JPH0543650B2 - - Google Patents
Info
- Publication number
- JPH0543650B2 JPH0543650B2 JP30221987A JP30221987A JPH0543650B2 JP H0543650 B2 JPH0543650 B2 JP H0543650B2 JP 30221987 A JP30221987 A JP 30221987A JP 30221987 A JP30221987 A JP 30221987A JP H0543650 B2 JPH0543650 B2 JP H0543650B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- optical element
- heat
- base material
- main component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 claims description 36
- 230000003287 optical effect Effects 0.000 claims description 15
- 238000000465 moulding Methods 0.000 claims description 11
- 239000011195 cermet Substances 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 238000001312 dry etching Methods 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 230000009257 reactivity Effects 0.000 claims description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- 229910018967 Pt—Rh Inorganic materials 0.000 description 5
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- -1 platinum group metals Chemical class 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 229910000629 Rh alloy Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 229910052729 chemical element Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
Description
【発明の詳細な説明】
産業上の利用分野
本発明は高精度な形状を有する光学素子を安価
に製造するための光学素子の製造方法に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an optical element manufacturing method for manufacturing an optical element having a highly accurate shape at low cost.
従来の技術
近年、光学素子は光学機器の高性能化、軽量化
に伴い、著しく高精度の素子が要求されてきてい
る。例えばレンズでは非球面レンズをプレス成形
により製造しようと試られている。このため型材
料としてシリコンカーバイドまたはシリコンナイ
トライドを用いたプレス成形用型（例えば特開昭
52−45613号公報）や、タングステンカーバイド
あるいはサーメツトを母材とし前記母材上に被プ
レス材料と反応しない耐熱性膜をコーテイングし
たプレス成形用型（例えば特願昭59−99059号）
などが提案されている。しかし前述した型材料を
高精度に加工する事をダイヤモンドバイトの摩耗
が原因となり非常にむずかしく、プレス成形型の
コストアツプの要因となつていた。これらの問題
を解決するために、シリコンを母材とした成形型
（例えば特願昭60−155405号）やWC又はサーメ
ツト上にダイヤモンドバイトでの加工性に特に優
れた中間層をもうけ、この中間層を高精度に加工
した後、被プレス材料と反応しない耐熱性膜をコ
ーテイングしたプレス成形用型（例えば特願昭60
−140824号）で光学素子をプレス成形する方法が
提案されている。BACKGROUND OF THE INVENTION In recent years, as optical devices have become more sophisticated and lighter in weight, there has been a growing demand for optical elements with extremely high precision. For example, attempts have been made to manufacture aspherical lenses by press molding. For this reason, press molds using silicon carbide or silicon nitride as the mold material (for example,
52-45613), and press molding molds that have a base material of tungsten carbide or cermet and coat the base material with a heat-resistant film that does not react with the material to be pressed (for example, Japanese Patent Application No. 59-99059).
etc. have been proposed. However, it has been extremely difficult to process the above-mentioned mold material with high precision due to wear of the diamond tool, which has been a factor in increasing the cost of press molding molds. In order to solve these problems, an intermediate layer that is particularly easy to work with a diamond tool is formed on a mold using silicon as a base material (for example, Japanese Patent Application No. 155405/1982), WC or cermet, and this intermediate layer is formed on WC or cermet. After processing the layers with high precision, a press molding die coated with a heat-resistant film that does not react with the material to be pressed (for example, a
-140824) proposes a method of press-molding optical elements.
発明が解決しようとする問題点
このようなシリコンを母材とした型材料では型
のチツピングが発生しやすいという欠点と、母材
と耐熱性膜との接着強度が得られにくいという欠
点を有し、型の寿命としては不十分であつた。ま
た、WC又はサーメツト上にダイヤモンドバイト
での加工性に特に優れた中間層をもうけ、この中
間層を高精度に加工し後、耐熱性膜をコーテイン
グして作製した成形型の場合も、中間層が比較的
やわらかいという欠点と中間層とした成形した金
属が低融点のため成形温度で粒成長を起しプレス
面の表面粗度をくずしやすいという欠点があつ
た。このため上記構成の成形型を用いて高精度な
光学素子を安定、かつ安価に製造できないという
問題点があつた。Problems to be Solved by the Invention Molding materials using silicon as a base material have the drawbacks that chipping of the mold is likely to occur and that it is difficult to obtain adhesive strength between the base material and the heat-resistant film. , which was insufficient for the life of the mold. In addition, in the case of a mold made by forming an intermediate layer that is particularly easy to work with a diamond tool on WC or cermet, processing this intermediate layer with high precision, and then coating it with a heat-resistant film, the intermediate layer The disadvantages were that the metal used as the intermediate layer was relatively soft, and because the metal formed into the intermediate layer had a low melting point, it caused grain growth at the forming temperature, easily destroying the surface roughness of the pressed surface. For this reason, there was a problem in that a high-precision optical element could not be manufactured stably and inexpensively using the mold having the above-mentioned configuration.
