JPH05223393A - Heat transfer apparatus - Google Patents

Abstract

PURPOSE:To operate a refrigerating cycle in a high efficiency without increasing its size. CONSTITUTION:A plurality of cylindrical inner tanks 71A, 71B, 71C are circumferentially arranged in a cylindrical outer tank 72, and refrigerant is supplied from a J-T expansion valve 39 arranged on one end of the tank 72. The refrigerant is supplied toward a central space enclosed by the tanks 71A, 71B, 71C to indirectly cool materials to be cooled in the tanks 71A, 71B, 71C. Fins 82 which radially externally protrude are formed on the surfaces of the tanks 71A, 71B, 71C. The fins 82 are so formed in protruding amounts at a part of a central space side that those disposed at positions separate farther from the valve 39 are more in number. Accordingly, the tanks 71A, 71B, 71C are uniformly cooled from one end to the other of the tank 72 and held at uniform temperatures.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to a heat transfer device.

[0002]

2. Description of the Related Art Conventionally, for example, in a heat transfer device for arranging a tubular body in a closed container and cooling an object to be cooled such as solids, fluids and fluids in the tubular body with a cooling medium, A cooling medium is supplied into the container and brought into contact with the surface of the cylindrical body, and heat is transferred through the wall of the cylindrical body.

In this case, in order to improve the heat transfer efficiency in the wall of the cylindrical body, fins are provided on the surface of the wall for increasing the contact area with the cooling medium.

[0004]

However, in the above-mentioned conventional heat transfer device, since the tubular body is arranged in the closed container, the inside of the tubular body cannot be efficiently cooled. , Requires a large amount of cooling medium. That is, when the cooling medium is supplied to the annular space between the cylindrical body and the closed container, if the cooling medium is supplied from the lateral direction of the cylindrical body, only the portion contacted by the cooling medium is cooled and the other portions are not cooled. However, the entire tubular body cannot be cooled.

Therefore, the cooling medium is supplied to one end of the closed container, flowed along the cylindrical body to conduct heat transfer, and then discharged from the other end of the closed container. In this case, the cooling medium can cool the entire tubular body, and the overall heat transfer efficiency is improved. However, even in this case, the cooling capacity by the cooling medium is high on one end side of the closed container to which the cooling medium is supplied, but the cooling capacity gradually decreases as the temperature flows to the other end side, and the cooling capacity decreases. However, uniform cooling cannot be performed over the entire tubular body. Therefore, uneven cooling occurs, it takes a long time to cool the entire tubular body, the cooling efficiency decreases, and the amount of the cooling medium used increases.

Therefore, for example, in a superconducting motor, a refrigerating device for cooling the superconducting magnet portion to a cryogenic temperature is arranged. However, when the heat transfer device is adopted in the refrigerating device, the refrigerating device becomes large. Not only that, but the efficiency of the refrigeration cycle is reduced, and the superconducting magnet cannot be cooled sufficiently. Moreover, the amount of refrigerant used increases and the refrigerant tank also becomes large.

The present invention solves the above problems of the conventional heat transfer device, improves the cooling efficiency, reduces the amount of the cooling medium used, and downsizes the device. An object is to provide a heat transfer device.

[0008]

To this end, in the heat transfer device of the present invention, a plurality of cylindrical inner tanks are provided inside the cylindrical outer tank, and each inner tank is arranged substantially on the circumference. To be done. An object to be cooled is housed inside the inner tank, and a refrigerant is supplied from a refrigerant supply means arranged at one end of the outer tank toward a central space surrounded by the inner tanks.

Fins are formed on the surface of the inner tank so as to project radially outward. As for the fins, the amount of protrusion of the portion on the side of the central space is increased as it is located farther from the refrigerant supply means.

[0010]

According to the present invention, as described above, a plurality of cylindrical inner tanks are provided inside the cylindrical outer tank, and each inner tank is arranged substantially on the circumference. An object to be cooled is housed inside the inner tank, and a refrigerant is supplied from a refrigerant supply means arranged at one end of the outer tank. The refrigerant is supplied toward the central space surrounded by the inner tanks, and indirectly cools the object to be cooled in the inner tanks.

Fins are formed on the surface of the inner tank so as to project outward in the radial direction, and the amount of projection of the fin on the side of the central space is increased as the position is farther from the refrigerant supply means. is there. Therefore, as the distance from the coolant supply means increases, the central space becomes narrower and the resistance to the flow of the coolant increases. As a result, the refrigerant passes along the fins between the inner tanks and spreads throughout the outer tank. In this way, the refrigerant supplied from the refrigerant supply means can be spread over the entire area of the outer tank simply by disposing the refrigerant supply means toward the central space surrounded by the inner tanks.

Further, the cooling capacity of the refrigerant per unit weight decreases while moving from one end to the other end of the outer tub, but as the distance from the refrigerant supply means increases, the protruding amount of the fins increases, which contributes to heat transfer. The surface area for Therefore, the inner tank is uniformly cooled from one end to the other end of the outer tank and is kept at a uniform temperature. Further, since the heat transfer efficiency is improved, the heat transfer device can be downsized.

[0013]

Embodiments of the present invention will now be described in detail with reference to the drawings. FIG. 1 is a schematic view of a cryogenic refrigeration system to which the heat transfer device of the present invention is applied. In the figure,
11 is a first refrigeration cycle for cooling the heat load, 12
Is a second refrigeration cycle which constitutes a low temperature source of the first refrigeration cycle 11. By connecting the first refrigeration cycle 11 and the second refrigeration cycle 12 in two stages, about 4.2
A cryogenic state of ° K is formed. The first refrigeration cycle 11 is an adsorption refrigeration cycle using helium (He) as a refrigerant and an adsorbent as an adsorbent, while the second refrigeration cycle 12 is hydrogen (H) as a refrigerant.
₂ ) is used and a chemical refrigeration cycle using a hydrogen storage alloy as an adsorbent is used, but an adsorbent can be used as in the first refrigeration cycle 11.

Reference numeral 13 is an adsorption device for adsorbing and releasing helium gas. The adsorption device 13 comprises an adsorbent 14 such as activated carbon or zeolite, a heater 15 for heating the adsorbent 14, and a cooler 16. When the temperature of the adsorbent 14 is forcibly raised by the heater 15, the adsorbed helium is released from the adsorbed helium. When the temperature of the adsorbent 14 is forcibly lowered by the cooler 16, helium is adsorbed on the adsorbent 14.

The adsorption device 13 having the adsorbent 14 is
The helium gas, which is connected to the loop-shaped refrigerant pipe 18 via the connection pipe 17 and is generated by heating the adsorbent 14, is supplied to the refrigerant pipe 18 and is arranged in the refrigerant pipe 18. It is expanded by the JT expansion valve 19 and is at least partially liquefied by the Joule-Thomson effect, and becomes a mist-like refrigerant. Then, the mist-like refrigerant is sent to the load cooler 20 which becomes a heat load, and in the load cooler 20, the object to be cooled is substantially 4.2 ° K in this embodiment.
It becomes helium gas as it cools and vaporizes.

Subsequently, by cooling the adsorbent 14, the helium gas in the refrigerant conduit 18 can be adsorbed by the adsorbent 14. The JT expansion valve 1
In order to liquefy the refrigerant by the Joule-Thomson effect in No. 9, it is necessary to supply a high-pressure refrigerant having a predetermined temperature or lower to the J-T expansion valve 19 and discharge the J-T expansion valve 19 to the low-pressure side. ..

Therefore, J-T in the refrigerant line 18 is
A one-way valve 22 is provided in the high pressure side refrigerant pipeline 18a upstream of the expansion valve 19 and a low pressure side refrigerant pipeline 1 downstream of the JT expansion valve 19 is provided.
A one-way valve 23 is arranged at 8b to allow the refrigerant to flow in one direction and form a high pressure in the high pressure side refrigerant pipe line 18a. In this case, the one-way valve 22 has a helium gas pressure of, for example, 14 atm. The structure is such that the pressure is not released until the set pressure becomes, and the helium gas in the high pressure side refrigerant pipe line 18a is 14-18 atm. Maintained at the pressure of. Even if the pressure is not maintained by the one-way valve 22, the pressure can be maintained by controlling the amount of activated carbon and the heat generation cycle.

The helium gas generated by heating the adsorbent 14 in this manner is sent to the high pressure side refrigerant pipe 18a via the one-way valve 22, and the JT expansion valve 1
9 is discharged to the low pressure side refrigerant pipe line 18b. As described above, the helium gas is discharged from the JT expansion valve 19 and at least part of it is liquefied.
The lower the temperature of the helium gas on the upstream side of 9, the lower the temperature after discharge and the more the amount of liquefaction. Therefore, the high pressure side refrigerant pipeline 1 on the upstream side of the JT expansion valve 19 is provided.
8a, the first and second heat exchangers 25 and 26 for cooling the helium gas and the third heat exchanger 27 are disposed between the first and second heat exchangers 25 and 26.

The first heat exchanger 25 and the second heat exchanger 2
6, a countercurrent heat exchanger is adopted, and the load cooler 20
Low pressure side refrigerant line 18b after cooling the object to be cooled in
High-pressure-side refrigerant line 18 using the cold heat of the helium gas in the
The helium gas in a is cooled. Also,
The third heat exchanger 27 uses the cold heat of the hydrogen gas after the adsorbent 14 is cooled by the cooler 16 in the second refrigeration cycle 12.

In this way, the refrigerant, which is at least partially liquefied and becomes a mixture of helium gas and liquid helium, is sent to the load cooler 20, and the load cooler 20 cools the object to be cooled. The boiling point of the liquid helium is about 4.2.
The load cooler 20 can cool the object to be cooled at about 4.2 ° K. Therefore, by disposing the load cooler 20 in the liquid helium tank of the superconducting motor, the superconducting magnet can be cooled and the vaporized helium gas can be liquefied again.

In this case, the helium gas vaporized by cooling the superconducting magnet is used as the object to be cooled of the load cooler 20. However, for example, the load cooler 20 is composed of a liquid helium tank, and the superconducting object as the object to be cooled is used. The magnet may be cooled directly. As described above, the adsorption device 1
3, a heater 15 is provided to heat the adsorbent 14. The heater 15 is connected to a power supply circuit 31,
The adsorbent 14 is intermittently heated by being controlled by a control device (not shown). Further, the adsorbent 14 is provided with a cooler 16, and the adsorbent 14 is constantly cooled to 22 ° K by a refrigerant composed of a mixture of hydrogen gas and liquefied hydrogen flowing in the cooler 16. ..

Next, the second refrigeration cycle 12 will be described. 33 absorbs hydrogen gas by cooling,
It is an occlusion device for releasing hydrogen gas by heating. The occlusion device 33 comprises an occlusion substance 34 made of a hydrogen occlusion alloy such as LaNi _5, and a Peltier element 35 for selectively heating and cooling the occlusion substance 34. The Peltier element 35 is connected to the power supply circuit 31 and is controlled by a control device (not shown).
Heat and cool at 60 ° C. That is, when the atmospheric temperature is maintained at 0 ° C, for example, heating at 60 ° C can be performed during heating, and cooling at -60 ° C can be performed during cooling.

Therefore, for example, when the occluding substance 34 that can occlude at a low temperature of about -60 ° C. is used, the occluding device 33 can be placed in an atmosphere of about 0 ° C. If the device 33 is separated from the cryogenic state and housed in an independent heat insulating structure, the thermal efficiency of the device can be improved. Storage device 33 having the above configuration
In the above, when the temperature of the storage substance 34 is forcibly raised by the Peltier element 35, the stored hydrogen is vaporized and becomes hydrogen gas, which is released from the storage substance 34. Further, the Peltier element 35 is switched to change the storage material 3
When the temperature of 4 is forcibly reduced by the Peltier element 35, hydrogen gas is stored in the storage material 34.

The occlusion device 33 having the occlusion substance 34 is connected to the loop-shaped refrigerant pipe 38 via the connecting pipe 37, and the hydrogen gas generated by heating the occlusion substance 34 is the refrigerant pipe. 38, and the refrigerant line 3
8 is expanded by the JT expansion valve 39, and at least a part thereof is liquefied by the Joule-Thomson effect, and becomes a mist-like refrigerant. Then, the mist-like refrigerant is sent to the cooler 16, and in the cooler 16, the adsorbent 14 is cooled to about 22 ° K and a part thereof is vaporized to become hydrogen gas. On the downstream side of the cooler 16, there is a third
The heat exchanger 27 is provided, and the refrigerant after cooling the adsorbent 14 is further sent to the third heat exchanger 27, where the helium gas is cooled and vaporized to hydrogen. It becomes gas.

Then, by switching the Peltier element 35 and cooling the storage substance 34, the hydrogen gas in the refrigerant pipe 38 can be stored in the storage substance 34. In the J-T expansion valve 39,
In order to liquefy the refrigerant by the Thomson effect, a high-pressure refrigerant having a temperature equal to or lower than a predetermined temperature is supplied to the J-T expansion valve 39,
It is necessary to discharge from the J-T expansion valve 39 to the low pressure side.

Therefore, J-T in the refrigerant pipe line 38 is
A one-way valve 42 is provided in the high pressure side refrigerant pipeline 38a upstream of the expansion valve 39, and a low pressure side refrigerant pipeline 3 is provided downstream of the JT expansion valve 39.
A one-way valve 43 is arranged at 8b to allow the refrigerant to flow in one direction and form a high pressure in the high pressure side refrigerant pipe line 38a. In this way, the hydrogen gas generated by heating the occlusion substance 34 is sent to the high pressure side refrigerant pipe line 38a via the one-way valve 42, and then from the JT expansion valve 39 to the low pressure side refrigerant pipe line 38b. Is ejected. As described above, the hydrogen gas is discharged from the J-T expansion valve 39 and at least a part thereof is liquefied. The lower the temperature of the hydrogen gas on the upstream side of the J-T expansion valve 39 is, the more the hydrogen gas is discharged. The subsequent temperature decreases and the amount of liquefaction increases. Therefore, the first and second heat exchangers 45 and 46 for cooling the hydrogen gas and the first and second heat exchangers 45 are provided in the high pressure side refrigerant pipe line 38a on the upstream side of the JT expansion valve 39. , 46 is provided with a third heat exchanger 47.

The first heat exchanger 45 and the second heat exchanger 4
6, a countercurrent heat exchanger is adopted, and the first refrigeration cycle 1
The hydrogen gas in the high pressure side refrigerant pipeline 38a is cooled to about 77 ° K by using the cold heat of the hydrogen gas in the low pressure side refrigerant pipeline 38b after cooling the helium gas in the first third heat exchanger 27. I am trying. The third heat exchanger 47 is composed of a liquefied gas cooler that uses liquefied gas, for example, liquid nitrogen (N ₂ ) as a cold heat source. Therefore, a liquefied gas supply means is provided, and the third heat exchanger 47 is connected to the liquid nitrogen line 51.
It is connected to the liquid nitrogen tank 52 via.

Liquid nitrogen has a boiling point of 77 ° K, has a relatively high evaporation latent heat per unit weight, and has a large cooling effect.
Therefore, the hydrogen gas in the high pressure side refrigerant pipe line 38a can be sufficiently cooled by supplying only a small amount of liquid nitrogen to the third heat exchanger 47. Although not shown, the liquid nitrogen conduit 51 is provided with a control valve for controlling the amount of liquid nitrogen supplied. The hydrogen gas is cooled in the third heat exchanger 47, and the vaporized nitrogen gas is released without being collected, and then the inside of the heat insulating case 55 is cooled.

Since the third heat exchanger 47 cools the hydrogen gas by utilizing the latent heat of vaporization of liquid nitrogen, the cooling of the hydrogen gas is promoted and the Joule-Thomson effect can be fully functioned. .. Therefore, even if the refrigeration cycle by the occlusion device 33 is used in the second refrigeration cycle 12, J
The amount of liquid hydrogen in the refrigerant after being discharged from the -T expansion valve 39 increases, and the device can be downsized by the amount that the second refrigeration cycle 12 is downsized.

In this way, the refrigerant in which a considerable part is liquefied and becomes a mixture of hydrogen gas and liquid hydrogen is sent to the cooler 16, but since the amount of liquid hydrogen in the refrigerant is large, the above-mentioned cooler is used. At 16 the adsorbent 14 can be cooled sufficiently. Therefore, even if the heater 15 is turned on at the same time without stopping the supply of the refrigerant to the cooler 16 when the adsorbent 14 is heated, the cooling capacity of the cooler 16 is not impaired and the cooling of the adsorbent 14 is stabilized. Can be made

Furthermore, since it is not necessary to stop the supply of the refrigerant to the cooler 16, a control valve such as a thermal switch or a solenoid valve becomes unnecessary. Therefore, it is not necessary to detect the temperature in an extremely low temperature state, and not only the controllability is improved, but also it is not necessary to place a part of the control valve at room temperature, so that the device can be downsized. After leaving the cooler 16, the refrigerant is sent to the third heat exchanger 27 of the first refrigeration cycle 11 and cools the helium gas in the third heat exchanger 27. The boiling point of liquid hydrogen is about 22 ° K, and the cooler 16
Can cool the adsorbent 14 at about 22 ° K, and the third heat exchanger 27 can cool the helium gas at about 22 ° K.

By the way, in the first refrigeration cycle 11, the refrigerant of about 22 ° K is used to form the cryogenic state of about 4.2 ° K in the load cooler 20. Therefore, each constituent element of the first refrigeration cycle 11, that is, the adsorption device 13, the refrigerant pipe line 18, the JT expansion valve 19, the load cooler 20, the one-way valves 22, 23, the first heat exchanger 25,
The second heat exchanger 26 and the third heat exchanger 27 are isolated from room temperature. Further, in the second refrigeration cycle 12, about 0
About 22 ° K in cooler 16 using an atmosphere of ° C
Form a cold state of. Therefore, the components other than the storage device 33 of the second refrigeration cycle 12, that is, the refrigerant pipe line 38, the JT expansion valve 39, the one-way valves 42 and 43, the first heat exchanger 45, the second heat exchanger 46, and The third heat exchanger 47 is isolated from room temperature. Further, the liquid nitrogen tank 52 and the liquid nitrogen pipe line 51 for cooling the third heat exchanger 47 by the liquid nitrogen are also isolated from room temperature.

Therefore, as shown by the broken line in FIG. 1, a heat insulating case 55 is provided so as to isolate each of the above components from room temperature. Then, the nitrogen gas after being vaporized by cooling the hydrogen gas in the third heat exchanger 47 is released into the heat insulating case 55 to utilize the cold heat of the nitrogen gas. In this case, the storage device 33 is arranged outside the heat insulating case 55 in order to operate the Peltier element 35.

As described above, since the ambient temperature when operating the Peltier element 35 must be maintained at 0 ° C. in this case, the storage device 33 is accommodated in the auxiliary heat insulating case 56 as shown by the alternate long and short dash line. Surrounded and isolated from room temperature. Therefore, only the power supply circuit 31 is arranged in the atmosphere. By configuring in this way,
Electric wiring 58 is provided at a point between the heat insulating case 55 and the atmosphere.
Is connected only via the space between the heat insulating case 55 and the sub heat insulating case 56 at the point b.
Connected only via a connecting pipe 37 that connects 2, 43,
The electric wiring 6 is provided at a point c between the sub-insulation case 56 and the atmosphere.
Therefore, the heat insulating property is improved.

The storage material 34 cannot be operated in a cryogenic state, whereas the adsorbent 14 can be operated in a cryogenic state. Therefore, the first refrigeration cycle 11 is operated in a cryogenic state, and the second refrigeration cycle 12 is operated.
Is operated in a temperature range higher than that of the first refrigeration cycle 11,
The object to be cooled can be cooled to a cryogenic state by the two-stage refrigeration cycle. In this case, since the storage substance 34 is used in the high temperature range, the adsorbent 14 can be operated only in the low temperature range. Since the adsorbent 14 has a larger amount of adsorbed refrigerant as the temperature range is lower, the device can be downsized accordingly.

In the above cryogenic refrigerator, the adsorbent 14
By providing a plurality of, heating and cooling each alternately,
The generation amount and adsorption amount of helium gas can be smoothed. Next, the heat transfer device used in the cryogenic refrigeration system will be described. FIG. 2 is a schematic diagram of a heat transfer device according to an embodiment of the present invention.

In the figure, reference numeral 86 is a heat transfer device, and the heat transfer device 86 includes three adsorption devices 13A, 13B, 1
3C, 3 outer tanks 71 in 1 outer tank 72
A, 71B and 71C are accommodated in parallel. In each of the inner tanks 71A, 71B, 71C, an adsorbent 14A, 14B, 14C such as activated carbon or zeolite and the adsorbent 14
Heaters 15A, 1 for heating A, 14B, 14C
5B and 15C are provided, and the heaters 15A, 15B and 1
5C is connected to the power supply circuit 31, is controlled by the control circuit 87, and is turned on alternately.

In the adsorption devices 13A, 13B and 13C, the temperature of the adsorbents 14A, 14B and 14C is set to the heater 1
When forcedly raised by 5A, 15B, 15C,
Helium that was adsorbed is absorbed by the adsorbents 14A, 14B, 14
Emitted from C. Also, the adsorbents 14A, 14B, 1
When the temperature of 4C is forcibly reduced by the second refrigerant, the helium gas is adsorbed by the adsorbents 14A, 14B, 14C.

Further, the inner tanks 71A, 71B, 71C
Are connecting pipes 88A, 88B, 88C, one-way valves 76A, 76B, 76C and connecting pipes 89A, 89B, 8 respectively.
It is connected to the common high-pressure side refrigerant pipeline 18a of the first refrigeration cycle 11 via 9C. Similarly, the inner tank 71A, 71
B and 71C are connection pipes 90A, 90B and 90, respectively.
C, one-way valves 77A, 77B, 77C and connecting pipe 91
It is connected to the common low pressure side refrigerant pipe line 18b of the first refrigeration cycle 11 via A, 91B and 91C.

