JPH05241185A - Method for joining circuit board in liquid crystal display module - Google Patents

Abstract

PURPOSE:To provide the method for joining the circuit boards of liquid crystal display modules which can simplify the process for production and can automate the stages from supply to joining of parts. CONSTITUTION:Three kinds of the circuit boards are successively positioned and mounted onto a bonding stage 38 by a circuit board mounting robot 39 in a circuit board mounting stage. The respective semiconductor units joined to the liquid crystal display panels are then transported to the bonding stage 38 by a panel mounting robot 34 and the respective input terminals of the semiconductor units and the respective connecting terminals of the respective circuit boards are aligned at one time in a panel mounting stage; thereafter, the bonding stage 38 is properly moved and rotated within the horizontal plane and the input terminals of the semiconductor units and the connecting terminals of the circuit boards are successively joined by bonding heads 41, 42 in a joining stage.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for joining circuit boards in a liquid crystal display module.

[0002]

2. Description of the Related Art In a liquid crystal display module, as shown in FIG. 3, a plurality of three kinds of semiconductor units 2 to 4 are joined to three sides of a liquid crystal display panel 1, and a circuit is formed in each semiconductor unit 2 to 4. Information such as an image corresponding to the drive signal is generated by operating the liquid crystal display panel 1 by bonding the substrates 5 to 7 and applying a drive signal to each of the semiconductor units 2 to 4 via each of the circuit boards 5 to 7. Is electro-optically displayed.

In this liquid crystal display panel 1, a large number of stripe-shaped transparent electrodes that are orthogonal to each other are formed on the opposing surfaces of a pair of glass substrates 10 and 11, and these electrodes have a first connecting terminal 12 and a second connecting terminal on three sides. Terminal 13 and third connection terminal 1
4 has been derived. The semiconductor units 2 to 4 joined to the liquid crystal display panel 1 are respectively the film substrate 15
The electrodes of the semiconductor chip 17 are bonded to the inner ends of the leads 16 formed on the film substrate 1, and the outer ends of the leads 16 are connected to the film substrate 1.
5, the structure is formed so as to project from the output terminals 18 and the input terminals 19. The output terminal 18 of the first semiconductor unit 2 is the first connection terminal 1 of the liquid crystal display panel 1.
2, the output terminal 18 of the second semiconductor unit 3 is joined to the second connection terminal 13 of the liquid crystal display panel 1,
The output terminal 18 of the semiconductor unit 4 is joined to the third connection terminal 14 of the liquid crystal display panel 1. Also, circuit boards 5-7
Each form a wiring lead 21 on the strip-shaped substrate 20, and a plurality of connection terminals 22 are formed on each wiring lead 21.
It has a structure that forms. Then, the first circuit board 5
A plurality of (six in the figure) input terminals 19 of the first semiconductor unit 2 are joined to the connection terminals 22 of the second circuit board 6
A plurality of (six in the figure) input terminals 19 of the second semiconductor unit 3 are joined to the connection terminals 22 of the third circuit board 7
The plurality of (four in the figure) input terminals 19 of the third semiconductor unit 4 are joined to the connection terminals 22 of FIG.

In such a liquid crystal display module,
When the circuit boards 5 to 7 are bonded to the respective semiconductor units 2 to 4 of the liquid crystal display panel 1, they are bonded as follows. For example, the first circuit board 5 bonded to the plurality of first semiconductor units 2 bonded to the first connection terminals 12 of the liquid crystal display panel 1 is manually placed on the bonding stage, and the first circuit board 5 is mounted on the bonding stage. The liquid crystal display panel 1 to which the respective semiconductor units 2 to 4 are joined is arranged. At this time, each input terminal 19 of the first semiconductor unit 2 joined to the first connection terminal 12 of the liquid crystal display panel 1 and the first
The position is manually adjusted so that the connection terminals 22 of the circuit board 5 correspond to each other. In this state, the bonding stage is manually moved to sequentially bond the input terminals 19 of the first semiconductor unit 2 and the connection terminals 22 of the first circuit board 5 with the bonding head. Then, the liquid crystal display panel 1 to which the first circuit board 5 is joined is removed from the bonding stage, and this time, the second semiconductor unit 3 joined to the second connection terminal 13 of the liquid crystal display panel 1 is joined to the second semiconductor unit 3. Position the circuit board 6 on the bonding stage,
The liquid crystal display panel 1 to which the first circuit board 5 is joined is placed on the bonding stage by rotating it manually in a horizontal plane, and each input terminal 19 of the second semiconductor unit 3 and the second circuit are placed in the same manner as described above. The connection terminals 22 of the substrate 6 are aligned with each other and sequentially bonded by a bonding head. Further, when the third circuit board 7 is bonded to the third semiconductor unit 4 bonded to the third connection terminal 14 of the liquid crystal display panel 1, once the first and second bonding stages are mounted on the bonding stage, as described above. The liquid crystal display panel 1 to which the circuit boards 5 and 6 are joined is removed, and the circuit board 7 is placed on the bonding stage.
After positioning, the liquid crystal display panel 1 to which the first and second circuit boards 5 and 6 are joined is manually rotated again to be aligned, and in this state, each input terminal 19 of each semiconductor unit 4 and the circuit The connection terminals 22 of the substrate 7 are sequentially joined by a bonding head.

[0005]

However, the semiconductor units 2 to 2 bonded to the liquid crystal display panel 1 as described above.
In the method of joining the circuit boards 5 to 7 to the board 4, the first circuit board 5 is sequentially joined to one side of the liquid crystal display panel 1, for example, the plurality of first semiconductor units 2 joined to the first connection terminals 12. , Second and third semiconductor units 3 joined to the second connection terminal 13 or the third connection terminal 14 on the other side,
When joining the second and third circuit boards 6 and 7 to 4,
Each time, the liquid crystal display panel 1 is once removed from the bonding stage, and in this state, the second and third circuit boards 6 and 7 are positioned on the bonding stage.
Since the removed liquid crystal display panel 1 is manually rotated and aligned in the horizontal plane, the manufacturing process becomes complicated, and not only the working time is long, but also the whole process is manual, so that the productivity is poor, There is a problem that a product of stable quality cannot be obtained.

The present invention has been made in view of the above circumstances, and an object thereof is to simplify the manufacturing process,
An object of the present invention is to provide a method for bonding a circuit board of a liquid crystal display module, by automating a process from supply of components to bonding, thereby improving productivity and obtaining a product of stable quality.

[0007]

In order to achieve the above object, the present invention provides one of at least two circuit boards.
A board mounting process in which one circuit board is mounted on the bonding stage by the board mounting means and positioned, and then this bonding stage is rotated by a predetermined angle, and in this state, another circuit board is mounted on the bonding stage by the board mounting means and positioned. Then, the liquid crystal display panel in which the output terminals of the plurality of semiconductor units are joined is mounted on the bonding stage on which the two circuit boards are positioned by the panel mounting means, and the input terminals of the plurality of semiconductor units are connected to each other. Panel mounting process to arrange on the connection terminals of each circuit board, each input terminal of a plurality of semiconductor units in which each output terminal is joined to one side of the liquid crystal display panel, and each connection terminal of the corresponding circuit board After sequentially joining and with the bonding head,
Rotate the bonding stage by a predetermined angle and use the bonding head to connect the input terminals of the semiconductor units with the output terminals joined to the other side of the liquid crystal display panel and the corresponding connection terminals of the other circuit board. And a bonding step of sequentially bonding.

[0008]

According to the present invention, at least two circuit boards are sequentially mounted on the bonding stage by the board mounting means and positioned in the board mounting step, and then each output terminal is bonded to the liquid crystal display panel in the panel mounting step. The semiconductor unit is mounted on the bonding stage by the panel mounting means to align each input terminal of each semiconductor unit and each connection terminal of each circuit board at a time, and then the bonding stage is appropriately moved in the horizontal plane in the bonding step. Then, by rotating and rotating, the respective input terminals of the respective semiconductor units having the respective output terminals bonded to at least two sides of the liquid crystal display panel and the respective connection terminals of the respective circuit boards are sequentially bonded.
The manufacturing process can be simplified, and the process from component supply to joining can be automated.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a schematic plan view showing the overall configuration of a joining device used in the joining method of the present invention. First, the joining device will be described with reference to this figure.

In this figure, 30 is a machine base. On the left side of the machine base 30, a board stocker 31 that accommodates three types of circuit boards 5 to 7 is arranged. A substrate transfer robot 32 is provided on the substrate stocker 31 to select any one of the circuit boards 5 to 7 as required, adsorb it, and transfer it to a predetermined position of the machine base 30. Further, on the right side of the machine base 30, a liquid crystal display panel 1 in which a plurality of semiconductor units 2 to 4 are joined on three sides and a panel stocker 33 for accommodating a liquid crystal display module which is a finished product described later are arranged. ing. This panel stocker 33
The liquid crystal display panel 1 is sucked and conveyed to a predetermined position on the machine base 30 and the liquid crystal display module arranged at a predetermined position on the machine base 30 is sucked on the panel stocker 3 above.
A panel-mounting robot 34 for transporting to 3 is provided.

The machine base 30 near the substrate stocker 31
Above the circuit boards 5 transported from the board stocker 31.
7 is placed, and in this state, the connection terminals 2 of the circuit boards 5 to 7
Flux application table 35 for applying flux to 2
Is provided. This is because each connection terminal 22 of the circuit boards 5 to 7 has been previously plated with solder. Machine stand 30 on the right side of the flux application table 35
A board positioning table 36 for mounting and positioning the circuit boards 5 to 7 coated with the flux is provided on the top. On the machine base 30 on the right side of the substrate positioning table 36, a liquid crystal display panel 1 conveyed from the panel stocker 33 and a panel temporary placement stage 37 on which the completed liquid crystal display module is once placed are provided. As shown in FIG. 2, on the machine base 30 on the front side (lower side) of the panel temporary placement stage 37, as shown in FIG. 2, the circuit boards 5 to 7 and the liquid crystal display panel in which the semiconductor units 2 to 4 are bonded to three sides are joined. There is provided a bonding stage 38 on which the No. 1 is mounted. Bonding stage 38
Has a structure in which the circuit boards 5 to 7 and the liquid crystal display panel 1 are mounted, movable in the X and Y directions, and rotatable in a horizontal plane. In addition, on the machine base 30 on the front side of the panel temporary placement stage 37 and on the left side of the bonding stage 38, a substrate mounting robot 39 for mounting the circuit boards 5 to 7 on the panel temporary placement stage 37 on the bonding stage 38 is provided. It is provided. further,
A bonding support base 40 is arranged on the machine base 30 on the front side of the bonding stage 38, and two types of bonding heads 41 and 42 are vertically movable on the bonding support base 40. The two types of bonding heads 41 and 42 are properly used when the bonding conditions between the circuit boards 5 to 7 and the semiconductor units 2 to 4 of the liquid crystal display panel 1 change. For example,
In this embodiment, the bonding head 41 bonds the first and second circuit boards 5 and 6 to the semiconductor units 2 and 3, and the bonding head 42 bonds the third circuit board 7 to the semiconductor unit 4. Is configured.

Next, by using such a joining device, the semiconductor units 2 to 4 of the liquid crystal display panel 1 are connected to the circuit boards 5 to 7.
The case of joining will be described.

First, of the three types of circuit boards 5 to 7 accommodated in the board stocker 31, for example, the liquid crystal display panel 1 is used.
The first circuit board 5 bonded to the first semiconductor unit 2 is adsorbed by the board transfer robot 32 and transferred to the flux application table 35, and on the flux application table 35, to each connection terminal 22 of the first circuit board 5. Apply flux. After that, the first circuit board 5 coated with the flux is again adsorbed by the board transfer robot 32 and transferred to the board positioning table 36, and the first circuit board 5 is mounted on the board positioning table 36 by a television camera (not shown). Positioning is performed based on image processing using. Then, the first circuit board 5 is sucked by the board mounting robot 39 and positioned and mounted at a predetermined position on the bonding stage 38. In this state, the bonding stage 38 is rotated by a predetermined angle so that the next circuit board can be mounted.

After this, again, the second circuit board 6 bonded to the second semiconductor unit 3 of the liquid crystal display panel 1 from the board stocker 31 is adsorbed by the board transfer robot 32 and transferred to the flux application table 35, As in the case of the first circuit board 5 described above, each connection terminal 2 of the first circuit board 6
After the flux is applied to the substrate 2, the substrate transport robot 32 transports it to the substrate positioning table 36, performs alignment based on image processing using a television camera (not shown), and mounts the first circuit substrate 6 on the substrate. The robot 39 positions and mounts the bonding stage 38 at a predetermined position. Also in this case, the bonding stage 38 is rotated by a predetermined angle so that the next circuit board can be mounted.

Similarly, after the third circuit board 7 joined to the third semiconductor unit 4 of the liquid crystal display panel 1 is transferred from the board stocker 31 to the flux application table 35 by the board transfer robot 32 and flux is applied, It is conveyed to the board positioning table 36, and a TV camera (not shown)
The first circuit board 6 is positioned and mounted at a predetermined position on the bonding stage 38 by the board mounting robot 39 by performing the alignment based on the image processing using.

In this way, the bonding stage 3
After positioning and mounting the three types of circuit boards 5 to 7 on 8, the liquid crystal display panel 1 housed in the panel stocker 33 is sucked by the panel mounting robot 34 and conveyed onto the panel temporary placement stage 37. After mounting and aligning the liquid crystal display panel 1 on the panel temporary placement stage 37 based on image processing using a television camera (not shown), the liquid crystal display panel 1 is again sucked by the panel mounting robot 34. It is transported and mounted on the bonding stage 38. At this time, the connection terminals 22 of the three types of circuit boards 5 to 7 mounted on the bonding stage 38 correspond to the input terminals 19 of the three types of semiconductor units 2 to 4 joined to the liquid crystal display panel 1. Then, as shown in FIG. 2, they are aligned and mounted so that they overlap each other.

In this way, three types of circuit boards 5-7
After the connection terminals 22 are aligned with the input terminals 19 of the three types of semiconductor units 2 to 4 of the liquid crystal display panel 1, the bonding stage 38 is moved to move the circuit boards 5 to 7 and the semiconductor units 2 to 4. The joint portion 4 is arranged below the bonding heads 41 and 42. At this time,
For example, a portion where the connection terminal 22 of the first circuit board 5 and each input terminal 19 of the first semiconductor unit 2 of the liquid crystal display panel 1 overlap is arranged below the bonding head 41, and the bonding head 41 is lowered in this state. Then, they are joined by thermocompression bonding. At this time, each input terminal 19 of the first semiconductor unit 2 is bridged to an opening (not shown) provided in the film substrate 15, and the opening is arranged on the first circuit board 5. At, the connection terminal 22 of the first circuit board 5 and the input terminal 19 of the first semiconductor unit 2 are joined. Then, the bonding stage 38 is rotated by a predetermined angle (180 degrees) to connect the connection terminals 2 of the second circuit board 6.
The portion where 2 and the respective input terminals 19 of the second semiconductor unit 3 of the liquid crystal display panel 1 overlap is arranged below the bonding head 41, and the bonding head 41 is lowered and bonded by thermocompression bonding as described above. At this time, each input terminal 19 of the second semiconductor unit 3 is bridged to an opening (not shown) provided in the film substrate 15, and the opening is arranged on the second circuit board 6. At the second
The connection terminal 22 of the circuit board 6 and the input terminal 19 of the second semiconductor unit 3 are joined. After that, the bonding stage 38 is rotated again by a predetermined angle (90 degrees),
A portion where the connection terminal 22 of the third circuit board 7 and each input terminal 19 of the third semiconductor unit 4 of the liquid crystal display panel 1 overlap each other is arranged below the bonding head 42, and the bonding head 42 is arranged in the same manner as described above. Lower and bond by thermocompression. At this time, each input terminal 19 of the third semiconductor unit 4 is bridged to an opening (not shown) provided in the film substrate 15, and the opening is arranged on the third circuit board 7. At, the connection terminal 22 of the third circuit board 7 and the input terminal 19 of the third semiconductor unit 4 are joined.

As a result, a liquid crystal display module in which the first, second and third circuit boards 5 to 7 are bonded to the respective semiconductor units 2 to 4 bonded to the three sides of the liquid crystal display panel 1 is formed. become. The liquid crystal display module formed in this way is once transported to the panel temporary placement stage 37 by the panel loading robot 34 and mounted, and then again sucked by the panel loading robot 34 and transported to the panel stocker 33 for storage. To be done.

As described above, in this bonding method, the three types of circuit boards 5 to 7 from the board stocker 31 are sequentially mounted by the board transfer robot 32 and the board mounting robot 39 at predetermined positions on the bonding stage 38, After this, the panel stocker 33 is placed on the bonding stage 38.
The liquid crystal display panel 1 to which the three types of semiconductor units 2 to 4 are joined is conveyed by the panel mounting robot 34, and each input terminal 19 of each semiconductor unit 2 to 4 and each connection of each circuit board 5 to 7 at a time. Align the terminal 22 and after this,
Since the aligned parts are sequentially joined by the bonding heads 41 and 42, the manufacturing process can be simplified,
It is possible to automate the entire process from the supply of parts to the joining, which makes it possible to improve the productivity and obtain a product of stable quality. In particular, the alignment between the input terminals 19 of the semiconductor units 2 to 4 joined to the liquid crystal display panel 1 and the connection terminals 22 of the circuit boards 5 to 7 is performed by performing image processing on the image taken by the television camera. Since the relative positional deviation is calculated and the positional deviation is automatically corrected according to the calculation result, highly accurate positioning can be performed.

[0020]

As described above, according to the present invention, after at least two circuit boards are mounted on the bonding stage by the board mounting means and positioned in the board mounting step, each of the liquid crystal display panels is mounted on the liquid crystal display panel in the panel mounting step. Each semiconductor unit to which the output terminal is joined is mounted on the bonding stage by the panel mounting means, each input terminal of the semiconductor unit and each connection terminal of each circuit board are aligned at one time, and then the bonding step is performed. Since the stage is appropriately moved and rotated in the horizontal plane, the input terminals of the semiconductor units having the output terminals joined to at least two sides of the liquid crystal display panel and the connection terminals of the circuit boards are sequentially joined. The manufacturing process can be simplified and the entire process from component supply to joining can be automated. It is possible to improve the productivity, it is possible to obtain a stable quality products.

[Brief description of drawings]

FIG. 1 is a schematic plan view showing the overall configuration of a joining apparatus suitable for the joining method of the present invention.

FIG. 2 is a cross-sectional view of a state in which a liquid crystal display panel having a semiconductor unit joined thereto and each circuit board are positioned and mounted on a bonding stage.

FIG. 3 is an exploded perspective view of a liquid crystal display module.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Liquid crystal display panel 2-4 Semiconductor unit 5-7 Circuit board 19 Input terminal 22 Connection terminal 34 Panel mounting robot 38 Bonding stage 39 Board mounting robot 41, 42 Bonding stage

Claims (1)

[Claims] 1. An input terminal of a semiconductor unit in which a plurality of output terminals are connected to at least two sides of a liquid crystal display panel and connection terminals of at least two wiring boards corresponding to the two sides of the liquid crystal display panel. And a circuit board bonding method in a liquid crystal display module, wherein one of the two circuit boards is mounted on a bonding stage by a board mounting means and positioned, and then the bonding stage is rotated by a predetermined angle. In this state, another circuit board is mounted on the bonding stage by the board mounting means and positioned, and a plurality of semiconductor units are mounted on the bonding stage on which the two circuit boards are positioned. The liquid crystal display panel to which the output terminals of A panel mounting step of arranging the input terminals of the conductor unit on the connection terminals of the circuit boards; and the input terminals of the plurality of semiconductor units in which the output terminals are joined to one side of the liquid crystal display panel. After sequentially connecting the respective connection terminals of the circuit board corresponding thereto with a bonding head, the bonding stage is rotated by a predetermined angle, and the plurality of output terminals having the respective output terminals bonded to the other side of the liquid crystal display panel. A method of joining a circuit board in a liquid crystal display module, comprising a step of joining each input terminal of the semiconductor unit and each corresponding connection terminal of the other circuit board in sequence with the bonding head.