JPH0485741U - - Google Patents

Info

Publication number
JPH0485741U
JPH0485741U JP12647290U JP12647290U JPH0485741U JP H0485741 U JPH0485741 U JP H0485741U JP 12647290 U JP12647290 U JP 12647290U JP 12647290 U JP12647290 U JP 12647290U JP H0485741 U JPH0485741 U JP H0485741U
Authority
JP
Japan
Prior art keywords
engaging
solder coating
lead frame
pressing
pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12647290U
Other languages
English (en)
Japanese (ja)
Other versions
JP2527420Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12647290U priority Critical patent/JP2527420Y2/ja
Publication of JPH0485741U publication Critical patent/JPH0485741U/ja
Application granted granted Critical
Publication of JP2527420Y2 publication Critical patent/JP2527420Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP12647290U 1990-11-30 1990-11-30 電子部品のはんだ被覆装置 Expired - Fee Related JP2527420Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12647290U JP2527420Y2 (ja) 1990-11-30 1990-11-30 電子部品のはんだ被覆装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12647290U JP2527420Y2 (ja) 1990-11-30 1990-11-30 電子部品のはんだ被覆装置

Publications (2)

Publication Number Publication Date
JPH0485741U true JPH0485741U (US07922777-20110412-C00004.png) 1992-07-24
JP2527420Y2 JP2527420Y2 (ja) 1997-02-26

Family

ID=31874028

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12647290U Expired - Fee Related JP2527420Y2 (ja) 1990-11-30 1990-11-30 電子部品のはんだ被覆装置

Country Status (1)

Country Link
JP (1) JP2527420Y2 (US07922777-20110412-C00004.png)

Also Published As

Publication number Publication date
JP2527420Y2 (ja) 1997-02-26

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees