JPH0572148U - Lead wire shape for discrete parts - Google Patents

Lead wire shape for discrete parts

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Publication number
JPH0572148U
JPH0572148U JP1996092U JP1996092U JPH0572148U JP H0572148 U JPH0572148 U JP H0572148U JP 1996092 U JP1996092 U JP 1996092U JP 1996092 U JP1996092 U JP 1996092U JP H0572148 U JPH0572148 U JP H0572148U
Authority
JP
Japan
Prior art keywords
component
lead wire
lead wires
substrate
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1996092U
Other languages
Japanese (ja)
Inventor
富雄 福島
Original Assignee
エスエムケイ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by エスエムケイ株式会社 filed Critical エスエムケイ株式会社
Priority to JP1996092U priority Critical patent/JPH0572148U/en
Publication of JPH0572148U publication Critical patent/JPH0572148U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】 【目的】 ディスクリ−ト部品を基板等へ固定した後に
おいても、その部品本体の位置を任意の位置に簡単に移
動できるようにすること。 【構成】 部品本体52と、この部品本体52から突出
した複数のリ−ド線54、54とを有し、このリ−ド線
54、54の先端側に基板14等へ固定するための固定
部54a、54aを形成してなるディスクリ−ト部品の
一例としてのLED素子50において、リ−ド線54、
54の固定部54a、54aと末端部54b、54bの
間であって、リ−ド線54、54の固定部54a、54
aを基板14等へ固定したときに基板14等と接触しな
い部分に、部品本体52の移動を容易にするための曲が
り部54c、54cを形成する。部品本体52を所定方
向へ押圧することによって曲がり部54c、54cが変
形し、部品本体52を任意の位置へ移動する。
(57) [Abstract] [Purpose] Even after fixing discrete components to a board or the like, the position of the component body can be easily moved to an arbitrary position. [Structure] A component main body 52 and a plurality of lead wires 54, 54 protruding from the component main body 52 are provided. Fixing for fixing the lead wires 54, 54 to the substrate 14 or the like at the tip end side thereof In the LED element 50 as an example of the discrete component formed by forming the portions 54a, 54a, the lead wire 54,
Between the fixed parts 54a, 54a of 54 and the end parts 54b, 54b, the fixed parts 54a, 54 of the lead wires 54, 54.
Bent portions 54c and 54c for facilitating the movement of the component main body 52 are formed in a portion which does not come into contact with the substrate 14 or the like when a is fixed to the substrate 14 or the like. By pressing the component body 52 in a predetermined direction, the bent portions 54c and 54c are deformed, and the component body 52 is moved to an arbitrary position.

