JPH0469815U - - Google Patents

Info

Publication number

JPH0469815U

JPH0469815U JP11208290U JP11208290U JPH0469815U JP H0469815 U JPH0469815 U JP H0469815U JP 11208290 U JP11208290 U JP 11208290U JP 11208290 U JP11208290 U JP 11208290U JP H0469815 U JPH0469815 U JP H0469815U

Authority

JP

Japan

Prior art keywords

conductor

thin copper

brazing material

multilayer structure

connection part

Prior art date

1990-10-29

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
• 229910052802 copper Inorganic materials 0.000 claims description 4
• 239000010949 copper Substances 0.000 claims description 4
• 238000005219 brazing Methods 0.000 claims description 3
• 239000000463 material Substances 0.000 claims description 3
• 239000004020 conductor Substances 0.000 claims 4
• 238000003466 welding Methods 0.000 claims 2
• 238000010438 heat treatment Methods 0.000 claims 1
• 238000010030 laminating Methods 0.000 claims 1
• 238000003825 pressing Methods 0.000 claims 1
• 239000011324 bead Substances 0.000 description 4
• 238000003475 lamination Methods 0.000 description 1

Cited By (1)