JPH0472605U - - Google Patents

Info

Publication number

JPH0472605U

JPH0472605U JP11619990U JP11619990U JPH0472605U JP H0472605 U JPH0472605 U JP H0472605U JP 11619990 U JP11619990 U JP 11619990U JP 11619990 U JP11619990 U JP 11619990U JP H0472605 U JPH0472605 U JP H0472605U

Authority

JP

Japan

Prior art keywords

base

lead wire

terminal

mount type

surface mount

Prior art date

1990-11-07

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 6
• 238000005476 soldering Methods 0.000 claims description 2
• 238000005452 bending Methods 0.000 description 2