JPH05220588A - Laser marker - Google Patents

Abstract

PURPOSE:To prevent sticking, on the surface of a work, of nonmetalic material part that remains without being completely burnt and gasified, at the time of marking the surface of the work such as an IC chip or a metallic plate with a coating film, to the work such place to be marked and also to realize the effect at low cost. CONSTITUTION:The marking is performed on the work 7 by the laser beam which is emitted from a laser generator 1, and, after its diameter is expanded by an expander 2, passes through a mask 3, by way of a reflecting mirror 5 and an image-forming lens 6. Immediately after that, a ground glass plate 4 is replaced with the mask 3 and arranged; through the glass plate, the work 7 is again irradiated with the laser beam; and a soot-like residue stuck on the marking place is removed by burning and gasifying.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention does not completely combust or vaporize when marking a surface of a work such as an IC chip or a component having a coating film on its surface, at least the surface layer portion of which is made of a non-metallic material. The present invention relates to a laser marker that cleans a marking portion by preventing the remaining non-metallic material portion from adhering to the work surface.

[0002]

2. Description of the Related Art Conventionally, when marking on the surface of a work such as an IC chip or a part having a coating film on its surface, at least the surface layer portion of which is made of a non-metal material, non-metal remaining without being completely burned or vaporized. The material portion adheres to the surface of the work in the form of soot, and if left as it is, the quality of the marking portion deteriorates. Therefore, as a post-step of marking, a step of wiping a residue or an ultrasonic cleaning step is added.

[0003]

In the conventional method, a post-treatment step is added whether it is a wiping step or an ultrasonic cleaning step, so that the number of man-hours is increased, work efficiency is lowered, and new equipment is added. Need. In order to improve it, a proposal was made according to Japanese Patent Laid-Open No. 3-86385.
This is because a beam splitter is provided after the mask, and a part of the laser light is used for marking, and the laser light of the other branched part is guided to the vicinity of the marking part by an optical fiber to produce a laser light with an almost uniform intensity distribution. Irradiate. The intensity of the latter laser light is lowered by selecting the split light amount ratio or by providing a slit or a limiting aperture after the beam splitter. Further, the latter laser light is reflected multiple times in the optical fiber, so that the influence of the transmitting portion of the mask is mitigated, and the intensity becomes substantially uniform on the work surface. By the latter irradiation of laser light, the residue is burned and vaporized to be removed. Although this proposal is effective in cleaning marking points, it requires the addition of optical components such as optical fibers and beam splitters, which has the drawback of increasing costs.

An object of the present invention is to solve the above problems of the prior art, and in particular to the surface of a work such as an IC chip or a part having a coating film on its surface, at least the surface layer of which is made of a non-metallic material. It is an object of the present invention to provide a laser marker that can prevent non-metallic material portions remaining without being completely burned and vaporized from adhering to the surface of a workpiece when the marking is performed, clean the marking portion, and can be realized at low cost.

[0005]

According to a first aspect of the present invention, there is provided a laser marker in which a laser beam is passed through a transparent portion of a mask,
In the laser marker that forms an image on the surface of the work and performs marking of the shape according to the transmission part at that position,
A diffusion / transmission member for laser light, which is installed and replaced with the mask immediately after the marking and irradiates the surface of the work with laser light again, is provided.

A laser marker according to claim 2 is the laser marker according to claim 1.
In the laser marker described in [1], the diffuse transmission member and the mask are installed adjacent to a frame body that is rotatable or rotatable around an axis parallel to the optical axis of the laser light that passes through the mask. A laser marker according to a third aspect is the laser marker according to the first or second aspect, further comprising a nozzle for blowing air to the irradiation position when the laser beam is radiated to the work surface through the diffuse transmission member.

The laser marker according to claim 4 is the laser marker according to claim 1.
In the laser marker described in any one of 1 to 3, at least the surface layer portion of the work is made of a non-metallic material.

[0008]

In the laser marker according to any one of claims 1 to 4, after the diffusion / transmission member for laser light is replaced with the mask immediately after marking and installed, the power level is lowered and leveled again through the diffusion / transmission member. The surface of the work is irradiated with atomized laser light, which completely burns during the previous marking.
Vaporize.

Particularly, in the laser marker according to claim 2,
By rotating or rotating the frame body, the diffuse transmission member and the mask are alternatively positioned on the optical axis of the laser light. Particularly, in the laser marker according to the third aspect, when the laser beam irradiates the work surface through the diffusion transmitting member, air is blown from the attached nozzle to the irradiation position, and the remaining work material portion is burned, vaporized and removed. Be promoted.

Particularly, in the laser marker according to claim 4,
At least the surface layer of the work is made of non-metallic material,
The difference between the laser light power level for burning and vaporizing the residue and for not damaging the marking portion of the work and that for marking becomes relatively large.

[0011]

Embodiments of the laser marker according to the present invention will be described below with reference to the drawings. 1 is a basic configuration diagram of the embodiment, and FIG. 2 is a radial power intensity distribution diagram of laser light in the embodiment. In FIG. 1, reference numeral 1 denotes a laser oscillator, which oscillates pulsed YAG laser light.
2 is an expander composed of a combination of lenses, which enlarges the diameter of the laser beam emitted from the laser oscillator 1 in accordance with the size of the marking mask. Reference numeral 3 is a mask having a transparent portion (hollow portion) for marking (shown by a broken line), 4 is a frosted glass plate as a diffusion transparent member, and the mask 3 is used for marking, and the frosted glass plate 4 is used immediately after removing the residue. , Alternatively inserted in the optical path. Reference numeral 5 is a reflection mirror, 6 is an imaging lens, and 7 is a work to be marked, which is, for example, an IC chip or a metal plate with a surface coated.

The diameter of the pulsed laser light emitted from the laser oscillator 1 is expanded by the expander 2. Next, after passing through the mask 3 and changing the optical axis to a right angle by the reflection mirror 5, the image is focused by the imaging lens 6 and an image is formed on the surface of the work 7 in accordance with the transmitting portion of the mask 3.
This is the marking process. The power intensity of the laser light at this time is extremely large. In FIG. 2, the horizontal axis represents the distance from the center, and the vertical axis represents the power intensity.
It maintains a high level of strength in a radius region and has varying strength at its apex. This power instantly burns and vaporizes the irradiation portion of the surface layer portion of the work 7 corresponding to the transmission portion of the mask 3, and engraves the portion. At that time, in the vicinity of the irradiation portion of the work 7, the remaining portion which is not completely combusted and vaporized remains attached to the work surface in the form of soot.

Immediately after marking, instead of the mask 3,
The frosted glass plate 4 is replaced and installed, and the pulsed laser light passes through it. This laser light has a low level of power intensity as shown by the solid line in FIG. 2, and the intensity is evened and leveled at the top. The intensity distribution has such a pattern because when the laser light is transmitted through the frosted glass plate 4, it is diffused in all directions due to the fine irregularities on the surface thereof. Therefore, instead of the frosted glass plate, it is possible to use a glass plate containing bubbles, emulsion, etc. inside so as to diffuse the laser light in the process of internal transmission. By the way, the laser light having a low level of power intensity passing through the frosted glass plate 4 and having its intensity leveled and leveled at the top of the frosted glass plate 4 is fine and black, which is attached near the marking location. The residue that easily absorbs heat is irradiated, and this is burned and vaporized to be removed, but there is not enough power to burn and vaporize the surface of the work 7 and damage it. In the embodiment, the work 7 is
Laser light power for burning and vaporizing the residue and not damaging the marking part of the work 7 because at least the surface layer is made of a non-metallic material such as an IC chip or a metal plate whose surface is painted. The difference between the level and that for marking is relatively large. Therefore, selection of each power level for marking and residue removal is facilitated.

FIG. 3 is a perspective view of the embodiment, and there are some additional units in the basic configuration of FIG. 1 according to practical needs. In FIG. 3, four types of masks 3A, 3B, 3C, 3D,
The four common ground glass plates 4 are alternately arranged on the same circumference of the rotary frame 8. The rotating frame 8 is rotatably supported around an axis parallel to the optical axis of the laser beam, and is rotated by a motor 9
It is driven to rotate by. In addition, the movable table 10 is used for the work 7.
Is placed, and another work is sequentially moved to the marking position. Further, a nozzle 11 is attached near the work 7, blows air to the place to be marked, and assists the residue by being burned, vaporized and removed by the laser light passing through the ground glass plate 4. The same units as those in FIG. 1 are designated by the same reference numerals, and the description thereof will be omitted here. The operation of each of these units is controlled by the control device 12 along the path indicated by the alternate long and short dash line.

