即ち本発明の課題は、基板と型抜き部品の異種
の樹脂を互いに溶着させることなく一体的に型成
形できるようにすることである。(Technical Problem) That is, an object of the present invention is to enable integral molding of different resins for a substrate and a die-cut part without welding them to each other.
（技術的手段）
前記課題を達するため本発明は、模型、玩具類
若しくは知育器具等を構成する平板状の型抜製品
について、合成樹脂により型成形された平面的な
凹凸形より成る中空部又は切欠部を有する基板
と、前記合成樹脂よりも成形温度が低いか又は収
縮率が大きいかの条件のうち少なくとも一つの条
件を満たす合成樹脂を用い、基板の中空部又は切
欠部の内側に充填された型抜き部品とを具備し、
前記中空部又は切欠部と型抜き部品に、相互に噛
み合う平面的な凹部３１と凸部３２とを型抜き部
品に、相互に噛み合う平面的な凹部３１と凸部３
２とを設け、かつ中空部又は切欠部の壁面２０に
型抜き部品の抜き方向へ拡がつた傾斜θを設けた
ものである。またこの型抜製品は、溶融温度差の
ある複数種の熱可塑性樹脂Ａ，Ｂ…の内、成形温
度の高い樹脂Ａを用いて中空部又は切欠部を有す
る基板を成形金型により型成形し、その基板の中
空部又は切欠部の内側をキヤビテイとして、そこ
に前記樹脂Ａより成型温度の低い樹脂Ｂ…を充填
する工程からなる成形方法によつて型成形するこ
とが望ましい。(Technical Means) In order to achieve the above-mentioned object, the present invention provides a planar die-cut product constituting a model, a toy, an educational device, etc., with a hollow part or Using a substrate having a notch and a synthetic resin that satisfies at least one of the following conditions: the molding temperature is lower than that of the synthetic resin, or the shrinkage rate is higher than that of the synthetic resin, the hollow part or the inside of the notch of the substrate is filled. and die-cut parts,
A planar recess 31 and a convex part 32 that engage with each other are provided in the hollow part or notch and the die-cut part, and a planar concave part 31 and a convex part 3 that engage with each other in the die-cut part.
2, and the wall surface 20 of the hollow portion or cutout portion is provided with an inclination θ that expands in the direction of cutting the die-cut part. In addition, this molded product is made by molding a substrate with a hollow part or notch using a mold using resin A, which has a higher molding temperature among multiple types of thermoplastic resins A, B, etc. with different melting temperatures. It is desirable that molding be carried out by a molding method comprising a step of filling the inside of the hollow or notch of the substrate with a resin B having a molding temperature lower than that of the resin A.
前記成形温度が高いという場合、樹脂は配合比
や着色剤の有無又はその種類の差等により成形の
ための温度が変り、他の条件によりさらに変化す
るので、現実の成形の際の温度に着目しそれを高
く設定できるものを樹脂Ａとし、その場合の樹脂
Ａに対して低く設定できるものを樹脂Ｂというも
のとする。 When the above-mentioned molding temperature is high, the temperature for molding changes depending on the blending ratio of the resin, the presence or absence of colorant, or the type of colorant, and further changes depending on other conditions, so focus on the temperature during actual molding. A resin that can be set to a higher value is called a resin A, and a resin that can be set lower than that of the resin A is called a resin B.
溶融温度差のある熱可塑性樹脂としては例えば
結晶性プラスチツクにポリプロピレンPP、ポリ
エチレンPE、ポリアミドPA、或いはポリアセタ
ール、非晶性プラスチツクにABS、ポリカーボ
ネートPC、塩化ビニルPVC、ポリスチレン及び
メタクリル樹脂PMMA等があり、これらは一般
的な、入手し易く成形管理が容易なものである。 Thermoplastic resins with different melting temperatures include, for example, crystalline plastics such as polypropylene PP, polyethylene PE, polyamide PA, or polyacetal, and amorphous plastics such as ABS, polycarbonate PC, vinyl chloride PVC, polystyrene, and methacrylic resin PMMA. These are common, easily available, and easy to control molding.
結晶性プラスチツクは成形収縮率が大きいが、
この特徴を利用して、型抜き部品用材料とすると
好都合な場合がある。これは型抜き部品を結晶性
プラスチツクで成形すると、型抜きし易くするこ
とができるためであるが、しかしこの性質にのみ
こだわるものではない。 Crystalline plastics have a high molding shrinkage rate, but
Taking advantage of this feature, it may be advantageous to use it as a material for die-cut parts. This is because molding the die-cut part out of crystalline plastic makes it easier to die-cut, but this property is not the only thing that matters.
前述のプラスチツク中例えば、ABS樹脂の金
型温度は40〜80℃、またはポリプロピレンの場合
のそれは30〜100℃であるとされるが、成型機に
装備された温度計は夫々50℃、40℃を指し、成形
温度もABSの方がが高温に適し、240〜250℃が
良好なのに対しポリプロピレンは190〜200℃と略
50゜の差がある。故に樹脂ＡにBSを、又同Ｂに
PPを用いる組合せは適当である。 Among the aforementioned plastics, for example, the mold temperature for ABS resin is said to be 40 to 80°C, or for polypropylene to be 30 to 100°C, but the thermometer installed in the molding machine indicates a temperature of 50°C and 40°C, respectively. In terms of molding temperature, ABS is more suitable for high temperatures, 240-250℃, while polypropylene is 190-200℃.
There is a difference of 50°. Therefore, add BS to resin A, and add BS to resin B.
Combinations with PP are suitable.
他の樹脂温度は、ポリエチレンが210〜290℃、
ポリアミドが220〜300℃、ポリアセタール190〜
220℃またポリスチレンは190〜260℃、塩化ビニ
ル175〜195℃、メタクリル樹脂200〜230℃、ポリ
カーボネート280〜320℃等である。 Other resin temperatures are 210-290℃ for polyethylene,
Polyamide 220~300℃, polyacetal 190~
220°C, polystyrene at 190-260°C, vinyl chloride at 175-195°C, methacrylic resin at 200-230°C, polycarbonate at 280-320°C, etc.
従つて前記のような樹脂から適当とする成形温
度と、接触時互いに溶けあわない性質を有するか
を見極めて樹脂Ａ，Ｂ…を決定する。本発明者の
知見によれば、このような条件を満す樹脂の組合
せ例として、例えば前記ABSとポリプロビレン
のほかスチロールとポリプロピレン、ABSとポ
リエチレン、スチロールとポリエチレン…ががあ
る。 Therefore, the resins A, B, etc. are determined by determining the appropriate molding temperature and whether they have the property of not melting into each other upon contact. According to the knowledge of the present inventors, examples of combinations of resins that satisfy such conditions include, for example, in addition to the above-mentioned ABS and polypropylene, styrene and polypropylene, ABS and polyethylene, styrene and polyethylene, etc.
さらに、型抜き部品１…を基板１０から分離す
るためには、基板１０に成形する中空部又は切欠
部の壁面２０が並行であるよりも、基板１０の１
面２１に対し他面２２側が開いているように傾斜
θを設けると好結果を得ることができる（第４図
参照）。型抜き部品が、開いた他面側へ抜け易い
からである。この中空部又は切欠部の壁面２０の
傾斜θは極く僅かで良く、0.5度以上、但しつき
過ぎると基板１０から型抜き部品１…が抜け易く
なるので30度以下、より好ましくは１〜10度の範
囲が適当である。 Furthermore, in order to separate the die-cut parts 1 from the substrate 10, it is necessary to have one wall of the substrate 10 parallel to the wall surface 20 of the hollow or notch formed in the substrate 10.
Good results can be obtained by providing an inclination θ such that the other surface 22 is open to the surface 21 (see FIG. 4). This is because the die-cut part is likely to come off to the other open side. The inclination θ of the wall surface 20 of this hollow part or notch may be very slight, 0.5 degrees or more, but if it is too steep, the die-cut parts 1 will easily come off from the board 10, so it is 30 degrees or less, more preferably 1 to 10 degrees. The degree range is appropriate.
