JPH0459815A - Production of polymer polyol - Google Patents
Production of polymer polyolInfo
- Publication number
- JPH0459815A JPH0459815A JP2173862A JP17386290A JPH0459815A JP H0459815 A JPH0459815 A JP H0459815A JP 2173862 A JP2173862 A JP 2173862A JP 17386290 A JP17386290 A JP 17386290A JP H0459815 A JPH0459815 A JP H0459815A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- polyol
- epoxy
- curing agent
- polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005862 polyol Polymers 0.000 title claims abstract description 58
- 150000003077 polyols Chemical class 0.000 title claims abstract description 56
- 229920000642 polymer Polymers 0.000 title claims description 30
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000003822 epoxy resin Substances 0.000 claims abstract description 40
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 40
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 19
- 239000004593 Epoxy Substances 0.000 claims abstract description 18
- 239000000203 mixture Substances 0.000 claims abstract description 18
- 239000003054 catalyst Substances 0.000 claims abstract description 11
- 239000002245 particle Substances 0.000 claims abstract description 10
- 230000004087 circulation Effects 0.000 claims abstract description 8
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 7
- 125000000524 functional group Chemical group 0.000 claims abstract description 5
- 238000003756 stirring Methods 0.000 abstract description 13
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 abstract description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract description 5
- 239000007788 liquid Substances 0.000 abstract description 4
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract 2
- -1 acrylic polyols Chemical class 0.000 description 25
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 10
- 229920000768 polyamine Polymers 0.000 description 9
- 125000002947 alkylene group Chemical group 0.000 description 8
- 125000004432 carbon atom Chemical group C* 0.000 description 8
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 7
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- 229920000570 polyether Polymers 0.000 description 6
- 239000004721 Polyphenylene oxide Substances 0.000 description 5
- 125000001931 aliphatic group Chemical group 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 4
- 229930185605 Bisphenol Natural products 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- 125000002723 alicyclic group Chemical group 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 4
- 150000005846 sugar alcohols Polymers 0.000 description 4
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 3
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 3
- 239000005062 Polybutadiene Substances 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- GKXVJHDEWHKBFH-UHFFFAOYSA-N [2-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC=C1CN GKXVJHDEWHKBFH-UHFFFAOYSA-N 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 150000002009 diols Chemical class 0.000 description 3
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- 235000011007 phosphoric acid Nutrition 0.000 description 3
- 229920002857 polybutadiene Polymers 0.000 description 3
- 229920005906 polyester polyol Polymers 0.000 description 3
- 229920001195 polyisoprene Polymers 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 2
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 2
- XYUINKARGUCCQJ-UHFFFAOYSA-N 3-imino-n-propylpropan-1-amine Chemical compound CCCNCCC=N XYUINKARGUCCQJ-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- WQDUMFSSJAZKTM-UHFFFAOYSA-N Sodium methoxide Chemical compound [Na+].[O-]C WQDUMFSSJAZKTM-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- MRNZSTMRDWRNNR-UHFFFAOYSA-N bis(hexamethylene)triamine Chemical compound NCCCCCCNCCCCCCN MRNZSTMRDWRNNR-UHFFFAOYSA-N 0.000 description 2
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000001273 butane Substances 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- YADSGOSSYOOKMP-UHFFFAOYSA-N dioxolead Chemical compound O=[Pb]=O YADSGOSSYOOKMP-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- 125000000623 heterocyclic group Chemical group 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 150000003016 phosphoric acids Chemical class 0.000 description 2
- 150000003018 phosphorus compounds Chemical class 0.000 description 2
- 229920001281 polyalkylene Polymers 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- RSJKGSCJYJTIGS-UHFFFAOYSA-N undecane Chemical compound CCCCCCCCCCC RSJKGSCJYJTIGS-UHFFFAOYSA-N 0.000 description 2
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical class C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 description 1
- FVCWZBVQRLEGDH-UHFFFAOYSA-N 1,2,2-trimethylcyclohexan-1-amine Chemical compound CC1(C)CCCCC1(C)N FVCWZBVQRLEGDH-UHFFFAOYSA-N 0.000 description 1
- CIPOCPJRYUFXLL-UHFFFAOYSA-N 2,3,4-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC=C(O)C(CN(C)C)=C1CN(C)C CIPOCPJRYUFXLL-UHFFFAOYSA-N 0.000 description 1
- VOZKAJLKRJDJLL-UHFFFAOYSA-N 2,4-diaminotoluene Chemical compound CC1=CC=C(N)C=C1N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 1
- OBETXYAYXDNJHR-UHFFFAOYSA-N 2-Ethylhexanoic acid Chemical compound CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical class NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 1
- FZIIBDOXPQOKBP-UHFFFAOYSA-N 2-methyloxetane Chemical compound CC1CCO1 FZIIBDOXPQOKBP-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- OCKYRUXIGBXXSZ-UHFFFAOYSA-N 2-piperazin-1-ylethane-1,1-diamine Chemical compound NC(N)CN1CCNCC1 OCKYRUXIGBXXSZ-UHFFFAOYSA-N 0.000 description 1
- JRBJSXQPQWSCCF-UHFFFAOYSA-N 3,3'-Dimethoxybenzidine Chemical compound C1=C(N)C(OC)=CC(C=2C=C(OC)C(N)=CC=2)=C1 JRBJSXQPQWSCCF-UHFFFAOYSA-N 0.000 description 1
