JPH0463651U - - Google Patents
Info
- Publication number
- JPH0463651U JPH0463651U JP10733690U JP10733690U JPH0463651U JP H0463651 U JPH0463651 U JP H0463651U JP 10733690 U JP10733690 U JP 10733690U JP 10733690 U JP10733690 U JP 10733690U JP H0463651 U JPH0463651 U JP H0463651U
- Authority
- JP
- Japan
- Prior art keywords
- protrusion
- metal plate
- groove
- metal ball
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10733690U JPH0463651U (US07943777-20110517-C00090.png) | 1990-10-12 | 1990-10-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10733690U JPH0463651U (US07943777-20110517-C00090.png) | 1990-10-12 | 1990-10-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0463651U true JPH0463651U (US07943777-20110517-C00090.png) | 1992-05-29 |
Family
ID=31853802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10733690U Pending JPH0463651U (US07943777-20110517-C00090.png) | 1990-10-12 | 1990-10-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0463651U (US07943777-20110517-C00090.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004207038A (ja) * | 2002-12-25 | 2004-07-22 | Sharp Corp | 接続装置 |
-
1990
- 1990-10-12 JP JP10733690U patent/JPH0463651U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004207038A (ja) * | 2002-12-25 | 2004-07-22 | Sharp Corp | 接続装置 |
