JPH0494907A - Resin molding die device - Google Patents

Resin molding die device

Info

Publication number
JPH0494907A
JPH0494907A JP21284890A JP21284890A JPH0494907A JP H0494907 A JPH0494907 A JP H0494907A JP 21284890 A JP21284890 A JP 21284890A JP 21284890 A JP21284890 A JP 21284890A JP H0494907 A JPH0494907 A JP H0494907A
Authority
JP
Japan
Prior art keywords
pin
template
undercut
fixed
round pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21284890A
Other languages
Japanese (ja)
Inventor
Jun Motojo
Tadao Yamazaki
Hiroyuki Najima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP21284890A priority Critical patent/JPH0494907A/en
Publication of JPH0494907A publication Critical patent/JPH0494907A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To set a device in a narrow space and incorporate the same into either of templates on the fixed or movable side by utilizing the rotation of a round pin for driving a sliding pin forming an undercut section and supporting the molding pressure applied on the template on the upper end face of the round pin.
CONSTITUTION: A side hole 9 is opened on the side face of a template forming the inner face of a resin molded product 2 provided with an undercut section on the inner side and communicated with a space 10 formed in the template. A sliding pin 4 is inserted into the while hole 9, and a pin 5 is fixed at the inner end of said pin. A round pin 6 is incorporated into the space 10 in the template, and a guide channel 7 is formed on the upper end face of the round pin 6 into which the pin 5 is inserted, and also a projection 8 supporting the molding pressure remains on the face. A contact face 11 to be in contact with the template is formed on the upper face of the projection. After molding is carried out with projected sliding pin, the round pin is rotated and the pin 5 is moved back along the guide channel, and simultaneously the sliding pin is also moved backward. As said undercut mechanism can be formed small, the upper face of the template for containing the same can be formed thick, and also the mechanism can be disposed on either of the templates on the fixed or movable side.
COPYRIGHT: (C)1992,JPO&Japio
JP21284890A 1990-08-10 1990-08-10 Resin molding die device Pending JPH0494907A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21284890A JPH0494907A (en) 1990-08-10 1990-08-10 Resin molding die device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21284890A JPH0494907A (en) 1990-08-10 1990-08-10 Resin molding die device

Publications (1)

Publication Number Publication Date
JPH0494907A true JPH0494907A (en) 1992-03-27

Family

ID=16629331

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21284890A Pending JPH0494907A (en) 1990-08-10 1990-08-10 Resin molding die device

Country Status (1)

Country Link
JP (1) JPH0494907A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1082429C (en) * 1997-09-29 2002-04-10 三星电子株式会社 Mold for injection molding of plastic
JP2009012331A (en) * 2007-07-05 2009-01-22 Takao Kikai Kk Slide core operating device and molding die equipped with this device
WO2011019915A1 (en) * 2009-08-13 2011-02-17 Illinois Tool Works Inc. Device and method for casting a component

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1082429C (en) * 1997-09-29 2002-04-10 三星电子株式会社 Mold for injection molding of plastic
JP2009012331A (en) * 2007-07-05 2009-01-22 Takao Kikai Kk Slide core operating device and molding die equipped with this device
WO2011019915A1 (en) * 2009-08-13 2011-02-17 Illinois Tool Works Inc. Device and method for casting a component

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