JPH0463128U - - Google Patents

Info

Publication number
JPH0463128U
JPH0463128U JP10541790U JP10541790U JPH0463128U JP H0463128 U JPH0463128 U JP H0463128U JP 10541790 U JP10541790 U JP 10541790U JP 10541790 U JP10541790 U JP 10541790U JP H0463128 U JPH0463128 U JP H0463128U
Authority
JP
Japan
Prior art keywords
collet
die bonding
semiconductor device
lead frame
relief
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10541790U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10541790U priority Critical patent/JPH0463128U/ja
Publication of JPH0463128U publication Critical patent/JPH0463128U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75Apparatus for connecting with bump connectors or layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525Means for applying energy, e.g. heating means
    • H01L2224/753Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301Bonding head
    • H01L2224/75302Shape
    • H01L2224/75303Shape of the pressing surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP10541790U 1990-10-05 1990-10-05 Pending JPH0463128U (US20110009641A1-20110113-C00185.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10541790U JPH0463128U (US20110009641A1-20110113-C00185.png) 1990-10-05 1990-10-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10541790U JPH0463128U (US20110009641A1-20110113-C00185.png) 1990-10-05 1990-10-05

Publications (1)

Publication Number Publication Date
JPH0463128U true JPH0463128U (US20110009641A1-20110113-C00185.png) 1992-05-29

Family

ID=31851094

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10541790U Pending JPH0463128U (US20110009641A1-20110113-C00185.png) 1990-10-05 1990-10-05

Country Status (1)

Country Link
JP (1) JPH0463128U (US20110009641A1-20110113-C00185.png)

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