JPH0527989U - IC Socket - Google Patents

Abstract

(57) [Abstract] [Purpose] Especially, by eliminating the link and latch mechanism made of metal parts and forming the latch mechanism by molded parts, and simplifying the manufacturing and assembling, cost reduction can be effectively realized. Moreover, it is to provide an IC socket that ensures a reliable latch function. [Structure] By mounting an IC carrier 2 carrying an IC package on a socket body 1, a lead of the IC package and a contact pin 3 implanted in the socket body 1 are connected. A cover 5 which is mounted on the socket body 1 so as to be movable up and down via an ammunition means 6 and has an action portion 7 configured to press and tilt the contact pin 3, and a pivotal support for the socket body 1. The latch means 8 is configured to be opened and closed with respect to the IC carrier 2 by the vertical movement of the cover 5, and the IC carrier 2 can be inserted and removed by the vertical movement operation of the cover 5. It is characterized by

Description

[Detailed description of the device]

[0001]

[Industrial application]

 The present invention particularly relates to an IC socket in which an IC carrier holding and fixing a flat type IC package is mounted and a lead of the IC package and a contact pin can be connected.

[0002]

[Prior Art]

 This type of IC socket is called a so-called open top type, and when an IC carrier holding and fixing an IC package inside is mounted, the IC carrier is inserted from above the socket body. .

FIG. 7 shows an example of the structure of this type of IC socket that the present applicant has already proposed (Japanese Patent Application No. 2-89791). In FIG. The IC package is designed to hold and fix the IC package. As shown in FIG. 8, the IC package 22 is housed in the IC carrier 21 so that its leads 22a are horizontally arranged.

Reference numeral 23 is a socket body adapted to accommodate the IC carrier 21 at a predetermined position, 24 is a contact pin arranged in a row in the socket body 23, and 25 is movable up and down in the socket body 23. A plurality of mounted outer frames 26 are coil springs, which are arranged at appropriate positions on a pedestal 27 fixed to the socket body 23 and urge the outer frame 25 upward.

Further, 28 is a rotary plate pivotally attached to four side portions of the socket body 23 via a support shaft 29, and 30 is planted in the outer frame 25 and at the same time, of the rotary plate 28. The drive pin 31 fitted in the long hole 28a is formed in a gate shape, and one end of the arm portions 31a on both sides is pinned to the rotary plate 28 through a connecting pin 32 so as to hold it. The portion 31b is a carrier holding metal fitting that is laid across the socket body 23 so that the IC carrier 21 housed in the socket body 23 can be pushed down from above with reference to FIG. 9 (A). Has become. Reference numeral 33 is a guide pin which is planted in the socket body 23 and is fitted in the long hole 31c of the carrier pressing fitting 31. These members constitute a link mechanism, and the outer frame 25 and the carrier pressing fitting 31 are interlocked via the link mechanism.

In such a conventional IC socket, when the IC carrier 21 is mounted, when the outer frame 25 is pushed down against the elastic force of the coil spring 26, the rotating plate 28 is moved downward by the drive pin 30 so that the rotary plate 28 has its long hole 28a. It is turned counterclockwise around the support shaft 29 via the guide pin (FIG. 9 (B), arrow A), and the arm portion 31a of the carrier holding metal fitting 31 is moved upward via the connecting pin 32, so that the guide pin 33 The arm portion 31a guided by is rotated rightward while rising (FIG. 9 (B), arrow B).

As a result, the holding portion 31b of the carrier holding metal fitting 31 is brought into the open state as shown in FIG. 9B, whereby the IC carrier 21 can be inserted into the socket body 23. Then, when the IC carrier 21 is set at a predetermined position of the socket body 23 and the pushing down on the outer frame 25 is released, the outer frame 25 is pushed up by the elastic force of the coil spring 26. As a result, the drive pin 30 moves upward, and contrary to the case of pushing down the outer frame 25, the carrier holding metal fitting 31 is closed by the clockwise rotation of the rotating plate 28, and the holding portion 31b is held by the IC carrier 21. Press in from above. As described above, in the conventional IC socket, the IC carrier 21 can be inserted and removed through the link mechanism by moving the outer frame 25 up and down.

[0008]

[Problems to be solved by the device]

 However, such a conventional IC socket is provided with the link mechanism configured as described above, but the link mechanism has a complicated structure and the number of parts constituting the link mechanism must be increased. In particular, since the number of metal parts such as the carrier pressing metal fitting 31 is large, it is troublesome to attach the metal parts after molding with the synthetic resin, which requires a long assembling time. Furthermore, there were problems that material costs were high and product costs had to be high.

In view of such circumstances, the present invention effectively realizes cost reduction by simplifying the manufacturing and assembling of the latch mechanism by forming the link mechanism and the latch mechanism made of metal parts without using the mold and the molded parts. It is an object of the present invention to provide an IC socket of this kind which can be realized and ensures a reliable latch function.