（実施例）
製品の構成
第１図中、１〜５は恐竜骨格模型Ｄを作るため
の型抜き部品で、樹脂Ｂからなり、１は前枠、２
は後枠、３は左脚、４は右脚、５は竜骨で、夫々
嵌合部６，６′，７，７′で組合わされる。型抜き
部品１〜５は、第２図に示された型抜き製品Ｍの
基板１０に、当初、一体的に保持されている。(Example) Product configuration In Fig. 1, 1 to 5 are die-cut parts for making the dinosaur skeleton model D, which are made of resin B, 1 is the front frame, 2
1 is a rear frame, 3 is a left leg, 4 is a right leg, and 5 is a keel, which are combined at fitting portions 6, 6', 7, and 7', respectively. The die-cut parts 1 to 5 are initially held integrally on the substrate 10 of the die-cut product M shown in FIG.
基板１０に部品１〜５を充填する前、及び基板
１０から部品１〜５を抜き出した後の、基板１０
は各部品と同形の抜き孔１１，１２，１３，１
４，１５を有しており、これらは基板１０の型成
形時に型成形された中空部と同形である。この基
板１０は樹脂Ａからなる。 The substrate 10 before filling the substrate 10 with the components 1 to 5 and after extracting the components 1 to 5 from the substrate 10
are punch holes 11, 12, 13, 1 of the same shape as each part.
4 and 15, and these have the same shape as the hollow portion molded when the substrate 10 was molded. This substrate 10 is made of resin A.
なお、図示の基板１０には示されていないが抜
き孔１１，１２…が基枠１０の枠内だけでなく外
周の縁から内側へ凹入して設けられている場合は
中空部とはいえないので、これを切欠部というも
のである。このような中空部、切欠部は単純な円
形、四辺形でなく、凹部３１又は凸部３２を有す
ることが必要である。これらの凹凸形により基板
１０と型抜き部品１…が噛み合つて型抜製品から
型抜き部品１…が抜け落ちるのを防止することが
できる。 Although not shown in the illustrated substrate 10, if the punch holes 11, 12, etc. are provided not only within the frame of the base frame 10 but also recessed inward from the outer periphery edge, they may be considered hollow parts. Since there is no part, this is called a notch. Such a hollow part or notch is not simply circular or quadrilateral, but needs to have a concave part 31 or a convex part 32. These uneven shapes can prevent the substrate 10 and the die-cut parts 1 from coming off from the die-cut product due to their engagement.
成形方法
第２図に示された基板で中空部をもつたもの
を成形するための金型を用い、ノズルを通る
ABS樹脂の成形温度を240℃、金型温度を75℃に
設定して500Kg／cm2の射出圧力で射出成形を行な
い、第２図のような基板を型成形した。Molding method: Use a mold for molding a board with a hollow part as shown in Figure 2, and pass it through a nozzle.
The ABS resin molding temperature was set at 240°C, the mold temperature was set at 75°C, and injection molding was performed at an injection pressure of 500 kg/cm 2 to form a substrate as shown in Figure 2.
次いで、上記基板を中空部に臨むゲートを備え
た別の金型に装填し、中空部にポリプロピレンを
金型温度35℃、成形温度190℃、射出圧力500Kg／
cm2で射出成形を行ない、型抜製品Ｍを成形した。 Next, the above substrate was loaded into another mold equipped with a gate facing the hollow part, and polypropylene was poured into the hollow part at a mold temperature of 35°C, a molding temperature of 190°C, and an injection pressure of 500 kg/kg.
Injection molding was performed in cm 2 to form a die-cut product M.
得られた製品Ｍは樹脂同士の溶け合いがなく、
極めて明瞭に区画された基板部と型抜き部品とを
有し、型抜き部品は予期した以上に密に基板部と
一体化していたが、指先で押す程度の力で取り出
すことができた。 The obtained product M has no melting of resins,
It had a board part and a die-cut part that were very clearly separated, and although the die-cut part was integrated with the board part more closely than expected, it was possible to take it out with just enough pressure to press it with a fingertip.
（発明の作用）
本発明は以上の如く構成されているので、異種
の樹脂から成る基板と型抜き部品が相互に溶け合
うことなく一体化した平面的な型抜製品が得られ
る。型抜製品は基板に型抜き部品を保持している
ので、型成形後の取扱いにより型抜き部品が脱落
することを防止する。(Function of the Invention) Since the present invention is configured as described above, a planar die-cut product in which a substrate made of different resins and a die-cut part are integrated without melting into each other can be obtained. Since the die-cut product holds the die-cut parts on the substrate, the die-cut parts are prevented from falling off during handling after molding.