- WECDUOXQLAIPQW-UHFFFAOYSA-N 4,4'-Methylene bis(2-methylaniline) Chemical compound C1=C(N)C(C)=CC(CC=2C=C(C)C(N)=CC=2)=C1 WECDUOXQLAIPQW-UHFFFAOYSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- IBOFVQJTBBUKMU-UHFFFAOYSA-N 4,4'-methylene-bis-(2-chloroaniline) Chemical compound C1=C(Cl)C(N)=CC=C1CC1=CC=C(N)C(Cl)=C1 IBOFVQJTBBUKMU-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- KOGSPLLRMRSADR-UHFFFAOYSA-N 4-(2-aminopropan-2-yl)-1-methylcyclohexan-1-amine Chemical compound CC(C)(N)C1CCC(C)(N)CC1 KOGSPLLRMRSADR-UHFFFAOYSA-N 0.000 description 1
- JKETWUADWJKEKN-UHFFFAOYSA-N 4-(3,4-diaminophenyl)sulfonylbenzene-1,2-diamine Chemical compound C1=C(N)C(N)=CC=C1S(=O)(=O)C1=CC=C(N)C(N)=C1 JKETWUADWJKEKN-UHFFFAOYSA-N 0.000 description 1
- DGUJJOYLOCXENZ-UHFFFAOYSA-N 4-[2-[4-(oxiran-2-ylmethoxy)phenyl]propan-2-yl]phenol Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 DGUJJOYLOCXENZ-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-KVTDHHQDSA-N D-Mannitol Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-KVTDHHQDSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- RFSUNEUAIZKAJO-ARQDHWQXSA-N Fructose Chemical compound OC[C@H]1O[C@](O)(CO)[C@@H](O)[C@@H]1O RFSUNEUAIZKAJO-ARQDHWQXSA-N 0.000 description 1
- 229930091371 Fructose Natural products 0.000 description 1
- 239000005715 Fructose Substances 0.000 description 1
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 1
- 229930195725 Mannitol Natural products 0.000 description 1
- UEZVMMHDMIWARA-UHFFFAOYSA-N Metaphosphoric acid Chemical compound OP(=O)=O UEZVMMHDMIWARA-UHFFFAOYSA-N 0.000 description 1
- OKIZCWYLBDKLSU-UHFFFAOYSA-M N,N,N-Trimethylmethanaminium chloride Chemical compound [Cl-].C[N+](C)(C)C OKIZCWYLBDKLSU-UHFFFAOYSA-M 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- AWMVMTVKBNGEAK-UHFFFAOYSA-N Styrene oxide Chemical compound C1OC1C1=CC=CC=C1 AWMVMTVKBNGEAK-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- CZMRCDWAGMRECN-UGDNZRGBSA-N Sucrose Chemical compound O[C@H]1[C@H](O)[C@@H](CO)O[C@@]1(CO)O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 CZMRCDWAGMRECN-UGDNZRGBSA-N 0.000 description 1
- 229930006000 Sucrose Natural products 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- TVXBFESIOXBWNM-UHFFFAOYSA-N Xylitol Natural products OCCC(O)C(O)C(O)CCO TVXBFESIOXBWNM-UHFFFAOYSA-N 0.000 description 1
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229920001893 acrylonitrile styrene Polymers 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001339 alkali metal compounds Chemical class 0.000 description 1
- 125000005250 alkyl acrylate group Chemical group 0.000 description 1
- 125000005263 alkylenediamine group Chemical group 0.000 description 1
- SMZOGRDCAXLAAR-UHFFFAOYSA-N aluminium isopropoxide Chemical compound [Al+3].CC(C)[O-].CC(C)[O-].CC(C)[O-] SMZOGRDCAXLAAR-UHFFFAOYSA-N 0.000 description 1
- LHIJANUOQQMGNT-UHFFFAOYSA-N aminoethylethanolamine Chemical compound NCCNCCO LHIJANUOQQMGNT-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 150000001448 anilines Chemical class 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 230000000844 anti-bacterial effect Effects 0.000 description 1
- 229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 description 1
- 150000001463 antimony compounds Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 239000003899 bactericide agent Substances 0.000 description 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 1
- KXHPPCXNWTUNSB-UHFFFAOYSA-M benzyl(trimethyl)azanium;chloride Chemical compound [Cl-].C[N+](C)(C)CC1=CC=CC=C1 KXHPPCXNWTUNSB-UHFFFAOYSA-M 0.000 description 1
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- 150000001639 boron compounds Chemical class 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- SHZIWNPUGXLXDT-UHFFFAOYSA-N caproic acid ethyl ester Natural products CCCCCC(=O)OCC SHZIWNPUGXLXDT-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- 238000011437 continuous method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- PDXRQENMIVHKPI-UHFFFAOYSA-N cyclohexane-1,1-diol Chemical compound OC1(O)CCCCC1 PDXRQENMIVHKPI-UHFFFAOYSA-N 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- GEQHKFFSPGPGLN-UHFFFAOYSA-N cyclohexane-1,3-diamine Chemical compound NC1CCCC(N)C1 GEQHKFFSPGPGLN-UHFFFAOYSA-N 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- KEIQPMUPONZJJH-UHFFFAOYSA-N dicyclohexylmethanediamine Chemical compound C1CCCCC1C(N)(N)C1CCCCC1 KEIQPMUPONZJJH-UHFFFAOYSA-N 0.000 description 1
- HQWPLXHWEZZGKY-UHFFFAOYSA-N diethylzinc Chemical compound CC[Zn]CC HQWPLXHWEZZGKY-UHFFFAOYSA-N 0.000 description 1
- 229940105990 diglycerin Drugs 0.000 description 1
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Natural products C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-N diphosphoric acid Chemical compound OP(O)(=O)OP(O)(O)=O XPPKVPWEQAFLFU-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- LRMHFDNWKCSEQU-UHFFFAOYSA-N ethoxyethane;phenol Chemical compound CCOCC.OC1=CC=CC=C1 LRMHFDNWKCSEQU-UHFFFAOYSA-N 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- 235000001727 glucose Nutrition 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- TZMQHOJDDMFGQX-UHFFFAOYSA-N hexane-1,1,1-triol Chemical compound CCCCCC(O)(O)O TZMQHOJDDMFGQX-UHFFFAOYSA-N 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- LTRVAZKHJRYLRJ-UHFFFAOYSA-N lithium;butan-1-olate Chemical compound [Li+].CCCC[O-] LTRVAZKHJRYLRJ-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000000594 mannitol Substances 0.000 description 1
- 235000010355 mannitol Nutrition 0.000 description 1
- HEBKCHPVOIAQTA-UHFFFAOYSA-N meso ribitol Natural products OCC(O)C(O)C(O)CO HEBKCHPVOIAQTA-UHFFFAOYSA-N 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- HOVAGTYPODGVJG-ZFYZTMLRSA-N methyl alpha-D-glucopyranoside Chemical compound CO[C@H]1O[C@H](CO)[C@@H](O)[C@H](O)[C@H]1O HOVAGTYPODGVJG-ZFYZTMLRSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- LSHROXHEILXKHM-UHFFFAOYSA-N n'-[2-[2-[2-(2-aminoethylamino)ethylamino]ethylamino]ethyl]ethane-1,2-diamine Chemical compound NCCNCCNCCNCCNCCN LSHROXHEILXKHM-UHFFFAOYSA-N 0.000 description 1
