JPH0518278B2 - - Google Patents

Info

Publication number
JPH0518278B2
JPH0518278B2 JP58239998A JP23999883A JPH0518278B2 JP H0518278 B2 JPH0518278 B2 JP H0518278B2 JP 58239998 A JP58239998 A JP 58239998A JP 23999883 A JP23999883 A JP 23999883A JP H0518278 B2 JPH0518278 B2 JP H0518278B2
Authority
JP
Japan
Prior art keywords
optical device
producing
optical
gas
oxygen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58239998A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59121886A (ja
Inventor
Kuwannyuu Chin Arando
Shingu Shooba
Jerarudo Uan Uitaato Regurando
Jon Zuidozuitsuku Jooji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
AT&T Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&T Technologies Inc filed Critical AT&T Technologies Inc
Publication of JPS59121886A publication Critical patent/JPS59121886A/ja
Publication of JPH0518278B2 publication Critical patent/JPH0518278B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Devices (AREA)
  • Light Receiving Elements (AREA)
  • Optical Integrated Circuits (AREA)
  • Semiconductor Lasers (AREA)
JP58239998A 1982-12-21 1983-12-21 光デバイス作成方法 Granted JPS59121886A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US45178982A 1982-12-21 1982-12-21
US451789 1999-12-01

Publications (2)

Publication Number Publication Date
JPS59121886A JPS59121886A (ja) 1984-07-14
JPH0518278B2 true JPH0518278B2 (enrdf_load_stackoverflow) 1993-03-11

Family

ID=23793695

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58239998A Granted JPS59121886A (ja) 1982-12-21 1983-12-21 光デバイス作成方法

Country Status (1)

Country Link
JP (1) JPS59121886A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01296676A (ja) * 1988-05-24 1989-11-30 Nec Corp 半導体受光装置
JP3326462B2 (ja) 1997-08-27 2002-09-24 仗祐 中田 球状半導体デバイスとその製造方法
WO2023148839A1 (ja) * 2022-02-02 2023-08-10 株式会社京都セミコンダクター 光半導体素子

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56107587A (en) * 1980-01-31 1981-08-26 Toshiba Corp End radiation type light emitting diode

Also Published As

Publication number Publication date
JPS59121886A (ja) 1984-07-14

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