Description

【考案の詳細な説明】[Detailed description of the device]
【0001】[0001]
【産業上の利用分野】[Industrial applications]
本考案は、部品本体から複数のリ−ド線を突出してなるディスクリ−ト部品を 基板等に取付けるために、そのリ−ド線を基板等の回路パタ−ンに半田付け固定 した場合に、その部品本体を前後左右上下のいずれの方向にも自由に移動できる ようにしたリ−ド線の形状に関するものである。 The present invention is intended for mounting a discrete component, which is formed by projecting a plurality of lead wires from a component body, on a board, etc., by soldering the lead wires to a circuit pattern such as the board. , The shape of the lead wire that allows the component body to be freely moved in any of the front, rear, left, right, up, and down directions.
【0002】[0002]
【従来の技術】[Prior Art]
従来、この種のディスクリ−ト部品としてのLED(発光ダイオ−ド)素子1 0のリ−ド線12、12は、図4の(a)、(b)、(c)に示すように、直線 状に形成されていた。そして、このLED素子10のリ−ド線12、12を自動 挿入機などを用いて基板14のリ−ド線挿入穴16、16に挿入し、半田槽など を用いて半田18、18で固定することによって、リ−ド線12、12を基板1 4の回路パタ−ンに接続固定するようにしていた。 Conventionally, the lead wires 12, 12 of an LED (light emitting diode) element 10 as this type of discrete component are as shown in FIGS. 4 (a), 4 (b) and 4 (c). , Was formed in a straight line. Then, the lead wires 12 and 12 of the LED element 10 are inserted into the lead wire insertion holes 16 and 16 of the substrate 14 using an automatic inserting machine or the like, and fixed with solder 18 and 18 using a solder bath or the like. By doing so, the lead wires 12 and 12 are connected and fixed to the circuit pattern of the board 14.
【0003】[0003]
【考案が解決しようとする課題】[Problems to be solved by the device]
しかしながら、図4の(a)、(b)、(c)に示した従来例では、LED素 子10のリ−ド線12、12が直線状であったので、リ−ド線12、12を基板 14に固定した状態が図5の(d)に示すような斜め状態となったときに、直立 状態に直すことが面倒であるという問題点があった。すなわち、半田18、18 で固定した状態のままではLED素子10の素子本体20を点線矢印方向に動か して直立状態に直すことができないので、半田18、18を溶かしてリ−ド線1 2、12を直立状態に直してから、再度半田18、18で固定するという作業が 必要であった。 However, in the conventional example shown in (a), (b) and (c) of FIG. 4, since the lead wires 12 and 12 of the LED element 10 are linear, the lead wires 12 and 12 are There is a problem that it is troublesome to restore the upright state when the state in which is fixed to the substrate 14 becomes an oblique state as shown in FIG. 5 (d). That is, since the element body 20 of the LED element 10 cannot be moved to the upright state by moving it in the direction of the dotted arrow while being fixed with the solders 18, 18, the solders 18, 18 are melted and the lead wires 12 It was necessary to fix the Nos. 12 and 12 upright and then fix them again with the solders 18 and 18.
【0004】 すなわち、LED素子10のリ−ド線12、12が直線状であったので、リ− ド線12、12の先端側の半田接続部12a、12aを半田18、18で基板1 4に固定した状態で素子本体20を移動させる場合、図5の(a)、(b)に実 線矢印で示す方向には移動できるが、同図の(c)に点線矢印で示す方向には移 動できないからである。That is, since the lead wires 12 and 12 of the LED element 10 are linear, the solder connection portions 12 a and 12 a on the tip ends of the lead wires 12 and 12 are soldered 18 and 18 to the board 14. When the element body 20 is moved in the state of being fixed to, the element body 20 can be moved in the directions shown by solid arrows in FIGS. 5A and 5B, but in the directions shown by dotted arrows in FIG. 5C. This is because it cannot be moved.
【0005】 詳述すると、図5の(a)に実線矢印で示すようなリ−ド線12、12を捩る 方向、同図の(b)に実線矢印で示すようなリ−ド線12、12の並び方向と垂 直な方向には素子本体20を若干移動させることができるが、同図の(c)に点 線矢印で示すようなリ−ド線12、12の並び方向と平行な方向には移動できな いからである。More specifically, in the twisting direction of the lead wires 12 and 12 as indicated by solid arrows in FIG. 5A, the lead wires 12 and 12 as indicated by solid arrows in FIG. Although the element body 20 can be slightly moved in a direction perpendicular to the direction in which 12 are arranged, it is parallel to the direction in which the lead lines 12 and 12 are arranged as indicated by the dotted arrow in FIG. It cannot move in the direction.
【0006】 また、図6に示すように、椀状のパネル22内で、複数のLED素子10、1 0、…を高さを変えて基板14に固定するような場合、自動挿入機を用いてLE D素子10、10、…のリ−ド線12、12、…を基板のリ−ド線挿入穴16、 16に挿入したときに、各LED素子10、10、…の上端面の高さが所定位置 となるように、LED素子10、10、…の素子本体20、20、…の下端面と 基板14との間に所定長さのスペ−サ241、242、…を設けなければならない ので、部品点数が多くなるとともに、作業が煩雑になるという問題点があった。 図7において、26、…はパネル22の表示部、28、…はLED素子10、… からの光を拡散して色むらをなくすための拡散体、30はLED素子10、…か らの光を遮断する遮光体である。Further, as shown in FIG. 6, in a case where a plurality of LED elements 10, 10, ... Are fixed to the substrate 14 with different heights in a bowl-shaped panel 22, an automatic insertion machine is used. When the lead wires 12, 12, ... Of the LED elements 10, 10, ... Are inserted into the lead wire insertion holes 16, 16 of the substrate, the height of the upper end surface of each LED element 10, 10 ,. Saga to a predetermined position, LED elements 10, 10, ... of the element body 20, 20, ... bottom surface and a predetermined length of the space between the substrate 14 - 24 1, 24 2, ... the provided Since it has to be done, there are problems that the number of parts increases and the work becomes complicated. In FIG. 7, 26, ... Is a display portion of the panel 22, 28, ... are diffusers for diffusing light from the LED elements 10, ... to eliminate color unevenness, and 30 is light from the LED elements 10 ,. It is a light shield that blocks the
【0007】 また、図7に示すように、LED素子40のリ−ド線42、42間のピッチP 1 (例えば2.5mm)が、基板44のリ−ド線挿入穴46、46間のピッチP2 (例えば5mm)と一致しないため、リ−ド線42、42に折り曲げ部48、… を形成したものも知られているが、リ−ド線42、42の基板44への固定部( すなわち半田付け部)42a、42aと末端部42b、42b(すなわち素子本 体50との連結部)との間であって、基板44と接触しない部分が依然として直 線状なので、前述と同様に半田付け固定した後は、半田を溶かさなければ素子本 体49を点線矢印方向へ移動することができないというの問題点があった。Further, as shown in FIG. 7, the pitch P between the lead wires 42, 42 of the LED element 40 is P. 1 (For example, 2.5 mm) is the pitch P between the lead wire insertion holes 46, 46 of the substrate 44.2 It is also known that the lead wires 42, 42 are formed with bent portions 48, ... Because they do not match (for example, 5 mm), but the fixed portions of the lead wires 42, 42 to the board 44 (that is, solder). The portion between the attachment portions) 42a, 42a and the end portions 42b, 42b (that is, the connection portion with the element body 50), which is not in contact with the substrate 44, is still a straight line. After that, the element body 49 cannot be moved in the direction of the dotted arrow unless the solder is melted.
【0008】 本考案は上述の問題点に鑑みなされたもので、ディスクリ−ト部品を基板等へ 固定した後においても、そのディスクリ−ト部品の部品本体の位置を前後左右上 下のいずれにも簡単に移動することのできる複数のリ−ド線を有するディスクリ −ト部品のリ−ド線形状を提供することを目的とするものである。The present invention has been made in view of the above-described problems, and even after fixing the discrete component to the substrate or the like, the position of the component body of the discrete component can be set to any of front, rear, left, right, top, and bottom. Another object of the present invention is to provide a lead wire shape of a discrete component having a plurality of lead wires that can be easily moved.
【0009】[0009]
【課題を解決するための手段】[Means for Solving the Problems]
本考案によるディスクリ−ト部品のリ−ド線形状は、部品本体と、末端部が前 記部品本体から突出した複数のリ−ド線とを有し、このリ−ド線の先端側に基板 等へ固定するための固定部を形成してなるディスクリ−ト部品において、前記リ −ド線の固定部と末端部の間であって、前記リ−ド線の固定部を前記基板等へ固 定したときに前記基板等と接触しない部分に、前記部品本体の移動を容易にする ための曲がり部を形成してなることを特徴とするものである。 A lead wire shape of a discrete component according to the present invention has a component body and a plurality of lead wires whose end portions protrude from the component body. In a discrete component having a fixing portion for fixing to a board or the like, the fixing portion of the lead wire is between the fixing portion and the terminal end of the lead wire, and the fixing portion of the lead wire or the like. It is characterized in that a bent portion for facilitating the movement of the component main body is formed in a portion which does not come into contact with the substrate or the like when the component is fixed.
