JPH0513525A - Ic socket - Google Patents
Ic socketInfo
- Publication number
- JPH0513525A JPH0513525A JP19259391A JP19259391A JPH0513525A JP H0513525 A JPH0513525 A JP H0513525A JP 19259391 A JP19259391 A JP 19259391A JP 19259391 A JP19259391 A JP 19259391A JP H0513525 A JPH0513525 A JP H0513525A
- Authority
- JP
- Japan
- Prior art keywords
- socket
- measured
- measurement
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Connecting Device With Holders (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、プリント基板装着用
ＩＣソケットに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board mounting IC socket.
【０００２】[0002]
【従来の技術】図２は従来のプリント基板装着用ＩＣソ
ケットに被測定物を挿入した状態を示す断面図であり、
図において、１はプリント基板、２はＩＣソケットフレ
ーム、３はＩＣソケットコンタクトピン、４はハンダ付
け部であり、５は被測定物、６は被測定物リード、７は
測定用端子である。2. Description of the Related Art FIG. 2 is a sectional view showing a state in which an object to be measured is inserted into a conventional printed circuit board mounting IC socket.
In the figure, 1 is a printed circuit board, 2 is an IC socket frame, 3 is an IC socket contact pin, 4 is a soldering portion, 5 is a measured object, 6 is a measured object lead, and 7 is a measuring terminal.
【０００３】次に動作について説明する。プリント基板
１にＩＣソケットコンタクトピンアウター部にて装着し
たＩＣソケットに、被測定物５を挿入することで、被測
定物リード６よりの任意の特性値を測定するが、この
際、測定用端子７を被測定物リード６またはハンダ付け
部４に当てて測定を行っている。Next, the operation will be described. By inserting the DUT 5 into the IC socket mounted on the printed circuit board 1 at the IC socket contact pin outer portion, an arbitrary characteristic value from the DUT lead 6 is measured. 7 is applied to the measured object lead 6 or the soldering portion 4 to perform the measurement.
【０００４】[0004]
【発明が解決しようとする課題】従来のプリント基板装
着用のＩＣソケットでは、被測定物よりの任意の特性値
を測定する際、被測定物リードまたはプリント基板裏面
のハンダ付け部に測定用端子を当てて測定しなければな
らず、被測定物のリードにストレスが加わり、または、
プリント基板裏面よりの測定のため測定の効率が悪い等
の問題点があった。In the conventional IC socket for mounting a printed circuit board, when measuring an arbitrary characteristic value from an object to be measured, a measuring terminal is provided on a lead of the object to be measured or a soldering portion on the back surface of the printed circuit board. Must be applied, and the lead of the DUT is stressed, or
Since the measurement is performed from the back side of the printed circuit board, there are problems such as poor measurement efficiency.
【０００５】この発明は上記のような問題点を解消する
ためになされたもので、被測定物のリードにストレスを
加えないで測定できるとともに、プリント基板裏面より
の測定をなくして測定効率の向上を図ることを目的とし
たものである。The present invention has been made in order to solve the above-mentioned problems, and the measurement can be performed without applying stress to the leads of the object to be measured, and the measurement efficiency is improved by eliminating the measurement from the back surface of the printed circuit board. The purpose is to achieve.
【０００６】[0006]
【課題を解決するための手段】この発明に係るプリント
基板装着用ＩＣソケットは、ＩＣソケットフレーム側面
に測定用チェックピンを突出して設けたものである。The printed circuit board mounting IC socket according to the present invention is provided with a measuring check pin projecting from the side surface of the IC socket frame.
【０００７】[0007]
【作用】この発明におけるプリント基板装着用ＩＣソケ
ットは、被測定物リードにストレスをかけないで測定可
能となり、またプリント基板裏面より測定しなくてよい
ので測定効率が良い。With the printed circuit board mounting IC socket according to the present invention, it is possible to perform measurement without applying stress to the leads to be measured, and since it is not necessary to perform measurement from the back surface of the printed circuit board, the measurement efficiency is good.
【０００８】[0008]
【実施例】以下、この発明の一実施例を図について説明
する。図１において、８はＩＣソケットフレーム２の側
面に突出して設けられた測定用チェックピンである。な
おその他の構成は上記従来例のものと同様につき説明を
省略する。DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, reference numeral 8 is a check pin for measurement provided on the side surface of the IC socket frame 2 so as to project. Since the other configurations are the same as those of the above-mentioned conventional example, description thereof will be omitted.
【０００９】次に動作を説明する。プリント基板１にＩ
Ｃソケットコンタクトピンのアウター部にて装着したＩ
Ｃソケットに被測定物５を挿入して被測定物リード６よ
りの任意の特性値を測定する際、測定用端子７を側面に
配置した測定用チェックピン８に当てて測定することが
できる。このことにより、従来のように被測定物リード
６またはハンダ付け部４に測定用端子７を当てて測定し
なくてよくなり、従って被測定物リードにストレスを加
えることなく、又、効率良く測定が可能となる。Next, the operation will be described. I on the printed circuit board 1
I mounted on the outer part of the C socket contact pin
When the DUT 5 is inserted into the C socket and an arbitrary characteristic value from the DUT lead 6 is measured, the measurement terminal 7 can be applied to the measurement check pin 8 arranged on the side surface for measurement. As a result, it is not necessary to apply the measurement terminal 7 to the DUT lead 6 or the soldering portion 4 as in the conventional case, and therefore the stress is not applied to the DUT lead and the measurement can be performed efficiently. Is possible.
【００１０】[0010]
【発明の効果】以上のようにこの発明によれば、被測定
物リードにストレスを加えずに測定でき、かつ効率良く
プリント基板表面より測定端子を当てて測定可能とな
る。As described above, according to the present invention, it is possible to perform measurement without applying stress to the lead to be measured, and to efficiently perform measurement by applying a measurement terminal from the surface of the printed circuit board.
【図１】この発明の一実施例によるプリント基板装着用
を示す断面図である。FIG. 1 is a sectional view showing mounting of a printed circuit board according to an embodiment of the present invention.
【図２】従来のプリント基板装着用ＩＣソケットを示す
断面図である。FIG. 2 is a sectional view showing a conventional printed circuit board mounting IC socket.
１ プリント基板 ２ ＩＣソケットフレーム ３ ＩＣソケットコンタクトピン ４ ハンダ付け部 ５ 被測定物 ６ リード ７ 測定用端子 ８ 測定用チェックピン 1 Printed circuit board 2 IC socket frame 3 IC socket contact pin 4 Solder attachment part 5 DUT 6 Lead 7 Measurement terminal 8 Measurement check pin
Claims (1)
トにおいて、上記ＩＣソケットのフレームの側面に突き
出した測定用チェックピンを設けたことを特徴とするＩ
Ｃソケット。Claim: What is claimed is: 1. An IC socket mounted on a printed circuit board, comprising a measuring check pin protruding from a side surface of a frame of the IC socket.
C socket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19259391A JPH0513525A (en) | 1991-07-05 | 1991-07-05 | Ic socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19259391A JPH0513525A (en) | 1991-07-05 | 1991-07-05 | Ic socket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0513525A true JPH0513525A (en) | 1993-01-22 |
Family
ID=16293858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19259391A Pending JPH0513525A (en) | 1991-07-05 | 1991-07-05 | Ic socket |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0513525A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1987002780A1 (en) * | 1985-11-05 | 1987-05-07 | Kanebo, Ltd. | Method of immunoassay |
-
1991
- 1991-07-05 JP JP19259391A patent/JPH0513525A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1987002780A1 (en) * | 1985-11-05 | 1987-05-07 | Kanebo, Ltd. | Method of immunoassay |
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