JPH05315814A - Irreversible circuit element - Google Patents

Abstract

PURPOSE:To improve the reliability against the connection and to enhance the productivity by preventing the positional deviation when matching circuit elements are connected while making components small. CONSTITUTION:Plural center conductors 7 arranged interdigitally at every prescribed interval in an electric insulation state are disposed to a ferrite 6 to form a ferrite element 3 and matching circuit elements 19, 20 are connected to one end part 7a of each of center conductors 7 to form the irreversible circuit element 1, then a ferrite element 3 and the matching circuit elefments 19, 20 are disposed on an electrode substrate 10 on which port electrodes 12a-12c are formed. Furthermore, a positioning member 21 having a recessed part 22 with a size to surround the matching circuit elements 19, 20 is formed. Then the positioning member 21 is arranged on the electrode substrate 10 so as to cover the matching circuit elements 19, 20 by its recessed part, one end part 7a of the center conductor 7 is connected to the port electrodes 12a-12c in such state and the matching circuit elements 19, 20 are connected thereto.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-reciprocal circuit device such as an isolator and a circulator, and particularly, the miniaturization of parts is prevented, and the positional deviation when connecting the matching circuit device is prevented to improve the reliability of the connection. The present invention relates to a structure capable of improving productivity as well as improving.

[0002]

2. Description of the Related Art Generally, isolators and circulators have a function of passing signals only in the transmission direction and blocking the transmission in the opposite direction, and are indispensable parts for mobile communication devices such as mobile phones and car phones. Is. As an example of such an isolator, there is conventionally one having a structure shown in FIG. In this isolator 40, a ground plate 42 and a dielectric substrate 43 are arranged on a lower yoke 41 made of a magnetic metal, and three central conductors 44 are provided with a ferrite 4 core.
A ferrite element 46 including 5 is arranged, an upper yoke 47 is inserted into the lower yoke 41 to form a magnetic closed circuit, and a permanent magnet 48 is attached to the inner surface of the upper yoke 47. The magnet 48 is configured to apply a DC magnetic field to the ferrite element 46. To obtain a matching capacitance in such an isolator 40, conventionally, three capacitor electrodes 50 to 52 are patterned on the upper surface of the dielectric substrate 43 by printing, etching, etc., and the ground electrode 53 is formed on the entire lower surface, Capacitance is set between the electrodes 50 to 52, 53 facing each other with the substrate 43 interposed therebetween. An input / output terminal 54 is connected to the above two capacitor electrodes 50 and 51.
A terminating resistance film 55 is formed on one of the capacitor electrodes 52 by thick film printing.

[0003]

By the way, in the above-mentioned isolator 40, miniaturization of parts is required due to its application. However, in the above-mentioned conventional isolator 40, since the matching capacitance is obtained by the capacitor electrodes 50 to 52 patterned on the dielectric substrate 43, the electrode area must be increased to obtain the required capacitance.
As a result, the size of the dielectric substrate 43 becomes large, and there is a problem that it is not possible to cope with the miniaturization of parts.

Here, the inventors of the present invention have paid attention to obtaining a matching capacitance with a chip capacitor as shown in FIG. This forms a port electrode 31 to which one end of each center conductor (not shown) is connected to an electrode substrate 30 made of resin or the like, and forms a ground electrode 32 by providing a gap at a portion corresponding to each port electrode 31. The chip capacitor 3 is attached to each port electrode 31 on the electrode substrate 30.
3 is connected to one electrode 33a, the other electrode 33b is connected to the ground electrode 32, and one of the electrodes 3 of the terminal chip resistor 34 is connected to any one of the port electrodes 31.
4a, the other electrode 34b is connected to the ground electrode 32. According to this, the required matching capacitance can be obtained with the chip capacitor 33 having a size of, for example, 0.5 × 0.5 × 1.0 mm, and as a result, the substrate can be made smaller than in the case of forming the capacitor electrode on the conventional dielectric substrate. It can be made smaller and can be made smaller accordingly.

When the chip capacitors 33 and the chip resistors 34 are soldered to the electrode substrate 30 as described above, solder films are printed on the port electrodes 31 and the ground electrodes 32, and the electrodes of the chip components are printed on the solder films. For example, reflow soldering is used for connection. In this case, there is a tombstone phenomenon in which the chip capacitor 33 is displaced and a connection failure occurs as shown in FIG. 4 (a), or the chip capacitor 33 rises as shown in FIG. 4 (b). This may occur, which lowers reliability of connection and lowers productivity. In order to prevent such misalignment, it is conceivable to optimize the pattern of each port electrode of the electrode substrate, the film thickness of the solder film, etc., but at present it can be said that it is a means that can reliably prevent misalignment. Absent.

The present invention has been made in view of the above-mentioned conventional situation, and it is possible to prevent misalignment at the time of soldering and to improve the reliability of connection while reducing the size of parts, and further to improve the productivity. An object is to provide a non-reciprocal circuit device that can be improved.

[0007]

SUMMARY OF THE INVENTION Therefore, the present invention is directed to a ferrite element in which a plurality of center conductors arranged in an electrically insulated state and arranged in a cross shape at predetermined intervals are arranged in the ferrite. In a nonreciprocal circuit element in which a matching circuit element is connected to one end of a conductor, the ferrite element and each matching circuit element are arranged on an electrode substrate on which a port electrode is formed, and each matching circuit element is surrounded. A positioning member having a recess having a size is formed, and the positioning member is placed on the electrode substrate by covering each matching circuit element with each recess of the positioning member. In this state, one end of the center conductor is attached to the port electrode. It is characterized in that each matching circuit element is connected together with the connection.

Here, for the positioning member, for example, resin or aluminum metal without solder can be used.
The positioning member may be used as a jig and removed after connection, or may be directly incorporated in the circuit element as one of the components.

[0009]

To assemble the nonreciprocal circuit device of the present invention, cream solder is applied to the surface of each port electrode of the electrode substrate by printing, for example, and the ferrite element and each nonreciprocal circuit device are arranged on this electrode substrate. , One end of the center conductor and the non-reciprocal circuit element are arranged on each of the port electrodes. Next, a positioning member is arranged on the electrode substrate so as to cover the non-reciprocal circuit elements with the recesses of the positioning member. As a result, the vertical and horizontal movements of the non-reciprocal circuit elements are restricted and positioned. In this state, the electrodes are connected to each other by, for example, reflow soldering.

As described above, according to the non-reciprocal circuit device of the present invention, since the positioning member is formed with the concave portion and the matching circuit element is covered by the concave portion from the upper portion and positioned, the matching circuit element at the time of soldering is formed. It is possible to reliably prevent the problem of misalignment and standing. As a result, the reliability of the connection can be improved, and the productivity can be improved by the yield. Further, the substrate can be made smaller than in the case where the capacitor electrodes are formed by patterning on the conventional dielectric substrate, and the above-mentioned demand for miniaturization can be met.

[0011]

Embodiments of the present invention will be described below with reference to the drawings. 1 and 2 are diagrams for explaining a non-reciprocal circuit device according to an embodiment of the present invention. In the present embodiment, a case of application to a lumped constant type isolator will be described as an example. In the figure, reference numeral 1 is a lumped-constant type isolator, in which a ferrite element 3 is arranged in a lower yoke 2 made of magnetic metal, and an upper yoke 4 made of magnetic metal is mounted on the lower yoke 2. And a permanent magnet 5 is attached to the inner surface of the upper yoke 4, and a DC magnetic field is applied to the ferrite element 3 by the permanent magnet 5.

The ferrite element 3 is constructed by inserting three center conductors 7 facing each other with the ferrite 6 sandwiched between the upper surface and the lower surface of a disk-shaped ferrite 6. Each of the central conductors 7 is formed by bending a strip-shaped metal plate into a substantially U shape, and each of the central conductors 7 extends in the diametrical direction on both surfaces of the ferrite 6 and has an insulating sheet 8 therebetween.
They are arranged in a cross shape with an angle of 120 degrees. Also,
One end 7a of each of the central conductors 7 projects from the ferrite 6, and the other end 7b is located at the outer edge of the lower surface of the ferrite 6.

A flat plate-shaped electrode substrate 10 is arranged on the bottom wall of the lower yoke 2. The electrode substrate 10 is formed by inserting a metal member having a shape corresponding to each electrode described later into a resin member. It is manufactured. The electrode substrate 10
The ferrite element 3 is disposed on a recess 10a formed in the center of the ferrite core 3, and the recess 10a absorbs the thickness of the central conductors 7 on the lower surface of the ferrite 6 due to the overlap.

Further, the ground electrodes 11 are formed at intervals of 120 degrees on the periphery of the recess 10a of the electrode substrate 10, and each of the ground electrodes 11 is led out to the lower surface of the electrode substrate 10 and the lower part thereof is formed. It is connected to the yoke 2. Outside the ground electrodes 11 of the electrode substrate 10, the electrodes 11 are
A gap between the first and third port electrodes 12a
~ 12c are formed. These electrodes 12a to 12c
A groove 13 is provided between the ground electrode 11 and the ground electrode 11, and the groove 13 prevents short-circuiting between the electrodes.

A ground electrode 14 is formed at both ends of one side edge of the electrode substrate 10 with a gap provided between the ground electrode 14 and the first and second port electrodes 12a and 12b. It is connected to the lower yoke 2. Also,
A gap is formed between the other end of the electrode substrate 10 and the third port electrode 12c so that the ground electrode 15 is provided.
Are formed. Further, input / output terminals 16 are formed on one end of the left and right side surfaces of the electrode substrate 10, and each of the terminals 16 has the first and second port electrodes 12a, 12b.
It is connected to the. Further, ground terminals 17 are formed on the other ends of the left and right side surfaces of the electrode substrate 10, and each ground terminal 17 is connected to the ground electrode 15. The terminals 16 and 17 are exposed outward from the opening 2a of the lower yoke 2.

One end 7a of each central conductor 7 of the ferrite element 3 is connected to the first to third port electrodes 12a to 12c of the electrode substrate 10, and the other end 7b is connected to the earth electrode 11. It is connected to the.

A chip capacitor 19 is arranged at one end of each of the first and second port electrodes 12a and 12b and the third port electrode 12c of the electrode substrate 10, and at the other end of the third port electrode 12c. Has a terminating chip resistor 20. One electrode 19a of each chip capacitor 19 is the first to third port electrodes 12a to 12c.
The other electrode 19b is in contact with the ground electrode 14,
It is in contact with 15. Further, one electrode 20a of the chip resistor 20 serves as the third port electrode 12c and the other electrode 20a
b contacts the ground electrode 15, respectively.

A positioning member 21, which characterizes this embodiment, is provided on the electrode substrate 10. This is a substantially plate frame made of resin, and a large diameter hole 21a into which the permanent magnet 5 is inserted and a small diameter hole 21b into which the ferrite element 3 is inserted are formed in the center of the hole. ing. Further, rectangular recesses 22 are provided at the four corners of the lower surface of the positioning member 21. The recesses 22 are formed by the chip capacitors 19 and the chip resistors 20.
The concave portions 22 cover the upper portions of the capacitors 19 and the resistors 20, thereby restricting the movement in the vertical and horizontal directions. Then, in this state, one electrode 1 of each chip capacitor 19
9a is soldered to the first to third port electrodes 12a to 12c, and the other electrode 19b is the ground electrode 1
4 and 15 are connected by soldering. Further, one electrode 20a of the chip resistor 20 serves as the third port electrode 12c,
The other electrode 20b is soldered and connected to the ground electrode 15.

Next, the operation and effect of this embodiment will be described. To assemble the isolator 1 of this embodiment, cream solder is applied to the surface of each electrode of the electrode substrate 10 by screen printing, and the substrate 10 is placed on the bottom wall of the lower yoke 2. Also, each chip capacitor 19 and chip resistor 2
0 for each port electrode 12a-12c and each ground electrode 1
4 and 15, the ferrite element 3 is further arranged in the recess 10a, and one end 7a of each central conductor 7 is used as the port electrodes 12a to 12c and the other end 7b.
On the ground electrode 11. Next, the positioning member 21 is arranged on the electrode substrate 10 and the small diameter hole 21 of the positioning member 21 is arranged.
The ferrite element 3 is inserted and positioned in b, and the chip capacitors 1 are placed in the recesses 22 of the ferrite element 3.
9. Insert the chip resistor 20. As a result, the chip capacitors 19 and the chip resistors 20 are covered with the recesses 22, so that they are positioned without moving. In this state, reflow soldering is performed for connection. After this, the upper yoke 4 is fitted on the lower yoke 2.

As described above, according to this embodiment, the chip capacitors 19 and the chip resistors 2 are provided at the four corners of the positioning member 21.
Since the concave portion 22 surrounding 0 is formed and the concave portion 22 is covered with the concave portion 22 and positioned, it is possible to reliably prevent the positional deviation and the standing up at the time of soldering, and it is possible to improve the reliability of the connection and the productivity. Further, in the present embodiment, since the matching capacitance is obtained by the chip capacitor 19, the substrate can be made smaller than that in the case where the capacitor electrode is patterned on the conventional dielectric substrate, and the size can be correspondingly reduced. Further, since the large diameter hole 21a and the small diameter hole 21b are formed in the positioning member 21 and the permanent magnet 5 and the ferrite element 3 are inserted therein, the thickness of the positioning member 21 can be absorbed and the enlargement of parts can be avoided. ..

In the above embodiment, the positioning member 21
Although the description has been made by taking as an example the case where the above is incorporated into the isolator 1 as it is, the present invention may remove the positioning member after connecting the chip capacitor, and the positioning member 21 may be made of a metal such as aluminum without soldering. You may comprise.

Although the above embodiment is applied to the isolator, the present invention can of course be applied to a circulator and other high frequency components. Furthermore, in the above-mentioned embodiment, the electrode member is formed by inserting the metal member into the resin, but the present invention may employ a printed circuit board, for example.

[0023]

As described above, according to the non-reciprocal circuit device of the present invention, a positioning member having a recess having a size enclosing the matching circuit device is formed, and the positioning member is provided in each recess of each matching circuit. Since it is placed on the electrode substrate so as to cover the element, and in this state, one end of the center conductor is connected to the port electrode and each matching circuit element is connected, it is possible to reduce the size of the component while soldering. The position shift of the matching circuit element can be prevented, the reliability of connection can be improved, and the productivity can be improved.

[Brief description of drawings]

FIG. 1 is an exploded perspective view illustrating an isolator according to an exemplary embodiment of the present invention.

FIG. 2 is an exploded perspective view showing each part of the isolator of the above embodiment.

FIG. 3 is an exploded perspective view for explaining a formation process of the present invention.

FIG. 4 is a perspective view showing a formation process of the present invention.

FIG. 5 is an exploded perspective view showing a conventional isolator.

[Explanation of symbols]

 1 Isolator (Non-Reciprocal Circuit Element) 3 Ferrite Element 6 Ferrite 7 Central Conductor 7a One End of Central Conductor 12a-12c Port Electrode 19 Chip Capacitor (Matching Circuit Element) 20 Termination Chip Resistor (Non-Reciprocal Circuit Element) 21 Positioning Member 22 Recess

Claims (1)

[Claims] 1. A ferrite element having a plurality of center conductors arranged in an electrically insulated state in a ferrite and arranged in a cross shape at predetermined intervals, and a matching circuit element is provided at one end of each center conductor. In the connected nonreciprocal circuit element, the ferrite element and each matching circuit element are arranged on an electrode substrate on which a port electrode is formed, and a positioning member having a concave portion having a size enclosing each matching circuit element is provided. The positioning member is formed on the electrode substrate by covering the matching circuit elements with the respective recesses, and in this state, one end of the center conductor is connected to each of the port electrodes and each matching circuit is formed. A non-reciprocal circuit element characterized by connecting elements.