JPH0492660U - - Google Patents
Info
- Publication number
- JPH0492660U JPH0492660U JP1990405304U JP40530490U JPH0492660U JP H0492660 U JPH0492660 U JP H0492660U JP 1990405304 U JP1990405304 U JP 1990405304U JP 40530490 U JP40530490 U JP 40530490U JP H0492660 U JPH0492660 U JP H0492660U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48475—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball
- H01L2224/48476—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area
- H01L2224/48477—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding)
- H01L2224/48478—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a wedge bond, i.e. wedge on pre-ball
- H01L2224/4848—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a wedge bond, i.e. wedge on pre-ball outside the semiconductor or solid-state body
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990405304U JPH0744029Y2 (ja) | 1990-12-28 | 1990-12-28 | Ledモジュール |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990405304U JPH0744029Y2 (ja) | 1990-12-28 | 1990-12-28 | Ledモジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0492660U true JPH0492660U (fr) | 1992-08-12 |
JPH0744029Y2 JPH0744029Y2 (ja) | 1995-10-09 |
Family
ID=31882770
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990405304U Expired - Fee Related JPH0744029Y2 (ja) | 1990-12-28 | 1990-12-28 | Ledモジュール |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0744029Y2 (fr) |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0921568A2 (fr) | 1997-11-25 | 1999-06-09 | Matsushita Electric Works, Ltd. | Luminaire à diodes électroluminescentes |
JP2003529792A (ja) * | 2000-03-31 | 2003-10-07 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | コリメーション及び収束用ワンピースレンズアレイ及び該ワンピースレンズアレイを用いるled発光器 |
JP2005117028A (ja) * | 2003-09-16 | 2005-04-28 | Matsushita Electric Ind Co Ltd | Led照明光源 |
WO2005067066A1 (fr) * | 2004-01-07 | 2005-07-21 | Matsushita Electric Industrial Co., Ltd. | Source lumineuse a dels |
JP2005203748A (ja) * | 2003-12-16 | 2005-07-28 | Nichia Chem Ind Ltd | 発光装置及びその製造方法 |
JP2006010745A (ja) * | 2004-06-22 | 2006-01-12 | Sony Corp | 照明装置 |
JP2007128735A (ja) * | 2005-11-02 | 2007-05-24 | Citizen Electronics Co Ltd | 照明用レンズの構造。 |
JP2007180520A (ja) * | 2005-10-25 | 2007-07-12 | Philips Lumileds Lightng Co Llc | 異なる補助光学素子を有する複合発光ダイオード |
JP2008053571A (ja) * | 2006-08-28 | 2008-03-06 | Nichia Chem Ind Ltd | 発光装置およびそれを用いた面状発光装置 |
JP2010109170A (ja) * | 2008-10-30 | 2010-05-13 | Stanley Electric Co Ltd | 半導体発光装置 |
JP2010529631A (ja) * | 2007-06-14 | 2010-08-26 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 調節可能なビーム形状を持つledベースの照明器具 |
WO2010098349A1 (fr) * | 2009-02-25 | 2010-09-02 | ローム株式会社 | Lampe à diode électroluminescente |
JP4720978B2 (ja) * | 2005-02-18 | 2011-07-13 | ミネベア株式会社 | 面状照明装置 |
WO2013089108A1 (fr) * | 2011-12-14 | 2013-06-20 | 株式会社小糸製作所 | Module électroluminescent |
WO2016052471A1 (fr) * | 2014-10-02 | 2016-04-07 | ウシオ電機株式会社 | Module électroluminescent |
JP2019208033A (ja) * | 2012-05-09 | 2019-12-05 | ローム株式会社 | 発光装置 |
CN112703595A (zh) * | 2018-09-19 | 2021-04-23 | 三星显示有限公司 | 发光器件及具有该发光器件的显示装置 |
JP2021090052A (ja) * | 2019-12-05 | 2021-06-10 | オプティツ インコーポレイテッド | モノリシック多焦点光源デバイス |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018063901A (ja) | 2016-10-14 | 2018-04-19 | 株式会社小糸製作所 | 車両用前照灯 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6161703U (fr) * | 1984-09-27 | 1986-04-25 | ||
JPS62103273U (fr) * | 1985-12-18 | 1987-07-01 | ||
JPS62229987A (ja) * | 1986-03-31 | 1987-10-08 | Koito Mfg Co Ltd | 照明装置 |
JPS6332972A (ja) * | 1986-07-26 | 1988-02-12 | Mitsubishi Cable Ind Ltd | ランプ |