[0010]

[Means for Solving the Problems]

 In the IC socket according to the present invention, by mounting the IC carrier carrying the IC package on the socket body, the leads of the IC package and the contact pins implanted in the socket body are connected. A cover having an action part which is mounted on the socket body so as to be movable up and down via an ammunition means so as to press the contact pin to tilt it; and Latch means for opening and closing the IC carrier by vertical movement of the cover is provided, and the IC carrier can be inserted and removed by vertical movement of the cover.

[0011]

[Action]

 According to the present invention, when the cover is pushed down, the contact pin is first pushed by the operating portion of the cover and tilted to the outside of the socket body. When the cover is further pushed down, the latch means is then rotated by the cover to the outside of the socket body, whereby the IC carrier can be inserted into the socket body. At this time, the contact pin is held in the tilted state.

In this state, when the IC carrier is inserted into the socket body and the pushing down on the cover is released, first, the latch means is rotated inside the socket body, thereby locking the IC carrier from the upper side. Then, the contact pin is restored from its tilted state by its own elasticity, thereby pushing up the IC carrier held from the upper side by the latch means from the lower side, and thus the contact portion of the contact pin and the inside of the IC carrier. Is connected to the leads of the IC package housed in. At the same time, the IC carrier is clamped from above and below.

[0013]

【Example】

 An embodiment of an IC socket according to the present invention will be described below with reference to FIGS. Also in this embodiment, as in the case of the conventional example, an IC carrier having a flat IC package sandwiched and fixed therein is used. In the figure, 1 is a socket body, 2 is an IC carrier to be housed in the socket body 1, and its schematic shape is shown by a chain double-dashed line. Is indicated by reference numeral 2a (FIG. 1). Reference numeral 3 denotes a contact pin having a contact portion 3a with the lead and a pressing portion 3b and arranged in a row on the socket body 1, and 4 denotes a guide pin for positioning with respect to the IC carrier 2. The IC carrier 2 housed in the socket body 1 is mounted on the mounting surface 1a of the socket body 1 and positioned on the guide pin 4.

Reference numeral 5 has a substantially frame-like plane shape (see FIG. 1), and the fitting projection 5a is guided by the guide wall 1b of the socket body 1 and is mounted on the socket body 1 so as to be vertically movable. Covers 6 are compression coil springs mounted between the socket body 1 and the cover 5 at four corners of the socket body 1 (FIG. 3) to urge the cover 5 upward. The cover 5 is provided with a stopper 5b for restricting its upward movement when being biased by the compression coil spring 6, and a guide wall 5c for guiding when the IC carrier 2 is inserted. ing. Reference numeral 7 denotes an acting portion for the contact pin 3 which is integrally formed with the cover 5. By pressing the pressing portion 3b of the contact pin 3 in response to the vertical movement of the cover 5, the contact pin 3 is moved to the socket main body 1. It is designed so that it can be tilted to the outside of.

Further, 8 is a latch means pivotally supported on both sides of the socket body 1 via a support shaft 9 in a central region of the socket body 1 in the longitudinal direction (direction in which the contact pins 3 are arranged). Reference numeral 10 is a torsion coil spring which is wound around the support shaft 9 and biases the latch means 8 to rotate inside the socket body 1. In the normal state (the state where the cover 5 is pushed up by the compression coil spring 6), the latch means 8 is housed in the socket body 1 by the elastic force of the torsion coil spring 10 as shown in FIG. The IC carrier 2 comes to a position where it can be pressed from above. A step portion 8b formed in an R shape is provided on both sides of the latch means 8 (see FIGS. 1 and 3), while the cover portion 5 has a step portion 8b corresponding to its vertical movement. As shown in FIG. 6, an inclined surface portion 5d is provided so that the cover 5 can be rotated toward the outside of the socket body 1 against the elastic force of the torsion coil spring 10 as shown in FIG. There is. When the latch means 8 is in the above-mentioned normal state, as shown in FIG. 4, a gap g is formed between the slope 5d and the step 8b.

In the above case, guide walls 11 for guiding the IC carrier 2 when the IC carrier 2 is mounted on the mounting surface 1a are provided upright at the four corners of the socket body 1. ing. A partition wall 12 is provided between the contact pins 3 (see FIG. 2) to prevent contact accidents between the contact pins 3 and guide the tilting operation.

Since the IC socket according to the present invention is constructed as described above, when the IC carrier 2 is housed in the IC socket, the cover 5 in its raised position is pushed down against the elasticity of the compression coil spring 6. Thus, first, the acting portion 7 pushes the pushing portion 3b of the contact pin 3 as shown in FIG. 5, whereby the contact pin 3 is tilted to the outside of the socket body 1. In this case, since the gap g is set between the sloped portion 5d of the cover 5 and the stepped portion 8b of the latch means 8, the latch 5 is pushed until the latch 5 is moved downward by a stroke corresponding to the gap g. Means 8 are kept in a normal state.

Further, when the cover 5 is pushed down, the pressing portion 3b of the contact pin 3 is disengaged from the acting portion 7 as shown in FIG. 6, and as a result, the state at that time is maintained without further tilting. On the other hand, when the cover 5 is pushed down, the slope 5d and the stepped portion 8b shown in FIG. 5 come into contact with each other, and both of them are brought into sliding contact with each other. Is rotated by the cover 5 to the outside of the socket body 1 against the elastic force of the torsion coil spring 10 (FIG. 6). Then, at this time, the contact pin is held in the tilted state, and thereby, the IC carrier 2 can be inserted into the socket body 1.

Next, when the IC carrier 2 is inserted into the socket body 1, the IC carrier 2 is guided and inserted by the guide wall 5c and the guide wall 11 of the cover 5 in the insertable state, and the socket body 1 is inserted. It is positioned by the guide pin 4 planted in 1 and mounted on the mounting surface 1 a of the socket body 1. Thus, after the IC carrier 2 is inserted, the pushing down on the cover 5 is released, that is, the cover 5 is moved upward by the elastic force of the compression coil spring 6, whereby the latch means 8 first causes the slope 5d of the cover 5 to move to the above-mentioned position. On the contrary, by moving upward, the elastic force of the torsion coil spring 10 causes it to rotate inside the socket body 1. As a result, the latch portion 8a of the latch means 8 presses the IC carrier 2 from above. Then, when the cover 5 further rises and returns to its normal position, the contact pin 3 is below the IC carrier 2 which is pressed from above by the latch means 8 in order to restore from the tilted state by its own elasticity. Enter the side and push up the IC carrier 2. Thus, the contact portion 3a of the contact pin 3 comes into pressure contact with the lead of the IC package housed in the IC carrier 2. At the same time, the IC carrier 2 is clamped from above and below.

Since the IC carrier 2 housed in the IC socket is accurately positioned by the guide pin 4, and each contact pin 3 is also precisely controlled by the partition wall 12, such contact pin 3 is It is securely connected to the corresponding IC package lead. When removing the accommodated IC carrier 2 from the IC socket, by depressing the cover 5 again, the latching step 8 with respect to the IC carrier 2 is released and the pushing up of the IC carrier 2 by the contact pin 3 is stopped. Then, the IC carrier 2 can be easily and easily taken out.

By operating the cover 5 up and down in this manner, the IC carrier 2 can be inserted and removed, but the contact pin 3 and the latch means 8 can be appropriately adjusted in accordance with the up and down movement of the cover 5. Since they are linked at the timing, the IC carrier 2 can be accurately inserted and removed without using a link mechanism in this type of IC socket as in the conventional case. Therefore, the number of parts can be reduced, and since no metal parts are used, the assembly is easy and the product is inexpensive. Further, in particular, as the cover 5 moves up and down, the pressing portion 3b of the contact pin 3 is separated from the acting portion 7 as described above, so that the contact pin 3 moves with respect to the vertical stroke of the cover 5. The tilting movement stroke can be reduced, and thus the contact pin 3 can be reduced in size by the reduction of the tilting movement stroke.

[0022]

[Effect of the device]

 As described above, according to the present invention, since the latch mechanism is configured to reduce the number of metal parts and the total number of parts, manufacturing and assembling can be simplified and cost reduction can be effectively realized. There are advantages such as being able to. In addition, the IC socket performs a reliable latch function to ensure a reliable electrical connection.

[Brief description of drawings]

FIG. 1 is a plan view of an embodiment of an IC socket according to the present invention.

FIG. 2 is a side sectional view illustrating a vertical movement of a cover in an embodiment of an IC socket according to the present invention.

FIG. 3 is a front vertical sectional view of an embodiment of an IC socket according to the present invention.

FIG. 4 is a partial vertical cross-sectional view showing the positional relationship between the action portion and the latch means in the normal state of the cover of the IC socket according to the present invention.

FIG. 5 is a partial vertical cross-sectional view showing a state where the cover of the IC socket according to the present invention is being pushed down.

FIG. 6 is a partial vertical cross-sectional view showing a state in which the cover of the IC socket according to the present invention has been completely pushed down.

FIG. 7 is a side view of a conventional IC socket.

FIG. 8 is a vertical cross-sectional view of an IC carrier housed in a conventional IC socket.

FIG. 9 is a partial vertical sectional view for explaining the operation of the link mechanism in the conventional IC socket.

[Explanation of symbols]

 1 Socket Main Body 2 IC Carrier 3 Contact Pin 4 Guide Pin 5 Cover 6 Compression Coil Spring 7 Working Part 8 Latch Means 9 Spindle 10 Torsion Coil Spring 11 Guide Wall 12 Partition Wall

Claims (2)

[Scope of utility model registration request] 1. An IC socket in which a lead of the IC package and a contact pin implanted in the socket body are connected by mounting an IC carrier carrying the IC package on the socket body,
A cover having an action portion which is mounted on the socket body so as to be movable up and down through an ammunition means so as to press and tilt the contact pin; and a cover pivotally supported on the socket body to The above IC by vertical movement
An IC characterized in that the IC carrier is configured to be opened / closed with respect to the carrier, and the IC carrier can be inserted / removed by the vertical movement operation of the cover.
socket. 2. The latch means comprises an ammunition means for the I
The IC carrier is urged to perform a closing operation with respect to the C carrier, and the IC carrier is clamped from above and below by the latch means and the elastic contact pin. The described IC socket.