- OHQOKJPHNPUMLN-UHFFFAOYSA-N n,n'-diphenylmethanediamine Chemical class C=1C=CC=CC=1NCNC1=CC=CC=C1 OHQOKJPHNPUMLN-UHFFFAOYSA-N 0.000 description 1
- OLAKSHDLGIUUET-UHFFFAOYSA-N n-anilinosulfanylaniline Chemical compound C=1C=CC=CC=1NSNC1=CC=CC=C1 OLAKSHDLGIUUET-UHFFFAOYSA-N 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- IGALFTFNPPBUDN-UHFFFAOYSA-N phenyl-[2,3,4,5-tetrakis(oxiran-2-ylmethyl)phenyl]methanediamine Chemical compound C=1C(CC2OC2)=C(CC2OC2)C(CC2OC2)=C(CC2OC2)C=1C(N)(N)C1=CC=CC=C1 IGALFTFNPPBUDN-UHFFFAOYSA-N 0.000 description 1
- DYFXGORUJGZJCA-UHFFFAOYSA-N phenylmethanediamine Chemical compound NC(N)C1=CC=CC=C1 DYFXGORUJGZJCA-UHFFFAOYSA-N 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 229920000137 polyphosphoric acid Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920003225 polyurethane elastomer Polymers 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- ZUFQCVZBBNZMKD-UHFFFAOYSA-M potassium 2-ethylhexanoate Chemical compound [K+].CCCCC(CC)C([O-])=O ZUFQCVZBBNZMKD-UHFFFAOYSA-M 0.000 description 1
- 235000011118 potassium hydroxide Nutrition 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 1
- RLJWTAURUFQFJP-UHFFFAOYSA-N propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CC(C)O.CC(C)O.CC(C)O RLJWTAURUFQFJP-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- APXBXAJWVZTKSE-UHFFFAOYSA-N pyridine-2,3,4-triamine Chemical compound NC1=CC=NC(N)=C1N APXBXAJWVZTKSE-UHFFFAOYSA-N 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 229940005657 pyrophosphoric acid Drugs 0.000 description 1
- 150000003856 quaternary ammonium compounds Chemical class 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 235000010356 sorbitol Nutrition 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- VXUYXOFXAQZZMF-UHFFFAOYSA-N tetraisopropyl titanate Substances CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 1
- DDFYFBUWEBINLX-UHFFFAOYSA-M tetramethylammonium bromide Chemical compound [Br-].C[N+](C)(C)C DDFYFBUWEBINLX-UHFFFAOYSA-M 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- VOITXYVAKOUIBA-UHFFFAOYSA-N triethylaluminium Chemical compound CC[Al](CC)CC VOITXYVAKOUIBA-UHFFFAOYSA-N 0.000 description 1
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000000811 xylitol Substances 0.000 description 1
- HEBKCHPVOIAQTA-SCDXWVJYSA-N xylitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)CO HEBKCHPVOIAQTA-SCDXWVJYSA-N 0.000 description 1
- 235000010447 xylitol Nutrition 0.000 description 1
- 229960002675 xylitol Drugs 0.000 description 1
- 239000004246 zinc acetate Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polyethers (AREA)
- Polyurethanes Or Polyureas (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野〕
本発明は成形性と物理的性質の優れたウレタン系複合樹
脂を製造する際に使用することのできるポリマーポリオ
ール組成物の製造法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for producing a polymer polyol composition that can be used in producing a urethane-based composite resin having excellent moldability and physical properties.
[従来の技術]
従来、ポリオール中でアクリロニトリル、スチレン等の
モノマーをラジカル重合させて製造したポリマーポリオ
ールをウレタン系合成樹脂の原料として使用する方法が
知られている。[Prior Art] Conventionally, a method is known in which a polymer polyol produced by radical polymerization of monomers such as acrylonitrile and styrene in a polyol is used as a raw material for a urethane-based synthetic resin.
[発明が解決しようとする課題]
しか□し、この方法では、ポリマー含量を多くすると、
粘度が著しく上昇し、硬度や耐熱性を上げるのが困難で
あった。また、ポリマーポリオール中のポリマー成分と
してエポキシ樹脂硬化物をポリオール中に均一に分散し
たものは、従来見いだされていなかった。[Problem to be solved by the invention] However, in this method, when the polymer content is increased,
The viscosity increased significantly, making it difficult to increase hardness and heat resistance. Furthermore, a polymer polyol in which a cured epoxy resin is uniformly dispersed as a polymer component in a polyol has not been found so far.
[課題を解決するための手段]
本発明者らはポリオール中にエポキシ樹脂硬化物を均一
に、かつ安定に分散させたポリマーポリオールを得るべ
く鋭意検討を重ねた結果、本発明に到達した。すなわち
本発明は、(a)水酸基当量200〜20.000で1
分子当たりの平均官能基数が2〜8であるポリオール、
(b)エポキシ樹脂および、(c)エポキシ硬化剤およ
び/またはエポキシ硬化触媒を、循環回数が0〜3/分
なる条件下で攪拌して反応させる(a)中にエポキシ樹
脂硬化物の粒子が分散されているポリマーポリオール(
重合体ポリオール)の製造方法および、管中に流速(V
)と管径(D)(llt (V/D) が、0.001
〜4/分なる条件下で流して反応させるポリマーポリオ
ール(重合体ポリオール)製造方法である。[Means for Solving the Problems] The present inventors have conducted extensive studies to obtain a polymer polyol in which a cured epoxy resin is uniformly and stably dispersed in a polyol, and as a result, they have arrived at the present invention. That is, the present invention provides (a) hydroxyl group equivalent of 200 to 20,000 and 1
a polyol having an average number of functional groups per molecule of 2 to 8;
(b) Epoxy resin and (c) epoxy curing agent and/or epoxy curing catalyst are stirred and reacted under conditions such that the number of circulation is 0 to 3/min. Dispersed polymer polyol (
Polymer polyol) and flow rate (V
) and tube diameter (D) (llt (V/D) are 0.001
This is a method for producing a polymer polyol (polymer polyol) in which the reaction is caused to flow under conditions of ~4/min.
本発明において使用されるポリオールとしては、水酸基
当量200〜20,000で1分子当たりの平均官能基
数が2〜8であるポリエーテルポリオール、ポリエステ
ルポリオール、ポリジエン系ポリオールおよびその水添
化物ならびにアクリルポリオールからなる群より選ばれ
る1種または2種以上の混合物があげられる。The polyols used in the present invention include polyether polyols, polyester polyols, polydiene polyols and their hydrogenated products, and acrylic polyols having a hydroxyl equivalent of 200 to 20,000 and an average number of functional groups per molecule of 2 to 8. Examples include one type or a mixture of two or more types selected from the group consisting of:
ポリエーテルポリオールとしては、活性水素原子含有化
合物[OB、 N11a、 N11l、 C0O
Hなどの活性水素原子含有基を有する化合物、たとえば
多価アルコール類、多価フェノール類、アミン類、燐酸
類。As polyether polyols, active hydrogen atom-containing compounds [OB, N11a, N11l, C0O
Compounds having active hydrogen atom-containing groups such as H, such as polyhydric alcohols, polyhydric phenols, amines, and phosphoric acids.
カルボン酸類]にアルキレンオキサイドを付加して得ら
れる、分子中に2個以上の水酸基を有するポリエーテル
が挙げられる。Examples include polyethers having two or more hydroxyl groups in the molecule, which are obtained by adding alkylene oxide to [carboxylic acids].
上記ポリエーテルの製造に用いられる活性水素原子含有
化合物としては
(1)脂肪族および脂環式多価アルコール、たとえばア
ルキレングリコール(炭素数2〜8)[エチレングリコ
ール、プロピレングリコール、1.4−ブタンジオール
、l、3−ブタングリコール、ネオペンチルグリコール
、l、トヘキサンジオールなどコ、シクロヘキサンジオ
ール、シクロヘキサンジメタツール等のグリコール類:
グリセリン、 トリメチロールプロパン、トリメチロ
ールエタン、ヘキサントリオール、ペンタエリスリトー
ル、ジグリセリン、α−メチルグルコシド、ソルビトー
ル、キシリット、マンニット、グルコース、フラクトー
ス、蔗糖等の3〜8価のアルコール類:
(2)多価フェノール類、たとえば;ハイドロキノン、
カテコール、レゾルシン、ピロガロール、ビスフェノー
ル類(ビスフェノールA1 ビスフェノールスルフォ
ン、ビスフェノールFなど)、フェノール−ホルムアル
デヒド縮合物(ノボラック樹脂、レゾール樹脂の中間物
);
(3)脂肪族、脂環式、芳香族および複素環式の、モノ
−およびポリアミン類、たとえば; アンモニア;モノ
−、ジーおよびトリーの、エタノールアミンおよび/ま
たはプロパツールアミンなどのアルカノールアミン類;
モノ−およびジ−アルキル(炭素数l〜20)アミン、
アルキレン(アルキレンの炭素数2〜G)ジアミン(エ
チレンジアミン、ヘキサメチレンジアミンなど)、ポリ
アルキレン(アルキレンの炭素数2〜B)ポリアミン(
ジエチレントリアミン、トリエチレンテトラミン、ビス
へキサメチレントリアミンなど)等の脂肪族アミン;ア
ニリン、フェニレンジアミン、ジアミノトルエン、キシ
リレンジアミン、メチレンジアニリン、ジエ、チルトリ
レンジアミン、ジフェニルエーテルジアミンなどの芳香
族アミン類;イソホロンジアミン、ジシクロヘキシルメ
タンジアミンなどの脂環式アミン類:ピペラジン、アミ
ノエチJレビペラジン、その他特公開55−21044
号公報記載の複素環式アミン類など:
(4)脂肪族、脂環式および芳香族の、アジピン酸、テ
トラヒドロフタル酸、ヘキサヒドロフタル酸、フタル酸
などのジカルボン酸等;
(5)燐酸類、たとえば:正燐酸、メタ燐酸、ピロ燐酸
、ポリ燐酸、亜燐酸など;およびこれらの酸性エステル
(ジブチルピロ燐酸など)等;およびこれらの2種以上
の混合物が挙げられる。The active hydrogen atom-containing compounds used in the production of the above polyether include (1) aliphatic and alicyclic polyhydric alcohols, such as alkylene glycols (having 2 to 8 carbon atoms) [ethylene glycol, propylene glycol, 1,4-butane; Glycols such as diol, l,3-butane glycol, neopentyl glycol, l,tohexanediol, cyclohexanediol, cyclohexane dimetatool, etc.:
Tri- to octa-hydric alcohols such as glycerin, trimethylolpropane, trimethylolethane, hexanetriol, pentaerythritol, diglycerin, α-methylglucoside, sorbitol, xylitol, mannitol, glucose, fructose, sucrose: (2) polyhydric alcohols; phenols, such as; hydroquinone,
Catechol, resorcinol, pyrogallol, bisphenols (bisphenol A1, bisphenol sulfone, bisphenol F, etc.), phenol-formaldehyde condensate (novolac resin, intermediate for resol resin); (3) Aliphatic, alicyclic, aromatic and heterocyclic mono- and polyamines of the formula, such as; ammonia; mono-, di- and tri-alkanolamines such as ethanolamine and/or propatoolamine;
Mono- and di-alkyl (1 to 20 carbon atoms) amines,
Alkylene (alkylene has 2 to G carbon atoms) diamine (ethylene diamine, hexamethylene diamine, etc.), polyalkylene (alkylene has 2 to B carbon atoms) polyamine (
Aliphatic amines such as diethylenetriamine, triethylenetetramine, bishexamethylenetriamine, etc.; aromatic amines such as aniline, phenylenediamine, diaminotoluene, xylylenediamine, methylenedianiline, diethyl diamine, tyltrylenediamine, diphenyl ether diamine, etc. ; Alicyclic amines such as isophorone diamine and dicyclohexylmethane diamine: piperazine, aminoethyl J reviperazine, and others JP 55-21044
Heterocyclic amines described in the publication: (4) Aliphatic, alicyclic and aromatic dicarboxylic acids such as adipic acid, tetrahydrophthalic acid, hexahydrophthalic acid and phthalic acid; (5) Phosphoric acids Examples include: orthophosphoric acid, metaphosphoric acid, pyrophosphoric acid, polyphosphoric acid, phosphorous acid, etc.; and acidic esters thereof (dibutylpyrophosphoric acid, etc.); and mixtures of two or more thereof.
これらのうちで、好ましいのは多価アルコール類とくに
2〜3価のものである。Among these, polyhydric alcohols, especially dihydric to trihydric alcohols, are preferred.
活性水素含有化合物に付加するアルキレンオキサイドと
しては、エチレンオキサイド(以下EOと略記)、プロ
ピレンオキサイド(以下POと略記)1.2−、、、、
、2.3−および1,3−ブチレンオキサイド、テトラ
ヒドロフラン、スチレンオキサイド、エピクロルヒドリ
ン等、およびこれらの2種以上(たとえばEOとPO)
の併用(ランダムおよび/またはプロツり)が挙げられ
る。Examples of the alkylene oxide added to the active hydrogen-containing compound include ethylene oxide (hereinafter abbreviated as EO), propylene oxide (hereinafter abbreviated as PO),
, 2,3- and 1,3-butylene oxide, tetrahydrofuran, styrene oxide, epichlorohydrin, etc., and two or more of these (e.g. EO and PO)
combinations (random and/or random).
ポリエステルポリオールとしては、たとえば、アルキレ
ン(アルキレンの炭素数2〜6)グリコール[エチレン
グリコール、プロピレングリコール、1.4−ブタンジ
オール、■、3−ブタンジオール、ネオペンチルグリコ
ール
、シクロヘキサンジオール、シクロヘキサンジメタツー
ル等の2価アルコールの1種または2種以上の混合物と
、マロン酸、琥珀酸、アジピン酸、マレイン酸、フマル
酸、アゼライン酸、フタル酸、イソフタル酸、テレフタ
ル酸などの2aiカルボン酸およびこれらの無水物の工
種または、2種以上の混合物とから誘導される末端に水
酸基を有する縮合型のポリエステルポリオールおよび、
2価または、3価の低分子量ポリオールを開始剤とする
ε−カプロラクトンの開環重合で得られるポリカプロラ
クトンポリオールなどがあげられる。Examples of polyester polyols include alkylene (alkylene having 2 to 6 carbon atoms) glycol [ethylene glycol, propylene glycol, 1,4-butanediol, 3-butanediol, neopentyl glycol, cyclohexanediol, cyclohexane dimetatool] and 2ai carboxylic acids such as malonic acid, succinic acid, adipic acid, maleic acid, fumaric acid, azelaic acid, phthalic acid, isophthalic acid, and terephthalic acid; A condensed polyester polyol having a hydroxyl group at the end derived from an anhydride type or a mixture of two or more types, and
Examples include polycaprolactone polyols obtained by ring-opening polymerization of ε-caprolactone using a divalent or trivalent low molecular weight polyol as an initiator.
ポリジエン系ポリオールおよびその水添化物としては、
ポリブタジェンポリオール、水添ポリブタジェンポリオ
ール、ポリイソプレンジオール、水添ポリイソプレンジ
オールなどがあげられる。As polydiene polyols and their hydrogenated products,
Examples include polybutadiene polyol, hydrogenated polybutadiene polyol, polyisoprene diol, and hydrogenated polyisoprene diol.
アクリルポリオールとしては、メタクリル酸アルキル、
アクリル酸アルキル、スチレン、アクリロニトリルなど
の(メタ)アクリル系モノマーの1種または2種以上と
ヒドロキシエチル(メタ)アクリレートとの共重合物が
あげられる。As the acrylic polyol, alkyl methacrylate,
Examples include copolymers of one or more (meth)acrylic monomers such as alkyl acrylates, styrene, and acrylonitrile and hydroxyethyl (meth)acrylate.
これらのポリオールの分子量は、通常400〜40。The molecular weight of these polyols is usually 400-40.
000、好ましくは1,000〜20,000である。000, preferably 1,000 to 20,000.
本発明に使用できるエポキシ樹脂としては、通常のもの
、たとえば「新エポキシ樹脂」 [垣内弘著、(株)昭
晃堂、昭和60年5月10日発行]】5〜97頁、「基
礎合成樹脂の化学(新版)」[三羽忠広著、技報堂、昭
和50年発行コ371〜392頁、 「エポキシ・レジ
ンズ」[マグロ−ヒル・ブック・コンパニー社1957
年発行コロ〜29頁に記載のものが使用でき、具体的に
は下記のものが挙げられる。As the epoxy resin that can be used in the present invention, ordinary ones such as "New Epoxy Resin" [written by Hiroshi Kakiuchi, published by Shokodo Co., Ltd., May 10, 1985]] pages 5-97, "Basic Synthesis "Chemistry of Resins (New Edition)" [written by Tadahiro Miwa, Gihodo, published in 1975, pp. 371-392, "Epoxy Resins" [McGraw-Hill Book Company, 1957
Those described on page 29 of the 2010 issue can be used, and specific examples include the following.
(1)フェノールエーテル系エポキシ樹脂[たとえばビ
スフェノールA型エポキシ樹脂、ビスフェノールF型エ
ポキシ樹脂、ビスフェノールAD型エポキシ樹脂、ハロ
ゲン化ビスフェノールA型エポキシ樹脂、フェノールノ
ボラック型エポキシ樹脂、クレゾールノボラック型エポ
キシ樹脂、ハロゲン化フェノールノボラック型エポキシ
樹脂など];(2)エーテル系エポキシ樹脂[ポリオー
ル、ポリエーテルポリオール、などとエピクロルヒドリ
ンとの縮合物などコ;(3)エステル系エポキシ樹脂[
グリシジル(メタ)アクリレートとエチレン性不飽和単
量体(アクリロニトリルなど)との共重合体など];(
4)グリシジルアミン系エポキシ樹脂[たとえばアニリ
ン、ジアミノジフェニルメタン、アミノフェノール類、
キシリレンジアミン、ハロゲン化アニリン、ビスアミノ
メチルシクロヘキサンなどのアミン類とエピクロルヒド
リンとの縮合物などコ;(5)非グリシジル型エポキシ
樹脂[環吠エポキシ樹脂、エポキシ化ポリブタジェン、
エポキシ化大豆油など];およびこれらの2種以上の混
合物が挙げられる。これらのうち好ましいものは(1)
および(4)である。(1) Phenol ether epoxy resins [e.g. bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol AD epoxy resin, halogenated bisphenol A epoxy resin, phenol novolak epoxy resin, cresol novolac epoxy resin, halogenated (2) Ether-based epoxy resins (e.g., condensates of epichlorohydrin with polyols, polyether polyols, etc.); (3) Ester-based epoxy resins [
Copolymers of glycidyl (meth)acrylate and ethylenically unsaturated monomers (acrylonitrile, etc.);
4) Glycidylamine-based epoxy resins [e.g. aniline, diaminodiphenylmethane, aminophenols,
Condensates of amines such as xylylene diamine, halogenated aniline, and bisaminomethylcyclohexane with epichlorohydrin, etc.; (5) Non-glycidyl epoxy resins [ring epoxy resins, epoxidized polybutadiene,
epoxidized soybean oil, etc.]; and mixtures of two or more thereof. Among these, the preferred one is (1)
and (4).
本発明において、エポキシ樹脂の硬化に使用できる硬化
剤としては、アミノ化合物があげられる。In the present invention, examples of the curing agent that can be used for curing the epoxy resin include amino compounds.
具体例としては、(1)脂肪族ポリアミン類、たとえば
エチレンジアミン、テトラメチレンレンジアミン、ヘキ
サメチレンジアミンなどのアルキレンジアミン、ジエチ
レントリアミン、イミノビスプロピルアミン、ビス(ヘ
キサメチレン)トリアミン、トリエチレンテトラミン、
テトラエチレンペンタミン、ペンタエチレンヘキサミン
などのポリアルキレン(アルキレンの炭素数2〜6)ポ
リアミン、アルキル(炭素数1〜3)アミノプロピルア
ミン、アミノエチルエタノールアミンイミノビスプロピ
ルアミンなどのアルキル(炭素数1〜4)またはヒドロ
キシアルキル(アルキルの炭素数2〜4)アミン化合物
、キシリレンジアミン、テトラクロル−p−キシリレン
ジアミンなどの芳香環含有脂肪族アミン類、ポリオキシ
テトラメチレンポリナミン、ポリオキシプロピレンポリ
アミンなどのポリエーテルポリアミン類など、(2)脂
環または複素環含有脂肪族ポリアミン、たとえば、メン
タンジアミン、に−アミノエチルピペラジン、1、3−
ジアミノシクロヘキサン、イソホロンジアミン、水添メ
チレンジアニリン、3,9−ビス(3−アミノプロピル
)−2,4,8,10−テトラオキサスピロ[5゜5]
ウンデカンなど、(3)芳香族ポリアミンたとえば、フ
ェニレンジアミン、トルエンジアミン、ジアミノジフェ
ニルメタン、ジアミノジフェニルスルホン、ベンジジン
、4.4’−ビス(0−トルイジン)、チオジアニリン
、ジアニシジン、メチレンビス(o−クロロアニリン)
、ビス(3,4−ジアミノフェニル)スルホン、ジアミ
ノジトリルスルホン、2.トリアミノピリジン、4−ク
ロロ−〇−フェニレンジアミン、4−メトキシ−トメチ
ルー−−フェニレンジアミン、−一アミノベンジルアミ
ン、4.4’−ジアミノ−3,3′−ジメチルジフェニ
ルメタンなど、(4)ポリアミドポリアミン(上記ポリ
アミン類とダイマー酸との縮合物)(5)ベンゾグアナ
ミンおよび/またはアルキルグアナミンおよびその変性
物、および(6)ジシアンジアミドなどが挙げられる。Specific examples include (1) aliphatic polyamines, such as alkylene diamines such as ethylene diamine, tetramethylene diamine, hexamethylene diamine, diethylene triamine, iminobispropylamine, bis(hexamethylene) triamine, triethylenetetramine;
Polyalkylene (alkylene has 2 to 6 carbon atoms) polyamines such as tetraethylenepentamine and pentaethylenehexamine, alkyl (1 to 3 carbon atoms) aminopropylamine, aminoethylethanolamine, iminobispropylamine, etc. ~4) or hydroxyalkyl (alkyl having 2 to 4 carbon atoms) amine compounds, aromatic ring-containing aliphatic amines such as xylylene diamine, tetrachloro-p-xylylene diamine, polyoxytetramethylene polynamine, polyoxypropylene polyamine (2) alicyclic or heterocyclic-containing aliphatic polyamines, such as menthanediamine, di-aminoethylpiperazine, 1,3-
Diaminocyclohexane, isophorone diamine, hydrogenated methylene dianiline, 3,9-bis(3-aminopropyl)-2,4,8,10-tetraoxaspiro [5°5]
undecane, etc., (3) aromatic polyamines such as phenylenediamine, toluenediamine, diaminodiphenylmethane, diaminodiphenylsulfone, benzidine, 4,4'-bis(0-toluidine), thiodianiline, dianisidine, methylenebis(o-chloroaniline)
, bis(3,4-diaminophenyl)sulfone, diaminoditolylsulfone, 2. (4) Polyamide polyamines such as triaminopyridine, 4-chloro-〇-phenylenediamine, 4-methoxy-tomethyl-phenylenediamine, -monoaminobenzylamine, 4,4'-diamino-3,3'-dimethyldiphenylmethane, etc. (Condensates of the above polyamines and dimer acids) (5) Benzoguanamine and/or alkylguanamine and modified products thereof, and (6) dicyandiamide.
エポキシ硬化剤は通常、エポキシ樹脂のエポキシ基と当
量近辺(同じ当量数程度)の量用いられるが、何れかを
過剰に(たとえばlO%程度またはそれ以上)存在させ
てもよい。The epoxy curing agent is usually used in an amount close to the equivalent (about the same number of equivalents) as the epoxy group of the epoxy resin, but either may be present in excess (for example, about 10% or more).
エポキシ硬化剤とともに、またはエポキシ硬化剤に変え
てエポキシ硬化触媒を使用することができる。エポキシ
硬化触媒の具体例としては、(1)3級アミン類、たと
えば、ピリジン、キノリン、イミダゾール、N、トリメ
チルシクロヘキシルアミン。Epoxy curing catalysts can be used with or in place of epoxy curing agents. Specific examples of epoxy curing catalysts include (1) tertiary amines, such as pyridine, quinoline, imidazole, N, trimethylcyclohexylamine;
トリエチルアミン、N−メチルモルホリン、トエチルモ
ルホリン、 トリエチレンジアミン、N、トリメチルア
ミリン、N、トジメチルベンジルアミン、 トリス(N
、N−ジメチルアミノメチル)フェノールなど、(2)
第4級アンモニウム化合物、たとえば、テトラメチルア
ンモニウムクロライド、テトラメチルアンモニウムブロ
マイド、 トリメチルベンジルアンモニウムクロライド
、テトラメチルアンモニウムヒドロキシドなど、(3)
塩基性アルカリ金属化合物、たとえば、ソジウムメトキ
シド、苛性カリ。Triethylamine, N-methylmorpholine, toethylmorpholine, triethylenediamine, N, trimethylamyline, N, dimethylbenzylamine, tris(N
, N-dimethylaminomethyl)phenol, etc. (2)
Quaternary ammonium compounds, such as tetramethylammonium chloride, tetramethylammonium bromide, trimethylbenzylammonium chloride, tetramethylammonium hydroxide, etc. (3)
Basic alkali metal compounds, such as sodium methoxide, caustic potash.
2−エチルヘキサン酸カリウムなど、(4)金属ハロゲ
ン化物、たとえば5nC14,FeC15l 1tc
h、、 5bC1s+BF、、 ZnC15t
Zn9r2. Kl、 LICIなど、(5)有機
金属化合物、たとえば、トリエチルアルミニウム、アル
ムニウムイソプロポキシド、テトライソプロピルチタネ
ート、ジエチル亜鉛、n−ブトキシリチウム、酢酸亜鉛
、2−エチルヘキサン酸鉛、アセチルアセトネート化合
物(Fe、 Co)など、(6)リン系化合物、たと
えば、トリアルキルフォスフイン、トリアルキルフォス
フインオキシド、フォスフオニウム塩など、(7)硼素
化合物、たとえば、トリアルキル−、トリアリール−ま
たはトリシクロアルキルボレートなど、などが挙げられ
る。(4) Metal halides, such as potassium 2-ethylhexanoate, such as 5nC14, FeC15l 1tc
h,, 5bC1s+BF,, ZnC15t
Zn9r2. (5) organometallic compounds such as triethylaluminum, aluminum isopropoxide, tetraisopropyl titanate, diethylzinc, n-butoxylithium, zinc acetate, lead 2-ethylhexanoate, acetylacetonate compounds ( (6) phosphorus compounds, such as trialkylphosphine, trialkylphosphine oxide, phosphonium salts, etc., (7) boron compounds, such as trialkyl-, triaryl- or tricyclo Examples include alkyl borates and the like.
硬化触媒は通常のエポキシ樹脂の硬化に用いられる程度
の量、通常エポキシ樹脂の0.5〜20重量%、好まし
くは0.5〜10重量%が用いられる。The curing catalyst is used in an amount normally used for curing epoxy resins, usually 0.5 to 20% by weight, preferably 0.5 to 10% by weight of the epoxy resin.
本発明の組成物中のエポキシ樹脂硬化物粒子の割合は、
通常5〜80重量%、好ましくは10〜70重量%であ
る。The proportion of cured epoxy resin particles in the composition of the present invention is
It is usually 5 to 80% by weight, preferably 10 to 70% by weight.
本発明の組成物の製造に当り、必要により他の添加剤を
使用することができる。この添加剤としては、難燃剤(
リン化合物、ハロゲン化合物、アンチモン化合物など)
、着色剤(顔料、染料)、内部離型剤、老化防止剤、抗
酸化剤、可塑剤、殺菌剤および充填剤[カーボンブラッ
ク、酸化亜鉛、酸化カルシウム、二酸化鉛、酸化チタン
、ケインウ土、ガラス繊維およびその破砕物(カットガ
ラス、ミルドガラス、ガラスフレークなど)、ガラスバ
ルーン、有機バルーン、タルク、マイカtt ト]など
が挙げられる。In producing the composition of the present invention, other additives may be used as necessary. This additive includes flame retardants (
(phosphorus compounds, halogen compounds, antimony compounds, etc.)
, colorants (pigments, dyes), internal mold release agents, anti-aging agents, antioxidants, plasticizers, bactericides and fillers [carbon black, zinc oxide, calcium oxide, lead dioxide, titanium oxide, cane earth, glass] Examples include fibers and their crushed products (cut glass, milled glass, glass flakes, etc.), glass balloons, organic balloons, talc, mica, etc.