つまり基板に形成された中空部又は切欠部と、
その内側に充填された型抜き部品とが凹部３１と
凸部３２により、平面的に噛み合つているため、
中空部又は切欠部と型抜き部品との大小の差が多
少大きくても型抜き部品の脱落が防止される。 In other words, a hollow part or a notch formed in the substrate,
Since the die-cut parts filled inside are engaged with each other in a plane by the concave part 31 and the convex part 32,
Even if the difference in size between the hollow part or the notch and the die-cut part is somewhat large, the die-cut part is prevented from falling off.
しかしながら型抜き部品が収まつている基板の
中空部又は切欠部の壁面２０は、抜き方向へ拡が
つた傾斜θを有しているので、型抜き部品を基板
から取り外すことは容易に行なえる。 However, since the wall surface 20 of the hollow or notch portion of the substrate in which the die-cut part is accommodated has an inclination θ that widens in the direction of the die-cutting, the die-cut part can be easily removed from the board.
（発明の効果）
本発明は以上の如く構成されかつ作用するもの
であり、基板に形成された中空部又は切欠部に、
基板を構成する樹脂よりも成形温度が低いか又は
収縮率が大きいかの条件の内少なくとも一つの条
件を満たす樹脂が充填されて、型抜き部品を形成
しているため、型抜き部品の形状は熱の影響を受
けることなく、中空部又は切欠部の形状そのまま
に成形され、前記中空部又は切欠部と型抜き部品
とは平面的な凹部３１と凸部３２により相互に噛
み合つており、使用時まで一体性を保持した型抜
製品が得られ、故に型抜き部品が勝手に離脱して
破損したりするおそれはなく、使用に際しては、
抜き方向へ拡がつた傾斜θが中空部又は切欠部の
壁面２０に設けられているため、抜き方向へ型抜
き部品を押せば容易に外すことができ、型抜き部
品を損傷するおそれがなく、また残つた基板も有
効利用できるという顕著な効果を奏する。(Effects of the Invention) The present invention is configured and operates as described above, and includes a hollow portion or a notch formed in a substrate.
Since the die-cut parts are filled with a resin that satisfies at least one of the following conditions: the molding temperature is lower than that of the resin constituting the substrate, or the shrinkage rate is greater than that of the resin constituting the substrate, the shape of the die-cut parts is The shape of the hollow part or cutout part is molded without being affected by heat, and the hollow part or cutout part and the die-cut part are engaged with each other by planar recesses 31 and protrusions 32, and the molded part is not used. A die-cut product that maintains its integrity over time is obtained, so there is no risk that the die-cut parts will detach or be damaged, and when used,
Since the slope θ that expands in the cutting direction is provided on the wall surface 20 of the hollow portion or notch, the die-cut part can be easily removed by pushing it in the die-cutting direction, and there is no risk of damaging the die-cut part. In addition, the remaining substrate can be used effectively, which is a remarkable effect.
本発明による型抜製品としては、前述の模型、
玩具類の他、基板の厚さを自由に設定でき、また
薄いカード状のものや地図その他の知育器具等も
適し、型抜き後の基板はそれをなぞつて絵をかく
型枠等にも使用できるなど実際面での利点が多
い。 The die-cut products according to the present invention include the above-mentioned model,
In addition to toys, the thickness of the board can be set freely, and it is also suitable for thin card-like items, maps, and other educational equipment, and the board after die-cutting can also be used as a formwork for tracing and drawing pictures. There are many practical advantages, such as being able to
また本発明の方法によれば、前記のような型抜
製品を、入手し易い樹脂Ａ，Ｂ…により容易に型
成形することができる効果が得られ、また製品も
安定している特徴がある。 Furthermore, according to the method of the present invention, the above-mentioned die-cut products can be easily molded using readily available resins A, B, etc., and the products are also stable. .
図面は本発明に係る型抜製品の実施例を示すも
ので第１図は型抜き部の平面図、第２図は型抜製
品の平面図、第３図は型抜き部を組合せたものの
斜視図、第４図は部分拡大断面図である。
The drawings show an embodiment of the die-cut product according to the present invention. Figure 1 is a plan view of the die-cut part, Figure 2 is a plan view of the die-cut product, and Figure 3 is a perspective view of the combination of the die-cut parts. 4 are partially enlarged sectional views.