問題点を解決するための手段
本発明は上記の問題点を解決するため耐熱性お
よび高温での強度に優れた材料を母材とし、この
母材を所望の形状に近い形状まで加工した後、被
プレス材料との反応性に乏しく、高温強度に優れ
た耐熱性の膜を母材上に被覆し、前記耐熱性膜上
に湿式法で簡単にエツチングされうる材料を所望
の厚さに中間層として成膜した後、前記材料によ
り成る膜上にレジストを用いて所望のパターンを
形成し、エツチング溶液を用い前記中間層の一部
をエツチングすることによりパターンの凹凸を協
調する工程を経た後、乾式エツチングによりレジ
スト及び中間層を完全に除去し、耐熱性膜を所望
の形状にエツチング加工して光学素子成形用金型
を作製した。このようにエツチング溶液による中
間層のエツチングを行なうことにより、レジスト
と耐熱性膜との乾式エツチングレートの顕しい差
を微妙にコントロールできるのである。以上のよ
うにして作成したプレス成形用金型を用いること
により高精度な光学素子をプレス成形により安定
かつ安価に提供しようとしたものである。Means for Solving the Problems In order to solve the above problems, the present invention uses a material with excellent heat resistance and strength at high temperatures as a base material, and after processing this base material into a shape close to the desired shape, A heat-resistant film with poor reactivity with the material to be pressed and excellent high-temperature strength is coated on the base material, and an intermediate layer of a material that can be easily etched by a wet method is formed on the heat-resistant film to a desired thickness. After forming a film of the material, a desired pattern is formed using a resist on the film made of the material, and a part of the intermediate layer is etched using an etching solution to adjust the unevenness of the pattern. The resist and intermediate layer were completely removed by dry etching, and the heat-resistant film was etched into a desired shape to produce a mold for molding an optical element. By etching the intermediate layer with an etching solution in this manner, it is possible to delicately control the noticeable difference in dry etching rate between the resist and the heat-resistant film. By using the press molding die created as described above, it is an attempt to stably and inexpensively provide a highly accurate optical element by press molding.
作 用
本発明では、耐熱性に優れた高強度母材を所望
の形状に近い形状に加工し、この上に高強度耐熱
性膜をコーテイングした後、この耐熱性コーテイ
ング膜を高精度にエツチング加工して高精度なプ
レス面を有する成形型を作製したものであり、比
較的軟かな金属を中間層として設けたり、もろく
てかけやすいシリコンを母材として用いたりする
必要なく高精度なプレス面を得ることを可能とし
たものである。上記のように作製した成形金型を
用いることにより高精度な光学素子を安定かつ安
価に製造することができるようにしたものであ
る。Function In the present invention, a high-strength base material with excellent heat resistance is processed into a shape close to a desired shape, a high-strength heat-resistant film is coated on top of this, and then this heat-resistant coating film is etched with high precision. A mold with a high-precision press surface was created by using this method, and it is possible to create a high-precision press surface without the need to provide a relatively soft metal as an intermediate layer or use brittle and easy-to-slip silicon as a base material. It is possible to obtain. By using the molding die produced as described above, a highly accurate optical element can be manufactured stably and at low cost.
