JPH0534096Y2 - - Google Patents

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Publication number
JPH0534096Y2
JPH0534096Y2 JP1987006371U JP637187U JPH0534096Y2 JP H0534096 Y2 JPH0534096 Y2 JP H0534096Y2 JP 1987006371 U JP1987006371 U JP 1987006371U JP 637187 U JP637187 U JP 637187U JP H0534096 Y2 JPH0534096 Y2 JP H0534096Y2
Authority
JP
Japan
Prior art keywords
resin layer
capacitor element
capacitor
undercoat
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987006371U
Other languages
Japanese (ja)
Other versions
JPS63114019U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987006371U priority Critical patent/JPH0534096Y2/ja
Publication of JPS63114019U publication Critical patent/JPS63114019U/ja
Application granted granted Critical
Publication of JPH0534096Y2 publication Critical patent/JPH0534096Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Description

【考案の詳細な説明】 産業上の利用分野 本考案は金属化フイルムコンデンサに関するも
のである。
[Detailed Description of the Invention] Industrial Application Field The present invention relates to a metallized film capacitor.

従来の技術 一般に金属化フイルムコンデンサは、誘電体プ
ラスチツクフイルムの片面または両面に金属を蒸
着して巻回し、その巻回端面部に金属を溶射して
電極引出層を形成し、該電極引出層に引出リード
を溶接し、樹脂外装して構成されている。しかし
上述のようなコンデンサに過電圧が印加されコン
デンサ素子が破壊すると、第3図のように上塗樹
脂層7が破壊して蒸着金属や溶射金属(電極引出
層3)の破片が飛散し、周辺回路において絶縁不
良、短絡不良などが生ずるといつた問題があつ
た。
2. Description of the Related Art In general, metallized film capacitors are made by depositing metal on one or both sides of a dielectric plastic film and winding it, then spraying metal on the end surface of the winding to form an electrode lead layer. It is constructed by welding the lead out and covering it with resin. However, when an overvoltage is applied to the capacitor as described above and the capacitor element is destroyed, the top resin layer 7 is destroyed as shown in Figure 3, and fragments of the vapor deposited metal and sprayed metal (electrode extraction layer 3) are scattered, damaging the surrounding circuitry. There were problems such as poor insulation and short circuits.

そのため、コンデンサ素子全体を可撓性樹脂を
用いて被覆したものが種々考案されている。(実
開昭55−139527号公報、実開昭60−76023号公報
など) 考案が解決しようとする問題点 上述のコンデンサ素子全体を可撓性樹脂を用い
て被覆した金属化フイルムコンデンサは大形にな
り、また樹脂外装の製造工程において引出リード
の根元に付着した可撓性樹脂を除去するのに時間
がかかる、耐湿性に劣るなどの問題があつた。
Therefore, various capacitor elements have been devised in which the entire capacitor element is covered with flexible resin. (Utility Model Application No. 55-139527, Utility Model Application No. 60-76023, etc.) Problems to be solved by the invention The metallized film capacitor, in which the entire capacitor element mentioned above is covered with a flexible resin, is large. In addition, there were other problems such as it took time to remove the flexible resin adhering to the base of the lead in the process of manufacturing the resin sheath, and the moisture resistance was poor.

問題点を解決するための手段 本考案は上述の問題を解決するため蒸着金属を
有する誘電体プラスチツクフイルムを巻回して扁
平状に熱圧着し、その端面部より同一方向に2本
の引出リードを導出してなる扁平状コンデンサ素
子と、該コンデンサ素子全体を被覆した下塗樹脂
層と、該下塗樹脂層上でかつコンデンサ素子の上
下左右の側面部を除く扁平部に塗布した可撓性樹
脂層と、該コンデンサ素子全体を被覆した上塗樹
脂層とを具備してなる金属化フイルムコンデンサ
である。
Means for Solving the Problems In order to solve the above-mentioned problems, the present invention involves winding a dielectric plastic film containing vapor-deposited metal, thermo-compressing it into a flat shape, and connecting two lead-out leads from the end face in the same direction. A flat capacitor element obtained by deriving the capacitor element, an undercoat resin layer covering the entire capacitor element, and a flexible resin layer applied on the undercoat resin layer to the flat part of the capacitor element except for the top, bottom, left and right sides. , a metallized film capacitor comprising an overcoat resin layer covering the entire capacitor element.

作 用 金属化フイルムコンデンサに過電圧が印加され
ると、コンデンサ素子の内部でガスが発生し、上
記コンデンサの扁平面が膨張して下塗樹脂層を押
し上げ、コンデンサ素子の扁平部に塗布した可撓
性樹脂層をふくらませ、上塗樹脂層を亀裂させ、
この亀裂部からガスが脱出する。そのため蒸着金
属や溶射金属3の破片が飛散することはない。
Action When an overvoltage is applied to a metallized film capacitor, gas is generated inside the capacitor element, and the flat surface of the capacitor expands, pushing up the undercoat resin layer and reducing the flexibility applied to the flat part of the capacitor element. The resin layer is swollen, the top resin layer is cracked,
Gas escapes from this crack. Therefore, fragments of the vapor-deposited metal and the sprayed metal 3 are not scattered.

