JPH0463153U - - Google Patents

Info

Publication number
JPH0463153U
JPH0463153U JP10422190U JP10422190U JPH0463153U JP H0463153 U JPH0463153 U JP H0463153U JP 10422190 U JP10422190 U JP 10422190U JP 10422190 U JP10422190 U JP 10422190U JP H0463153 U JPH0463153 U JP H0463153U
Authority
JP
Japan
Prior art keywords
sealed
resin
semiconductor element
lead frame
element mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10422190U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10422190U priority Critical patent/JPH0463153U/ja
Publication of JPH0463153U publication Critical patent/JPH0463153U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP10422190U 1990-10-03 1990-10-03 Pending JPH0463153U (US20030157376A1-20030821-M00001.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10422190U JPH0463153U (US20030157376A1-20030821-M00001.png) 1990-10-03 1990-10-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10422190U JPH0463153U (US20030157376A1-20030821-M00001.png) 1990-10-03 1990-10-03

Publications (1)

Publication Number Publication Date
JPH0463153U true JPH0463153U (US20030157376A1-20030821-M00001.png) 1992-05-29

Family

ID=31849424

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10422190U Pending JPH0463153U (US20030157376A1-20030821-M00001.png) 1990-10-03 1990-10-03

Country Status (1)

Country Link
JP (1) JPH0463153U (US20030157376A1-20030821-M00001.png)

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