JPH0550381A - Working device - Google Patents

Abstract

PURPOSE:To optimize the working conditions of each portion by memorizing each of the soldering start and finish positions of a soldering means to a workpiece and the soldering conditions during relative movement between the two points and actuating the soldering means while reading out the memory data in a soldering device. CONSTITUTION:Data related to soldering work are input through an inputting means 8 and read out by an arithmetic processing unit 21 and stored in a memory 22. These data include the data of a position X where soldering work start from with the end of iron made be in close vicinity to a printed wiring board 3, the position X where soldering work finishes at and corresponds to Y- coordinate data, the moving speed data of the end of the iron from the start position to finishing position corresponding to Y-coordinate data, solder supply speed during the movement of the end of the iron, time data for solder supply, time data for preheating the position to be applied solder, time data for heating, and time data for remaining heat. In soldering work, these data are read out by the arithmetic processing unit 21, and a soldering means 23 is controlled by an X direction moving means 4, Y direction moving means 5, heater, and solder supplying device 17.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a working device which is preferably implemented in a soldering device for soldering a wiring board.

[0002]

2. Description of the Related Art In a soldering device for soldering an integrated circuit or the like to a wiring board, conventionally, position data of a portion to be soldered is stored in a memory, and the position data is sequentially read and automatically. A device for performing soldering work is used.

[0003]

In the above-mentioned prior art,
Only the position data is stored in the memory, and therefore, only the soldering points having substantially the same soldering conditions, that is, the preheating time, the heating time, the remaining heat time, and the solder feeding time can be continuously soldered. Therefore, when these conditions are different, for example, complicated work such as soldering under a certain number of predetermined lots under certain conditions, changing the conditions, and then soldering the remaining solders of those lots again is required. Become.

An object of the present invention is to provide a working apparatus capable of working under optimum conditions for each of a plurality of parts to be worked.

[0005]

SUMMARY OF THE INVENTION The present invention comprises a working means for performing work on a work, and a moving means capable of relatively moving the work means over a portion of the work on which work is to be performed. A memory for storing each position of the work start point and the end point relative to the work of the work means, the work condition during the relative movement between the start point and the end point, and the stored contents of the memory And a control means for operating the working means under the working condition during the relative movement.

[0006]

According to the present invention, the memory stores the data indicating the respective positions of the work start point and the end point relative to the work of the work means, and the work conditions between the start point and the end point. ing. The work conditions include, for example, when the work is soldering, the solder preheating time, the heating time, the remaining heat time, and the solder supply speed, and the relative moving speed of the wiring board as the work and the iron tip as the working means. And so on.

The control means reads the stored contents of the memory and moves the working means relative to the work by the moving means between the start point and the end point, and at the same time, the respective working parts during the movement. The work means is caused to perform work such as soldering under optimum work conditions for each case.

Therefore, even under different work conditions, the work can be continuously and efficiently performed, and high-quality work can be performed under the optimum work condition for each work site.

[0009]

1 is a perspective view of a soldering apparatus 1 according to an embodiment of the present invention. This soldering device 1 moves a trowel 6 with respect to a wiring board 3 which is a work placed on a base 2 by means of an X-direction moving means 4 and a Y-direction moving means 5 to set a predetermined soldering condition. Solder with. On the front panel 7 of the soldering device 1, input means 8 such as a ten-key pad and various function keys are arranged.

FIG. 2 is a side view of the iron 6 and FIG. 3 is a front view thereof. An electric heater 12 is housed in the housing 11, and the heat generated by the electric heater 12 is conducted to the iron tip 13 to melt the solder.
A support member 14 is also fixed to the housing 11, and the tip 1 a of the support member 14 has the tip 1 a.
A guide tube 15 and a smoke exhaust pipe 16 are attached toward the nozzle 3. Thread-shaped solder is supplied to the guide cylinder 15 from the solder supply device 17 via the supply pipe 18 shown in FIG.
The smoke exhaust pipe 16 is connected to an induction fan via a smoke exhaust pipe (not shown), and the flux gas generated during soldering is sucked and removed from the smoke exhaust pipe 16.

FIG. 4 is a block diagram showing a simplified electrical structure of the soldering apparatus 1 described above. The data relating to the soldering work input from the input means 8 is read by the arithmetic processing unit 21 realized by a microcomputer or the like and stored in the memory 22 as shown in FIG. 5, for example.

The data includes X coordinate data DSX at a position where the soldering tip 13 is brought close to the wiring board 3 to start soldering work, Y coordinate data DSY, and X at a position where the soldering work should be finished. Coordinate data DEX and Y coordinate data D
EY, movement speed data DTS of the iron tip 13 from the start position to the end position, solder supply speed data DFS during the movement, solder supply time data DFW, solder and soldered points It includes preheating time data DH1 for preheating, heating time data DH2, and residual heat time data DH3.

Each of these data is data for continuous soldering work from the start of the soldering work by lowering the iron tip 13 to the end of the soldering work by raising the iron tip 13. In the memory 22, a plurality of pieces of data relating to a single soldering operation, which are composed of these data groups, are stored as indicated by reference numerals D1, D2, ... It can be soldered with. When the soldering point is a point, that is, when it is a so-called spot soldering work, the respective data DEX, DEY, DTS, etc. are deleted.

