JPH053232Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Object of the Invention] (Field of Industrial Application) The present invention relates to a device for opening and closing a lid for a pressure fluid discharge port.

(Prior art) When spraying a solution of sulfuric acid or nitric acid to open a semiconductor package, the solution of sulfuric acid or nitric acid is sprayed intermittently as the semiconductor package is transported and installed. Even after spraying of the solution is finished and the semiconductor package is removed, the discharge port for the solution remains open.

(Problem to be solved by the invention) However, in the above-mentioned conventional technology, when the semiconductor package is not transported and installed in the open processing section, the discharge port for the dissolving solution is in an open state, and sulfuric acid or nitric acid is It is also conceivable that the gas generated from the solution may flow out of the discharge port, or that the solution itself may flow out of the discharge port due to malfunction, etc., and there is also a safety problem due to the nature of the solution.

In view of this, the present invention has a mechanism that automatically opens and closes the lid provided at the discharge port of the base as the semiconductor package is transported and installed, and the solution is discharged when the lid is opened. It is an object of the present invention to provide a discharge port inner lid opening/closing device that can be opened and opened accurately.

[Structure of the idea]

(Means for Solving the Problems) In order to achieve the above object, the present invention has a base having a pressure fluid discharge port and a lid having a hole,
The discharge port is opened and closed by a mechanism that slides the lid while keeping it in contact with the lower part of the base, and the lid is pressed against the base by an elastic member. It is characterized by a discharge port inner lid opening/closing device.

(Function) According to the present invention, the lid provided on the discharge port is automatically opened and closed in accordance with the transportation and installation of the semiconductor package, and when the lid is opened, a fixed amount of solution is discharged. can be safely and reliably sprayed onto semiconductor packages.

(Embodiments) The present invention will be described below with reference to embodiments shown in the drawings.

Fig. 1 shows a plan view of the discharge port inner lid opening/closing device according to an embodiment of the present invention, Fig. 2 shows a cross section taken along the line A-A in Fig. 1, with the discharge port in the "closed" state, and Fig. 3 shows the state in which the discharge port is "closed". The cross section taken along the line A-A in Figure 1 shows the discharge port in an "open" state. In the embodiment shown in each of the above figures, the base 1 is made of a disk-shaped acid-resistant member and is fixed to a machine base (not shown), and has a circular discharge port 2 formed in the center and a discharge port. A recess 4 into which a semiconductor package 3 is inserted is formed around the upper portion of the recess 2 . Further, a sliding surface 6 is formed at the bottom of the discharge port 2 of the base 1 by carving the lower inner surface of the base 1 for opening and closing the inner lid 5 by contacting the discharge port 2. A hole 8 for inserting a shaft 7 necessary for opening and closing the lid 5 is provided through the side surface of the base 1.

The inner lid 5 is made of a rectangular acid-resistant member, and an opening 11 of the same size as the circular discharge port 2 formed on the base 1 is formed approximately in the center thereof. is combined with

In addition, the lower surface of the inner lid 5 is the surface where the opening 11 is not formed in the inner lid 5, and the discharge port 2 of the base 1
In order to prevent the solution of sulfuric acid or nitric acid from leaking from between the inner lid 5 and the base 1 and leaking out from the outlet 2 when the lid is closed, a presser cap 9 is provided and held by a spring 10. Inner lid 5
The structure is such that a seal is formed between the inner lid 5 and the base 1 by pressing the inner lid 5 toward the base 1.

The shaft 7 has one end connected to the inner lid 5 via a connector 12.
The other end is connected to the fixture 13 and the E-ring 14.
It is held between a long plate-shaped arm 15 and held by a housing 17 via a spring 16, and the hole 8 on the side of the base 1 is connected to the O-rings 18, 18.
It is sealed by.

The arm 15 has a fulcrum 22 at its approximate center, one end of which is clamped to the shaft 7, and the other end rotatably connected by a pin 23 to an arm 21 connected to a plunger 20 of the solenoid 19.

Next, the operation of this embodiment will be explained. When the semiconductor package 3 is transported onto the base 1 by a manipulator or the like (not shown) and fitted into the recess 4 on the base 1, a position detector (not shown) detects the semiconductor package 3, The solenoid 19 is energized, the plunger 20 is retracted, and the arm 21 moves toward the solenoid 19, which causes the arm 15 to move away from the base 1 about the fulcrum 22, and is therefore connected to the arm 15. a shaft 7 and a connector 1 connected to the shaft 7
2, the inner lid 5 moves to the left in the figure, and the opening 11 of the inner lid 5 matches the discharge port 2 formed in the base 1, and the solution of sulfuric acid or nitric acid flows through the opening of the inner lid 5. The unsealing is performed by blowing a solution of sulfuric acid or nitric acid onto the semiconductor package 3 by blowing from the hole 11 through the outlet 2 of the base 1.

On the other hand, if you do not open the package, solenoid 1
9 does not operate, the shaft 7 connected to the inner lid 5 is fixed to the shaft 7 by the fixture 13, the spring 16 provided between the E-ring 14, and the housing 17. The discharge port 2 of the base 1 and the inner lid 5
The holes 11 formed in the
The solution will no longer blow out.

[Effect of idea]

As explained above, the present invention has a mechanism that automatically opens and closes the lid provided on the discharge port of the base as the semiconductor package is transported and installed, and the solution is discharged when the lid is opened. This method does not require operator skill, and allows for safe and accurate opening of the solution when handling the solution. In addition, the opening and closing of the discharge port is done by matching or non-matching the holes in the lid, so less space is required in the thickness direction, and it can be easily assembled into a narrow base.Furthermore, the lid is made of an elastic material and is Since it is biased toward the stand side, it has the advantage that no leakage occurs when it is closed.

[Brief explanation of the drawing]

Fig. 1 is a plan view of a discharge port inner lid opening/closing device according to an embodiment of the present invention, Figs. 2 and 3 are cross-sectional views taken along line A-A in Fig. 1, and Fig. 2 shows the "closed" state. FIG. 3 shows the "open" state. 1... Base, 2... Discharge port, 3... Semiconductor package, 5... Inner lid, 7... Shaft, 9... Presser cap, 10... Spring, 12... Connector, 13... Fixing Ingredients, 14... E-ring, 15...
...Arm, 16...Spring, 17...Casing,
18...O-ring, 19...Solenoid, 20...
...Plunger, 21...Arm, 23...Pin.

Claims (1)

[Scope of utility model registration request] The discharge port is opened and closed by a mechanism that has a base with a pressure fluid discharge port formed therein and a lid with a hole formed therein, and slides the lid while keeping it in contact with the lower part of the base. Further, the discharge port inner lid opening/closing device is characterized in that the lid is pressed against the base by an elastic member.