The high-pressure side refrigerant pipe line 18a and the low-pressure side refrigerant pipe line 18b constitute a loop-shaped refrigerant pipe line, and the adsorbents 14A, 14B and 14C are connected to the heater 15
Helium gas generated by heating in A, 15B, and 15C is supplied to the high-pressure side refrigerant pipe line 18a, and is a JT expansion valve arranged between the high-pressure side refrigerant pipe line 18a and the low-pressure side refrigerant pipe line 18b. It is expanded at 19, and at least a part is liquefied by the Joule-Thomson effect, and becomes a mist-like first refrigerant. Then, the mist-like first refrigerant is sent to the load cooler 20, cools the object to be cooled and is vaporized, and becomes helium gas.

In the JT expansion valve 19, the Joule
In order to liquefy the refrigerant by the Thomson effect, a high-pressure refrigerant having a temperature equal to or lower than a predetermined temperature is supplied to the J-T expansion valve 19,
It is necessary to discharge from the J-T expansion valve 19 to the low pressure side.
Therefore, the one-way valves 76A, 7A are provided on the high pressure side refrigerant pipeline 18a side.
6B, 76C to the low pressure side refrigerant pipe line 18b, the one-way valve 77
A, 77B, and 77C are provided to allow the refrigerant to flow in one direction and form a high pressure in the high-pressure side refrigerant pipe line 18a. In this case, the one-way valves 76A, 76B, and 76C have a helium gas pressure of, for example, 14 atm. The structure is such that the helium gas is not released until the set pressure reaches 14 to 18a in the high pressure side refrigerant pipe line 18a.
tm. Maintained at the pressure of.

In this way, the adsorbents 14A, 14B,
Helium gas generated by heating 14C is sent to the high pressure side refrigerant pipe line 18a via the one-way valves 76A, 76B, 76C, and is discharged from the JT expansion valve 19 to the low pressure side refrigerant pipe line 18b. .. As described above, the helium gas is discharged from the JT expansion valve 19 and at least a part thereof is liquefied. The lower the temperature of the helium gas on the upstream side of the JT expansion valve 19, the more the helium gas is discharged. The subsequent temperature decreases and the amount of liquefaction increases.

On the other hand, the outer tank 72 and the inner tanks 71A, 71
A common hydrogen refrigerant chamber 72a is formed between B and 71C, and the hydrogen gas formed in the second refrigeration cycle 12, liquid hydrogen, or a mixture thereof is supplied. Hydrogen gas, liquid hydrogen or a mixture thereof is supplied from the high pressure side refrigerant pipe line 38a of the second refrigeration cycle 12 through the JT expansion valve 39, and the inner tanks 71A, 71B, 7
Always cool 1C.

In the heat transfer device 86 having the above structure, when the heaters 15A, 15B and 15C are alternately turned on to heat the adsorbents 14A, 14B and 14C alternately, the heated adsorbents 14A, 14B and 14C become helium. Gas is generated and supplied to the high pressure side refrigerant pipe line 18a. The unheated adsorbents 14A, 14B, 14C are cooled by the hydrogen gas in the hydrogen refrigerant chamber 72a, liquid hydrogen or a mixture thereof, and adsorb the helium gas supplied from the low pressure side refrigerant pipe line 18b.

The one-way valves 76A, 76B and 76C are
The pressure of the helium gas is 14 atm. The structure is such that it will not be released until the set pressure is reached. Therefore, the helium gas is automatically discharged from the inner tanks 71A, 71B, 71C that have reached the set pressure. In this way, the first refrigerant, which is at least partially liquefied and becomes a mixture of helium gas and liquid helium, is the load cooler 2
0, and the load cooler 20 cools the object to be cooled.
The boiling point of the liquid helium is about 4.2 ° K, and about 4.
The object to be cooled can be cooled at 2 ° K.

The second refrigeration cycle 12 uses a storage device 33 that stores hydrogen gas by cooling and releases hydrogen gas by heating, and operates by heating and cooling the storage device 33. To do. Then, the hydrogen gas generated by the Joule-Thomson effect in the JT expansion valve 39, liquid hydrogen, or a mixture thereof is supplied into the hydrogen refrigerant chamber 72a. Liquid hydrogen in the mixture cools the adsorbing devices 13A, 13B, 13C in the hydrogen refrigerant chamber 72a and is vaporized into hydrogen gas, which is discharged from the low pressure side refrigerant pipe line 38b.

In this way, the hydrogen gas, liquid hydrogen, or a mixture thereof supplied to the heat transfer device 86 can sufficiently cool the adsorbents 14A, 14B, 14C in the heat transfer device 86. Therefore, the adsorbent 14
Even if the heaters 15A, 15B and 15C are turned on at the same time without stopping the supply of hydrogen gas, liquid hydrogen or a mixture thereof to the heat transfer device 86 at the time of heating A, 14B and 14C, the heat transfer device 86 is cooled. The cooling of the adsorbents 14A, 14B, 14C can be stabilized without impairing the capacity.

In FIG. 1, for convenience of explanation, the adsorbent 14 and the one-way valves 22 and 23 are connected by one connecting pipe 17. However, as shown in FIG.
6A, 76B, 76C, 77A, 77B, 77C for each connection pipe 88A, 88B, 88C, 89A, 89B, 89
C should be installed. Next, the structure of the heat transfer device 86 will be described with reference to FIGS.

FIG. 3 is a longitudinal sectional view of a heat transfer device according to an embodiment of the present invention, FIG. 4 is a sectional view taken along line AA of FIG. 3, FIG. 5 is a sectional view taken along line BB of FIG. 3, and FIG. It is CC sectional drawing. Figure 3
In FIG. 4, only the adsorption devices 13A, 13B among the three adsorption devices 13A, 13B, 13C are shown, but in reality, as shown in FIGS.
B and 13C are arranged in a regular triangular shape on the circumference.

The three adsorption devices 13A, 13B and 13C which constitute the heat transfer device 86 are housed in the adsorption device case 81. The adsorption device case 81 is made of a heat insulating material, and forms a heat insulating chamber 81a between itself and the outer tank 72, and the one-way valves 76A, 76B, 76C, 77A, 7 are provided in the heat insulating chamber 81a.
It contains 7B and 77C. Inside the outer tub 72, inner tubs 71A, 71B made of a material having high thermal conductivity,
71C is disposed, and a hydrogen refrigerant chamber 72a is formed between them. The inner tubs 71A, 71B, 71C each have a cylindrical shape and are arranged in a triangular shape.
A central space 92 surrounded by A, 71B and 71C is formed. Each of the inner tanks 71A, 71B, 71C is formed with a plurality of annular fins 82 projecting outward in the radial direction to improve heat transfer with hydrogen gas, liquid hydrogen or a mixture thereof. As for the fins 82, the protrusion amount of the triangular portion on the side of the central space 92 is larger as it is located on the left side of FIG.

Inside the inner tanks 71A, 71B and 71C, cylindrical adsorbents 14A, 14B and 14C are arranged,
A heater 15 is provided inside the adsorbents 14A, 14B and 14C.
A, 15B and 15C are arranged. The one-way valves 76A, 76B, and 76C have a common high-pressure side refrigerant line 1
8a is connected to the one-way valve 77A, 77B, 77C.
A common low-pressure side refrigerant pipe line 18b is connected to.

The low pressure side refrigerant pipe line 38b of the second refrigeration cycle 12 is connected to the left end of the outer tank 72 and opens to the hydrogen refrigerant chamber 72a. The high-pressure side refrigerant pipe 38a is connected to the right end of the outer tank 72, and opens to the hydrogen refrigerant chamber 72a via the JT expansion valve 39. The J-T expansion valve 39 is disposed substantially in the center of the wall at the right end of the outer tank 72, and the hydrogen gas, liquid hydrogen or a mixture thereof discharged from the J-T expansion valve 39 is the hydrogen refrigerant chamber. It is directly supplied to 72a and hits the fins 82 of each inner tank 71A, 71B, 71C.

Here, the refrigerant discharged from the JT expansion valve 39 is hydrogen gas, liquid hydrogen or a mixture thereof as described above, and is a central space surrounded by the inner tanks 71A, 71B, 71C. When it is discharged toward 92,
Proceeding through the central space 92, inner tanks 71A, 71B, 71C
The fins 82 are cooled from the side of the central space 92, but the fins 82 are located at positions away from the J-T expansion valve 39 so that the protrusion amount of the triangular portion on the side of the central space 92 is as shown in FIGS. There are many. Therefore, the JT expansion valve 39
The central space 92 becomes narrower as it goes away from, and the contact area with the flow of hydrogen gas, liquid hydrogen or a mixture thereof can be increased along the axial direction. As a result, hydrogen gas, liquid hydrogen or a mixture thereof passes along the fins 82 between the inner tanks 71A, 71B and 71C, and the outer tank 7
Go to the whole area in 2. As described above, the hydrogen gas and liquid discharged from the JT expansion valve 39 are simply disposed by arranging the JT expansion valve 39 toward the central space 92 surrounded by the inner tanks 71A, 71B, 71C. Hydrogen or a mixture thereof can be distributed throughout the outer tank 72.

Further, after being discharged from the JT expansion valve 39, hydrogen gas, liquid hydrogen or a mixture thereof moves from one end side to the other end side, during which the inner tanks 71A, 71B,
Since the adsorbents 14A, 14B and 14C in the 71C are cooled, liquid hydrogen in the mixture is gradually vaporized and the cooling capacity per unit weight is lowered. However, the protrusion amount of the fin 82 on the central space 92 side is J-
The larger the distance from the T expansion valve 39, the larger the surface area of each fin 82 that contributes to heat transfer.
Each inner tank 71A, 71B, 71C can be cooled uniformly in the longitudinal direction.

Further, in this case, the protrusion amount of the fin 82 is increased only on the side of the central space 92, and the discharge amount on the side opposite to the central space 92 is the same.
2 does not need to be increased, and the heat transfer device 86 is not upsized. The heaters 15A, 15B, 15C disposed inside the adsorbents 14A, 14B, 14C are connected to the power supply circuit 31 (FIG. 2) and are turned on intermittently by the control device 87, and the adsorbents 14A, 14B, Heat 14C. Therefore, the heaters 15A, 15B and 15C penetrate the inner tanks 71A, 71B and 71C, the outer tank 72 and the adsorption device case 81 and are electrically connected to the power supply circuit 31.

Next, a heat transfer device 86 according to another embodiment of the present invention will be described. 7 is a first sectional view of a heat transfer device according to another embodiment of the present invention, FIG. 8 is a second sectional view of a heat transfer device according to another embodiment of the present invention, and FIG. 9 is another embodiment of the present invention. It is a 3rd sectional view of the heat transfer device in an example. 7 corresponds to the AA cross section in FIG. 3, FIG. 8 corresponds to the BB cross section in FIG. 3, and FIG. 9 corresponds to the CC cross section in FIG.

In this case, each inner tank 71 is the same as in FIGS.
A plurality of annular fins 82 projecting outward in the radial direction are formed on the A, 71B, and 71C to improve heat transfer with hydrogen gas, liquid hydrogen, or a mixture thereof. As for the fins 82, the protrusion amount of the triangular portion on the side of the central space 92 is larger as it is located on the left side of FIG. The adsorbents 94A, 94B and 94C are disposed inside the inner tanks 71A, 71B and 71C, respectively.
The centers of 94B and 94C are eccentric to the outer peripheral side with respect to the centers of the inner tanks 71A, 71B and 71C.

That is, the adsorbents 94A, 94B, 9
4C is thicker on the side of the central space 92, and becomes thinner as it goes away from the central space 92. Therefore, when the refrigerant moves to the outer peripheral side along each fin 82, it can be cooled uniformly, the adsorption amount can be averaged in the radial direction, and the adsorption efficiency per unit volume can be improved. At the same time, the efficiency of use of the refrigerant can be improved.

In each of the above embodiments, as the adsorbent, a storage material such as a hydrogen storage alloy such as palladium or titanium can be used.

[Brief description of drawings]

FIG. 1 is a schematic view of a cryogenic refrigerator to which a heat transfer device of the present invention is applied.

FIG. 2 is a schematic view of a heat transfer device according to an embodiment of the present invention.

FIG. 3 is a vertical sectional view of a heat transfer device according to an embodiment of the present invention.

4 is a cross-sectional view taken along the line AA of FIG.

5 is a sectional view taken along line BB of FIG.

6 is a cross-sectional view taken along line CC of FIG.

FIG. 7 is a first heat transfer device according to another embodiment of the present invention.
FIG.

FIG. 8 is a second heat transfer device according to another embodiment of the present invention.
FIG.

FIG. 9 is a third heat transfer device according to another embodiment of the present invention.
FIG.

[Explanation of symbols]

 39 JT expansion valve (refrigerant supply means) 71A, 71B, 71C Inner tank 72 Outer tank 82 Fin 92 Central space

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Yoshihisa Ito 2-19-12 Sotokanda, Chiyoda-ku, Tokyo Equas Research Co., Ltd. (72) Inventor Koji Hori 2-19, Sotokanda, Chiyoda-ku, Tokyo No. 12 Equus Research Co., Ltd.

Claims (1)

[Claims] 1. A cylindrical outer tank, comprising: (a) a cylindrical outer tank, and (b) a plurality of cylindrical inner tanks arranged substantially on the circumference of the outer tank for accommodating an object to be cooled. c) a coolant supply means which is arranged at one end of the outer tank and supplies a coolant toward a central space surrounded by the inner tanks; and (d) which projects radially outward on the surface of the inner tank. The heat transfer is characterized by having fins to be formed, and (e) the fins of each of the inner tanks have a larger amount of protrusion of the portion on the central space side as they are located farther from the refrigerant supply means. apparatus.