JPH0463642U - - Google Patents

Info

Publication number
JPH0463642U
JPH0463642U JP1990106682U JP10668290U JPH0463642U JP H0463642 U JPH0463642 U JP H0463642U JP 1990106682 U JP1990106682 U JP 1990106682U JP 10668290 U JP10668290 U JP 10668290U JP H0463642 U JPH0463642 U JP H0463642U
Authority
JP
Japan
Prior art keywords
cover
handler
cutting
state
detects
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990106682U
Other languages
English (en)
Japanese (ja)
Other versions
JP2520796Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990106682U priority Critical patent/JP2520796Y2/ja
Priority to KR1019910017602A priority patent/KR960007507B1/ko
Priority to US07/774,811 priority patent/US5177469A/en
Publication of JPH0463642U publication Critical patent/JPH0463642U/ja
Priority to KR1019960000786A priority patent/KR960007506B1/ko
Application granted granted Critical
Publication of JP2520796Y2 publication Critical patent/JP2520796Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP1990106682U 1990-10-08 1990-10-11 Ｉｃハンドラ Expired - Fee Related JP2520796Y2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP1990106682U JP2520796Y2 (ja) 1990-10-11 1990-10-11 Ｉｃハンドラ
KR1019910017602A KR960007507B1 (ko) 1990-10-08 1991-10-08 Ic시험장치
US07/774,811 US5177469A (en) 1990-10-11 1991-10-11 Safety device for an IC handler and method for its operation
KR1019960000786A KR960007506B1 (ko) 1990-10-11 1996-01-17 Ic핸들러용 안전장치 및 그의 동작방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990106682U JP2520796Y2 (ja) 1990-10-11 1990-10-11 Ｉｃハンドラ

Publications (2)

Publication Number Publication Date
JPH0463642U true JPH0463642U (US07642317-20100105-C00010.png) 1992-05-29
JP2520796Y2 JP2520796Y2 (ja) 1996-12-18

Family

ID=14439838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990106682U Expired - Fee Related JP2520796Y2 (ja) 1990-10-08 1990-10-11 Ｉｃハンドラ

Country Status (2)

Country Link
US (1) US5177469A (US07642317-20100105-C00010.png)
JP (1) JP2520796Y2 (US07642317-20100105-C00010.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10277902A (ja) * 1997-03-31 1998-10-20 Nidek Co Ltd レンズ研削加工装置

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5982285A (en) * 1998-05-14 1999-11-09 Bueche; Kenneth M. Compliance monitoring system
US6206073B1 (en) 1999-10-12 2001-03-27 John Jacob Lay Safety system for use with a grain bin
KR100951608B1 (ko) * 2007-06-13 2010-04-09 이명진 시그널 타워 및 그 통합시스템
US20100045458A1 (en) * 2008-08-19 2010-02-25 Silverbrook Research Pty Ltd Safety system for an integrated circuit alignment testing apparatus
US7880900B2 (en) * 2008-08-19 2011-02-01 Silverbrook Research Pty Ltd Measuring apparatus for performing positional analysis on an integrated circuit carrier
US7924440B2 (en) * 2008-08-19 2011-04-12 Silverbrook Research Pty Ltd Imaging apparatus for imaging integrated circuits on an integrated circuit carrier
US20100045729A1 (en) * 2008-08-19 2010-02-25 Silverbrook Research Pty Ltd Method for testing alignment of a test bed with a plurality of integrated circuits thereon
US8915368B2 (en) * 2012-09-20 2014-12-23 Shenzhen China Star Optoelectronics Technology Co., Ltd LCD glass substrate storage tray

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3631447A (en) * 1969-07-11 1971-12-28 Hudson Tool & Die Co Inc Safety alarm
KR0177589B1 (en) * 1987-02-13 1999-04-15 Tokyo Electron Ltd Wafer accounting and processing system
US4987407A (en) * 1988-04-22 1991-01-22 Asq. Boats, Inc. Wafer interleaving with electro-optical safety features

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10277902A (ja) * 1997-03-31 1998-10-20 Nidek Co Ltd レンズ研削加工装置

Also Published As

Publication number Publication date
JP2520796Y2 (ja) 1996-12-18
US5177469A (en) 1993-01-05

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees