JPH048756A - Resin composition for sealing - Google Patents

Resin composition for sealing

Info

Publication number
JPH048756A
JPH048756A JP11105690A JP11105690A JPH048756A JP H048756 A JPH048756 A JP H048756A JP 11105690 A JP11105690 A JP 11105690A JP 11105690 A JP11105690 A JP 11105690A JP H048756 A JPH048756 A JP H048756A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
resin
pts
compounding
wt
inorganic filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11105690A
Inventor
Yutaka Hori
Original Assignee
Aica Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Abstract

PURPOSE: To obtain a composition giving a cured article having excellent heat- resistance, high moisture resistance and low residual strain by compounding an unsaturated melamine resin with an inorganic filler.
CONSTITUTION: The objective composition is produced by compounding 10-80 pts.wt. of an unsaturated melamine resin used as a main resin component with 90-20 pts.wt. of an inorganic filler. The resin is preferably produced by reacting 1mol of melamine with 6mols of formaldehyde.
COPYRIGHT: (C)1992,JPO&Japio
JP11105690A 1990-04-27 1990-04-27 Resin composition for sealing Pending JPH048756A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11105690A JPH048756A (en) 1990-04-27 1990-04-27 Resin composition for sealing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11105690A JPH048756A (en) 1990-04-27 1990-04-27 Resin composition for sealing

Publications (1)

Publication Number Publication Date
JPH048756A true true JPH048756A (en) 1992-01-13

Family

ID=14551287

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11105690A Pending JPH048756A (en) 1990-04-27 1990-04-27 Resin composition for sealing

Country Status (1)

Country Link
JP (1) JPH048756A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5920117A (en) * 1994-08-02 1999-07-06 Fujitsu Limited Semiconductor device and method of forming the device
US7640920B2 (en) 2007-10-25 2010-01-05 Aisan Kogyo Kabushiki Kaisha Fuel vapor processing apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59120614A (en) * 1982-12-27 1984-07-12 Hitachi Chem Co Ltd Molding resin composition

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59120614A (en) * 1982-12-27 1984-07-12 Hitachi Chem Co Ltd Molding resin composition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5920117A (en) * 1994-08-02 1999-07-06 Fujitsu Limited Semiconductor device and method of forming the device
US7640920B2 (en) 2007-10-25 2010-01-05 Aisan Kogyo Kabushiki Kaisha Fuel vapor processing apparatus

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