JPH0532907B2 - - Google Patents

Info

Publication number
JPH0532907B2
JPH0532907B2 JP58146324A JP14632483A JPH0532907B2 JP H0532907 B2 JPH0532907 B2 JP H0532907B2 JP 58146324 A JP58146324 A JP 58146324A JP 14632483 A JP14632483 A JP 14632483A JP H0532907 B2 JPH0532907 B2 JP H0532907B2
Authority
JP
Japan
Prior art keywords
glass
semiconductor element
plastic substrate
substrate
sealant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58146324A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6038842A (ja
Inventor
Takashi Miwa
Kanji Ootsuka
Atsushi Pponda
Masayuki Shirai
Yasuyuki Yamazaki
Koji Nakamura
Toshuki Morizori
Tamotsu Usami
Hiroshi Hososaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58146324A priority Critical patent/JPS6038842A/ja
Publication of JPS6038842A publication Critical patent/JPS6038842A/ja
Publication of JPH0532907B2 publication Critical patent/JPH0532907B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP58146324A 1983-08-12 1983-08-12 ピングリッドアレイ型半導体パッケージ Granted JPS6038842A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58146324A JPS6038842A (ja) 1983-08-12 1983-08-12 ピングリッドアレイ型半導体パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58146324A JPS6038842A (ja) 1983-08-12 1983-08-12 ピングリッドアレイ型半導体パッケージ

Publications (2)

Publication Number Publication Date
JPS6038842A JPS6038842A (ja) 1985-02-28
JPH0532907B2 true JPH0532907B2 (cs) 1993-05-18

Family

ID=15405092

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58146324A Granted JPS6038842A (ja) 1983-08-12 1983-08-12 ピングリッドアレイ型半導体パッケージ

Country Status (1)

Country Link
JP (1) JPS6038842A (cs)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS516868U (cs) * 1974-06-29 1976-01-19
JPS5420667U (cs) * 1977-07-14 1979-02-09
JPS56139253U (cs) * 1980-03-19 1981-10-21
JPS5724554A (en) * 1980-07-22 1982-02-09 Nec Corp Semiconductor device
JPS57184239A (en) * 1981-05-08 1982-11-12 Nec Corp Substrate for semiconductor device
JPS57210645A (en) * 1981-06-19 1982-12-24 Toshiba Corp Hybrid integrated circuit module and manufacture thereof
JPS58159355A (ja) * 1982-03-17 1983-09-21 Nec Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
JPS6038842A (ja) 1985-02-28

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