FIG. 6 is an enlarged perspective view showing the integrated circuit 31 soldered to the wiring board 3. The integrated circuit 31 includes a large number of terminals 32a and 32b extending from the pair of end portions 31a and 31b, respectively. Therefore, the terminals 32a arranged on the one end portion 31a side are continuously connected by the data group D1 described above. Can be soldered. Further, the terminals 32b provided on the other end 31b can be continuously soldered by the data group D2. By continuously soldering a large number of terminals 32a and 32b in this manner, the soldering work time can be shortened.

The arithmetic processing unit 21 sequentially reads the data groups D1, D2, ... Stored in the memory 22 as described above, and the X-direction moving means 4, Y corresponding to the read data. The soldering means 23 including the direction moving means 5, the electric heater 12, the solder supply device 17, and the like are drive-controlled to perform soldering under optimum conditions for each of a plurality of soldering points.

FIG. 7 is a flow chart for explaining the procedure of the soldering operation as described above. In step n1, the data group D1, D2, ... Is read from the memory 22, and in step n2, it is judged whether or not there is any data to be read, that is, whether or not the soldering work is completed. If so, the operation ends, and if not, the process moves to step n3.

At step n3, the X-direction moving means 4 reaches the position corresponding to the X coordinate data DSX and the Y coordinate data DSY of the data group read at step n1.
Then, the Y-direction moving means 5 is driven to start moving the iron tip 13. In step n4, it is determined whether or not the iron tip 13 has reached the start position, and if not, the process returns to step n3, and when it reaches the start position, step n4.
Go to 5.

At step n5, the iron tip 13 is lowered, and at step n6, the electric heater 12 is driven in accordance with the preheating time data DH1, heating time data DH2 and residual heat time data DH3, and the solder feed speed data DFS. And the solder supply device 17 is driven corresponding to the solder feed time data DEW to start soldering. In step n7, the X coordinate data DEX, Y coordinate data D
Iron tip 1 corresponding to EY and movement speed data DTS
Move 3 starts. In step n8, it is determined whether or not the iron tip 13 has reached the position corresponding to the X coordinate data DEX and the Y coordinate data DEY. If not, the process returns to step n7, and if the end position is reached, the process proceeds to step n9. ..

In step n9, the movement of the iron tip 13 is stopped, the heating of the iron tip 13 is stopped, the supply of solder is stopped, and the soldering is completed. When the soldering is completed in this way, after the iron tip 13 is raised, the process returns to step n1, the next data group is read, and the above-described soldering operation is repeated.

As described above, in the soldering device 1 according to the present invention, the start position and the end position of the soldering work are stored in the memory 22, and the soldering speed such as the moving speed of the iron tip 13 and the heating time of the electric heater 12 is also stored. Since the soldering conditions are stored, the soldering work can be performed under optimum conditions for each soldering location, and the soldering quality can be improved.

Further, the soldering work under different conditions can be carried out sequentially, so that the wiring board 3 is once mounted on the base 2
When it is placed on the top, complicated work such as attaching and detaching the wiring board 3 is unnecessary until the soldering work is completed, and the work efficiency can be improved. Furthermore, the plurality of terminals 32a and 32b of the integrated circuit 31 can be continuously soldered, and the working time can be shortened.

The present invention is not limited to the above-mentioned soldering work, but can be suitably applied to other working devices such as a screw tightening device and a grease applying device.

[0023]

As described above, according to the present invention, the memory stores the work start point and the end point relative to the work of the work means, and the work condition between the start point and the end point. Therefore, even if the working conditions are different,
Work can be performed continuously. Therefore, the work can be efficiently performed without performing a complicated work such as exchanging the work during the work. In addition, it is possible to set optimal work conditions for each work site, and improve work quality.

[Brief description of drawings]

FIG. 1 is a perspective view of a soldering device 1 according to an embodiment of the present invention.

FIG. 2 is a side view of the iron 6;

FIG. 3 is a front view of the iron 6;

FIG. 4 is a block diagram showing a simplified electrical configuration of the soldering device 1.

5 is a diagram showing a recording state of soldering data in a memory 22. FIG.

6 is an enlarged perspective view showing an integrated circuit 31 soldered to the wiring board 3. FIG.

FIG. 7 is a flowchart for explaining a procedure of a soldering operation.

[Explanation of reference numerals] 1 soldering device 3 wiring board 4 X-direction moving means 5 Y-direction moving means 6 iron 8 input means 12 electric heater 13 iron tip 17 solder supply device 21 arithmetic processing device 22 memory 23 soldering means 31 integrated circuit

Claims (1)

[Claims] 1. A work means for performing work on a work, a moving means for relatively moving the work means over a region where the work for work is to be performed, and a relative movement means for the work means with respect to the work. A memory for storing each position of the work start point and the end point, the work condition during the relative movement between the start point and the end point, and the stored contents of the memory are read out to read the relative position. A working device comprising: a control unit that operates the working unit under the working condition while moving.