【0010】[0010]
【作用】[Action]
複数のリ−ド線の先端側を基板等のリ−ド線挿入穴に挿入し、これらのリ−ド 線の固定部を半田付けなどにより基板等に固定した後に部品本体の位置を所定方 向へ移動する場合、部品本体を移動したい方向へ押圧すると、これによってリ− ド線の曲がり部が曲がり、部品本体を前後左右上下の所定方向に移動する。この とき、リ−ド線の曲がり部はリ−ド線の固定部と末端部の間であって、リ−ド線 の固定部を基板等へ固定したときに基板等と接触しない部分に形成されているの で、部品本体を移動したい方向へ押圧するなどという簡単な作業で部品本体を移 動させることができる。 Insert the tip ends of multiple lead wires into the lead wire insertion holes in the board, etc., and fix the fixed parts of these lead wires to the board etc. by soldering etc. When moving in the direction, when the component body is pressed in the desired direction, the bending portion of the lead wire is bent, and the component body is moved in the front, rear, left, right, up, and down predetermined directions. At this time, the bent portion of the lead wire is formed between the fixed portion of the lead wire and the end portion, and is formed in a portion which does not come into contact with the substrate or the like when the fixed portion of the lead wire is fixed to the substrate or the like. Therefore, it is possible to move the component body by a simple operation such as pressing the component body in the desired direction.
【0011】[0011]
【実施例】【Example】
図1の(a)、(b)、(c)は本考案によるディスクリ−ト部品のリ−ド線 形状の一実施例を示すもので、この図において図4の(a)、(b)、(c)と 同一部分は同一符号とする。図1において、50は複数のリ−ド線を有するディ スクリ−ト部品としてのLED(発光ダイオ−ド)素子である。前記LED素子 50は、素子本体52と、末端部(すなわち素子本体52との連結部)54b、 54bが前記素子本体52から突出した2本のリ−ド線54、54とからなり、 前記リ−ド線54、54の先端側には基板14のリ−ド線挿入穴16、16に挿 入されて半田18、18で固定される固定部54a、54aが形成されている。 1 (a), (b) and (c) show an embodiment of the lead wire shape of the discrete component according to the present invention. In this figure, (a), (b) of FIG. ) And (c), the same parts are designated by the same reference numerals. In FIG. 1, reference numeral 50 is an LED (light emitting diode) element as a disc part having a plurality of lead lines. The LED element 50 includes an element body 52 and two lead wires 54, 54 having terminal portions (that is, connecting portions with the element body 52) 54b, 54b protruding from the element body 52. Fixing portions 54a and 54a, which are inserted into the lead wire insertion holes 16 and 16 of the substrate 14 and fixed by the solders 18 and 18, are formed on the tip ends of the lead wires 54 and 54.
【0012】 前記リ−ド線54、54の固定部54a、54aと末端部54b、54bとの 間であって、前記基板14と接触しない部分には、前記素子本体52の移動を容 易にするための曲がり部54c、54cが形成されている。The element main body 52 is easily moved to a portion between the fixed portions 54 a, 54 a and the end portions 54 b, 54 b of the lead wires 54, 54, which is not in contact with the substrate 14. Bent portions 54c and 54c for forming are formed.
【0013】 つぎに前記実施例の作用を図2の(a)、(b)、(c)を併用して説明する 。 図2に示すようにLED素子50のリ−ド線を基板14に半田付け固定した後に 、素子本体52の位置を調整するために移動する場合は、LED素子50の素子 本体52を押圧する等して、素子本体52を同図の(a)、(b)、(c)に矢 印で示す方向に、またはこれらを組み合わせた方向に移動させることができる。Next, the operation of the above embodiment will be described with reference to FIGS. 2 (a), 2 (b) and 2 (c). As shown in FIG. 2, when the lead wire of the LED element 50 is fixed to the substrate 14 by soldering and then moved to adjust the position of the element body 52, the element body 52 of the LED element 50 is pressed, etc. Then, the element main body 52 can be moved in the directions shown by the arrows in (a), (b), and (c) of FIG.
【0014】 すなわち、図2の(a)はリ−ド線54、54を捩じる方向に素子本体52を 移動する場合を示し、同図の(b)はリ−ド線54、54の並び方向と垂直な方 向に素子本体52を移動する場合を示し、同図の(c)はリ−ド線54、54の 並び方向と平行な方向に素子本体52を移動する場合を示している。That is, FIG. 2A shows a case where the element body 52 is moved in a direction in which the lead wires 54, 54 are twisted, and FIG. 2B shows the lead wires 54, 54. The case where the element body 52 is moved in the direction perpendicular to the arrangement direction is shown, and FIG. 7C shows the case where the element body 52 is moved in the direction parallel to the arrangement direction of the lead lines 54, 54. There is.