本発明の組成物を製造する際の反応温度は、通常20〜
200℃、好ましくは、30〜tso’cである。The reaction temperature when producing the composition of the present invention is usually 20 to
The temperature is 200°C, preferably 30°C to 30°C.
本発明の組成物の製造は通常の方法で行うことができ、
たとえば、ポリオール中にエポキシ樹脂を混合、溶解し
たものに、一定温度で硬化剤および/または硬化触媒を
添加して反応させてもよく、または、ポリオール、エポ
キシ樹脂、硬化剤および/または硬化触媒を同時に混合
してから、一定温度で反応させてもよい。The composition of the present invention can be produced by a conventional method,
For example, a curing agent and/or curing catalyst may be added to a mixture and dissolved epoxy resin in a polyol at a constant temperature, or the polyol, epoxy resin, curing agent and/or curing catalyst may be mixed and dissolved. They may be mixed at the same time and then reacted at a constant temperature.
本発明の組成物の製造は、バッチ式、連続式のいずれの
方法も使用できる。The composition of the present invention can be produced using either a batch method or a continuous method.
本発明のポリマーポリオールを製造する際に重要なファ
クターとなるのはポリオール、エポキシ樹脂、およびエ
ポキシ硬化剤および/またはエポキシ硬化触媒を均一に
混合した後の攪拌の程度にある。シェアーが大きすぎて
、液の攪拌により系に乱流が多(発生すると反応により
生成するエポキシ樹脂硬化物粒子が凝集して分散物が得
られない。An important factor in producing the polymer polyol of the present invention is the degree of stirring after uniformly mixing the polyol, epoxy resin, and epoxy curing agent and/or epoxy curing catalyst. If the shear is too large, stirring of the liquid will cause too much turbulence in the system (if this occurs, the epoxy resin cured particles produced by the reaction will aggregate, making it impossible to obtain a dispersion).
本発明の組成物をパッチ式の反応槽で製造する場合は、
攪拌機を使用しても良い。攪拌機はどのような形式のも
のでもよく、たとえば、プロペラ形攪拌機、櫂形攪拌機
、タービン形攪拌機などがあげられる。When producing the composition of the present invention in a patch-type reaction tank,
A stirrer may also be used. The stirrer may be of any type, such as a propeller-type stirrer, a paddle-type stirrer, a turbine-type stirrer, and the like.
攪拌の程度を表す指標である循環回数は、通常0〜37
分、好ましくは、0〜27分である。循環回数が37分
を越えるとポリマー成分が凝集してポリマーポリオール
が得られない。The number of circulations, which is an indicator of the degree of stirring, is usually 0 to 37.
minutes, preferably 0 to 27 minutes. If the number of circulation exceeds 37 minutes, the polymer components will aggregate and no polymer polyol will be obtained.
ここで言う循環回数は吐出流量を攪拌液量で除・した値
である。なお、吐出流量は、攪拌羽根の吐出面積と吐出
速度の積で表される(「化学装置」、1981年9月号
、15ページ)。The number of circulations referred to here is the value obtained by dividing the discharge flow rate by the amount of stirring liquid. Note that the discharge flow rate is expressed as the product of the discharge area of the stirring blade and the discharge speed ("Kagakusei", September 1981 issue, page 15).
本発明の組成物を連続式で製造する場合、管が使用され
る。管径は通常1〜100cmである。When producing the composition of the invention in a continuous manner, tubes are used. The tube diameter is usually 1 to 100 cm.
管の長さは、通常0.1”lOmである。The length of the tube is typically 0.1"lOm.
流速(v)と管径(D)(7)比(V/D)!t、0.
001〜4/分、好ましくは、0.01〜37分である
。V/Dが4/分を越えるとポリマー成分が凝集してポ
リマーポリオールが得られない。Flow velocity (v) and pipe diameter (D) (7) Ratio (V/D)! t, 0.
0.001 to 4/min, preferably 0.01 to 37 min. If V/D exceeds 4/min, the polymer components will aggregate and no polymer polyol will be obtained.
本発明のポリマーポリオール中に存在する硬化物粒子の
粒径は、使用するポリオールの種類、エポキシ樹脂、硬
化剤および/または硬化触媒の種類および、攪拌量によ
り種々変えることができるが通常0.1〜500μ讃で
ある。The particle size of the cured product particles present in the polymer polyol of the present invention can be varied depending on the type of polyol used, the type of epoxy resin, curing agent and/or curing catalyst, and the amount of stirring, but is usually 0.1 ~500μ praise.
[実施例コ
以下に本発明を実施例により具体的に説明するが、本発
明はこれらの実施例に限定されるものではない。実施例
および比較例に使用した原料の組成は次の通りである。[Examples] The present invention will be specifically explained below using Examples, but the present invention is not limited to these Examples. The composition of the raw materials used in the Examples and Comparative Examples is as follows.
なお部および%はそれぞれ重量部および重量%を表す。Note that parts and % represent parts by weight and % by weight, respectively.
(1)ポリオール
ポリオール(イ): グリセリン92部に PO5゜1
00部とEO800部の混合物を付加させた3官能ポリ
エーテルポリオール(分子量 6,000)ポリオール
(ロ):分子量2500の水添ポリイソプレングリコー
ル
(2)エポキシ樹脂:
エポキシ樹脂(イ): ビスフェノールAのグリシジル
エーテル(エポキシ当量 19o)
エポキシ樹脂(ロ):テトラグリシジルジアミノジフェ
ニルメタン(エポキシ当量 125)(3)エポキシ硬
化剤
硬化剤(イ):ジアミノジフェニルメタン(活性水素当
量49−5)
1M化剤(ロ)ニジアミノジシクロヘキシルメタン(活
性水素当量 52.5)
実施例1
攪拌および温度制御付の容器にポリオール(イ)700
部、エポキシ樹脂(イ)238部、硬化剤(イ)82部
を投入し均一に混合した後、緩やかに攪拌しつつ100
℃に昇温した。その後、循環回数07分(攪拌停止)で
反応温度を100−130℃に保ち5時間反応させた。(1) Polyol Polyol (a): 92 parts of glycerin with PO5゜1
Trifunctional polyether polyol (molecular weight 6,000) to which a mixture of 00 parts and EO 800 parts was added Polyol (b): Hydrogenated polyisoprene glycol (2) with a molecular weight of 2500 Epoxy resin: Epoxy resin (a): Bisphenol A Glycidyl ether (epoxy equivalent 19o) Epoxy resin (b): Tetraglycidyldiaminodiphenylmethane (epoxy equivalent 125) (3) Epoxy curing agent Curing agent (a): Diaminodiphenylmethane (active hydrogen equivalent 49-5) 1M agent (b) Nidiaminodicyclohexylmethane (active hydrogen equivalent 52.5) Example 1 Polyol (a) 700 in a container with stirring and temperature control
After adding 238 parts of epoxy resin (A) and 82 parts of curing agent (A) and mixing them uniformly, 100 parts of epoxy resin (A) was added and mixed uniformly.
