JPH0542989B2 - - Google Patents

Info

Publication number
JPH0542989B2
JPH0542989B2 JP61227208A JP22720886A JPH0542989B2 JP H0542989 B2 JPH0542989 B2 JP H0542989B2 JP 61227208 A JP61227208 A JP 61227208A JP 22720886 A JP22720886 A JP 22720886A JP H0542989 B2 JPH0542989 B2 JP H0542989B2
Authority
JP
Japan
Prior art keywords
adhesive sheet
curing agent
thermosetting
curing
thermosetting adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61227208A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6381187A (ja
Inventor
Mitsuhiro Kondo
Tsukasa Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP61227208A priority Critical patent/JPS6381187A/ja
Publication of JPS6381187A publication Critical patent/JPS6381187A/ja
Publication of JPH0542989B2 publication Critical patent/JPH0542989B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesive Tapes (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP61227208A 1986-09-25 1986-09-25 熱硬化性接着シ−ト Granted JPS6381187A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61227208A JPS6381187A (ja) 1986-09-25 1986-09-25 熱硬化性接着シ−ト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61227208A JPS6381187A (ja) 1986-09-25 1986-09-25 熱硬化性接着シ−ト

Publications (2)

Publication Number Publication Date
JPS6381187A JPS6381187A (ja) 1988-04-12
JPH0542989B2 true JPH0542989B2 (enEXAMPLES) 1993-06-30

Family

ID=16857185

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61227208A Granted JPS6381187A (ja) 1986-09-25 1986-09-25 熱硬化性接着シ−ト

Country Status (1)

Country Link
JP (1) JPS6381187A (enEXAMPLES)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3041980B2 (ja) * 1991-02-14 2000-05-15 セイコーエプソン株式会社 液晶パネル及び液晶パネルの製造方法
JP3002591B2 (ja) * 1992-02-13 2000-01-24 イビデン株式会社 接着剤シートとこの接着剤シートを用いたプリント配線板の製造方法およびプリント配線板
JP3350266B2 (ja) * 1994-12-09 2002-11-25 ダイハツ工業株式会社 熱硬化性両面接着テープ及びそれを用いた自動車の付属物取付け構造体
US7967943B2 (en) 1997-03-31 2011-06-28 Hitachi Chemical Company, Ltd. Circuit-connecting material and circuit terminal connected structure and connecting method
KR100543428B1 (ko) * 1999-06-18 2006-01-20 히다치 가세고교 가부시끼가이샤 접착제, 접착부재, 접착부재를 구비한 반도체탑재용배선기판 및 이것을 사용한 반도체장치
US6833629B2 (en) † 2001-12-14 2004-12-21 National Starch And Chemical Investment Holding Corporation Dual cure B-stageable underfill for wafer level
JP4831980B2 (ja) * 2005-02-25 2011-12-07 富士フイルム株式会社 セルロースエステルフィルム、偏光板、液晶表示装置、およびセルロースエステルフィルムの製造方法
TWI494364B (zh) * 2009-01-30 2015-08-01 Ajinomoto Kk Resin composition
JP5552788B2 (ja) * 2009-10-05 2014-07-16 日立化成株式会社 エポキシ樹脂組成物、半導体封止充てん用樹脂組成物及び半導体装置
JP6134497B2 (ja) * 2012-11-08 2017-05-24 京セラ株式会社 積層コアの製造方法
US11193049B2 (en) 2016-11-25 2021-12-07 Lg Chem, Ltd. Curable composition
KR102239656B1 (ko) * 2018-09-28 2021-04-12 (주)엘지하우시스 외단열용 접착제 조성물 및 이를 이용한 외단열 시스템

Also Published As

Publication number Publication date
JPS6381187A (ja) 1988-04-12

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