JPH0556878B2 - - Google Patents
Info
- Publication number
- JPH0556878B2 JPH0556878B2 JP3616687A JP3616687A JPH0556878B2 JP H0556878 B2 JPH0556878 B2 JP H0556878B2 JP 3616687 A JP3616687 A JP 3616687A JP 3616687 A JP3616687 A JP 3616687A JP H0556878 B2 JPH0556878 B2 JP H0556878B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- recess
- metal substrates
- conductive path
- separated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 37
- 229910052751 metal Inorganic materials 0.000 claims description 36
- 239000002184 metal Substances 0.000 claims description 36
- 239000000463 material Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 2
- 238000005452 bending Methods 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 229920002050 silicone resin Polymers 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3616687A JPS63204697A (ja) | 1987-02-19 | 1987-02-19 | 混成集積回路の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3616687A JPS63204697A (ja) | 1987-02-19 | 1987-02-19 | 混成集積回路の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63204697A JPS63204697A (ja) | 1988-08-24 |
| JPH0556878B2 true JPH0556878B2 (pm) | 1993-08-20 |
Family
ID=12462174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3616687A Granted JPS63204697A (ja) | 1987-02-19 | 1987-02-19 | 混成集積回路の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63204697A (pm) |
-
1987
- 1987-02-19 JP JP3616687A patent/JPS63204697A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63204697A (ja) | 1988-08-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |