JPH0467347U - - Google Patents

Info

Publication number

JPH0467347U

JPH0467347U JP11087190U JP11087190U JPH0467347U JP H0467347 U JPH0467347 U JP H0467347U JP 11087190 U JP11087190 U JP 11087190U JP 11087190 U JP11087190 U JP 11087190U JP H0467347 U JPH0467347 U JP H0467347U

Authority

JP

Japan

Prior art keywords

heat sink

wiring board

printed wiring

electronic component

hole provided

Prior art date

1990-10-23

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 125000006850 spacer group Chemical group 0.000 claims description 5
• 239000011888 foil Substances 0.000 claims description 4
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
• 230000003139 buffering effect Effects 0.000 claims 1
• 239000004065 semiconductor Substances 0.000 description 4
• 239000010445 mica Substances 0.000 description 2
• 229910052618 mica group Inorganic materials 0.000 description 2
• 238000005476 soldering Methods 0.000 description 2