That is, a predetermined work 7 is positioned along with the movement of the moving table 10, and the rotary frame 8 is positioned by the rotation of the motor 9 so that the mask corresponding to this, for example, the mask 3A is positioned on the optical axis of the laser light. To be done. next,
Pulsed laser light is oscillated from the laser oscillator 1
Marking of 7 is done. Immediately after that, the rotating frame 8
Is rotated and the frosted glass plate 4 is positioned on the optical axis of the laser beam, the laser beam is oscillated again to irradiate the residue adhering near the marking part of the work 7 with low power intensity, and Combustion, vaporization and removal. At this time, at the same time, air is blown from the nozzle 11 to the marking location to promote the removal of the residue. When the types of markings are sequentially different, the rotary frame 8 is rotated in the same direction accordingly, and the masks 3A, 3B, 3C, 3D are sequentially positioned on the optical axis of the laser light. When the same mask 3A is continuously used, the rotary frame 8 rotates instead of rotating, and the mask 3A and the adjacent ground glass plates 4 are alternately positioned on the optical axis.

[0016]

In the laser marker according to any one of claims 1 to 4, after the laser light diffusion / transmission member is replaced with the mask immediately after marking and installed, the power level is again passed through the diffusion / transmission member. The work surface is irradiated with a low and leveled laser beam, and the non-metallic material part that did not completely burn and vaporize during the previous marking,
Burns and vaporizes. Therefore, the marking location can be cleaned quickly and the means is simple, so that the cost increase for that is small.

Particularly, in the laser marker according to claim 2,
By rotating or rotating the frame body, the diffuse transmission member and the mask are alternatively positioned on the optical axis of the laser light. Therefore, the replacement work of the diffuse transmission member and the mask is easy,
It will be faster and will help reduce man-hours. Particularly, in the laser marker according to the third aspect, when the laser beam irradiates the surface of the work through the diffusion transmitting member, air is blown from the attached nozzle to the irradiation location, and the remaining non-metallic material portion is burned, vaporized and removed. Is promoted. Therefore, the marking location is assisted to be cleaned quickly and completely.

Particularly, in the laser marker according to claim 4,
At least the surface layer of the work is made of non-metallic material,
The difference between the laser light power level for burning and vaporizing the residue and for not damaging the marking portion of the work and that for marking becomes relatively large. Therefore, it becomes easy to select each power level for marking and residue removal for a work with high marking needs such as an IC chip or a metal plate having a coating film on the surface.

[Brief description of drawings]

FIG. 1 is a basic configuration diagram of an embodiment according to the present invention.

FIG. 2 is a power intensity distribution diagram of a laser beam in a radial direction in the example.

FIG. 3 is a perspective view of an embodiment.

[Explanation of symbols]

 1 Laser Oscillator 2 Expander 3 Mask 4 Frosted Glass Plate 5 Reflecting Mirror 6 Imaging Lens 7 Work 8 Rotating Frame 9 Motor 10 Moving Base 11 Nozzle 12 Controller

Claims (4)

[Claims] 1. A laser marker in which a laser beam is passed through a transparent portion of a mask and then imaged on a surface of a work, and a marking having a shape corresponding to the transparent portion is performed at that portion. A laser marker, comprising a diffused transmission member for laser light, which is replaced and installed, and which again irradiates the surface of the work with laser light. 2. The laser marker according to claim 1, wherein
A laser marker, wherein the diffuse transmission member and the mask are installed adjacent to a frame body that is rotatable or rotatable around an axis parallel to the optical axis of the laser light that passes through the mask. 3. The laser marker according to claim 1 or 2, wherein a nozzle for blowing air is attached to an irradiation position when the surface of the work is irradiated with the laser light through the diffuse transmission member. .. 4. The laser marker according to claim 1, wherein at least a surface layer portion of the work is made of a non-metallic material.