実施例
以下、本発明の一実施例について、図面を用い
て説明する。まず、たて５cm、厚さ２cmのWC母
材１０を鏡面研摩してその表面粗度をRMS＝８
〜10Åに仕上げた後第１図ａに示すように耐熱性
膜Pt−Rh合金１１をマグネトロンスパツタ装置
を用いて成膜した。続いて銅膜１２をPt−Rh合
金１１上にマグネトロンスパツタ装置を用いて成
膜したものが第１図ｂである。その後、銅膜１２
上にレジスト１３を塗布し、フオトリソグラフイ
により所望する最終形状が得られるようパターン
を形成したものが第１図ｃである。この後、銅膜
１２を一部をエツチングにより除去し、所望する
パターンの凹凸を強調したものが第１図ｄであ
る。最後に、レジスト１３及び銅膜１２の全てと
耐熱性膜Pt−Rh１１の一部をエツチングにより
除去して最終の所望する形状の金型に作製したの
が第１図ｅである。以上のようにして作成した成
形型を用つて平板ガラスをプレスすることにより
0.8μｍピツチで、深さ0.8μｍの回析格子を安定に
製造することができた。なお本発明の実施例で
は、母材にWCを主成分とする超硬合金、耐熱性
膜にPt−Rh合金を選んだが、母材としては他に
サーメツトも使用可能で有り、耐熱性膜としても
他に白金族金属を主成分とする合金、ちつ化物、
炭化物、あるいはホウ化物なども使用可能であ
る。また、プレス面パターンの凹凸を強調するた
めに用いられる酸またはアルカリ溶液に簡単にエ
ツチングされる金属膜としてニツケル及びアルミ
ニウムなども使用可能である。Embodiment An embodiment of the present invention will be described below with reference to the drawings. First, a WC base material 10 with a length of 5 cm and a thickness of 2 cm was mirror-polished to obtain a surface roughness of RMS = 8.
After finishing the film to a thickness of ~10 Å, a heat-resistant film Pt-Rh alloy 11 was formed using a magnetron sputtering device as shown in FIG. 1a. Subsequently, a copper film 12 was formed on the Pt--Rh alloy 11 using a magnetron sputtering device, as shown in FIG. 1b. After that, the copper film 12
A resist 13 is applied thereon, and a pattern is formed by photolithography to obtain a desired final shape, as shown in FIG. 1c. Thereafter, a portion of the copper film 12 is removed by etching to emphasize the desired pattern irregularities, as shown in FIG. 1d. Finally, all of the resist 13 and copper film 12 and a part of the heat-resistant film Pt-Rh 11 were removed by etching to produce a mold having the final desired shape, as shown in FIG. 1e. By pressing flat glass using the mold created as described above,
We were able to stably manufacture a diffraction grating with a pitch of 0.8 μm and a depth of 0.8 μm. In the example of the present invention, a cemented carbide whose main component is WC and a Pt-Rh alloy were selected as the base material and a Pt-Rh alloy as the heat-resistant film, but cermets can also be used as the base material. In addition, alloys whose main components are platinum group metals, chitride,
Carbides or borides can also be used. Also, nickel, aluminum, etc. can be used as a metal film that is easily etched in an acid or alkaline solution used to emphasize the unevenness of the pressed surface pattern.
発明の効果
以上述べたように、本発明は多少加工性に劣る
ような母材でも、ほぼ所望の形状に近い形状にさ
れ加工できれば、前記母材上に形成した耐熱性膜
の一部とレジスト及び湿式エツチングしやすい金
属膜の全てを完全にエツチング除去して加工する
ことにより高精度なプレス面をもつ成形型に簡単
に作製することができるようにしたもので、これ
により従来加工性を考慮するため母材選択の自由
度があまりないという欠点を解決し、さらに高精
度加工のため比較的やわらかな金属を中間層とし
て設けるために型の寿命が十分でないというよう
な欠点をも解決したものであり、本発明により高
精度な化学素子を安定にプレス成形することを可
能としたものである。Effects of the Invention As described above, the present invention allows even a base material with somewhat inferior workability to be processed into a shape close to the desired shape, and a part of the heat-resistant film formed on the base material and a resist. By completely etching and removing all the metal films that are easy to wet-etch, it is possible to easily create a mold with a highly precise press surface, which takes into account conventional workability. This solves the drawback that there is not much freedom in selecting the base material, and also solves the drawback that the mold life is not sufficient because a relatively soft metal is used as an intermediate layer for high-precision machining. According to the present invention, it is possible to stably press-form a highly precise chemical element.