The temperature was raised to ℃. Thereafter, the reaction temperature was kept at 100-130° C. and the reaction was carried out for 5 hours with the number of circulations being 07 minutes (stirring stopped).
最後に真空ポンプで低揮発分を除去し、重合体濃度30
%の乳白色のポリマーポリオール中を得た。Finally, remove low volatile matter using a vacuum pump to obtain a polymer concentration of 30%.
% of milky white polymer polyol was obtained.
実施例2〜4
実施例1と同様にして、表1の条件でポリマーポリオー
ル■、■を製造した。Examples 2 to 4 Polymer polyols (1) and (2) were produced in the same manner as in Example 1 under the conditions shown in Table 1.
比較例1
攪拌および温度制御付の容器にポリオール(イ)700
部、エポキシ樹脂(イ)238部、硬化剤(イ)62部
を投入し均一に混合した後緩やかに攪拌しつつ100℃
に昇温した。その後循環回数5/分(激しい攪拌)で反
応温度を100−130”cに保ち5時間反応させた。Comparative Example 1 Polyol (a) 700 in a container with stirring and temperature control
1, 238 parts of epoxy resin (A), and 62 parts of curing agent (A) were added, mixed uniformly, and heated to 100°C with gentle stirring.
The temperature rose to . Thereafter, the reaction was carried out for 5 hours while maintaining the reaction temperature at 100-130"C with a circulation rate of 5/min (vigorous stirring).
最後に真□空ポンプで低揮発分を除去して得たポリマー
ポリオールは粒子が凝集して、粒子と液が分離していた
。Finally, the particles of the polymer polyol obtained by removing low volatile matter using a vacuum pump were aggregated, and the particles and liquid were separated.
表1
した後、100℃に加熱した直径5 CL 長さ3m
のステンレス製の管中をlc■/分(v/d=0.2)
で流して反応させた。最後に真空ポンプで低揮発分を除
去し、重合体濃度30%の乳白色のポリマーポリオール
Iを得た。Table 1 After heating to 100℃ Diameter 5 CL Length 3 m
lc/min (v/d=0.2) in a stainless steel tube.
It was run with water and reacted. Finally, low volatile components were removed using a vacuum pump to obtain a milky white polymer polyol I with a polymer concentration of 30%.
実施例5〜7
実施例1と同様にして、表1の条件でポリマーポリオー
ル■、■を製造した。Examples 5 to 7 Polymer polyols (1) and (2) were produced in the same manner as in Example 1 under the conditions shown in Table 1.
比較例2
管の長さをelmにし、流速を25c■/分(V/d=
5)にする以外は実施例4と同様にして反応を行ったと
ころ反応開始の約1時間後に管が詰まりポリマーポリオ
ールは得られなかった。Comparative Example 2 The length of the tube was set to elm, and the flow rate was set to 25c/min (V/d=
When the reaction was carried out in the same manner as in Example 4 except for step 5), the tube was clogged about 1 hour after the start of the reaction and no polymer polyol was obtained.
富測定不能
実施例4
ポリオール(イ)700部、エポキシ樹脂(イ)238
部、硬化剤(イ)62部を約70℃で均一に溶解混合表
2
安定に分散されており、従来のアクリロニトリル−スチ
レン等のモノマーを用いたポリマーポリオールよりも硬
い粒子をより大量に含有するためポリウレタン樹脂とし
た場合の耐熱性、剛性が従来のポリマーポリオールを用
いたものに比べ優れたものとなる。Unmeasurable wealth Example 4 700 parts of polyol (a), 238 parts of epoxy resin (a)
and 62 parts of curing agent (A) were uniformly dissolved and mixed at approximately 70°C Table 2 It is stably dispersed and contains a larger amount of hard particles than conventional polymer polyols using monomers such as acrylonitrile-styrene. Therefore, when used as a polyurethane resin, the heat resistance and rigidity are superior to those using conventional polymer polyols.
従って、−本発明の方法により製造したポリマーポリオ
ールは軟質および硬質発泡ポリウレタン、半硬質および
硬質ポリウレタンエラストマー等の製造原料として有用
であり、その実用的価値は高末測定不能
[発明の効果]Therefore, - the polymer polyol produced by the method of the present invention is useful as a raw material for producing soft and rigid polyurethane foams, semi-rigid and rigid polyurethane elastomers, etc., and its practical value cannot be measured at all [Effects of the invention]
Claims (1)
たりの平均官能基数が2〜8であるポリオール、(b)
エポキシ樹脂および、(c)エポキシ硬化剤および/ま
たはエポキシ硬化触媒を、循環回数が0〜3/分なる条
件下で攪拌して反応させる(a)中にエポキシ樹脂硬化
物の粒子が分散されているポリマーポリオールの製造方
法。 2、(a)水酸基当量200〜20,000で1分子当
たりの平均官能基数が2〜8であるポリオール、(b)
エポキシ樹脂および、(c)エポキシ硬化剤および/ま
たはエポキシ硬化触媒を、管中に流速(V)と管径(D
)の比(V/D)が、0.001〜4/分なる条件下で
流して反応させる(a)中でエポキシ樹脂硬化物粒子が
分散されているポリマーポリオールの製造方法。[Claims] 1. (a) a polyol having a hydroxyl equivalent of 200 to 20,000 and an average number of functional groups per molecule of 2 to 8; (b)
The epoxy resin and (c) the epoxy curing agent and/or the epoxy curing catalyst are stirred and reacted under conditions such that the number of circulation is 0 to 3 minutes.(a) Particles of the cured epoxy resin are dispersed in the mixture. A method for producing polymer polyols. 2. (a) a polyol having a hydroxyl equivalent of 200 to 20,000 and an average number of functional groups per molecule of 2 to 8; (b)
Epoxy resin and (c) epoxy curing agent and/or epoxy curing catalyst are introduced into the tube at a flow rate (V) and a tube diameter (D).
A method for producing a polymer polyol, wherein particles of a cured epoxy resin are dispersed in (a), which is reacted by flowing under conditions such that the ratio (V/D) of (V/D) is 0.001 to 4/min.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2173862A JPH0459815A (en) | 1990-06-29 | 1990-06-29 | Production of polymer polyol |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2173862A JPH0459815A (en) | 1990-06-29 | 1990-06-29 | Production of polymer polyol |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0459815A true JPH0459815A (en) | 1992-02-26 |
Family
ID=15968520
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2173862A Pending JPH0459815A (en) | 1990-06-29 | 1990-06-29 | Production of polymer polyol |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0459815A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0582250A3 (en) * | 1992-08-06 | 1995-01-04 | Hoechst Ag | Crosslinked polymer microparticles based on epoxy resin, their preparation and their use. |
-
1990
- 1990-06-29 JP JP2173862A patent/JPH0459815A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0582250A3 (en) * | 1992-08-06 | 1995-01-04 | Hoechst Ag | Crosslinked polymer microparticles based on epoxy resin, their preparation and their use. |
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