【0015】 なお、図4に示した従来例でも、本考案の図2の(a)、(b)に示すような 移動は可能であるが、本考案の方が移動のために要する力が少なく移動が容易で あり、しかも移動可能範囲を広くできる。また、図4に示した従来例では、本考 案の図2の(c)に示す移動は不可能であり、この(c)に示す移動を伴う(a )、(b)に示す移動は不可能である。The conventional example shown in FIG. 4 can also move as shown in FIGS. 2A and 2B of the present invention, but the force required for the movement of the present invention is higher than that of the present invention. It is small and easy to move, and the movable range can be widened. Further, in the conventional example shown in FIG. 4, the movement shown in FIG. 2 (c) of the present proposal is impossible, and the movements shown in (a) and (b) accompanying the movement shown in FIG. It is impossible.
【0016】 前記実施例では、単一のLED素子を基板に半田付け固定した後に、素子本体 を移動してその位置を調整する場合について説明したが、本考案はこれに限るも のでなく、複数のLED素子を基板に半田付け固定した後に、それらの素子本体 を移動してその高さ位置を調整する場合についても本考案を利用することができ る。In the above-described embodiment, the case where a single LED element is soldered and fixed to a board and then the element body is moved to adjust the position is described. However, the present invention is not limited to this, and a plurality of LED elements can be used. The present invention can also be applied to a case where the LED elements are fixed to the board by soldering and then the element bodies are moved to adjust the height position.
【0017】 例えば、図3の(b)に示すように椀状のパネル22内で、複数のLED素子 50、50、…を高さを変えて基板14に固定する場合について説明する。まず 自動挿入機等を用いて図3の(a)に示すように同一形状のLED素子50の複 数個を基板14のリ−ド線挿入穴16、…に挿入し、ついで半田18、…でリ− ド線54、…の固定部(半田接続部)54a、…を基板14に固定する。For example, as shown in FIG. 3B, a case will be described in which a plurality of LED elements 50, 50, ... Are fixed to the substrate 14 with different heights in a bowl-shaped panel 22. First, using an automatic inserter or the like, a plurality of LED elements 50 of the same shape are inserted into the lead wire insertion holes 16, ... Of the substrate 14 as shown in FIG. The fixing portions (solder connection portions) 54a of the lead wires 54, ... Are fixed to the substrate 14.
【0018】 そして、LED素子50、…の素子本体52、…の上部がパネル22の内側に 形成された凹部60、…と対面するように、リ−ド線54、…の曲げ部54c、 …を曲げて位置決めし、パネル22を矢印で示す方向に押圧して各LED素子5 0、…を凹部60、…内に収容しつつ上端面を押し下げて図3の(b)に示す状 態となる。すなわち、リ−ド線54、…の曲げ部54c、…の曲がりによって、 各LED素子50、…のそれぞれの高さが所定の高さに調整されたことになる。 このとき、図6に示した従来例のように位置決め用のスペ−サ241、242、… を設ける必要がないので、部品点数を少なくして、作業を簡単にすることができ る。The bent portions 54c, ... Of the lead wires 54, ... are arranged so that the upper portions of the element bodies 52, ... Of the LED elements 50, ... Face the recesses 60 ,. Is bent and positioned, and the panel 22 is pressed in the direction indicated by the arrow to accommodate the LED elements 50, ... In the recesses 60 ,, and the upper end surface is pushed down to obtain the state shown in FIG. Become. That is, the bending of the bent portions 54c of the lead wires 54, ... Adjusts the respective heights of the LED elements 50 ,. In this case, space for positioning as in the conventional example shown in FIG. 6 - 24 1, 24 2, there is no need to provide a ..., with fewer parts, Ru can simplify the task.
【0019】 前記実施例では、LED素子を基板面にほぼ垂直に取付けた場合について説明 したが、本考案はこれに限るものでなく、LED素子を基板面に対して傾けて取 付ける場合についても利用できる。例えば、コ−ナ−部に設けた表示部を内側か らLED素子で照射するような場合に、LED素子のリ−ド線の曲がり部を曲げ ることによって素子本体を基板面に対して所定角度(例えば45度)となるよう にしてもよい。In the above embodiment, the LED element is mounted almost vertically to the substrate surface. However, the present invention is not limited to this, and the LED element may be mounted at an angle to the substrate surface. Available. For example, when the LED element is illuminated from the inside of the display section provided in the corner section, the element main body is moved relative to the substrate surface by bending the lead wire bent portion of the LED element. You may make it an angle (for example, 45 degrees).
【0020】 前記実施例では、ディスクリ−ト部品は2本のリ−ド線を有するLED素子と したが、本考案はこれに限るものでなく、部品本体と、末端部が部品本体から突 出した複数のリ−ド線とを有し、このリ−ド線の先端側に基板等へ固定するため の固定部を形成してなるディスクリ−ト部品一般について利用することができる 。In the above-mentioned embodiment, the discrete component is the LED element having two lead wires, but the present invention is not limited to this, and the component main body and the end portion protrude from the component main body. The present invention can be used for general discreet parts having a plurality of lead wires that are extended and a fixing portion for fixing to a substrate or the like is formed at the tip end side of the lead wires.
【0021】[0021]
【考案の効果】[Effect of the device]
本考案による複数のリ−ド線を有するディスクリ−ト部品のリ−ド線形状は、 上記のように、リ−ド線の固定部と末端部の間であって、リ−ド線の固定部を基 板等へ固定したときに基板等と接触しない部分に、部品本体の移動を容易にする ための曲がり部を形成したので、部品本体を移動させたい方向へ押圧するなどと いう簡単な作業でディスクリ−ト部品の部品本体を所定方向へ移動させることが できる。 The lead wire shape of the discrete component having a plurality of lead wires according to the present invention is, as described above, between the fixed portion and the end portion of the lead wire, Since the bent part is formed in the part that does not come into contact with the board etc. when the fixed part is fixed to the base plate etc., it is easy to move the part main body in the desired direction. It is possible to move the component body of the discrete component in a predetermined direction by performing various operations.
【図面の簡単な説明】[Brief description of drawings]
【図1】本考案による複数のリ−ド線を有するディスク
リ−ト部品のリ−ド線形状の一実施例を示すもので、
(a)は斜視図、(b)は(a)に示すディスクリ−ト
部品を基板に固定した状態の一部を断面で表わした正面
図、(c)は一部を断面で表わした(b)の側面図であ
る。
1 shows an embodiment of a lead wire shape of a discrete component having a plurality of lead wires according to the present invention,
(A) is a perspective view, (b) is a front view in which a part of a state where the discrete component shown in (a) is fixed to a substrate is shown in cross section, and (c) is part in cross section ( It is a side view of b).
【図2】図1の作用を説明するもので、(a)はリ−ド
線を捩る方向に部品本体を移動する場合を示し、(b)
はリ−ド線の並び方向と垂直な方向に部品本体を移動す
る場合を示し、(c)はリ−ド線の並び方向と平行な方
向に部品本体を移動する場合を示す説明図である。
2A and 2B are views for explaining the operation of FIG. 1, in which FIG. 2A shows a case where a component body is moved in a direction in which a lead wire is twisted, and FIG.
FIG. 4A is an explanatory view showing a case where the component body is moved in a direction perpendicular to the lead line arrangement direction, and FIG. 7C is a diagram showing a case where the component body is moved in a direction parallel to the lead line arrangement direction. .
【図3】他の実施例を示すもので、(a)は組み立ての
途中の状態を示す部分図、(b)は組み立て完了した状
態を示す部分図である。
3A and 3B show another embodiment, in which FIG. 3A is a partial view showing a state in the middle of assembly, and FIG. 3B is a partial view showing a state in which the assembly is completed.
【図4】従来例を示す図である。FIG. 4 is a diagram showing a conventional example.
【図5】図4の作用を説明する説明図である。5A and 5B are explanatory views illustrating the operation of FIG.
【図6】他の従来例を示す部分図である。FIG. 6 is a partial view showing another conventional example.
【図7】さらに他の従来例を示す一部を断面した正面図
である。
FIG. 7 is a partially sectional front view showing still another conventional example.
【符号の説明】[Explanation of symbols]
14…基板、 16…リ−ド線挿入穴、 18…半田、
50…LED素子(ディスクリ−ト部品)、 52…素
子本体(部品本体)、54…リ−ド線、 54a…リ−
ド線50の固定部、54b…リ−ド線50の末端部、
54c…リ−ド線50の曲げ部、60…凹部。
14 ... Board, 16 ... Lead wire insertion hole, 18 ... Solder,
50 ... LED element (discrete component), 52 ... Element body (component body), 54 ... Lead wire, 54a ... Lead
Fixed portion of the lead wire 50, 54b ... the end portion of the lead wire 50,
54c ... a bent portion of the lead wire 50, 60 ... a concave portion.

