JPH0547469B2 - - Google Patents

Description

[Detailed Description of the Invention] [Technical Field] The present invention relates to transportation and transportation of electronic components, particularly semiconductor devices.
It relates to techniques that are effective when applied to storage.

[Background Art] It is known that in electronic components such as semiconductor devices, the electrode portions of pellets may corrode due to moisture infiltration into the package, resulting in product defects.

Incidentally, it is believed that the intrusion of moisture into the interior of the package is further accelerated by exposure to high humidity air outside during storage and transportation of the semiconductor device.

However, the inventors of the present invention have discovered that moisture-proofing has not been considered in storage tools for storing and transporting these electronic components.

For example, semiconductor devices are usually stored and transported in magazines or trays, which are storage devices.The structure of the magazine is a long cylinder with a rectangular cross section and openings at both ends. When the semiconductor device is stored, both ends are locked with pins made of synthetic resin or the like, and no moisture-proofing measures are taken in the product storage section. Furthermore, when it comes to trays, the products are always stored in a state where they are exposed to the outside air.

The present inventor further believes that this can cause product defects such as pellet corrosion and package cracks in resin-sealed semiconductor devices, which have higher hygroscopic properties than hermetically sealed products such as ceramic packages. It was revealed that

An example of a magazine that is a storage device for semiconductor devices is "Introduction to Automatic Assembly of Electronic Components" published by Nikkan Kogyo Shimbun, July 30, 1981.
There are P24 to P44.

[Object of the Invention] An object of the present invention is to prevent moisture from entering the storage device during storage and transportation of electronic components, particularly resin-sealed semiconductor devices, and to prevent product defects due to corrosion of the electronic components stored therein. The objective is to provide technology that can prevent the occurrence of

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Summary of the Invention] A brief overview of typical inventions disclosed in this application is as follows.

In other words, by forming the resin-sealed semiconductor device storage device into a structure consisting of a product storage section and a member that seals the product storage section, the stored products can be stored and transported without being exposed to the outside air. Therefore, product defects due to corrosion of resin-sealed semiconductor devices during storage and transportation can be prevented, and highly reliable electronic components can be provided.

[Embodiment 1] FIG. 1 is a partial sectional view showing an electronic component storage device according to an embodiment of the present invention, and FIG. 2 is a sectional view taken along the line -- in FIG.

The electronic component storage device 1 of the first embodiment stores a so-called dual inline package (DIP) type semiconductor device as a product 2.

In the electronic component storage device 1 of the first embodiment, a cylindrical body 3 made of polyvinyl chloride resin and having a substantially square cross section is inserted with a partition member 4 of approximately the same length as the cylindrical body, and openings 5 at both ends of the cylindrical body 3. A cap 6 also made of polyvinyl chloride resin is attached to the cap.

The cylinder body 3 is obtained by mixing carbon into polyvinyl chloride resin and integrally molding it with a mold.
A brim-like convex portion 7 is formed around the entire periphery near the opening 5 at both ends. Here, the reason why carbon is mixed during manufacturing is to prevent electrostatic charging and to prevent electrostatic damage to the product 2 to be stored.

The partition member 4 and the cap 6 are also manufactured in the same manner as the cylinder 3, and the partition member 4 has a U-shaped cross section with flat plates 4a provided on the outside of both ends in the width direction. , a large number of minute through holes 8 are formed in the side surface 4b.

The interior of the cylinder 3 is partitioned by the partition member 4 into a product storage space 1a and a desiccant storage space 1b.

The cap 6 has a slightly larger cross-sectional shape than the cylinder 3, and has a sleeve 6a formed around it, and a recess 9 corresponding to the convex part 7 of the cylinder on the inner periphery of the sleeve 6a. has been done.

To store the product 2 in the storage device 1, first attach the cap 6 to one opening (not shown) of the cylindrical body 3, then insert the partition member 4 from the other opening 5, and then After filling a predetermined amount of silica gel into the desiccant storage space 1b partitioned by 4, the products 2 are sequentially inserted into the product storage space 1a. Finally, cylinder 3
The cap 6 is inserted into the opening 5 of the cylinder body 3 by pushing it in the length direction of the cylinder body 3 while expanding the sleeve part outward, and the storage operation is completed.

By attaching the cap 6 to the cylindrical body 3 in this way, the inside of the cylindrical body 3 is isolated from the outside air.

Therefore, it is possible to prevent the product 2 from absorbing external moisture and causing product defects.

Furthermore, by filling the desiccant storage section 1b partitioned by the partition member 4 with silica gel, the humidity inside the cylinder 3 can be lowered, and moisture absorption into the product 2 during storage and transportation can be prevented. and can prevent product corrosion.

FIG. 3 is a sectional view showing an electronic component storage device as a reference example.

The electronic component storage device 21 of the reference example stores a so-called flat package type semiconductor device as a product 22, and as shown in FIG. Become.

The tray 23 is partitioned into single product storage sections, and is obtained by integrally molding carbon-mixed polyvinyl chloride resin with a mold, for example.

Hereinafter, a storage method using the storage tool 21 of the reference example will be explained.

First, a predetermined number of products 22 are placed on a tray 23, and then the tray 23 is covered with a bag-shaped vinyl sheet 24. Thereafter, the air inside the vinyl sheet 24 is mechanically extracted to create a vacuum state. While maintaining this vacuum state, the open ends 24a and 24b of the vinyl sheet 24 are pressed together while applying heat or ultrasonic waves to seal the inside.

As described above, according to the reference example, since the inside of the storage device 21 can be maintained in a vacuum state, the product 22 can maintain high reliability without absorbing moisture even when the product 22 is stored for a long period of time. I can do it.

[Effects] (1) By making the electronic component storage device have a structure consisting of a product storage section and a member that seals the product storage section, the stored products can be stored and transported without being exposed to the outside air. Because it can be stored and
It is possible to prevent product defects due to corrosion of electronic components during transportation and provide highly reliable electronic components.

(2) By providing a desiccant storage section in the product storage section, moisture inside the storage device can be removed and high reliability of the electronic components stored can be maintained.

(3) By sealing the entire product storage area with a synthetic resin sheet, high reliability can be maintained without the electronic components absorbing moisture even when the electronic components are stored for a long period of time.

Although the invention made by the present inventor has been specifically explained based on Examples above, the present invention is not limited to the Examples described above, and it is understood that various changes can be made without departing from the gist of the invention. Needless to say.

For example, in the example
Although only package type and flat package type semiconductor devices have been described, the present invention is not limited thereto, and may be a chip carrier type semiconductor device or the like.

Moreover, the material of the storage tool is not limited to those mentioned above.

[Field of Application] In the above explanation, the invention made by the present inventor was mainly applied to the field of application which is its background, which is the so-called storage device for semiconductor devices, but the present invention is not limited to this. It goes without saying that this technique is also effective when applied to storage devices for other electronic components, such as transistors and diodes.

[Brief explanation of drawings]

FIG. 1 is a partial cross-sectional view showing an electronic component storage device according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view taken along the - line in FIG. 1, and FIG. 3 is a cross-sectional view showing an electronic component storage device as a reference example. It is a diagram. DESCRIPTION OF SYMBOLS 1...Electronic component storage device, 2...Product, 3...Cylinder, 4...Partition member, 5...Opening, 6...Cap, 8...Through hole, 21...Electronic component storage device, 22...Product, 23...Tray, 24...
vinyl sheet.

Claims (1)

[Claims] 1. A method for transporting or storing a resin-encapsulated semiconductor device in which a resin-encapsulated semiconductor device is transported or stored includes a cylinder having a substantially square cross section, and a cylinder having a U-shaped cross section, which is inserted into the cylinder. a partition member that divides the cylindrical body into a first space and a second space for accommodating a resin-sealed semiconductor device, and is provided with a plurality of minute through holes that connect the first space and the second space;
A storage device consisting of a cap attached to both end openings of the cylindrical body is prepared, and the first cap of the cylindrical body is
Transporting or storing the resin-sealed semiconductor device in a state in which the resin-sealed semiconductor device is stored in the space, a desiccant is placed in the second space, and the cap is attached to openings at both ends of the cylindrical body. A method for transporting and storing a resin-sealed semiconductor device, characterized by: