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JPH0533536B2 - - Google Patents

Info

Publication number
JPH0533536B2
JPH0533536B2 JP9214084A JP9214084A JPH0533536B2 JP H0533536 B2 JPH0533536 B2 JP H0533536B2 JP 9214084 A JP9214084 A JP 9214084A JP 9214084 A JP9214084 A JP 9214084A JP H0533536 B2 JPH0533536 B2 JP H0533536B2
Authority
JP
Japan
Prior art keywords
active layer
vertical wire
pressure
applied
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP9214084A
Other versions
JPS60235446A (en
Inventor
Masaaki Yasumoto
Tadayoshi Enomoto
Original Assignee
Nippon Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co filed Critical Nippon Electric Co
Priority to JP9214084A priority Critical patent/JPH0533536B2/ja
Publication of JPS60235446A publication Critical patent/JPS60235446A/en
Publication of JPH0533536B2 publication Critical patent/JPH0533536B2/ja
Anticipated expiration legal-status Critical
Application status is Expired - Lifetime legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits

Abstract

PURPOSE:To reduce the pressure applied during diffusion welding in a multi- layer semiconductor integrated circuit, by forming the part of a vertical wire in a first active layer contacted with a vertical wire in a second active layer so as to have a triangular or trapezoidal cross section. CONSTITUTION:An end of a vertical wire 220 in a first active layer is formed to have a triangular cross section. In practice, however, it may be formed into a conical shape when the aperture in a first insulation film 202 is circular, and into a pyramid when the aperture is square. When such second active layer is superposed on the first active layer, the tip 221 of the first vertical wire 220 is contacted with the surface of a metal bump in the initial stage when no pressure is applied. Accordingly, if a slight pressure is applied after that, all the pressure is concentrated at the tip 221. The first vertical wire 220 or the metal bump is therefore easily deformed plastically. Thus, any dirty or oxide film is broken and it is facilitated to perform diffusion welding.
JP9214084A 1984-05-09 1984-05-09 Expired - Lifetime JPH0533536B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9214084A JPH0533536B2 (en) 1984-05-09 1984-05-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9214084A JPH0533536B2 (en) 1984-05-09 1984-05-09

Publications (2)

Publication Number Publication Date
JPS60235446A JPS60235446A (en) 1985-11-22
JPH0533536B2 true JPH0533536B2 (en) 1993-05-19

Family

ID=14046128

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9214084A Expired - Lifetime JPH0533536B2 (en) 1984-05-09 1984-05-09

Country Status (1)

Country Link
JP (1) JPH0533536B2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0374508B2 (en) * 1986-03-20 1991-11-27
US5354695A (en) * 1992-04-08 1994-10-11 Leedy Glenn J Membrane dielectric isolation IC fabrication
JP4110390B2 (en) * 2002-03-19 2008-07-02 セイコーエプソン株式会社 A method of manufacturing a semiconductor device
JP5315688B2 (en) * 2007-12-28 2013-10-16 株式会社ニコン Stacked semiconductor device

Also Published As

Publication number Publication date
JPS60235446A (en) 1985-11-22

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