Claims (1)
平板状の型抜製品であつて、合成樹脂により型成
形された平面的な凹凸形より成る中空部又は切欠
部を有する基板と、前記合成樹脂よりも成形温度
が低いか又は収縮率が大きいかの条件の内少なく
とも一つの条件を満たす合成樹脂を用い、基板の
中空部又は切欠部の内側に充填された型抜き部品
とから成り、前記中空部又は切欠部と型抜き部品
に、相互に噛み合う平面的な凹部３１と凸部３２
とを設け、かつ中空部又は切欠部の壁面２０に型
抜き部品の抜き方向へ拡がつた傾斜θを設けたこ
とを特徴とする型抜製品。 ２ 模型、玩具類若しくは知育器具等を構成する
平板状の型抜製品を成形する方法であつて、溶融
温度差のある複数種の熱可塑性樹脂Ａ，Ｂ…の
内、成形温度の高い樹脂Ａを用いて中空部又は切
欠部を有する基板を成形金型により型成形し、そ
の基板の中空部又は切欠部の内側をキヤビテイと
して、そこに前記樹脂Ａより成形温度の低い樹脂
Ｂ…を充填する工程を含む型抜製品の成形方法。 ３ ２種の樹脂Ａ，Ｂの組み合わせが、ABSと
ポリプロピレン、スチロールとポリプロピレン、
ABSとポリエチレン、スチロールとポリエチレ
ンのいずれかである特許請求の範囲第２項記載の
型抜製品の成形方法。[Scope of Claims] 1. A flat plate-shaped die-cut product constituting a model, toy, educational device, etc., which has a hollow or notched portion made of a planar uneven shape molded from a synthetic resin. and a die-cut part filled inside the hollow or notch of the substrate using a synthetic resin that satisfies at least one of the following conditions: the molding temperature is lower than that of the synthetic resin, or the shrinkage rate is larger than that of the synthetic resin. A planar concave portion 31 and a convex portion 32 that engage with each other are formed in the hollow portion or cutout portion and the die-cut part.
A die-cut product characterized in that the wall surface 20 of the hollow part or notch is provided with an inclination θ extending in the direction of cutting the die-cut part. 2. A method for molding flat plate-shaped die-cut products constituting models, toys, educational equipment, etc., in which resin A has a higher molding temperature among multiple types of thermoplastic resins A, B, etc. with different melting temperatures. A substrate having a hollow part or notch is molded using a mold using a mold, and the inside of the hollow part or notch of the substrate is used as a cavity, and resin B, which has a lower molding temperature than the resin A, is filled into the cavity. A method of forming die-cut products, including processes. 3 The combination of two types of resins A and B is ABS and polypropylene, styrene and polypropylene,
The method for molding a die-cut product according to claim 2, which is made of either ABS and polyethylene or styrene and polyethylene.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13385887A JPS63296909A (en) | 1987-05-29 | 1987-05-29 | Rapped product and its molding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13385887A JPS63296909A (en) | 1987-05-29 | 1987-05-29 | Rapped product and its molding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63296909A JPS63296909A (en) | 1988-12-05 |
| JPH0579216B2 true JPH0579216B2 (en) | 1993-11-01 |
Family
ID=15114687
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13385887A Granted JPS63296909A (en) | 1987-05-29 | 1987-05-29 | Rapped product and its molding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63296909A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50119063A (en) * | 1974-03-06 | 1975-09-18 | ||
| JPS59212232A (en) * | 1983-05-17 | 1984-12-01 | Nippon Gakki Seizo Kk | Molding and assembling of synthetic resin parts |
| JPS6250109A (en) * | 1985-08-29 | 1987-03-04 | Bandai Co | Apparatus for manufacturing toy |
-
1987
- 1987-05-29 JP JP13385887A patent/JPS63296909A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50119063A (en) * | 1974-03-06 | 1975-09-18 | ||
| JPS59212232A (en) * | 1983-05-17 | 1984-12-01 | Nippon Gakki Seizo Kk | Molding and assembling of synthetic resin parts |
| JPS6250109A (en) * | 1985-08-29 | 1987-03-04 | Bandai Co | Apparatus for manufacturing toy |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63296909A (en) | 1988-12-05 |
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