JPH0472751A - Semiconductor lead frame and manufacture thereof - Google Patents

Semiconductor lead frame and manufacture thereof

Info

Publication number
JPH0472751A
JPH0472751A JP18592390A JP18592390A JPH0472751A JP H0472751 A JPH0472751 A JP H0472751A JP 18592390 A JP18592390 A JP 18592390A JP 18592390 A JP18592390 A JP 18592390A JP H0472751 A JPH0472751 A JP H0472751A
Authority
JP
Japan
Prior art keywords
lead
lead frame
thin
reinforced
concerned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18592390A
Other languages
Japanese (ja)
Inventor
Takahide Ono
Yoshio Ozeki
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Priority to JP18592390A priority Critical patent/JPH0472751A/en
Publication of JPH0472751A publication Critical patent/JPH0472751A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To realize a lead frame where pins are remarkably enhanced in number by a method wherein the lead frame is provided with a thin part located close to an IC chip, and the thick part of the lead frame is reinforced with a synthetic resin film.
CONSTITUTION: A lead frame metal board is prepared, an outer lead section 1, a die pad 5, and a sprocket hole 4 are provided to the board concerned through processing, and an inner lead 2 section is formed thin. Then, a synthetic resin film 3 is pasted on the thin part concerned. Furthermore, the thin part is processed into an inner lead 2. In another method, a part to be reinforced is formed thin, the part concerned is reinforced with a synthetic resin film, and then the outer lead l, the inner lead 2, and others are provided through processing.
COPYRIGHT: (C)1992,JPO&Japio
JP18592390A 1990-07-13 1990-07-13 Semiconductor lead frame and manufacture thereof Pending JPH0472751A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18592390A JPH0472751A (en) 1990-07-13 1990-07-13 Semiconductor lead frame and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18592390A JPH0472751A (en) 1990-07-13 1990-07-13 Semiconductor lead frame and manufacture thereof

Publications (1)

Publication Number Publication Date
JPH0472751A true JPH0472751A (en) 1992-03-06

Family

ID=16179246

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18592390A Pending JPH0472751A (en) 1990-07-13 1990-07-13 Semiconductor lead frame and manufacture thereof

Country Status (1)

Country Link
JP (1) JPH0472751A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5998547A (en) * 1982-11-26 1984-06-06 Hitachi Ltd Semiconductor device and manufacture thereof
JPH02228058A (en) * 1989-03-01 1990-09-11 Mitsubishi Electric Corp Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5998547A (en) * 1982-11-26 1984-06-06 Hitachi Ltd Semiconductor device and manufacture thereof
JPH02228058A (en) * 1989-03-01 1990-09-11 Mitsubishi Electric Corp Semiconductor device

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