JPH0546998B2 - - Google Patents

Info

Publication number
JPH0546998B2
JPH0546998B2 JP61089219A JP8921986A JPH0546998B2 JP H0546998 B2 JPH0546998 B2 JP H0546998B2 JP 61089219 A JP61089219 A JP 61089219A JP 8921986 A JP8921986 A JP 8921986A JP H0546998 B2 JPH0546998 B2 JP H0546998B2
Authority
JP
Japan
Prior art keywords
polyimide film
insulating layer
filler
layers
wiring pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61089219A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62247597A (ja
Inventor
Hikari Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP8921986A priority Critical patent/JPS62247597A/ja
Publication of JPS62247597A publication Critical patent/JPS62247597A/ja
Publication of JPH0546998B2 publication Critical patent/JPH0546998B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP8921986A 1986-04-19 1986-04-19 絶縁層の構造 Granted JPS62247597A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8921986A JPS62247597A (ja) 1986-04-19 1986-04-19 絶縁層の構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8921986A JPS62247597A (ja) 1986-04-19 1986-04-19 絶縁層の構造

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP231793A Division JPH0831696B2 (ja) 1993-01-11 1993-01-11 絶縁層の構造

Publications (2)

Publication Number Publication Date
JPS62247597A JPS62247597A (ja) 1987-10-28
JPH0546998B2 true JPH0546998B2 (enrdf_load_stackoverflow) 1993-07-15

Family

ID=13964614

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8921986A Granted JPS62247597A (ja) 1986-04-19 1986-04-19 絶縁層の構造

Country Status (1)

Country Link
JP (1) JPS62247597A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101525664B1 (ko) * 2013-06-12 2015-06-03 현대중공업 주식회사 액화가스 처리 시스템 및 방법

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2517369B2 (ja) * 1988-10-06 1996-07-24 イビデン株式会社 多層配線板の製造方法
JP2803684B2 (ja) * 1990-03-27 1998-09-24 富士通株式会社 回路基板
JPH04103196A (ja) * 1990-08-23 1992-04-06 Nec Corp 高密度多層配線基板のコーティング方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52149358A (en) * 1976-06-08 1977-12-12 Fujitsu Ltd Multilayer wiring method
JPS55105399A (en) * 1979-02-08 1980-08-12 Cho Lsi Gijutsu Kenkyu Kumiai Multilayer wired circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101525664B1 (ko) * 2013-06-12 2015-06-03 현대중공업 주식회사 액화가스 처리 시스템 및 방법

Also Published As

Publication number Publication date
JPS62247597A (ja) 1987-10-28

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term