JPH0458183B2 - - Google Patents
Info
- Publication number
- JPH0458183B2 JPH0458183B2 JP15884086A JP15884086A JPH0458183B2 JP H0458183 B2 JPH0458183 B2 JP H0458183B2 JP 15884086 A JP15884086 A JP 15884086A JP 15884086 A JP15884086 A JP 15884086A JP H0458183 B2 JPH0458183 B2 JP H0458183B2
- Authority
- JP
- Japan
- Prior art keywords
- carrier
- guide member
- carrier guide
- clamper
- internal lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000008188 pellet Substances 0.000 claims description 16
- 239000004065 semiconductor Substances 0.000 claims description 16
- 230000000630 rising effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000007688 edging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15884086A JPS6315433A (ja) | 1986-07-08 | 1986-07-08 | 内部リ−ド接合装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15884086A JPS6315433A (ja) | 1986-07-08 | 1986-07-08 | 内部リ−ド接合装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6315433A JPS6315433A (ja) | 1988-01-22 |
| JPH0458183B2 true JPH0458183B2 (h) | 1992-09-16 |
Family
ID=15680552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15884086A Granted JPS6315433A (ja) | 1986-07-08 | 1986-07-08 | 内部リ−ド接合装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6315433A (h) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02273949A (ja) * | 1989-04-17 | 1990-11-08 | Shinkawa Ltd | テープボンデイング装置 |
| US5120391A (en) * | 1989-04-17 | 1992-06-09 | Kabushiki Kaisha Shinkawa | Tape bonding apparatus |
| KR0145128B1 (ko) * | 1995-04-24 | 1998-08-17 | 김광호 | 열방열 핀을 구비한 내부 리드 본딩 장치 및 이를 이용한 내부 리드 본딩 방법 |
-
1986
- 1986-07-08 JP JP15884086A patent/JPS6315433A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6315433A (ja) | 1988-01-22 |
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