JPS6322759U (fr) * | 1986-07-26 | 1988-02-15 | ||
JPS6335089U (fr) * | 1986-08-25 | 1988-03-07 | ||
JPS6395261U (fr) * | 1986-12-11 | 1988-06-20 | ||
JPS63107483U (fr) * | 1986-12-29 | 1988-07-11 | ||
JPH0244780A (ja) * | 1988-08-04 | 1990-02-14 | Sharp Corp | 標示用ランプ |
JPH0278102A (ja) * | 1987-12-24 | 1990-03-19 | Mitsubishi Cable Ind Ltd | 発光ダイオード照明具 |
-
1990
- 1990-12-28 JP JP1990405304U patent/JPH0744029Y2/ja not_active Expired - Fee Related
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6161703U (fr) * | 1984-09-27 | 1986-04-25 | ||
JPS62103273U (fr) * | 1985-12-18 | 1987-07-01 | ||
JPS62229987A (ja) * | 1986-03-31 | 1987-10-08 | Koito Mfg Co Ltd | 照明装置 |
JPS6332972A (ja) * | 1986-07-26 | 1988-02-12 | Mitsubishi Cable Ind Ltd | ランプ |
JPS6322759U (fr) * | 1986-07-26 | 1988-02-15 | ||
JPS6335089U (fr) * | 1986-08-25 | 1988-03-07 | ||
JPS6395261U (fr) * | 1986-12-11 | 1988-06-20 | ||
JPS63107483U (fr) * | 1986-12-29 | 1988-07-11 | ||
JPH0278102A (ja) * | 1987-12-24 | 1990-03-19 | Mitsubishi Cable Ind Ltd | 発光ダイオード照明具 |
JPH0244780A (ja) * | 1988-08-04 | 1990-02-14 | Sharp Corp | 標示用ランプ |
Cited By (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0921568A2 (fr) | 1997-11-25 | 1999-06-09 | Matsushita Electric Works, Ltd. | Luminaire à diodes électroluminescentes |
JP2003529792A (ja) * | 2000-03-31 | 2003-10-07 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | コリメーション及び収束用ワンピースレンズアレイ及び該ワンピースレンズアレイを用いるled発光器 |
JP2005117028A (ja) * | 2003-09-16 | 2005-04-28 | Matsushita Electric Ind Co Ltd | Led照明光源 |
JP2005203748A (ja) * | 2003-12-16 | 2005-07-28 | Nichia Chem Ind Ltd | 発光装置及びその製造方法 |
JP4654670B2 (ja) * | 2003-12-16 | 2011-03-23 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
WO2005067066A1 (fr) * | 2004-01-07 | 2005-07-21 | Matsushita Electric Industrial Co., Ltd. | Source lumineuse a dels |
JPWO2005067066A1 (ja) * | 2004-01-07 | 2007-12-20 | 松下電器産業株式会社 | Led照明光源 |
JP2006010745A (ja) * | 2004-06-22 | 2006-01-12 | Sony Corp | 照明装置 |
JP4720978B2 (ja) * | 2005-02-18 | 2011-07-13 | ミネベア株式会社 | 面状照明装置 |
JP2007180520A (ja) * | 2005-10-25 | 2007-07-12 | Philips Lumileds Lightng Co Llc | 異なる補助光学素子を有する複合発光ダイオード |
JP4535504B2 (ja) * | 2005-11-02 | 2010-09-01 | シチズン電子株式会社 | 照明用レンズの構造。 |
JP2007128735A (ja) * | 2005-11-02 | 2007-05-24 | Citizen Electronics Co Ltd | 照明用レンズの構造。 |
JP2008053571A (ja) * | 2006-08-28 | 2008-03-06 | Nichia Chem Ind Ltd | 発光装置およびそれを用いた面状発光装置 |
JP2010529631A (ja) * | 2007-06-14 | 2010-08-26 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 調節可能なビーム形状を持つledベースの照明器具 |
JP2010109170A (ja) * | 2008-10-30 | 2010-05-13 | Stanley Electric Co Ltd | 半導体発光装置 |
US11608941B2 (en) | 2009-02-25 | 2023-03-21 | Rohm Co., Ltd. | LED lamp |
WO2010098349A1 (fr) * | 2009-02-25 | 2010-09-02 | ローム株式会社 | Lampe à diode électroluminescente |
JP2010198919A (ja) * | 2009-02-25 | 2010-09-09 | Rohm Co Ltd | Ledランプ |
US11629826B2 (en) | 2009-02-25 | 2023-04-18 | Rohm Co., Ltd. | LED lamp |
WO2013089108A1 (fr) * | 2011-12-14 | 2013-06-20 | 株式会社小糸製作所 | Module électroluminescent |
JP2019208033A (ja) * | 2012-05-09 | 2019-12-05 | ローム株式会社 | 発光装置 |
WO2016052471A1 (fr) * | 2014-10-02 | 2016-04-07 | ウシオ電機株式会社 | Module électroluminescent |
CN112703595A (zh) * | 2018-09-19 | 2021-04-23 | 三星显示有限公司 | 发光器件及具有该发光器件的显示装置 |
CN112703595B (zh) * | 2018-09-19 | 2024-08-23 | 三星显示有限公司 | 发光器件及具有该发光器件的显示装置 |
JP2021090052A (ja) * | 2019-12-05 | 2021-06-10 | オプティツ インコーポレイテッド | モノリシック多焦点光源デバイス |
Also Published As
Publication number | Publication date |
---|---|
JPH0744029Y2 (ja) | 1995-10-09 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |