JPH0525809Y2 - - Google Patents

Description

[Detailed description of the invention] [Summary] A double-sided polishing device in which a liquid is supplied to a gear portion where a carrier that holds a workpiece and a sun gear and an internal gear that control the rotation and revolution of the carrier mesh with each other.

[Industrial Field of Application] The present invention relates to a double-sided polishing apparatus for semiconductor wafers that requires polishing of thin pieces, and particularly relates to an improvement of a double-sided polishing apparatus using an ultra-thin carrier.

As the patterns of semiconductor devices have become significantly finer, there has been a demand for high-quality semiconductor polished wafers with extremely high flatness and fewer defects on the crystal surface. There is a need for a double-sided polishing device that can be used for polishing.

[Conventional technology]

As shown in FIG. 3, in a conventional double-side polishing device, a workpiece 1 sandwiched between two rotating surface plates 5 and 6 to which polyurethane pads are attached is inserted into a hole in a carrier 2. put in and kept.

The carrier 2 is surrounded by gears, and rotates on its own axis with a rotating sun gear 3 and an internal gear 4, and revolves depending on the combination of the rotational speeds of the internal gear 4 and the sun gear 3.

Since the workpiece 1 is held in the hole of the carrier 2, when an abrasive dissolved in water is poured into the hole 5a provided in the upper surface plate 5, the upper surface plate 5 and the lower surface plate 5 are separated. Polishing occurs by flowing between the polyurethane pad attached to the disk 6 and the workpiece.

[Problem that the invention attempts to solve]

The problem with the conventional double-side polishing apparatus described above is that the abrasive adheres to the meshing part between the gears around the carrier 2 and the gears of the sun gear 3 or internal gear 4, and when it dries, it gels and sticks. That's true.

In other words, as mentioned above, the pattern of semiconductor devices has become significantly finer, and as a result, there has been a demand for high-quality semiconductor polished wafers with extremely high flatness and fewer defects on the crystal surface. As the thickness of the workpiece 1 has become extremely thin, the carrier 2 has also become extremely thin.

The rotation of the sun gear 3 and internal gear 4 is controlled so that this extremely thin carrier 2 revolves while rotating, but if the gelled abrasive sticks to the gear part 2a that meshes with these gears, , it peels off again and enters between the workpiece 1 and the surface plate and becomes involved in polishing, causing defects in the workpiece 1. Also, if it enters the gap between the gear teeth, the carrier 2 will be deflected, and in extreme cases, the workpiece 1 will separate from the carrier 2.
This will cause damage to all the workpieces 1.

In view of the above-mentioned circumstances, the present invention prevents abrasives from adhering to the gear portion 2a where the gears around the carrier 2 mesh with the gears of the sun gear 3 or internal gear 4, drying, gelling, and sticking. The purpose of the present invention is to provide a double-sided polishing device for polishing.

[Means for solving problems]

The above problem is caused by the upper surface plate and lower surface plate that sandwich the workpiece between the front and back surfaces, the sun gear that is provided at the center of the device and is rotated by a rotational drive source, and the sun gear that is formed around the sun gear. A carrier having a hole into which the workpiece is inserted, and a gear part meshing with the gear part of this carrier are formed on the inner periphery. In a double-sided polishing device that includes an internal gear, a liquid supply port that vertically passes through the sun gear, a liquid supply ring that includes a liquid storage portion that is connected to the liquid supply port, and a liquid supply ring that is connected to the liquid supply port, and The present invention is solved by a double-sided polishing apparatus characterized by comprising a liquid supply port and a liquid supply ring having a liquid reservoir connected to the liquid supply port.

[Effect]

That is, in the present invention, the abrasives that tend to adhere to the gears that mesh with the sun gear, the internal gear, and the carrier that holds the workpiece are removed.
Since it is washed away by supplying liquid, it is possible to prevent the abrasive from drying and gelling in this gear part and sticking to the gear, which will interfere with gear engagement, and it is possible to maintain smooth operation of the double-sided polishing machine. becomes.

〔Example〕

An embodiment of the present invention will be described below with reference to FIGS. 1 and 2.

As shown in FIG.
The carrier 2 is held between an upper surface plate 5 and a lower surface plate 6, and the gears provided around the carrier 2 mesh with the sun gear 3 and internal gear 4, applying rotational force to the carrier 2, thereby increasing its rotational speed. The carrier 2 is rotating around its axis under the control of.

The abrasive solution is poured into holes 5 provided in the upper surface plate 5.
It is supplied from a, flows between the workpiece 1 and the upper surface plate 5, and polishes the workpiece 1.

Fixed liquid supply rings 9 and 10 are provided at the lower part of the sun gear 3 and the outer periphery of the internal gear 4, and the liquid stored in the liquid storage parts 9a and 10a provided therein is supplied to the sun gear 3 and the internal gear. 4
The liquid flows out from the liquid supply ports 7 and 8, and washes away the abrasive that tends to flow down and adhere to the gear portion 2a.

Since the liquid supplied to the liquid supply rings 9 and 10 is always filled in the liquid storage parts 9a and 10a,
Liquid constantly flows out from the liquid supply ports 7 and 8 of the sun gear 3 and internal gear 4, which rotate while in contact with this, and it becomes possible to wash away the abrasive that tends to adhere to the gear part 2a. .

[Effect of idea]

As explained above, according to the present invention, by providing a liquid supply mechanism with an extremely simple configuration, liquid is supplied to the gear portion where the carrier, the sun gear, and the internal gear engage, and the abrasive that is about to adhere is washed away. Since it is possible to prevent the abrasive from gelling and sticking, it is possible to smoothly operate the double-sided polishing apparatus without impairing the quality of the workpiece, which has a significant practical effect.

[Brief explanation of the drawing]

FIG. 1 is a side sectional view showing an embodiment of the present invention, and FIG. 2 is an A-A diagram showing an embodiment of the present invention.
FIG. 3 is a side sectional view showing a conventional double-side polishing apparatus. In the figure, 1 is the workpiece, 2 is the carrier, 2
a is a gear part, 3 is a sun gear, 4 is an internal gear, 5 is an upper surface plate, 5a is a hole, 6 is a lower surface plate, 7
is a liquid supply port, 8 is a liquid supply port, 9 is a liquid supply ring, 9
a indicates a liquid storage section, 10 indicates a liquid supply ring, and 10a indicates a liquid storage section.

Claims (1)

[Claims for Utility Model Registration] An upper surface plate 5 and a lower surface plate 6 that sandwich the workpiece 1 between the front and back surfaces, a sun gear 3 that is provided at the center of the device and is rotated by a rotational drive source, and A carrier 2 is formed around the sun gear 3 and has a gear portion 2a that meshes with a gear portion 3a formed around the sun gear 3, and has a hole into which the workpiece 1 is inserted, and the gear portion 2a of the carrier 2. In the double-sided polishing apparatus, the double-side polishing apparatus is comprised of: an internal gear 4 having a gear portion 4a formed on its inner periphery that meshes with the sun gear 3; a liquid supply port 7 vertically penetrating the sun gear 3; a liquid supply ring 9 having a liquid storage portion 9a connected to the liquid supply ring 9; and a liquid supply port 8 provided in the internal gear 4.
A double-side polishing apparatus comprising: and a liquid supply ring 10 having a liquid storage portion 10a connected to the liquid supply port 8.