また可撓性樹脂層が引出リードの根元に付か
ず、除去作業が不要になり耐湿性に優れる。
Furthermore, the flexible resin layer does not stick to the base of the lead-out lead, eliminating the need for removal work and providing excellent moisture resistance.

実施例 以下、本考案の実施例を第1図および第2図に
より説明する。
Embodiment Hereinafter, an embodiment of the present invention will be described with reference to FIGS. 1 and 2.

第1図は金属化フイルムコンデンサの断面図
で、まず誘電体プラスチツクフイルムの片面また
は両面にアルミニウム、亜鉛などの金属を蒸着さ
せ、これを巻回し、その巻回終端部に上記誘電体
プラスチツクフイルムより0.5〜1.0mm狭幅で、厚
さ0.01〜0.015mmのプラスチツクフイルムを5回
以上巻回してダンパー層1を形成し、その外周部
を熱シールしてコンデンサ素子2を形成する。次
いで該素子2を熱プレスしてテーピングしコンデ
ンサ素子2の端面に亜鉛、半田などの金属を溶射
して電極引出層3を形成した後、テーピングから
外し、上記電極引出層3に引出リード4を溶接
し、該コンデンサ素子2全体をエポキシ樹脂、ポ
リエステル樹脂などの液状樹脂で被覆し下塗樹脂
層5を形成する。次いで該下塗樹脂層5上でかつ
コンデンサ素子2の上下左右の側端部を除く扁平
部(第1図イの点線で囲まれた部分)に可撓性樹
脂を塗布して可撓性樹脂層6を形成する。可撓性
樹脂層6は難燃性で引張強度5〜20Kg/cm2、伸び
50〜150%のものが望ましく塗布厚さは0.2〜1.0
mmの範囲が望ましい。そして該コンデンサ素子2
全体をエポキシ樹脂からなる上塗樹脂を被覆し、
上塗樹脂層7を形成する。
Figure 1 is a cross-sectional view of a metallized film capacitor. First, a metal such as aluminum or zinc is deposited on one or both sides of a dielectric plastic film, and this is wound. The end of the winding is covered with the dielectric plastic film. A damper layer 1 is formed by winding a plastic film having a narrow width of 0.5 to 1.0 mm and a thickness of 0.01 to 0.015 mm five or more times, and the outer periphery of the damper layer 1 is heat-sealed to form a capacitor element 2. Next, the element 2 is hot-pressed and taped, and metal such as zinc or solder is thermally sprayed on the end face of the capacitor element 2 to form an electrode lead layer 3. After that, the element 2 is removed from the taping, and the lead lead 4 is attached to the electrode lead layer 3. Welding is performed, and the entire capacitor element 2 is coated with a liquid resin such as epoxy resin or polyester resin to form an undercoat resin layer 5. Next, a flexible resin is applied on the undercoat resin layer 5 and to the flat part (the part surrounded by the dotted line in FIG. 1A) of the capacitor element 2 excluding the upper, lower, left, and right side edges to form a flexible resin layer. form 6. The flexible resin layer 6 is flame retardant and has a tensile strength of 5 to 20 Kg/cm 2 and elongation.
50 to 150% is desirable, and the coating thickness is 0.2 to 1.0
Preferably in the mm range. and the capacitor element 2
The entire body is coated with a top coat of epoxy resin,
A top coat resin layer 7 is formed.

次ぎに上述の実施例に基づき定格250VAC、
0.22μFの金属化フイルムコンデンサを製作し、同
定格の可撓性樹脂層6を有しない従来品と共に
JIS C 5102 7.4により強制破壊試験を行つた。
その結果本考案に基づいて製作したコンデンサ
は、金属の飛散は20個全数発生せず、第2図のよ
うに上塗樹脂層7に亀裂を生じたものが8個で、
残りの12個は外観に異常はなかつた。これに対し
可撓性樹脂層6を有しない従来品では20個全数第
3図のように上塗樹脂層7の飛散と共にに電極引
出層3の破片が飛散した。
Next, based on the above example, the rating is 250VAC,
A 0.22 μF metallized film capacitor was manufactured, along with a conventional product without the flexible resin layer 6 of the same rating.
A forced destruction test was conducted in accordance with JIS C 5102 7.4.
As a result, all 20 capacitors manufactured based on the present invention did not have metal scattering, but only 8 capacitors had cracks in the top resin layer 7, as shown in Figure 2.
The remaining 12 pieces had no abnormalities in appearance. On the other hand, in all 20 pieces of the conventional product without the flexible resin layer 6, as shown in FIG. 3, the top resin layer 7 was scattered and the pieces of the electrode extraction layer 3 were scattered.

考案の効果 以上のように本考案の金属化フイルムコンデン
サは、破壊時において金属片が飛散せず、極めて
安全性が高く、生産性の面においても有利とな
る。
Effects of the Invention As described above, the metallized film capacitor of the present invention does not scatter metal fragments when broken, is extremely safe, and is advantageous in terms of productivity.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の金属化フイルムコンデンサの
一実施例で、イは正断面図、ロは側断面図、第2
図は強制破壊された本考案に係る金属化フイルム
コンデンサの斜視図、第3図は強制破壊された従
来品の斜視図である。 1……ダンパー層、2……コンデンサ素子、3
……電極引出層、4……引出リード、5……下塗
樹脂層、6……可撓性樹脂層、7……上塗樹脂
層。
Figure 1 shows one embodiment of the metallized film capacitor of the present invention, in which A is a front sectional view, B is a side sectional view, and
The figure is a perspective view of a metallized film capacitor according to the present invention that has been forcibly destroyed, and FIG. 3 is a perspective view of a conventional product that has been forcibly destroyed. 1... Damper layer, 2... Capacitor element, 3
. . . electrode extraction layer, 4 . . . extraction lead, 5 . . . undercoat resin layer, 6 .

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 蒸着金属を有する誘電体プラスチツクフイルム
を巻回して扁平状に熱圧着し、その端面部より同
一方向に2本の引出リードを導出してなる扁平状
コンデンサ素子と、該コンデンサ素子全体を被覆
した下塗樹脂層と、該下塗樹脂層上でかつコンデ
ンサ素子の上下左右の側端部を除く扁平部に塗布
した可撓性樹脂層と、該コンデンサ素子全体を被
覆した上塗樹脂層とを具備してなる金属化フイル
ムコンデンサ。
A flat capacitor element made by winding a dielectric plastic film containing vapor-deposited metal and thermally pressing it into a flat shape, and having two lead-out leads led out in the same direction from the end face thereof, and an undercoat covering the entire capacitor element. A resin layer, a flexible resin layer coated on the undercoat resin layer and on a flat part of the capacitor element excluding the top, bottom, left and right side edges, and a top coat resin layer covering the entire capacitor element. Metallized film capacitor.
JP1987006371U 1987-01-19 1987-01-19 Expired - Lifetime JPH0534096Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987006371U JPH0534096Y2 (en) 1987-01-19 1987-01-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987006371U JPH0534096Y2 (en) 1987-01-19 1987-01-19

Publications (2)

Publication Number Publication Date
JPS63114019U JPS63114019U (en) 1988-07-22
JPH0534096Y2 true JPH0534096Y2 (en) 1993-08-30

Family

ID=30788827

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987006371U Expired - Lifetime JPH0534096Y2 (en) 1987-01-19 1987-01-19

Country Status (1)

Country Link
JP (1) JPH0534096Y2 (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS509059A (en) * 1973-05-29 1975-01-30
JPS5037044A (en) * 1973-08-04 1975-04-07
JPS5214860A (en) * 1975-07-26 1977-02-04 Matsushita Electric Ind Co Ltd Film capacitor and method of making same
JPS56101730A (en) * 1980-01-19 1981-08-14 Matsushita Electric Ind Co Ltd Electronic part
JPS5753926A (en) * 1980-09-16 1982-03-31 Nichicon Capacitor Ltd KONDENSA
JPS5784127A (en) * 1980-11-13 1982-05-26 Nichicon Capacitor Ltd Condenser
JPS58134415A (en) * 1982-02-05 1983-08-10 マルコン電子株式会社 Method of sheathing film capacitor

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5475354U (en) * 1977-11-08 1979-05-29
JPS56117574U (en) * 1980-02-08 1981-09-08

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS509059A (en) * 1973-05-29 1975-01-30
JPS5037044A (en) * 1973-08-04 1975-04-07
JPS5214860A (en) * 1975-07-26 1977-02-04 Matsushita Electric Ind Co Ltd Film capacitor and method of making same
JPS56101730A (en) * 1980-01-19 1981-08-14 Matsushita Electric Ind Co Ltd Electronic part
JPS5753926A (en) * 1980-09-16 1982-03-31 Nichicon Capacitor Ltd KONDENSA
JPS5784127A (en) * 1980-11-13 1982-05-26 Nichicon Capacitor Ltd Condenser
JPS58134415A (en) * 1982-02-05 1983-08-10 マルコン電子株式会社 Method of sheathing film capacitor

Also Published As

Publication number Publication date
JPS63114019U (en) 1988-07-22

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