Claims (2)

    【実用新案登録請求の範囲】[Scope of utility model registration request]
  1. 【請求項1】 部品本体と、末端部が前記部品本体から
    突出した複数のリ−ド線とを有し、このリ−ド線の先端
    側に基板等へ固定するための固定部を形成してなるディ
    スクリ−ト部品において、前記リ−ド線の固定部と末端
    部の間であって、前記リ−ド線の固定部を前記基板等へ
    固定したときに前記基板等と接触しない部分に、前記部
    品本体の移動を容易にするための曲がり部を形成してな
    ることを特徴とするディスクリ−ト部品のリ−ド線形
    状。
    1. A component main body and a plurality of lead wires having terminal ends projecting from the component main body, and a fixing portion for fixing to a substrate or the like is formed on a tip end side of the lead wires. In the discrete component, the portion between the lead wire fixing portion and the terminal portion, which does not come into contact with the board or the like when the lead wire fixing portion is fixed to the board or the like. A lead wire shape of a discrete component, characterized in that a bent portion is formed to facilitate movement of the component body.
  2. 【請求項2】 ディスクリ−ト部品は2本のリ−ド線を
    有するLED素子としてなり、前記2本のリ−ド線の固
    定部は基板に半田付け固定するための半田付け部として
    なる請求項1記載のディスクリ−ト部品のリ−ド線形
    状。
    2. The discrete component is an LED element having two lead wires, and the fixing portion of the two lead wires serves as a soldering portion for soldering and fixing to a substrate. The lead wire shape of the discrete component according to claim 1.
JP1996092U 1992-03-03 1992-03-03 Lead wire shape for discrete parts Pending JPH0572148U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1996092U JPH0572148U (en) 1992-03-03 1992-03-03 Lead wire shape for discrete parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1996092U JPH0572148U (en) 1992-03-03 1992-03-03 Lead wire shape for discrete parts

Publications (1)

Publication Number Publication Date
JPH0572148U true JPH0572148U (en) 1993-09-28

Family

ID=12013768

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1996092U Pending JPH0572148U (en) 1992-03-03 1992-03-03 Lead wire shape for discrete parts

Country Status (1)

Country Link
JP (1) JPH0572148U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09116193A (en) * 1995-10-17 1997-05-02 Alps Electric Co Ltd Light emitting diode device
JPH09116194A (en) * 1995-10-17 1997-05-02 Alps Electric Co Ltd Light emitting diode device
JP2009152473A (en) * 2007-12-21 2009-07-09 Icom Inc Fitting structure of light-emitting diode element

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09116193A (en) * 1995-10-17 1997-05-02 Alps Electric Co Ltd Light emitting diode device
JPH09116194A (en) * 1995-10-17 1997-05-02 Alps Electric Co Ltd Light emitting diode device
JP2009152473A (en) * 2007-12-21 2009-07-09 Icom Inc Fitting structure of light-emitting diode element

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