第１図は本発明で構成した成形用金型作製の工
程図である。
１０……母材WC、１１……耐熱性膜Pt―Rh
合金、１２……Cu膜、１３……レジスト。
FIG. 1 is a process diagram of manufacturing a molding die constructed according to the present invention. 10...Base material WC, 11...Heat-resistant film Pt-Rh
Alloy, 12...Cu film, 13...Resist.
Claims (1)
材とし、前記母材を所望の形状に加工した後、被
プレス材料との反応性に乏しく、高温強度に優れ
た耐熱性の膜を母材上に被覆し、前記耐熱性膜上
に湿式法により簡単にエツチングされうる材料を
所望の厚さに中間層として成膜した後、前記材料
より成る膜上にレジストを用いて所望のパターン
を形成する工程を経た後、エツチング溶液を用い
中間層の一部をエツチングにより除去する工程と
それに続く乾式エツチングによりレジスト及び中
間層を完全に除去する工程により作製した金型を
用いて光学素子をプレス成形して製造することを
特徴とする光学素子の製造方法。 ２ 母材がWCを主成分とする超硬合金、TiNを
主成分とするサーメツト、TiCを主成分とするサ
ーメツト、Cr3C2を主成分とするサーメツト、あ
るいはAl2O3を主成分とするサーメツトであるこ
とを特徴とする特許請求の範囲第１項記載の光学
素子の製造方法。 ３ 耐熱性膜が白金族金属あるいは白金族金属を
主成分とする合金膜、ちつ化物膜、炭化物膜ある
いはホウ化物膜であることを特徴とする特許請求
の範囲第１項または第２項のいずれかに記載の光
学素子の製造方法。 ４ 材料より成る膜がニツケル膜、アルミニウム
膜、あるいは銅膜であることを特徴とする特許請
求の範囲第１項、第２項、または第３項のいずれ
かに記載の光学素子の製造方法。[Claims] 1. A material with excellent heat resistance and strength at high temperatures is used as a base material, and after processing the base material into a desired shape, a material with poor reactivity with the material to be pressed and excellent in high temperature strength is used. A heat-resistant film is coated on a base material, and a material that can be easily etched by a wet method is formed as an intermediate layer on the heat-resistant film to a desired thickness, and then a resist is applied on the film made of the material. After passing through the step of forming a desired pattern using etching solution, a step of removing a part of the intermediate layer by etching using an etching solution, followed by a step of completely removing the resist and the intermediate layer by dry etching. 1. A method for manufacturing an optical element, characterized in that the optical element is manufactured by press molding using the same. 2 The base material is a cemented carbide whose main component is WC, a cermet whose main component is TiN, a cermet whose main component is TiC, a cermet whose main component is Cr 3 C 2 , or a cermet whose main component is Al 2 O 3 . 2. The method of manufacturing an optical element according to claim 1, wherein the optical element is a cermet. 3. The heat-resistant film according to claim 1 or 2, wherein the heat-resistant film is a platinum group metal or an alloy film mainly composed of a platinum group metal, a chitide film, a carbide film, or a boride film. A method for manufacturing an optical element according to any one of the above. 4. The method for manufacturing an optical element according to claim 1, 2, or 3, wherein the film made of the material is a nickel film, an aluminum film, or a copper film.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30221987A JPH01145342A (en) | 1987-11-30 | 1987-11-30 | Production of optical element |
| US07/235,301 US4842633A (en) | 1987-08-25 | 1988-08-23 | Method of manufacturing molds for molding optical glass elements and diffraction gratings |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30221987A JPH01145342A (en) | 1987-11-30 | 1987-11-30 | Production of optical element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01145342A JPH01145342A (en) | 1989-06-07 |
| JPH0543650B2 true JPH0543650B2 (en) | 1993-07-02 |
Family
ID=17906386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30221987A Granted JPH01145342A (en) | 1987-08-25 | 1987-11-30 | Production of optical element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01145342A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0359928A (en) * | 1989-07-27 | 1991-03-14 | Matsushita Electric Ind Co Ltd | Gas discharge display element and its manufacture |
-
1987
- 1987-11-30 JP JP30221987A patent/JPH01145342A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01145342A (en) | 1989-06-07 |
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